KR20170003211U - Flow-field Device with Uniform Protective Air Curtain - Google Patents
Flow-field Device with Uniform Protective Air Curtain Download PDFInfo
- Publication number
- KR20170003211U KR20170003211U KR2020160001189U KR20160001189U KR20170003211U KR 20170003211 U KR20170003211 U KR 20170003211U KR 2020160001189 U KR2020160001189 U KR 2020160001189U KR 20160001189 U KR20160001189 U KR 20160001189U KR 20170003211 U KR20170003211 U KR 20170003211U
- Authority
- KR
- South Korea
- Prior art keywords
- air
- flow
- field apparatus
- shell
- holes
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F9/00—Use of air currents for screening, e.g. air curtains
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- F24F3/1607—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Abstract
The present invention relates to a flow-field apparatus having a uniform air curtain installed over an opening between a forep (front opening single compartment) and the local space of the cleanroom. The flow-tightening device of the present invention comprises two shells, at least one ventilation plate and two cover plates. The two shells can be joined together to form a case with a bottom outlet. The vent plate is horizontally installed and has a plurality of small vent holes. Two cover plates are provided on both sides of the case. The air charged in the flow-field apparatus can be accumulated to establish air resistance by the micro-ventilation holes. When the internal pressure of the air rises to the critical region, the air in the flow-field apparatus, to block the outside air penetrating into the poop, Layer can be blown downward from the layer toward the lower outlet.
Description
The present invention relates to a method and apparatus for providing uniform air curtains on a front opening single compartment (a front opening unified pod (FOUP)) and a mini-environment, In particular, the flow-field apparatus of the present invention is provided with a plurality of internal ventilation plates through which a plurality of vented fine holes on the vent plate Thereby allowing the air curtain to accumulate to form a pressure resistance, thereby blowing air downward to form an air curtain that uniformly blocks external air from penetrating.
Semiconductor manufacturing processes typically operate in a cleanroom. However, maintaining clean air adds significant manufacturing costs. Therefore, the minienvironment is widely used in the semiconductor manufacturing process for cost reduction. For example, a forep (front opening single compartment) is being used to store wafers consumed in local space. The wafer is a semiconductor material for manufacturing integrated circuits and the wafer surface must remain clean throughout the manufacturing process. The wafers are typically stored in a poof to prevent moisture or airborne particles or airborne molecular contaminants (AMCs) from contacting the wafer surface. The method is to form a positive pressure to fill the pore with clean dry air or nitrogen to block the outside air that penetrates into the pore.
Poof is a compartment with a front opening in the local space. The plows are provided with multiple layers of supporting plates for storing the wafers. However, air in the localized space can penetrate into the pof and the production yield of the wafers can be affected by cross contamination when the wafers are taken out of the pofu. In order to solve such a problem, a flow-field device of the present invention having an air curtain for blocking external air penetrating into a pore has been developed (FIG. 1). The flow-fitting apparatus of the present invention comprises a first shell A, an interspace plate B, and a second shell C, which are provided on the opening between the pooff and the local space, . The upper and inner surfaces of the first shell A and the second shell C are provided with filling grooves A2 and C2 opposed to the screw holes A1 and C1 opposed to each other, At least one filling hole A3 is provided in the filling groove A2 of the second shell C and a parallel calibration groove C3 is provided below the filling groove C2 of the second shell C. The interspace plate B has a through hole B1 in the opposite direction to the screw holes A1 and C1 of the first shell A and the second shell C,
The interspace plate B is sandwiched between the first shell A and the second shell C by bolts connecting the screw holes A1 and C1 and the through hole B1, So that the filling grooves A2 and C2 of the flow-fitting device of the present invention form an inner space leading to the lower outlet gap D. Therefore, the air flowing from the filling hole A3 to the inner space of the flow- And can be calibrated in the calibration groove C3 to create an air curtain blowing downwardly from the opening between the poop and the local space to block the outside air penetrating into the flap.Conventional fluid-tight devices provide a protective film air curtain, but have the following disadvantages:
(1) Charged air in a conventional flow-field device internal space that directly blows to form an air curtain does not provide a suitable protective film: that is, air flows toward the smallest pressure resistance, Can not be formed.
(2) The outlet gap D of the conventional flow-field apparatus is formed by a gap plate sandwiched between two shells, which means that the width of the outlet gap is determined by the thickness of the interspace plate between 0.05 mm and 3 mm it means. As a result, the air is diffused and does not reach the bottom of the opening, and the air curtain can not block the outside air penetrating into the plow.
(3) Both sides of the air outlet gap of the conventional flow-field apparatus are formed so as to form an inclined angle so that outside air flows into the air inlet through the air outlet.
The main purpose of the present invention is to provide an air curtain of uniform shielding.
The air curtain is installed in the clean room above the opening between the local space and the forep (front opening single compartment). The flow-fitting apparatus of the present invention comprises two shells, at least one ventilation plate, and two cover plates. The two shells can be joined together to form a case with a bottom outlet. The ventilation plate is installed horizontally and has small ventilation holes. Two cover plates are provided on both sides of the case. The air charged in the flow-field apparatus can be accumulated to establish air resistance by the micro-ventilation holes. Air in the flow-inducing device to block the outside air penetrating into the pore when the internal pressure of the air rises to the critical region, the air in the flow-field device is uniformly applied to the
BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings illustrate preferred embodiments and modes of operation of the present invention, wherein like numerals denote like or similar parts in the figures:
1 is a cross-sectional view showing a conventional flow-field apparatus with a protective film air curtain;
2 is a perspective view showing the flow-field device of the present invention installed over an opening between the pore and the local space;
FIG. 3 is a perspective view showing a flow-field apparatus providing a uniform shield air curtain; FIG.
FIG. 4 is an exploded perspective view showing a flow-field apparatus providing a uniform shield air curtain of the present invention; FIG.
5 is a partial cross-sectional view showing the flow direction of the flow-field apparatus of the present invention;
FIG. 6 is a perspective view showing another embodiment of the present invention.
As shown in FIG. 2, the flow-field apparatus of the present invention having a uniform shielding air curtain comprises a first shell 1, a
The ventilation plate (3) is made of polyethylene and is provided with a plurality of small ventilation holes (31). The ventilation plate is installed in a layered manner in peripheral grooves formed by the
The combined flow-field apparatus is installed above the opening 51 between the
FIG. 6 shows another embodiment of a flow-field device which is varied from 40 cm to 60 cm to provide a longer air curtain covering the
It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents. will be.
Claims (2)
A first shell having a length slightly longer than the length of the opening and having a plurality of through holes and a transverse groove at an inner surface edge;
An inverted L-shaped plate having a closed end, comprising: a second shell having a plurality of screw holes and an annular groove at an inner surface edge opposite to the plurality of through holes and transverse grooves on the first shell, Two shells can be combined to form a case having a bottom outlet by inserting a bolt into the through hole and the screw hole, and at least one fill hole located at the top of the coupling case is provided);
A plurality of ventilation plates installed in layers on the peripheral grooves defined by the transverse grooves and the annular grooves and having a plurality of micro vents; And
Two cover plates installed on both sides of the flow-field apparatus;
Lt; / RTI >
Clean dry air or nitrogen is charged from the fill hole into the flow-field apparatus and accumulated to build up the internal air resistance by the micro-vent holes, and the external air that reaches the critical area of the air reaches the critical area, Characterized in that the air in the flow-field device is blown downwardly from the air-venting plate layer towards the lower air-outlet port to form a uniform protective film air curtain in said opening between the plow and the local space, .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2020160001189U KR20170003211U (en) | 2016-03-07 | 2016-03-07 | Flow-field Device with Uniform Protective Air Curtain |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2020160001189U KR20170003211U (en) | 2016-03-07 | 2016-03-07 | Flow-field Device with Uniform Protective Air Curtain |
Publications (1)
Publication Number | Publication Date |
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KR20170003211U true KR20170003211U (en) | 2017-09-15 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR2020160001189U KR20170003211U (en) | 2016-03-07 | 2016-03-07 | Flow-field Device with Uniform Protective Air Curtain |
Country Status (1)
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KR (1) | KR20170003211U (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200056084A (en) | 2018-11-14 | 2020-05-22 | 주식회사 저스템 | An air shielding device for shielding the inflow of outside air into the wafer pod and a semiconductor device including the same |
KR20210023653A (en) | 2019-08-22 | 2021-03-04 | 주식회사 저스템 | Apparatus for reducing moisture of front opening unified pod in load port module and semiconductor process device comprising the same |
KR102226506B1 (en) | 2019-09-09 | 2021-03-11 | 주식회사 저스템 | Apparatus for reducing moisture of front opening unified pod in transfer chamber and semiconductor process device comprising the same |
KR20220021069A (en) | 2020-08-12 | 2022-02-22 | 주식회사 저스템 | Apparatus for reducing moisture of front opening unified pod in load port module and semiconductor process device comprising the same |
KR20230096337A (en) | 2021-12-23 | 2023-06-30 | 주식회사 저스템 | Apparatus for reducing moisture of front opening unified pod in load port module and semiconductor process device comprising the same |
-
2016
- 2016-03-07 KR KR2020160001189U patent/KR20170003211U/en not_active Application Discontinuation
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200056084A (en) | 2018-11-14 | 2020-05-22 | 주식회사 저스템 | An air shielding device for shielding the inflow of outside air into the wafer pod and a semiconductor device including the same |
KR20210023653A (en) | 2019-08-22 | 2021-03-04 | 주식회사 저스템 | Apparatus for reducing moisture of front opening unified pod in load port module and semiconductor process device comprising the same |
KR102226506B1 (en) | 2019-09-09 | 2021-03-11 | 주식회사 저스템 | Apparatus for reducing moisture of front opening unified pod in transfer chamber and semiconductor process device comprising the same |
KR20220021069A (en) | 2020-08-12 | 2022-02-22 | 주식회사 저스템 | Apparatus for reducing moisture of front opening unified pod in load port module and semiconductor process device comprising the same |
KR20220137596A (en) | 2020-08-12 | 2022-10-12 | 주식회사 저스템 | Apparatus for reducing moisture of front opening unified pod in load port module and semiconductor process device comprising the same |
KR20230096337A (en) | 2021-12-23 | 2023-06-30 | 주식회사 저스템 | Apparatus for reducing moisture of front opening unified pod in load port module and semiconductor process device comprising the same |
KR20230163967A (en) | 2021-12-23 | 2023-12-01 | 주식회사 저스템 | Apparatus for reducing moisture of front opening unified pod in load port module and semiconductor process device comprising the same |
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