TW202405883A - 基板處理系統、基板處理方法及元件構造 - Google Patents

基板處理系統、基板處理方法及元件構造 Download PDF

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Publication number
TW202405883A
TW202405883A TW112120516A TW112120516A TW202405883A TW 202405883 A TW202405883 A TW 202405883A TW 112120516 A TW112120516 A TW 112120516A TW 112120516 A TW112120516 A TW 112120516A TW 202405883 A TW202405883 A TW 202405883A
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TW
Taiwan
Prior art keywords
laser
layer
wafer
substrate
interface
Prior art date
Application number
TW112120516A
Other languages
English (en)
Chinese (zh)
Inventor
山下陽平
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202405883A publication Critical patent/TW202405883A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Element Separation (AREA)
TW112120516A 2022-07-27 2023-06-01 基板處理系統、基板處理方法及元件構造 TW202405883A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-119975 2022-07-27
JP2022119975 2022-07-27

Publications (1)

Publication Number Publication Date
TW202405883A true TW202405883A (zh) 2024-02-01

Family

ID=89705935

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112120516A TW202405883A (zh) 2022-07-27 2023-06-01 基板處理系統、基板處理方法及元件構造

Country Status (3)

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JP (1) JP7815447B2 (https=)
TW (1) TW202405883A (https=)
WO (1) WO2024024191A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007220749A (ja) * 2006-02-14 2007-08-30 Seiko Epson Corp 半導体装置の製造方法
US12512336B2 (en) 2020-03-24 2025-12-30 Tokyo Electron Limited Substrate processing method and substrate processing apparatus
CN115335965B (zh) 2020-03-24 2025-10-14 东京毅力科创株式会社 基板处理方法和基板处理装置
JP2022091504A (ja) 2020-12-09 2022-06-21 東京エレクトロン株式会社 レーザ照射システム、基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
WO2024024191A1 (ja) 2024-02-01
JP7815447B2 (ja) 2026-02-17
JPWO2024024191A1 (https=) 2024-02-01

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