JPWO2024024191A1 - - Google Patents

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Publication number
JPWO2024024191A1
JPWO2024024191A1 JP2024536783A JP2024536783A JPWO2024024191A1 JP WO2024024191 A1 JPWO2024024191 A1 JP WO2024024191A1 JP 2024536783 A JP2024536783 A JP 2024536783A JP 2024536783 A JP2024536783 A JP 2024536783A JP WO2024024191 A1 JPWO2024024191 A1 JP WO2024024191A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024536783A
Other languages
Japanese (ja)
Other versions
JP7815447B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2024024191A1 publication Critical patent/JPWO2024024191A1/ja
Application granted granted Critical
Publication of JP7815447B2 publication Critical patent/JP7815447B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Element Separation (AREA)
JP2024536783A 2022-07-27 2023-04-25 基板処理システム、基板処理方法及びデバイス構造 Active JP7815447B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022119975 2022-07-27
JP2022119975 2022-07-27
PCT/JP2023/016356 WO2024024191A1 (ja) 2022-07-27 2023-04-25 基板処理システム、基板処理方法及びデバイス構造

Publications (2)

Publication Number Publication Date
JPWO2024024191A1 true JPWO2024024191A1 (https=) 2024-02-01
JP7815447B2 JP7815447B2 (ja) 2026-02-17

Family

ID=89705935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024536783A Active JP7815447B2 (ja) 2022-07-27 2023-04-25 基板処理システム、基板処理方法及びデバイス構造

Country Status (3)

Country Link
JP (1) JP7815447B2 (https=)
TW (1) TW202405883A (https=)
WO (1) WO2024024191A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007220749A (ja) * 2006-02-14 2007-08-30 Seiko Epson Corp 半導体装置の製造方法
WO2021192853A1 (ja) * 2020-03-24 2021-09-30 東京エレクトロン株式会社 基板処理方法及び基板処理装置
WO2021192854A1 (ja) * 2020-03-24 2021-09-30 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP2022091504A (ja) * 2020-12-09 2022-06-21 東京エレクトロン株式会社 レーザ照射システム、基板処理装置及び基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007220749A (ja) * 2006-02-14 2007-08-30 Seiko Epson Corp 半導体装置の製造方法
WO2021192853A1 (ja) * 2020-03-24 2021-09-30 東京エレクトロン株式会社 基板処理方法及び基板処理装置
WO2021192854A1 (ja) * 2020-03-24 2021-09-30 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP2022091504A (ja) * 2020-12-09 2022-06-21 東京エレクトロン株式会社 レーザ照射システム、基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
TW202405883A (zh) 2024-02-01
WO2024024191A1 (ja) 2024-02-01
JP7815447B2 (ja) 2026-02-17

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