TW202403943A - Apparatus for reducing moisture of front opening unified pod in load port module and semiconductor process device comprising the same - Google Patents

Abstract

The invention relates to a front opening unified pod dehumidification device of a load port module and a semiconductor process device thereof. The load port module is arranged in front of the front opening unified pod to form an insulating film at an entrance and exit port through which wafers enter and exit, thereby reducing the humidity of the front opening unified pod. The dehumidification device comprises: a main body disposed on the front upper portion of the front opening unified pod; a blower for blowing air to supply gas to the inside of the main body; and a jetting part for dispersing and discharging the gas injected into the main body downward to form a gas film. Therefore, in the invention, the main body, the blower, a partition wall, and the jetting part are disposed in front of the front opening unified pod in the load port module, so as to form a gas film at the entrance and exit port of the front opening unified pod, and further form an insulating gas film at the entrance and exit port of the front opening unified pod to block the inflow of outside air, thereby achieving the effect of reducing the humidity of the front opening unified pod.

Description

Chip container dehumidification device for loading port module, semiconductor process device and semiconductor process method thereof

The present invention relates to a wafer container dehumidification device of a load port module and a semiconductor processing device thereof. More specifically, it relates to a dehumidification device for a wafer container in a load port module that is provided in front of a wafer container to form a gas film at the entrance and exit of the wafer to reduce the humidity. The wafer container dehumidification device of the loading port module of the wafer container humidity and its semiconductor processing equipment.

In the semiconductor manufacturing process, wafers and semiconductor components formed on the wafer are high-precision items. Therefore, during storage and transportation, attention should be paid to wall surface damage due to external contaminants and impact. In particular, it is necessary to manage the storage and transportation of wafers to prevent the surface from being contaminated by impurities, such as dust, moisture, various organic matter, etc.

In the past, in order to improve the yield and quality of semiconductor manufacturing, wafer processing was performed in a clean room. However, with the high integration and refinement of components and the enlargement of wafers, it has become more and more difficult in terms of cost and technology to manage a relatively large space in a clean room.

Based on this, mini-environment cleaning methods that focus on improving the cleanliness of a local space around the wafer have recently been adopted instead of improving the overall cleanliness of the clean room.

On the other hand, the semiconductor manufacturing process repeatedly performs various unit processes, such as etching and deposition. During each process, impurities or contaminants remain on the wafer, causing defects or reducing the yield of the semiconductor process.

Therefore, in the semiconductor manufacturing process, wafers will be transported to various processing chambers or semiconductor processing spaces. At this time, various tools are provided to remove impurities or contaminants attached to the wafers during the transportation of the wafers from one processing space to other processing spaces. minimize.

As shown in Figure 1, a semiconductor process device including an Equipment Front End Module (EFEM) includes a Load Port Module (LPM) 110, a wafer container (Front Opening Unified Pod, FOUP) 120, and a fan Filter unit (Fan Filter Unit, FFU) 130 and wafer transfer chamber 140.

In order to store wafers in a highly clean environment, a wafer container 120 called a Front-Opening Unified Pod (FOUP) is used to form a wafer transfer chamber on the path where the wafers move from the wafer container 120 to the semiconductor processing space. 140, and the wafer transfer chamber 140 maintains a clean space through the fan filter unit 130.

Through wafer transfer tools such as arm robots installed in the wafer transfer chamber 140 , the wafers in the wafer container 120 can be transferred to the wafer transfer chamber 140 through the loading port module 110 , or can be stored in the wafer container from the wafer transfer chamber 140 Within 120.

The door 111 of the load port module 110 is opened simultaneously with the door provided on the front of the wafer container 120 in close contact, and the wafers are transported or stored through the open area.

Generally, fume generated after the process remains on the surface of a wafer that has undergone a semiconductor processing process, thereby causing a chemical reaction and causing a reduction in the productivity of the semiconductor wafer.

Furthermore, in order to transport or store wafers, when the door of the wafer container 120 is open, the concentration of the purge gas inside the wafer container 120 is controlled to be maintained at a predetermined level, and the outside air entering the wafer container is filtered.

However, due to the external air flowing into the wafer container 120, there is a part of unfiltered air inside the wafer container 120. Although the atmospheric environment of the wafer transfer chamber 140 is clean air that controls particulate matter, it contains oxygen, moisture, etc., if this If air enters the inside of the wafer container 120 and increases the internal humidity, there is a possibility that the surface of the wafer may be oxidized by moisture or oxygen contained in the outside air.

Therefore, as a tool that can effectively prevent outside air from entering the wafer container 120 from the wafer transfer chamber 140, the opening and closing of the cover of the load port module 110 and the wafer container 120 has been equipped with a double door opening and closing tool in the past, and can further isolate the outside air. However, If there is a door member that slides in the up and down direction, there is a problem that the loading port structure becomes very complicated.

Not only that, by moving the door up and down to block outside air, the time required to transport and store wafers increases significantly, which changes the internal humidity of the wafer container, leading to a problem of lowering semiconductor manufacturing yields.

In particular, if outside air enters the wafer container 120 through the entrance and exit of the wafer container 120 and increases the internal humidity through the entrance and exit, the surface of the wafer will be damaged by the moisture or oxygen contained in the outside air, and there is also a problem of lowering the yield. .

existing technical documents (Patent document) Korean Public Patent No. 10-2003-0011536 (February 11, 2003) Korean Public Utility Model No. 20-2017-0003211 (September 15, 2017) Korean Authorized Patent No. 10-1924185 (November 30, 2018)

problem to be solved The present invention is proposed to solve the above problems, and aims to provide a loading port module wafer container dehumidification device and its semiconductor processing device. In the loading port module, a main body is provided in front of the wafer container. The blowing part, the partition part and the spray part form a gas film at the entrance and exit of the wafer container, and then form an insulating gas film at the entrance and exit of the wafer container to block the inflow of outside air, thereby reducing the humidity of the wafer container.

Another object of the present invention is to provide a loading port module wafer container dehumidification device and a semiconductor processing device thereof: as a main body, a first body, a second body and a spacer are provided, and the gas injected through the injection part is ejected from the main body. The upper part of the part is distributed to one side area, the middle area and the other side area, which improves gas distribution and injection properties while forming multiple gas films to reduce interference caused by air flow in the wafer transfer chamber and form external air isolation. gas membrane.

Another object of the present invention is to provide a loading port module wafer container dehumidification device and a semiconductor processing device thereof as follows: having a plurality of fans as the blowing part, and individually controlling the air volume of the fans through the control part, and then according to the respective conditions at the upper part of the entrance. The air volume is controlled finely in each area to improve the retention performance of the gas film and maintain a uniform gas film according to each area.

In addition, another object of the present invention is to provide a loading port module wafer container dehumidification device and a semiconductor processing device thereof: having a distribution pipe as an injection part, the distribution pipe having a plurality of through holes formed in a circular cross-section Or honeycomb shape, and then the gas can be linearly and evenly distributed and injected into the upper part of the inlet and outlet to maintain a uniform gas film.

In addition, another object of the present invention is to provide a wafer container dehumidification device for a loading port module and a semiconductor processing device thereof as follows: a filtering portion is further disposed between the blowing portion and the spraying portion to further filter the gas supplied through the blowing portion, Impurities in the air, such as foreign matter or dust, are removed through filtration to prevent contamination of the gas dispersed and supplied through the blower part and the spray part, thereby increasing the yield of the wafer container.

means of solving problems The present invention is used to achieve the above purpose as a wafer container dehumidification device of a loading port module. It is arranged in front of the wafer container in the loading port module to form an isolation film at the entrance and exit of the wafer, thereby reducing the humidity of the wafer container. The humidity of the container is characterized by including: a main body part 10, which is arranged on the front upper part of the wafer container; an injection part 20, which is arranged on one side of the main body part 10 and injects gas; and a blowing part 30, which blows air to the Gas is supplied to the inside of the main body 10; partition walls 40 are provided at intervals inside the blowing part 30 to divide the blowing area of the blowing part 30 into a plurality of areas; and an injection part 60 is provided on the main body 10 At the lower part, the gas supplied inside the main body part 10 is linearly and uniformly dispersed downward and discharged to form a gas film.

The characteristic of the present invention is that the main body part 10 includes: a first body formed in an up-down column shape; a second body expanded and formed at a lower part of the first body and formed in an up-down column shape; and Separators are arranged at intervals inside the first body to divide the internal space of the first body into multiple sections.

A feature of the present invention is that the blowing part 30 is composed of a blowing tool provided in a plurality of blowing areas divided into a plurality of blowing areas by the partition part 40 inside the main body part 10 .

The characteristic of the present invention is that the blowing tool includes: a first fan disposed in each blowing area defined on one side of the main body 10; and a second fan disposed in a central portion of the main body 10. Each blowing area; and a third fan is provided in each blowing area defined on the other side of the main body 10 . A feature of the present invention is that the blowing tool is composed of fans that individually control wind speed.

The characteristic of the present invention is that the injection part 60 is composed of a distribution pipe, and a plurality of through holes of the distribution pipe are formed in a honeycomb shape or a circular cross-section, so that the gas is linearly and evenly distributed and injected into the upper part of the inlet and outlet. .

The present invention is characterized in that it further includes a filter part 50 , which is disposed between the blowing part 30 and the injection part 60 to filter the gas supplied through the blowing part 30 .

In addition, the present invention is a semiconductor processing apparatus, characterized by a wafer container dehumidification device having the above-described loading port module.

Effect of the invention As mentioned above, in the present invention, in the loading port module, a main body part, a blowing part, a partition part and a spray part are provided in front of the wafer container, so as to form a gas film at the entrance and exit of the wafer container, and then form a gas film at the entrance and exit of the wafer container. The gas isolation film blocks the inflow of outside air and provides the effect of reducing the humidity of the wafer container.

In addition, the main body part has a first body, a second body and a spacer, and the gas injected through the injection part is distributed from the upper part of the main body part to one side area, the middle area and the other side area, thereby improving gas distribution and injection properties. Multiple gas films are formed at the same time, which provides the effect of reducing interference caused by air flow in the wafer transfer chamber and forming a gas film to insulate the outside air.

In addition, a plurality of fans are provided as the blowing part, and the air volume of the fans is individually controlled by the control unit, and the air volume is finely controlled for each area at the upper part of the entrance and exit, thereby improving the retention performance of the gas film and maintaining a uniform gas film for each area. Effect.

In addition, the injection part has a distribution pipe with a plurality of through holes formed in a circular or honeycomb shape in cross-section, and the gas is linearly and evenly distributed and injected into the upper part of the inlet and outlet, thereby providing a uniform gas film. Effect.

In addition, a filter part is disposed between the blowing part and the spray part to further filter the gas supplied through the blowing part, remove impurities in the air, such as foreign matter or dust, through filtration, and prevent contamination of the gas dispersed and supplied through the blowing part and the spray part , providing an effect that improves the yield of the wafer container.

Hereinafter, a preferred embodiment of the present invention will be described in more detail with reference to the drawings.

FIG. 1 is a structural diagram showing a wafer container dehumidification device of a loading port module and its semiconductor processing device according to an embodiment of the present invention; FIG. 2 is a schematic diagram showing a wafer container of a loading port module according to an embodiment of the present invention. A state diagram showing the installation state of the dehumidification device; Figure 3 is a structural diagram showing the wafer container dehumidification device of the loading port module according to one embodiment of the present invention; Figure 4 is a diagram showing the loading port according to one embodiment of the present invention. The main cross-sectional view of the wafer container dehumidification device of the module; Figure 5 is a structural diagram showing the first body of the wafer container dehumidification device of the loading port module according to an embodiment of the present invention; Figure 6 is a schematic diagram of the present invention A side cross-sectional view of the wafer container dehumidification device of the loading port module according to an embodiment of the present invention; Figure 7 is a side cross-sectional view of the blowing portion of the wafer container dehumidification device of the loading port module according to an embodiment of the present invention; FIG. 8 is a structural diagram showing an example of the injection part of the wafer container dehumidification device of the loading port module according to one embodiment of the present invention; FIG. 9 is a schematic diagram showing the wafer loading port module according to one embodiment of the present invention. Structural diagram of another example of the spray part of the container dehumidification device.

The semiconductor processing device of the present invention, as a semiconductor processing device having a wafer container dehumidification device of a load port module of this embodiment, as shown in Figure 1, includes: a load port module (LPM) 110, a wafer container 120 (Front Opening Unified Pod (FOUP)), Fan Filter Unit (FFU) 130 and wafer transfer chamber 140 can be installed by the front-end module of the equipment with the wafer container dehumidification device of the loading port module. It is composed of Equipment Front End Module (EFEM).

The load port module (LPM) 110 is a device that can transport wafers while opening or closing the door 111 of a wafer container (Front Opening Universal Pod, FOUP) 120 that contains wafers for manufacturing semiconductors.

The structure of this loading port module (LPM) 110 is as follows: if a wafer container (Front Opening Unified Pod, FOUP) 120 is installed in the platform unit, nitrogen gas is injected into the wafer container 120 and the inside of the wafer container 120 is discharged to the outside of the wafer container 120 contaminants to prevent the wafers stored and transported in the wafer container 120 from being damaged by the contaminants.

The wafer container dehumidification device of the loading port module of this embodiment is disposed in front of the wafer container 120 between the wafer container 120 and the wafer transfer chamber 140 to form an external air isolating gas film or air curtain at the entrance and exit of the wafer, so that the wafer The internal humidity of container 120 is maintained at a set value.

A loading space for loading a plurality of wafers is formed inside the wafer container 120, and a door is opened to transport or store the wafers. This wafer container 120 may be composed of a front-opening unified pod (FOUP).

The wafer transfer chamber 140 is formed as a space between a wafer container 120 for loading a plurality of wafers and a processing space (not shown) for processing the wafers through a semiconductor process. The wafer transfer chamber 140 maintains a clean space to facilitate processing by a transfer robot or the like. The transfer tool minimizes the attachment of foreign matter or contaminants to the wafer during the transfer of the wafer from one processing space to another.

The fan filter unit 130 is disposed at an upper part of the wafer transfer chamber 140 and removes molecular pollutants such as smoke and particulate matter such as dust, thereby keeping the air in the wafer transfer chamber 140 clean. Generally, the air flow in the wafer transfer chamber 140 is formed from an upper part where the fan filter unit 130 is provided to a lower part.

As shown in Figures 2 to 4, the wafer container dehumidification device of the loading port module of this embodiment consists of a main body 10, an injection part 20, a blowing part 30, a partition part 40, a filter part 50, an injection part 60 and a discharge part. 70, it is installed in front of the wafer container (Front Opening Unified Pod, FOUP) in the Load Port Module (LPM) to form a gas isolation film such as an air curtain or air curtain at the entrance and exit of the wafer to lower the wafer. The loading port module dehumidifies the wafer container by dehumidifying the interior space of the container.

The main body 10 is a main body member provided on the upper front surface of the wafer container 120 in the load port module (LPM) 110 and is provided at the entrance and exit of the wafer. As shown in FIG. 5 , the main body 10 is composed of the first main body 11 , the second main body 12 and The spacer 13 is formed.

The first main body 11 is a main body member formed in a quadrangular box-shaped columnar shape and passes through the interior in the vertical direction. are arranged in a straight line in the length direction, so by flowing the purge gas or pure air through the fan filter unit 130, the upper part can flow in and the lower part can flow out.

The second body 12 is a columnar body member that is expanded at the lower part of the first body 11 and is formed into a quadrangular box shape penetrating in the vertical direction. One end and the other end of the upper part are arranged in a straight line in the length direction. Therefore, the purge gas or pure air flowing through the fan filter unit 130 can of course flow into the first body 11 at the upper part and flow out at the lower part.

The partitions 13 are spaced inside the first body 11 as a partitioning tool that divides the internal space of the first body 11 into a plurality of spaced apart parts. The partitions 13 are composed of two partitions, namely the first partition 13a and the second partition. 13b, so as to divide the internal space of the first body 11 into three areas: one side area 11a, a middle area 11b and the other side area 11c.

The first partition 13a is disposed between one side area and the middle area of the first body 11 to divide the internal space of the first body 11 into one side area and the middle area; the second partition 13b is disposed between the first body 11 between the other side area and the middle area, so as to divide the internal space of the first body 11 into the other side area and the middle area.

The injection part 20 is an injection tool provided on one side of the main body 10 to inject gas such as purge gas or pure air into the interior of the main body 10. As shown in FIG. 5, the injection part 20 is provided in the interior of the first body 11. The first injection port 21 , the second injection port 22 , and the third injection port 23 are composed of three areas: one side area, the middle area, and the other side area of the space.

The first injection port 21 is provided on the outer side of one side area of the first body 11 to inject gas into the inside of the one side area; the second injection port 22 is provided on the outer side of the middle area of the first body 11 to inject gas. Inside the middle area; the third injection port 23 is provided outside the other side area of the first body 11 to inject gas into the inside of the other side area.

The blowing unit 30 serves as a supply tool for blowing and supplying gas such as purge gas or pure air into the interior of the main body 10 , and is composed of a blowing tool installed inside the main body 10 or installed outside and connected through a communication duct.

As shown in Figures 6 and 7, this blowing tool includes: one or more first fans, which are arranged in each blowing area defined on one side of the main body 10; and one or more second fans, which are arranged on one side of the main body 10. Each blowing area is defined in the central part of the main body 10; one or more third fans are provided in each blowing area defined in the other side part of the main body part 10. These fans are connected to each drive motor and control piece, and the air volume and wind speed can be controlled individually or according to the setting location.

The first fan is a blowing tool provided in each blowing area divided by the partition portion 40 on one side of the first body 11 and is composed of a first fan 31 and a first second fan 32 .

The first fan 31 and the first fan 32 are respectively disposed at one end and the other end of the lower part of the side area divided by the first partition 13 a of the first body 11 . The air volume and wind speed can be controlled individually or partially according to settings in the internal space of one side area.

The second fan is a blowing tool provided in each blowing area divided by the partition portion 40 in the center of the first body 11, and is composed of a second-first fan 33 and a second-second fan 34.

The second fan 33 and the second fan 34 are respectively disposed at one end and the other end of the lower part of the middle area divided by the first partition 13a and the second partition 13b of the first body 11, so that The air volume and wind speed are individually controlled or partially controlled in the internal space of the middle area of the first body 11 .

The third fan is a blowing tool provided in each blowing area divided by the partition portion 40 on the other side of the first body 11, and is composed of a third-first fan 35 and a third-second fan 36.

The third-first fan 35 and the third-second fan 36 are respectively disposed at one end and the other end of the lower part of the other side area partitioned by the second partition 13b of the first body 11, so as to realize the first fan 35 and the second fan 36. The air volume and wind speed in the internal space of the other side area of the main body 11 are individually controlled or controlled based on settings.

The partition walls 40 are wall members provided inside the first body 11 of the main body 10 at equal intervals. As shown in FIGS. 6 and 7 , the partition walls 40 divide the internal space of the first body 11 into a plurality of sections. A fan is installed in the space, and the blowing space of the fan can be individually controlled.

Of course, this kind of partition wall 40 can also be composed of a plurality of first partition walls 41 and a second partition wall 42 divided into a plurality of first partition walls at the lower part of one side area of the first body 11 , and a plurality of third partition walls divided into a plurality of third partition walls at the lower part of the middle area of the first body 11 . 43 and the fourth partition wall 44, and a plurality of fifth partition walls 45 divided into a lower portion of the other side area of the first body 11.

The filter part 50 is a filtering tool disposed between the blowing part 30 and the injection part 60 to filter the gas supplied through the blowing part 30, and is composed of a filter component such as an ultra-high efficiency filter or a high-efficiency air screening program to remove the gas contained in the gas. Contains impurities such as foreign matter or dust.

In addition, of course, a switch piece can be provided on one side of the second body 12 of the main body 10 to open and close a part of the second body 12 when replacing the filter element of the filter part 50 provided in the inner space of the second body 12 .

The injection part 60 is composed of a dispersion tool provided at the lower part of the main body part 10 and the lower part of the filter part 50 to discharge the gas supplied to the inside of the main body part 10 in a linear and uniform manner downward to form a gas isolation film. .

As shown in FIGS. 8 and 9 , this injection part 60 is preferably composed of a distribution pipe having a plurality of distribution holes. The cross-sections of the plurality of distribution holes are formed in a honeycomb shape or a circle to direct the gas in a straight line. Distribute it uniformly and inject it into the upper part of the entrance and exit of the wafer container.

Such a distribution pipe may of course consist of a first distribution pipe 61 with perforations having a circular cross-section, or a second distribution pipe 62 with perforations having a honeycomb shape in cross-section.

The discharge part 70 is a discharge tool provided at the lower part of the main body part 10 to discharge the gas injected through the injection part 60, and is provided at the lower part of the main body part 10 and is open.

As mentioned above, according to the present invention, in the loading port module, the main body part, the blowing part, the partition part and the injection part are provided in the front of the wafer container, so as to form a gas film at the entrance and exit of the wafer container, and then form a gas film at the entrance and exit of the wafer container. The gas isolation film blocks the inflow of outside air and provides the effect of reducing the humidity of the wafer container.

In addition, the main body part has a first body, a second body and a spacer, and the gas injected through the injection part is distributed from the upper part of the main body part to one side area, the middle area and the other side area, thereby improving gas distribution and injection properties. Multiple gas films are formed at the same time, which provides the effect of reducing interference caused by air flow in the wafer transfer chamber and forming a gas film to insulate the outside air.

In addition, a plurality of fans are provided as the blowing part, and the air volume of the fans is individually controlled by the control unit, and the air volume is finely controlled for each area at the upper part of the entrance and exit, thereby improving the retention performance of the gas film and maintaining uniform gas for each area. membrane effect.

In addition, the injection part has a distribution pipe with a plurality of through holes formed in a circular or honeycomb shape in cross-section, and the gas is linearly and evenly distributed and injected into the upper part of the inlet and outlet, thereby providing a uniform gas film. Effect.

In addition, a filter part is disposed between the blowing part and the spray part to further filter the gas supplied through the blowing part, remove impurities in the air, such as foreign matter or dust, through filtration, and prevent contamination of the gas dispersed and supplied through the blowing part and the spray part , thereby providing an effect that can improve the yield rate of the wafer container.

The invention described above can be implemented in various other forms without departing from the technical idea or main features. Therefore, the described embodiments are merely examples in all respects and should not be construed restrictively.

10: Main part 11:First subject 11a: One side area 11b: middle area 11c: Area on the other side 12:Second subject 13: spacer 13a: First spacer 13b: Second spacer 20:Injection part 21:First injection port 22:Second injection port 23:Third injection port 30: Hair drying department 31:First-one fan 32:First-second fan 33:Second-One Fan 34: Second-second fan 35:Third-one fan 36:Third-Second Fan 40: Next door 41:The first next door 42:The second next door 43:The third next door 44:The fourth next door 45:The fifth next door 50:Filtering Department 60:Injection Department 61: First distribution pipe 62: Second distribution pipe 70:Emissions Department 110:Module 120:wafer container 130:Unit 140:Teleport room

FIG. 1 is a structural diagram showing a wafer container dehumidification device of a loading port module and its semiconductor processing device according to an embodiment of the present invention. 2 is a state diagram showing the installation state of the wafer container dehumidification device of the loading port module according to one embodiment of the present invention. FIG. 3 is a structural diagram showing the wafer container dehumidification device of the loading port module according to an embodiment of the present invention. 4 is a main cross-sectional view showing the wafer container dehumidification device of the loading port module according to an embodiment of the present invention. 5 is a structural diagram showing the first body of the wafer container dehumidification device of the loading port module according to an embodiment of the present invention. 6 is a side cross-sectional view of the wafer container dehumidification device of the loading port module according to an embodiment of the present invention. 7 is a side cross-sectional view showing the blowing part of the wafer container dehumidification device of the loading port module according to one embodiment of the present invention. 8 is a structural diagram illustrating an example of the injection unit of the wafer container dehumidification device of the loading port module according to an embodiment of the present invention. 9 is a structural diagram showing another example of the injection unit of the wafer container dehumidification device of the loading port module according to an embodiment of the present invention.

10: Main part

20:Injection part

30: Hair drying department

40: Next door

50:Filtering Department

60:Injection Department

70:Emissions Department

Claims (10)

A wafer container dehumidification device of a loading port module is arranged in front of the wafer container in the loading port module to form an isolation film at the entrance and exit of the wafer, thereby reducing the humidity of the wafer container. It is characterized by including: The main body part (10) is arranged on the upper front part of the wafer container; The injection part (20) is provided on one side of the main body part (10) and injects gas; A blowing part (30) performs blowing to supply gas to the inside of the main body part (10); and Wherein, the main body part (10) includes: The first main body is formed into a columnar shape in an up-and-down direction; The second body is expanded and formed at the lower part of the first body, and is formed into a columnar shape in the up and down direction; and Separators are arranged at intervals inside the first body to divide the internal space of the first body into multiple sections. The wafer container dehumidification device of the loading port module as described in claim 1, which further includes: The partition walls (40) are arranged at intervals inside the blowing part (30) to divide the blowing area of the blowing part (30) into a plurality of blowing areas. The wafer container dehumidification device of the loading port module as described in claim 2, wherein, The blowing part (30) is composed of blowing tools respectively provided in a plurality of blowing areas divided into a plurality of blowing areas by the partition part (40) inside the main body part (10). The wafer container dehumidification device of the loading port module as described in claim 3, wherein, The blowing tools include: The first fan is installed in each blowing area defined on one side of the main body (10); A second fan is installed in each blowing area defined in the center of the main body (10); and The third fan is installed in each blowing area defined on the other side of the main body (10). The wafer container dehumidification device of the loading port module as described in claim 3, wherein, The blowing tool is composed of fans that individually control wind speed. The wafer container dehumidification device of the loading port module as described in claim 1, which further includes: The injection part (60) is provided at the lower part of the main body part (10), and disperses the gas supplied inside the main body part (10) linearly and uniformly downward and discharges it to form a gas film. The wafer container dehumidification device of the loading port module as described in claim 6, wherein, The injection part (60) is composed of a distribution pipe, and a plurality of through holes of the distribution pipe are formed in a honeycomb shape or a circular cross section, so that gas can be uniformly distributed linearly and injected into the upper part of the inlet and outlet. The wafer container dehumidification device of the loading port module as described in claim 6, further comprising: A filtering part (50) is provided between the blowing part (30) and the injection part (60) to filter the gas supplied through the blowing part (30). A semiconductor processing equipment, characterized by a wafer container dehumidification device having the loading port module described in claim 1. A semiconductor manufacturing method using the wafer container dehumidification device of the loading port module described in claim 1, which includes: The step of transporting wafers that have undergone semiconductor processing processes in the loading port module; The step of storing the transported wafers in a wafer container; and The step of forming an insulating film at an entrance and exit of a wafer container storing the wafers based on the dehumidification device.