JP6206126B2 - Closed container lid opening / closing system and substrate processing method using the system - Google Patents

Description

  The present invention relates to a so-called FIMS (Front-Opening Interface Mechanical Standard) system used when a wafer internally held in a transfer container called a pod is transferred between semiconductor processing apparatuses in a semiconductor manufacturing process or the like. More specifically, in a FIMS system in which a so-called FOUP (Front-Opening Unified Pod), which is a closed container that contains a wafer, is placed, and the lid of the pod is opened and closed to transfer the wafer to the pod. The present invention relates to a FIMS system having a purge mechanism for cleaning the inside of the pod, that is, a lid opening / closing system.

  Previously, semiconductor manufacturing processes were performed in a so-called clean room in which the interior of a room for handling semiconductor wafers was highly cleaned. However, from the viewpoint of dealing with the increase in wafer size and cost reduction required for clean room management, in recent years, only the inside of the processing apparatus, the pod (wafer container), and the minute space for transferring the substrate from the pod to the processing apparatus. Has been adopted to maintain a highly clean state.

  The pod has a substantially cubic body having a shelf that can hold a plurality of wafers in parallel and spaced apart from each other, and an opening used for loading and unloading the wafer on one of the surfaces constituting the outer surface. And a lid that closes the opening. The pod in which the surface where the opening is formed is located not on the bottom surface of the pod but on one side surface (the surface facing the minute space) is collectively referred to as FOUP (front-opening unified pod). The configuration to be used is the main target.

  The minute space described above includes a first opening facing the opening of the pod, a door for closing the first opening, a processing apparatus-side opening provided on the semiconductor processing apparatus side, and a first opening. And a transfer robot that enters the inside of the pod and holds the wafer and passes the opening to the processing apparatus side through the opening on the processing apparatus side. The structure that forms the minute space has a mounting table that supports the pod so that the pod opening faces the front of the door at the same time.

  On the top surface of the mounting table, a positioning pin that fits into a positioning hole provided on the bottom surface of the pod to define the mounting position of the pod and a clamped portion provided on the bottom surface of the pod are engaged with the mounting pod. And a clamp unit for fixing to. Usually, the mounting table can move back and forth a predetermined distance with respect to the door direction. When the wafer in the pod is transferred to the processing apparatus, the pod is moved with the pod being placed until the lid of the pod comes into contact with the door, and after the contact, the lid is removed from the pod opening by the door. . By these operations, the inside of the pod and the inside of the processing apparatus communicate with each other through a minute space, and the wafer transfer operation is repeated thereafter. FMS (front-opening interface mechanical standard) system including this mounting table, door, first opening, door opening / closing mechanism, wall that forms part of the minute space in which the first opening is configured Collectively.

  Here, the inside of the pod in a state where a wafer or the like is accommodated is usually filled with highly clean dry nitrogen or the like to prevent entry of contaminants, oxidizing gas, etc. into the pod. Yes. However, when the wafer in the pod is brought into various processing apparatuses and subjected to predetermined processing, the inside of the pod and the inside of the processing apparatus are always kept in communication. A fan and a filter are arranged in the upper part of the chamber in which the transfer robot is arranged, and clean air in which particles and the like are usually managed is introduced into the room. However, when such air enters the pod, the wafer surface may be oxidized by oxygen or moisture in the air. Further, along with miniaturization and high performance of semiconductor elements, attention is being paid to oxidation due to oxygen or the like that has entered the inside of the pod, which has not been a significant problem in the past.

  These oxidizing gases form an extremely thin oxide film on the wafer surface or various layers formed on the wafer. Due to the presence of such an oxide film, there is a possibility that the fine element cannot secure desired characteristics. As a countermeasure, it is conceivable to suppress the intrusion of the gas whose oxygen partial pressure or the like is not controlled from the outside of the pod into the pod. As a specific method, Patent Document 1 or 2 discloses a configuration in which a nozzle for supplying an inert gas such as nitrogen is disposed in a region adjacent to an opening of a pod in the FIMS system. An inert gas is supplied from the gas supply nozzle to the inside of the pod whose opening is opened by removing the lid, thereby reducing the oxygen concentration inside the pod. Moreover, in the structure disclosed by patent document 3 or 4, an inert gas is supplied from the gas port provided in the pod wall surface, and, thereby, the oxygen concentration is reduced. Further, Cited Document 5 discloses a configuration in which an inert gas is supplied from both the pod opening and the pod wall surface.

Japanese Patent No. 4301456 Japanese Patent No. 4309935 JP 2012-019046 A JP 2012-135355 A JP 2009-290102 A

  In the configuration disclosed in Patent Document 1 or 2, since an inert gas with a large flow rate can be supplied using an opening having a sufficient frontage, the inert gas replacement inside the pod is quickly performed, and the oxygen concentration is reduced. It can be easily reduced below a predetermined value. However, in these configurations, it is essential to open the lid in order to replace the inert gas. For example, it is practically impossible to manage the oxygen concentration during a waiting time for waiting for processing on the mounting table. Here, for example, when the time required for processing a single wafer is long, supply of an inert gas at a large flow rate is not permitted from the viewpoint of cost and safety, and the pod is closed with a lid at a time other than the insertion / removal timing of the wafer. There is also a way to do it. At that time, when there is a situation where the oxygen concentration inside the pod rises due to leakage, etc., in the case of forming extremely fine wiring, in the case of processing using highly oxidizable material, gas, etc., immediately before the processing The oxygen concentration in the environment where each wafer is placed is different, and there is a possibility that the characteristics of each wafer are different. When the pod is enlarged to accommodate large-diameter wafers, it is generally difficult to keep the internal space of the pod sealed, and internal gas leakage and external gas intrusion may occur during this waiting time. There is a concern that this will increase.

  In the case of the configuration disclosed in the cited document 3 or 4, since the port must be provided on the wall surface of the pod, the diameter of the gas pipe used for supplying the inert gas is limited. For this reason, in order to supply the inert gas amount for suitably reducing the oxygen concentration, this must be performed at a large flow rate. However, as described above, pods are becoming larger and it is becoming difficult to ensure a sufficient supply amount. Also, even if satisfactory supply itself is possible, the supply gas pressure must be increased and the gas flow rate must be increased. As a result, the wafer may be contaminated. Further, the configuration disclosed in the cited document 5 does not consider the above-described problem of increase in oxygen concentration during standby and supply of a sufficient amount of inert gas.

  The present invention has been made in view of the above background, and quickly suppresses the partial pressure of an oxidizable gas such as oxygen inside a pod to a predetermined low level, and this is performed during a so-called standby time. It is an object of the present invention to provide a lid opening / closing system for a pod as an airtight container that can be maintained.

In order to solve the above-described problems, a lid opening / closing system according to the present invention includes a substantially box-shaped main body capable of accommodating an object to be accommodated therein and having an opening on one surface, and separable from the main body. Removing the lid from the storage container comprising: a lid that closes the opening and forms a sealed space together with the main body; and at least one supply port that enables gas supply from the outside provided on the wall surface of the main body. The lid opening / closing system that opens and closes the object by opening the opening, and is disposed adjacent to the mounting table on which the receiving container is mounted, It is formed on a micro space in which particles are managed and a mechanism for transporting the objects to be accommodated and on a wall that defines a part of the micro space adjacent to the mounting table and is placed on the mounting table. In the container The first opening having a substantially rectangular shape provided in an arrangement capable of facing the opening, and the lid can be held and the first opening can be substantially closed, and the lid is held. A door that connects the opening and the first opening by opening the first opening; an open / close detection means that detects opening and closing of the opening using the lid by the door; and the supply port A supply valve that supplies gas into the storage container in cooperation with the storage container, and a total flow rate of 1 to 60 L / min through the supply port and the supply valve in a state where the storage container is mounted on the mounting table. A gas supply system for supplying a predetermined gas at a flow rate or at a flow rate of 1 to 20 L / min; and a purge nozzle capable of supplying the predetermined gas to the storage container through the opening of the storage container; Through the supply port and supply valve Possess control means for controlling the supply of the predetermined gas from said supply of a constant gas purge nozzle, wherein the control means, in response to closing of the opening the opening and closing detection unit detects the purge nozzle It switched to the supply port and the supply of the predetermined gas through a supply valve from the supply of the predetermined gas from and wherein Rukoto.

The lid opening / closing system described above further includes an exhaust valve capable of discharging gas inside the storage container in cooperation with an exhaust port provided in the storage container, and the exhaust valve is a pressure inside the storage container. It is preferable that the differential pressure valve be open when the pressure becomes higher than a predetermined pressure . Also, container has at least one exhaust port to allow discharge of the gas to the outside provided on the wall surface of the main body, a discharge valve for discharging the exhaust ports in cooperation with the gas from the interior container and Further, it may be included.

Alternatively, in the above-described lid opening / closing system, the second opening is formed in the minute space continuously with the first opening, covers the moving space of the door, and forms the second opening. An enclosure having a second opening in which a mechanism for communicating the object to be communicated with each other and the minute space can be passed along with the object to be contained, and the first opening within the enclosure And a curtain nozzle capable of supplying the predetermined gas along a direction from the upper side toward the lower side of the first opening, and the enclosure includes the predetermined gas. It is more preferable to have a gas outlet through which the predetermined gas can flow out in the minute space along the direction in which the gas flows.

  According to the present invention, it is possible to quickly perform inert gas replacement inside the pod by combining inert gas replacement with a large flow rate from the opening and inert gas replacement with a small flow rate from the pod wall surface. In addition, it is possible to effectively suppress an increase in oxygen concentration even during a standby time on the mounting table.

It is a perspective view which shows schematic structure in the principal part of the lid | cover opening / closing system which concerns on one Embodiment of this invention. FIG. 2 is a diagram showing a schematic configuration of a cut surface perpendicular to the pod opening of the lid opening / closing system according to the embodiment of the present invention shown in FIG. 1, that is, a load port, a pod, a lid for the pod, and a part of the opener. is there. It is a figure which shows the state which looked at the 1st opening part 10 shown in FIG. 1 from the arrow 2B direction. It is a figure explaining the supply direction of the purge gas supplied toward the inside of a pod from a purge nozzle. FIG. 2 is a diagram showing one stage of an operation for opening and closing the lid in the lid opening and closing system shown in FIG. 1. FIG. 2 is a diagram showing one stage of an operation for opening and closing the lid in the lid opening and closing system shown in FIG. 1. 4B is a diagram showing a state in which the first opening 10 is viewed in the same manner as in FIG. 2B in the state shown in FIG. 4B. 1 is an overall side view showing a schematic configuration of a general semiconductor wafer processing apparatus to which the present invention is applied. It is a figure which shows the schematic structure of the state which expanded the door opening-and-closing mechanism in the apparatus shown in FIG. 5, and its vicinity, and looked at this from the side surface. It is a figure which shows schematic structure at the time of seeing the structure shown to FIG. 6A from the conveyance chamber side. It is a figure which shows the cross section of the perpendicular direction containing a gas supply valve about the mounting base in the lid | cover opening / closing system shown in FIG. It is other embodiment of this invention, Comprising: It is a figure which shows schematic structure at the time of seeing the structure of the upper surface of a mounting base from upper direction.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a schematic configuration of a main part of a lid opening / closing device (FIMS, hereinafter referred to as a load port) according to a first embodiment of the present invention. An opening, a part of a door opening / closing mechanism, a wall forming a part of a minute space in which the first opening is formed, an enclosure newly added in the present invention, and an accompanying structure only from the minute space side It is a schematic perspective view when seen. 2A is a diagram showing a schematic configuration of a cross section of the load port and the pod when the pod is placed on the load port (mounting table) and the lid of the pod is in contact with the door. FIG. 2A shows a state in which the cross section along the line BB in FIG. 2A is viewed from the minute space side. Various configurations associated with the mounting table will be described later with reference to FIG.

  Here, the pod placed on the load port and the wafer accommodated in the pod will be described first (see FIG. 2A). Inside the main body 2a of the pod 2, a space for accommodating the wafer 1 which is an object to be processed is formed. The main body 2a has a substantially box-like shape having an opening on any one surface present in the horizontal direction. The pod 2 includes a lid 4 for sealing the opening 2b of the main body 2a. A shelf (not shown) having a plurality of steps for vertically stacking horizontally held wafers 1 is disposed inside the main body 2a, and the wafers 1 placed thereon are set at a constant interval. Housed inside the pod 2. The wafer 1 is an object to be accommodated in the present invention, the pod 2 is an accommodation container, the main body 2a is a main body defined as having a substantially box shape since the basic shape is a box, and the pod 2 The opening 2b corresponds to an opening defined as a substantially rectangular shape because the basic shape is rectangular. In the present embodiment, the pod 2 has a supply port 2d for gas supply on the bottom surface.

  The load port 51 according to the present invention includes a mounting table 53, a door 6, a first opening 10 that functions as an opening of the load port, a door opening / closing mechanism 60, and a micro space (described later). The wall 11 as one member constituting the transfer chamber 52) and the enclosure 31 newly added in the present invention. The mounting table 53 is provided with a movable plate 54 having a flat surface on the upper part, on which the pod 2 is actually mounted and capable of moving the mounted pod toward or away from the first opening 10. Including. Positioning pins 54a are embedded in the flat surface of the movable plate 54, and the positioning pins 54a are fitted into the positioning recesses 2c provided on the lower surface of the pod body 2a, whereby the position of the pod 2 and the movable plate 54 is reached. The relationship is determined uniquely.

  The mounting table 53 has a gas supply valve 53a disposed on the surface thereof in order to enable supply of purge gas to the port corresponding to the gas supply port 2d provided on the bottom surface of the pod 2. FIG. 7 shows a vertical cross section including the gas supply valve 53 a in the mounting table 53. The gas supply valve 53a is constituted by a check valve capable of supplying gas only in one direction, and in this embodiment, the gas supply ports 53a are arranged in a pair by combining the gas supply ports 2d provided on the bottom surface of the pod 2. The gas supply valve 53a is supplied via a gas supply pipe 57 from an inert gas supply system (not shown) that supplies or stops by controlling the gas pressure and flow rate. In addition, the gas supply valve 53a is fixed to the mounting table 53 via a valve up / down mechanism 55, and the supply position at which the inert gas can be supplied to the pod 2 by the valve up / down mechanism 55 is not supplied. It is moved between a lower standby position that avoids contact with the bottom surface of the pod 2.

  The first opening 10 provided in the wall 11 is a lid that closes the pod opening 2b when the pod 2 positioned on the movable plate 54 is closest to the first opening 10 by the plate. 4 is a size that fits in, that is, a rectangular shape that is slightly larger than the rectangular outer shape of the lid 4. The position where the movable plate 54 stops the pod 2 may be a position where the door 6 can remove the lid 4 of the pod 2 from the pod body 2a. The door 6 is supported by the door opening / closing mechanism 60 via the door arm 6a. The door opening / closing mechanism 60 opens the door 6 at a position where the first opening 10 is substantially closed, and completely opens the opening 10, and a transport mechanism (not shown) connects the inside of the pod 2 via the opening 10. It is possible to move between the retracted positions where the wafer 1 can be inserted and removed.

  The door opening / closing mechanism 60 includes a plurality of air cylinders (not shown) and the like, and rotates the door 6 together with the door arm 6a around a fulcrum 61. The rotation operation is performed between the closed position of the first opening 10 and the position where the door 6 takes the retracted posture when the door 6 is driven to the retracted position vertically below. Moreover, the surface 6b opposite to the surface facing the first opening 10 of the door 6 is a rectangular flat surface having a size capable of closing a second opening 31a described later. The said flat surface 6b is inclined and arrange | positioned with respect to the surface which closes the 1st opening part 10. As shown in FIG. The inclination angle is set to be parallel to the formation surface of the second opening 31a when the door 6 rotates to open the first opening 10 and takes the retracted posture. Further, the door opening / closing mechanism 60 has a lid opening / closing detection means for detecting the position of the lid 6 attached to or detached from the pod 2 by detecting the position of the door 6 and the holding / non-holding of the lid 4 by the door 6.

  The enclosure 31 includes a rectifying plate 31e on the upper side and rectifying plates 31f and 31g on both immediate sides, and has a rectangular parallelepiped shape in which one surface toward the wall 11 is an open surface. The lateral length of the space formed in the enclosure 31 (the length corresponding to the side extending in the horizontal direction of the first opening 10, that is, the width) accommodates the door 6 and the curtain nozzle 12 described later. The possible length. Further, the length in the vertical direction (the length in the direction corresponding to the side extending in the vertical direction of the first opening 10) is the case where the door 6 exists at each of the retracted position and the closed position of the first opening 10. Even if it exists, it is made the minimum length which can accommodate this, and can also accommodate the purge nozzle 21 mentioned later arrange | positioned further upper part of the upper side of the 1st opening part 10. FIG. In addition, about the baffle plates 31f and 31g of the both sides, it is good also as arrange | positioning the board | plate material for reinforcement between these, and connecting these.

  The thickness (the length of the movable plate 54 in the operation direction, that is, the depth), when the door 6 opens the first opening 10, rotates around the fulcrum 61 to take a retracted posture. The flat surface 6b opposite to the surface on the first opening 10 side of the door 6 does not interfere with the enclosure 31, and the flat surface 6b substantially closes the second opening 31a. It has a possible length. The enclosure 31 is disposed at an optimum position for accommodating the purge nozzle 21, the curtain nozzle 12 and the door 6, and forms a second minute space 30 having a substantially rectangular parallelepiped shape in cooperation with the wall 11.

A rectangular second opening 31 a is formed on the surface of the enclosure 31 that faces the first opening 10. The second opening 31 a is arranged to face the first opening 10, but the rectangular size is such that a transfer mechanism (not shown) arranged in the minute space holds the wafer 1 against the inside of the pod 2. It is preferable that the enclosure 31 has a minimum size that does not interfere with the insertion / removal operation. As a result, the second minute space 30 in the enclosure 31 is brought closer to the closed space as much as possible to obtain a state in which the space 30 and the minute space 52 are substantially separated. The retracting direction of the door 6 of the enclosure 31 is open . In the enclosure 31, purge gas is supplied vertically downward from a curtain nozzle 21 described later, but a state in which a so-called downflow is always formed in the enclosure 31 by opening the lower surface 31 b. Can be obtained.

  The curtain nozzle 12 is disposed in the uppermost part of the interior of the enclosure 31 and in the upper part of the space immediately before the first opening 10 in the interior (upper part of the upper side of the first opening). The curtain nozzle 12 is arranged to form a downflow in the second minute space 30 and to form a gas curtain immediately before the first opening 10. In the present embodiment, the curtain nozzle 12 is disposed as close as possible to the upper end surface 31d of the enclosure 31 (the surface facing the lower surface 31b described above). The curtain nozzle 12 has a rectangular parallelepiped shape having an upper and lower surface slightly smaller than the upper end surface 31d, and a plurality of nozzle openings 12b are formed on the lower surface 12a.

  In addition, a purge nozzle 21 that supplies a purge gas for purging the inside of the pod 2 is also disposed inside the enclosure 31. The purge nozzle 21 has a tubular purge nozzle body 21a extending in one direction and is connected to a purge gas supply system (not shown). The purge nozzle main body 21 a is on the side different from the mounting table on which the pod 2 is placed in the load port opening 10, adjacent to the outside of the opening on both sides of the opening 10, and parallel to the side. It arrange | positions as a pair so that it may extend.

  FIG. 3 shows a schematic configuration of the purge nozzle main body 21a, the pod 2, the wafer 1, and the enclosure 31 as viewed from above. In the purge nozzle main body 21a, a plurality of purge nozzle openings 21b are arranged at equal intervals in the extending direction so as to coincide with the accommodation interval of the wafers 1 in the pod 2 and between the wafers 1. Is preferred. Further, the purge nozzle opening 21 b is formed so as to be directed toward the center of the wafer 1. That is, the direction of gas supply from the purge nozzle is parallel to a plane extending perpendicularly to the gas supply direction from the curtain nozzle and is directed to a point that is at an equal distance from both purge nozzles in the plane. It is preferable that

  By setting the direction perpendicular to the flow direction of the curtain gas, the purge gas can be reliably supplied into the pod 2. Here, it is most effective to eject the purge gas so that the purge gas is directed toward the wafer surface. However, the gas is supplied in parallel to the wafer surface in the pod 2 because the interval between the wafers 1 is narrow. I am going to do that. The purge nozzle 21 and the curtain nozzle 12 described above are actually connected to a gas supply system (not shown), but are omitted in the drawing note for easy understanding of the configuration of the present invention. Has been. Further, since this gas supply system is a general system composed of a gas source, a regulator, and the like, description thereof is omitted here.

  In the present embodiment, the nozzle opening 12b is formed over substantially the entire lower surface 12a of the curtain nozzle 12. Therefore, when the door 6 is in the retracted position, a so-called down flow due to the curtain gas supplied from the curtain nozzle 12 is present in the space between the first opening 10 and the second opening 31 a in the enclosure 31. It will always be formed. The second minute space 30 communicates with the minute space 52 through the second opening 31a and a hole in the lower surface 31b of the enclosure in a state where the second minute space 30 communicates with the inside of the pod 2. That is, the enclosure lower surface 31b acts as a curtain gas outflow path as a gas outlet. In the present invention, the gas outlet is disposed at a position facing the curtain gas flow direction and perpendicular to the gas flow. By arranging the curtain gas outflow path on the lower surface 31b of the enclosure, it is possible to reliably bring the downflow to the lower portion of the second minute space 30 in a stable flow state.

  Curtain gas is easier to manage so-called contamination factors such as particles than gas (atmosphere) supplied into the micro space 52 via a fan filter unit described later. Therefore, by arranging the downflow due to the gas immediately before the first opening 10, the inflow of the contamination factor from the minute space 52 side to the inside of the pod 2 is more effective than the case of the conventional load port. Can be prevented.

  Here, in the minute space 52, in order to maintain a high cleanliness inside the space, a so-called down flow 63a of clean air is formed by the fan filter unit (FFU) 63 disposed in the upper portion of the space. . That is, the minute space 52 is used as a space where particle management is performed and the transport mechanism is arranged. A gas outflow path (not shown) is provided at the lower part of the minute space 52. By adjusting the air flow rate of the fan filter unit 63, the pressure inside the minute space 52 is controlled by the pressure outside the minute space. Is also slightly higher. Further, by adjusting the amount of curtain gas flowing out from the gas outflow path communicating with the minute space 52 and the amount of curtain gas and purge gas supplied from the curtain nozzle 12 and the purge nozzle 21, the second minute space 30, minute amount is adjusted. It is possible to easily create an environment in which the internal pressure decreases sequentially in the order of the space 52 and the external space.

  Actually, the pressure difference between these spaces is small. For example, when the second minute space 30 is exhausted by providing a specific exhaust path, it is actually possible to provide such a pressure difference. Have difficulty. In the present invention, the communication portion is arranged downstream of the flow of the linear purge gas, so that the gas outflow from the second microspace 30 as a gas outlet is formed in the path communicating with the microspace 52 in the lower portion of the space. The above-mentioned pressure difference is facilitated by making the main path of the above and the exhaust resistance of the path appropriate.

  In the present embodiment, the opening direction of the second opening 31 a is arranged in parallel with the flow direction of the downflow 63 a from the fan filter unit 63. Furthermore, the flow direction of the purge gas supplied from the curtain nozzle 12 is also arranged in parallel with the opening direction of the second opening 31a. Since the flow of the purge gas and the flow of the down flow 63a are parallel and a slight difference in flow velocity is maintained from the viewpoint of maintaining a slight differential pressure, the so-called Venturi effect is slight. Therefore, the atmosphere drawn into the second microspace 30 from the microspace 52 by the Venturi effect is slightly suppressed. On the other hand, since the gas existing inside the pod 2 does not flow originally and the flow velocity difference between the air flow and the curtain gas is large, the effect of drawing the gas inside the pod 2 to the second micro space 30 side by the Venturi effect. Can be expected. By performing the effect and the supply of the purge gas in parallel, the purge operation inside the pod 2 can be performed more efficiently.

  For example, when a processed wafer is accommodated in a pod and the processed wafer is inserted into and removed from the pod, the gas used during processing attached to the wafer surface is desorbed from the surface and contaminates the minute space 52. It is possible to do. In the present invention, the desorbed gas is removed from the vicinity of the wafer surface by the purge gas, and is transported from the second microspace 30 to the microspace 52 by the curtain gas through the gas outlet described above. The gas can be carried out to the outside of the micro space 52 through a discharge unit (not shown) that discharges the downflow 63a from the inside of the micro space 52 to the external space (formed on the lower or lower surface of the micro space 52). . Therefore, the gas derived from the wafer is reduced not as much as possible from the wide microspace where the flow velocity of the downflow is low in the conventional configuration but through the second microspace where the flow velocity of the downflow is narrow and low, and the time passing through the microspace is reduced as much as possible. Will be excluded to the external space. That is, by simultaneously causing the curtain gas and the purge gas flowing in different directions, the inside of the pod 2 including the processed wafer can be more efficiently purged.

  In addition, when gas is supplied to a specific space by a normal nozzle or the like, the gas in the vicinity of the nozzle is entrained by the previous Venturi effect, and as a result, the purity of the supplied gas decreases immediately after discharge from the nozzle or the like. To do. In the present invention, both the curtain nozzle 12 and the purge nozzle 21 are provided with a wall constituting the enclosure 31 behind them. Therefore, there is no possibility that the atmosphere is supplied to the vicinity of these nozzles from the outside of the enclosure 31, and by performing the gas discharge operation for a certain period of time, it is possible to reduce the gas existing around the nozzle as much as possible other than the predetermined gas. Become. That is, it is possible to supply a gas having high purity from the nozzle.

  Another object of the present invention is to suppress an increase in the partial pressure of the oxidizing gas inside the pod 2 in a so-called standby state in which the lid is fixed to the pod 2. In the present embodiment, in the so-called purge operation inside the normal pod 2, the supply of a large flow of inert gas from the purge nozzle 21 is mainly used. The flow rate is, for example, 300 L / min, so that the partial pressure of the oxidizing gas inside the pod 2 can be reduced to a predetermined value or less in a short time. Further, in the standby state, the increase in the partial pressure of the oxidizing gas is due to a minute leak that is not allowed in nature, so that it is not necessary to supply an inert gas at a large flow rate. In this embodiment, a low flow rate that is unlikely to cause the raising of dust or the like having a size that may cause a problem from the gas supply valve 53a and the gas supply port 2d, for example, from all the supply ports and supply valves. The inert gas is supplied at a total flow rate of 1 to 60 L / min. The low flow rate may be a low flow rate, for example, when the flow rate of the gas supplied from the purge nozzle is a large flow rate. With respect to the above flow rate, when viewed with a single supply port and supply valve, an inert gas is supplied at 1 to 20 L / min. By setting the flow rate at a single supply port and supply valve to 1 to 20 L / min, it is possible to suppress or prevent local dust from being wound up in the region where the supply port and supply valve in the pod 2 are located. It becomes possible.

  If it is the said flow volume, even if the pipe diameter of the gas supply piping 57 is slight, it will become possible to suppress the partial pressure rise of oxidizing gas at the low flow rate which can suppress the dust raising. More specifically, since dust of a size that may cause a problem in the wiring formed on the wafer becomes a problem, it is possible to suppress the raising of the dust from the gas supply port 2d and the like at a low flow rate and low pressure. Control is performed to supply nitrogen. In the present embodiment, the flow rate is selected based on the conditions and the minimum supply amount for maintaining the inside of the pod 2 at a constant positive pressure (pressure higher than the external space) from the external space during standby.

  In the present embodiment, in the state where the lid 4 is removed, the supply of the inert gas from the path cannot be expected to have a great effect. Rather, the supply from the purge nozzle 21 is preferable. The inert gas is supplied at a suitable timing. More specifically, after detecting that the opening 2b is closed by the lid 4 by the lid opening / closing detection means described above, the control means causes the inert gas supply system to start supply in response thereto. It is an aspect. Further, in the present embodiment, an example in which only a pair of configurations including the gas supply valve 53a is used is exemplified. However, as will be described later, the configuration is increased according to the internal volume of the pod 2 or the required partial pressure of the oxidizing gas. Also good. It is also possible to add a new exhaust port for exhausting the gas inside the pod 2 to further reduce the partial pressure of the oxidizing gas even during the standby time.

  According to the present invention, even if the internal gas leaks in a state where the lid of the pod is closed and the external gas can enter, the gas supply from the port continues to supply the oxidizing gas. An increase in partial pressure can be suppressed. For example, when the processing time of a single wafer is long, it may be possible to close the lid appropriately and wait for the end of one process in a standby state. Conventionally, as the standby time becomes longer, the partial pressure of the oxidizing gas inside the pod increases, and the oxidation of the wafer surface may progress. However, according to the present invention, even when the standby state becomes long, the partial pressure of the oxidizing gas is always maintained at a predetermined value or less, and the effect of keeping the quality of all the wafers in the pod uniform is obtained. It is done.

  A simulated second microspace in which the partial pressure of not only particles but also the oxidizing gas is controlled between the microspace where the particles are controlled but the oxidizing gas partial pressure is not controlled and the inside of the pod. By providing this, the amount of oxidizing gas diffusing from the minute space into the pod can be greatly suppressed as compared with the conventional configuration. Further, the second minute space and the minute space are communicated by the gas outlet, and the gas in the second minute space flows out into the minute space according to the pressure difference between these spaces, and from the pod wall surface. By supplying the inert gas to the inside, it is possible to easily generate a pressure difference between the second micro space, the micro space, and the atmosphere around the micro space with a simple configuration. Thereby, it is possible to effectively suppress the diffusion of the oxidizing gas from the minute space into the pod.

  In the second minute space, a down flow is formed by a purge gas, and a so-called gas curtain is formed by the down flow. Thereby, it is possible to effectively prevent atmospheric diffusion or particle scattering from the minute space toward the pod. Furthermore, when the effect is combined with the above-described effect of generating the pressure difference, a large amount of purge gas that prevents the invasion of the oxidizing gas into the pod simply by supplying the purge gas into the pod is required. Or, compared with the conventional configuration in which a gas curtain is formed by supplying a large amount of purge gas from one side and sucking and exhausting the gas from the other side, a low partial pressure of oxidizing gas equal to or higher than that by a very small amount of purge gas A maintenance effect is obtained.

  Here, it is known that when a gas is ejected from a nozzle, the gas entrains another gas existing in the vicinity of the nozzle opening and forms a gas mixture to form a gas flow. In other words, when the gas curtain is formed, the gas around the nozzle entrains the gas, so that the concentration of the purge gas such as an inert gas constituting the gas curtain is lowered, and the oxidizing gas is supplied from the gas curtain into the pod. There is a fear. According to the present invention, the purge gas is supplied from a purge nozzle different from the curtain nozzle after the second minute space having a small volume, which is substantially closed by the enclosure and the door, is filled with the purge gas to some extent by the gas curtain. Therefore, even if the purge gas supplied from the purge nozzle entrains the gas around the purge nozzle, the gas having a low partial pressure of the original oxidizing gas is entrained, and a decrease in the purity of the purge gas can be suppressed.

  Further, the periphery of the curtain nozzle is also surrounded by the enclosure, and the periphery of the curtain nozzle can be easily filled with the purge gas having a certain degree of purity. The same applies to the purge nozzle. Since the periphery is surrounded by the enclosure, the periphery of the nozzle can be easily filled with a purge gas having a certain degree of purity. Due to the above effects, an effect of suppressing the partial pressure of the oxidizing gas in the gas introduced to the periphery of the pod as compared with the conventional case can be obtained.

  Next, the operation of the configuration when the wafer 1 is actually inserted into and removed from the pod 2 will be described. When the pod 2 is placed on the placing table 53, the door 6 substantially closes the first opening 10. In the present embodiment, the door 6 is sized to form a gap that allows the minute space 52 and the external space to communicate with each other when the door 6 is in a position to close the first opening 10. Therefore, in this embodiment, the door 6 can only substantially close the first opening 10. After placing the pod 2, the movable plate 54 moves toward the first opening 10 and stops at a position where the lid 4 is brought into contact with the door 6. The door 6 holds the lid 4 by an engagement mechanism (not shown). Here, the formation of the downflow in the minute space 52 by the fan filter unit 63 and the formation of the downflow in the second minute space 30 by the gas supply from the curtain nozzle 12 are performed by placing the pod 2. It has always been done from before.

  As described above, the flat portion 6b provided on the back side of the door 6 is inclined and arranged so as to approach the second opening 31a as the distance from the curtain nozzle 12 increases with respect to the flow of the gas constituting the gas curtain. Has been. Moreover, the lower end part of the flat part 6b is comprised so that it may be located below rather than the lower side which comprises the 2nd opening part 31a. The internal pressure of the second micro space 30 divided by the enclosure 31 is made higher than the pressure inside the micro space 52 by the gas supply from the curtain nozzle 12. In addition to the pressure difference, the inclined surface of the flat portion 6b changes the direction of the gas curtain so that a part of the inclined surface flows into the minute space 52, so that particles from the minute space 52 side to the second minute space 30 side, etc. Is more effectively prevented.

  Subsequently, the door opening / closing mechanism 60 rotates the door arm 6 a about the fulcrum 61 to cause the door 6 to take the retracted position shown in FIG. 4A, so that the pod 2 is partially with respect to the second minute space 30. Let open. 4A and FIG. 4B to be described later show a state in which the periphery of the enclosure 31 is viewed from the side surface in the same manner as in FIG. 2A. From this point, supply of purge gas from the purge nozzle 21 is started. The door opening / closing mechanism 60 retracts the door 6 to the retracted position which is the lowermost end in the enclosure 31 while maintaining the retracted posture with respect to the door 6. FIG. 4B shows a state where the door 6 is disposed at the retracted position. In this state, the opening 2b of the pod 2 is opened, and the wafer 1 can be transferred to the inside of the pod 2 by a transfer mechanism (not shown) disposed in the minute space 52 through the second opening 31a.

  FIG. 4C shows a schematic configuration in a state where the first opening 10 is viewed from the minute space 52 side in the same manner as FIG. 2B. A gas similar to the purge gas is supplied from the curtain nozzle 12 so as to form a downflow parallel to the wall 11. Further, the purge gas is supplied from each of the pair of purge nozzles 21 so that the purge gas flows toward the center of the wafer 1 accommodated in the pod 2. In this state, the wafer 1 is transferred. During the transfer operation, the purge operation for the inside of the pod 2 is continuously performed, and the partial pressure of the oxidizing gas inside the pod is kept low. After the operation of loading the wafer 1 to be accommodated into the pod 2 is completed, the following closing operation of the lid 4 is performed.

  In the closing operation, the door opening / closing mechanism 60 raises the door 6, and the door 6 shown in FIG. 4A stops rotating and returns to the position where the retracted posture is taken. In this state, the door opening / closing mechanism 60 temporarily stops operating, and maintains the door 6 in the posture before rotation. At that time, the flat surface 6 b provided on the back side of the door 6 is in close contact with the periphery of the second opening 31 a of the enclosure 31 to increase the degree of closing of the second minute space 30. Further, the lid 4 held by the door 6 is positioned at a certain angle with respect to the gas curtain, and changes the gas flow direction from the downward direction of the enclosure to the inside of the pod.

  Improvement in the degree of closure of the enclosure 31 facilitates improvement in the partial pressure of the purge gas existing in the space including the second minute space 30 and the inside of the pod 2. Further, since the curtain gas can be directly used for purging the inside of the pod 2, the purging efficiency inside the pod 2 can be further increased. The state shown in FIG. 4A is maintained for a predetermined time, and after the inside of the pod 2 is sufficiently purged to sufficiently reduce the amount of oxidizing gas in the space, the door opening / closing mechanism 60 rotates the door 6. The pod opening 2 a is closed by the lid 4. By the above operation, the wafer 1 can be sealed in the pod 2 at a low oxidizing gas concentration that cannot be obtained by the conventional configuration.

  Subsequently, the lid opening / closing detection means detects the closing of the opening 2b by the lid 4, and notifies this to the control means. The control means instructs the inert gas supply system to supply the inert gas in response to the notification of the closure detection. The inert gas supply system starts supplying inert gas into the pod 2 at a predetermined flow rate or flow rate via the gas supply valve 53a and the gas supply port 2d. Further, the control means also instructs the reduction or stop of the flow rate to the configuration in which the inert gas is supplied to the purge nozzle 21. This suppresses or reduces the use of unnecessary inert gas. By performing the above operations, it is possible to achieve both a reduction in the partial pressure of the oxidizing gas inside the pod 2 and its maintenance in the atmospheric state by using an inert gas in a necessary and sufficient amount.

  In the above-described operation, when the wafer insertion / removal operation is performed, the door 6 is retracted from the start to the end of insertion / removal of all the wafers. Here, when purging the inside of the pod 2 quickly and effectively, a large amount of purge gas is supplied to the purge space to increase the pressure of the space, and the gas existing before that can be quickly discharged. Necessary. However, when the second opening 31a is in an open state as in the above operation, it is difficult to extremely increase the internal pressure of the second minute space 30. In addition, when the open time is long, the partial pressure of the oxidizing gas inside the pod 2 may gradually increase due to the diffusion of the atmosphere from the minute space 52. In such a case, each time one wafer 1 is inserted / removed, the door 6 is lifted from the retracted position and positioned at the substantially closed position of the second opening 31a shown in FIG. It is desirable to purge the inside and the inside of the pod 2 in a substantially sealed state. Thereby, it becomes possible to effectively suppress an increase in the partial pressure of the oxidizing gas.

  In the above embodiment, the curtain nozzle 12 has a rectangular parallelepiped shape, and gas ejection holes are provided in the entire lower surface thereof. However, the shape, arrangement, or number of the ejection holes depends on the flow rate of the gas to be supplied and the number of the gas ejection holes. It is desirable to change appropriately according to the volume of the second minute space 30 or the like. Similarly, the purge nozzle 21 is preferably changed as appropriate in the shape and arrangement of the gas jetting opening 21b. Moreover, although the door 6 is supposed to substantially close the first opening 10, the door 6 may be configured to be completely closed. Further, the lower surface 31b of the enclosure is opened as a gas outlet provided facing the curtain gas flow direction. The configuration of the lower surface 31b is, for example, a mesh, a structure provided with a specific slit, a hole of a punching metal, or the like. Any structure that does not interfere with the formation of the downflow and the operation of the door 6 and exhibits a certain amount of exhaust resistance may be used.

  Further, from the viewpoint of preventing generation of particles or the like, the rotation amount of the door 6 is determined so that the wall around the second opening 31a in the enclosure 31 and the flat surface 6b approach but do not come into contact with each other. However, when purging the inside of the second minute space 30 and the inside of the pod 2 at the same time, it is more preferable that the space between the flat surface 6b and the enclosure 31 is sealed. In this case, the rotation range of the door 6 may be divided into two stages, and a difference may be provided between the purge operation and the door 6 when retracted, and these components may be in close contact with each other only during the purge operation. Alternatively, a seal member that expands or contracts by introducing or discharging fluid, for example, may be disposed on the outer periphery of the flat surface 6b. In this case, the seal member may be expanded only at the time of the purge operation, and the seal member may be brought into close contact with the enclosure 31 to obtain the above-described adhesion, and the contact with the enclosure 31 can be released by contraction.

  Next, other embodiments of the present invention will be described. In the above-described embodiment, the configuration in which gas is supplied to the pod 2 from the gas supply valve 53a disposed on the mounting table 53 via the supply port 2d is illustrated. In this embodiment, not only the gas is supplied to the pod 2 but also the gas is discharged from the pod 2 whose internal pressure is increased by the gas supply, and a flow of clean gas is formed in the pod 2. The partial pressure of the effective oxidizing gas is reduced. FIG. 8 shows an example of this embodiment, and shows each of the gas supply valve 53 a and the gas discharge valve 53 b arranged on the upper surface of the mounting table 53. In FIG. 8, the first opening 10 is arranged in the upper part of the figure. Each of these valves has a structure similar to the structure illustrated in FIG. 7, and ports corresponding to these valves are also arranged on the bottom surface of the pod 2. In this embodiment, the case where there are three gas supply valves 53a and one gas discharge valve 53b is illustrated.

  In this embodiment, the gas discharge valve 53b is discharged from a gas discharge system (not shown) via a gas discharge pipe arranged in the same manner as the gas supply pipe 57, but the inside of the pod 2 except for the gas discharge system. It is also possible to discharge gas using the pressure of Moreover, regarding the control means arranged in the previous embodiment, the gas discharge valve 53b may be operated according to the operation of the gas supply valve 53a. Alternatively, the gas discharge valve 53b may be a so-called differential pressure valve or the like, and may be in an open state when the inside of the pod 2 becomes higher than a predetermined pressure. Further, in order to prevent dust and the like from entering the gas supply pipe via the gas supply valve 53a, a filter or the like may be provided for the gas supply valve 53a. By arranging a filter or the like in the gas supply line in this way, it is possible to suppress dust from being brought in when an inert gas is supplied into the pod 2 from the line.

  It should be noted that various changes can be made depending on the form in which only a part of these valves are used, the form in which the number of supply and discharge is changed, such as the internal volume of the pod 2 and the required partial pressure of the oxidizing gas. is there. As an example, it is possible to adopt a form in which one is used as the gas supply valve 53a, one is used as the gas discharge valve and 53b, and the other two are not used. Further, the total number and arrangement of each valve can be changed in the same manner, for example, by increasing the number of valves by 8 or the like, or by making the gas supply valve 53a the deepest part of the pod 2 and closest to the side wall. Forms such as positioning are also conceivable. Further, in these embodiments, the valves and ports are arranged only on the bottom surface of the pod 2 in consideration of compatibility with the current load port device, but some or all of them are on the side surface, top surface, or lid side. Similar effects can be obtained by arranging them.

  In the above-described embodiment, the supply amount of the inert gas from the purge nozzle 21 is 300 L / min, and the supply amount from all the supply valves is 1 to 60 L / min with respect to the inert gas supply amount from the gas supply valve 53a. The case where the supply amount from a single supply valve is 1 to 20 L / min is illustrated. However, the actual supply amount of the inert gas from the purge nozzle 21 is actually controlled between 60 and 300 L / min depending on the required pod internal volume, oxidizing gas partial pressure, and the like. Therefore, in accordance with these conditions and according to changes in the number and arrangement of the gas supply valves 53a as in this embodiment, the actual control is performed in the range of 1 to 60 L / min. The supply amount of the inert gas via the gas supply valve 53a is preferably larger in consideration of the time required to reduce the partial pressure of the oxidizing gas to a desired value or less. In view of the above, a smaller one is preferable. In consideration of the characteristics of each of the above inert gas supply systems, it is most preferable to control the amount of inert gas supplied from the gas supply valve 53a in the range of 1 to 45 L / min.

  In the present embodiment, the case where both the supply of the inert gas from the purge nozzle and the supply of the inert gas using the supply valve and the supply port are described as an example. However, the embodiment of the present invention is not limited to this. It is not limited to form. For example, it is possible to supply the inert gas using only the supply valve and the supply port without supplying the inert gas from the purge nozzle. Even in this case, regarding the gas supply amount, the total amount is set to 1 to 60 L / min, or the supply amount with a single supply valve is set to 1 to 20 L / min, thereby preventing the dust and the like from being wound up. Can be obtained. Furthermore, as in the present embodiment, by satisfying both the conditions that the supply amount as a total amount is 1 to 60 L / min and the supply amount from a single supply valve is 1 to 20 L / min, dust and the like are more suitably It is possible to obtain the effect of preventing the hoisting. In addition, the work efficiency is improved by combining with the inert gas at the purge nozzle as described above, but from the viewpoint of preventing dust and the like from being raised, the supply of the inert gas through the supply port / supply valve is mainly used. Thus, it is possible to obtain the effect of reducing the time required for purging and simultaneously suppressing the generation of dust.

  Next, a FIMS system which is an actual lid opening / closing system embodying the present invention and a semiconductor wafer processing apparatus using the system will be described. FIG. 5 is a diagram showing a schematic configuration of a semiconductor wafer processing apparatus 50 corresponding to a so-called mini-environment system. The semiconductor wafer processing apparatus 50 mainly includes a load port unit (FIMS system, lid opening / closing device) 51, a transfer chamber (microspace) 52, and a processing chamber 59. Each joint portion is partitioned by a partition and cover 58a on the load port side and a partition and cover 58b on the processing chamber side. In order to discharge dust in the transfer chamber 52 in the semiconductor wafer processing apparatus 50 and maintain high cleanliness, an air flow (down flow) is directed downward from above the transfer chamber 52 by the fan filter unit 63 provided on the upper portion thereof. Is generated. A down-follow discharge path is provided on the lower surface of the transfer chamber 52. With the above configuration, dust is always discharged downward.

  On the load port portion 51, the pod 2 as a storage container for a silicon wafer or the like (hereinafter simply referred to as a wafer) is installed on the mounting table 53. As described above, the inside of the transfer chamber 52 is kept highly clean in order to process the wafer 1, and a robot arm 55 that can actually hold the wafer in the transfer mechanism is provided therein. It has been. With this robot arm 55, the wafer is transferred between the inside of the pod 2 and the inside of the processing chamber 59. The processing chamber 59 normally includes various mechanisms for performing processing such as thin film formation and thin film processing on the wafer surface and the like, but these configurations are not directly related to the present invention. Description is omitted.

  As described above, the pod 2 has a space for accommodating the wafer 1 as an object to be processed therein, and has a box-shaped main body 2a having an opening on any one surface, and a lid 4 for sealing the opening. It has. A shelf having a plurality of steps for stacking the wafers 1 in one direction is arranged inside the main body 2a, and each of the wafers 1 placed therein is accommodated in the pod 2 with a constant interval. In the example shown here, the direction in which the wafers 1 are stacked is the vertical direction. The opening 10 and the enclosure 31 described above are provided on the load port portion 51 side of the transfer chamber 52. The opening 10 is arranged at a position facing the opening of the pod 2 when the pod 2 is arranged on the load port unit 51 so as to be close to the opening 10. In addition, the main structure which concerns on this invention, such as the enclosure 31 and the door 6, is abbreviate | omitted description and illustration here from the viewpoint of making it easy to understand what is described in the said embodiment and drawing.

  6A and 6B show an enlarged side sectional view of the door 6 and the door opening / closing mechanism 60 in the apparatus and a front view seen from the side of the transfer chamber 52, respectively. FIG. 6C shows a schematic side sectional view of the state where the lid 4 is removed from the pod 2 using the door opening / closing mechanism 60. A fixing member 46 is attached to the door 6, and the door 6 is rotatably connected to one end of the door arm 6 a via the fixing member 46. The other end of the door arm 6a is rotatably supported with respect to the pivot 40 via the pivot 40 with respect to the tip of the rod 37 which is a part of the air-driven cylinder.

  A through hole is provided between the one end and the other end of the door arm 42. A pin 61 (not shown) penetrates the hole and the hole of the fixing member 39 fixed to the support member 60 of the movable portion 56 that moves up and down the door arm 42 and the like to open and close the door. Yes. Therefore, the door arm 42 can rotate around the fulcrum 61 according to the expansion and contraction of the rod 37 by driving the cylinder. A fulcrum 61 of the door arm 42 is fixed to a support member 60 provided on a movable portion 56 capable of moving up and down.

  When processing the wafer 1 with these configurations, the wafer 1 is first placed on the mounting table 53 so as to be close to the transfer chamber opening 10, and the lid 4 is held by the door 6. An engagement mechanism (not shown) is arranged on the surface of the door 6 and an engaged mechanism (not shown) is arranged on the surface of the lid 4. The surfaces of the lid 4 and the door 6 are in contact with each other. The lid 4 is held by the door 6 by operating these mechanisms in the above state. Here, when the rod of the cylinder 57 is contracted, the door arm 42 moves around the fulcrum 61 so that the door 6 moves away from the first opening 10. By this operation, the door 6 rotates together with the lid 4 to remove the lid 4 from the pod 2. This state is shown in FIG. 6C. Thereafter, the movable portion 56 is lowered to transport the lid 4 to a predetermined retracted position. Since the transfer operation is described in the above-described embodiment, a description thereof is omitted here.

  In this embodiment, FOUP and FIMS are described as examples, but application examples of the present invention are not limited to these. The lid opening and closing device according to the present invention is applied to a front open type container that accommodates a plurality of objects to be held therein and a system that opens and closes the lid of the container and inserts and removes the objects to be held from the container. In addition, the partial pressure of the oxidizing atmosphere inside the container can be maintained at a low pressure. Further, when using a specific gas having a desired characteristic instead of an inert gas as a gas filling the container, the partial pressure of the specific gas inside the container is set using the lid opening / closing system according to the present invention. It is also possible to maintain a high altitude.

  According to the present invention, it is possible to obtain the space shielding effect by the enclosure and the effect of suppressing the entry of external gas by supplying the purge gas from the gas curtain or the like. Further, by supplying the purge gas toward the wafer separately from the gas curtain, it is possible to effectively suppress an increase in the partial pressure of the oxidizing gas in the pod. In addition, the present invention can be implemented only by adding an enclosure, a curtain nozzle, a purge nozzle, etc. to an existing FIMS system, and can be easily and inexpensively attached to a standardized system.

  1: wafer, 2: pod, 2a: main body, 2b: opening, 2c: positioning recess, 2d: gas supply port, 4: lid, 6: door, 6a: door arm, 6b: flat surface, 10: first opening 11: Wall, 12: Curtain nozzle, 12a: Curtain nozzle lower surface, 12b: Nozzle opening, 21: Purge nozzle, 21a: Purge nozzle body, 21b: Purge nozzle opening, 30: Second minute space, 31: Enclosure, 31a: second opening, 31b: lower surface, 31d: upper end surface, 31e, 31f, 31g: current plate, 37: rod, 40: pivot, 46: fixing member, 50: semiconductor processing apparatus, 51: load port, 52: transfer chamber (microspace), 53: mounting table, 53a: gas supply valve, 53b: gas discharge valve, 54: movable pump 54a: positioning pin, 55: robot arm, 56: movable part, 57: gas supply pipe, 58a, 58b: partition and cover, 60: door opening / closing mechanism, 61: fulcrum, 63: fan filter unit, 63a: down flow

Claims (8)

A substantially box-shaped main body capable of accommodating an object to be contained therein and having an opening on one side thereof; a lid which is separable from the main body and closes the opening to form a sealed space with the main body; Removing the lid from a storage container provided with at least one supply port capable of supplying gas from the outside provided on the wall surface, thereby enabling the opening to be opened and insertion / removal of the objects to be stored A lid opening and closing system comprising:
A mounting table on which the container is mounted;
A minute space that is disposed adjacent to the mounting table and that accommodates a mechanism for transporting the object to be contained by managing particles.
A substantially rectangular shape that is formed on a wall that defines a part of the micro space adjacent to the mounting table, and that is provided in an arrangement that can face the opening in the storage container mounted on the mounting table. A first opening;
The lid can be held and the first opening can be substantially closed, and the opening and the first opening are communicated by holding the lid and opening the first opening. Door to make
Open / close detecting means for detecting opening / closing of the opening using the lid by the door;
A supply valve for supplying gas into the container in cooperation with the supply port;
A gas supply system for supplying a predetermined gas at a flow rate of 1 to 60 L / min as a total of the flow rates supplied through the supply port and the supply valve in a state where the storage container is placed on the mounting table. When,
A purge nozzle capable of supplying the predetermined gas to the storage container through the opening of the storage container;
Have a, and control means for controlling the supply of the predetermined gas from said supply of said predetermined gas through the supply port and the supply valve purge nozzle,
The control means, in response to closing of the opening the open-close detection unit detects, Ru said switched from the supply of the predetermined gas to the supply of the predetermined gas through the supply port and the supply valve from the purge nozzle A lid opening and closing system characterized by that. Further comprising an exhaust valve capable of discharging the gas inside the container in cooperation with an exhaust port provided in the container;
2. The lid opening / closing system according to claim 1, wherein the exhaust valve is a differential pressure valve that is opened when a pressure inside the storage container becomes higher than a predetermined pressure . The container has at least one discharge port that allows discharge of gas to the outside provided on the wall surface of the main body,
Cover opening and closing system according to claim 1 or 2, characterized by further comprising a discharge valve for discharging the gas from the interior of the container in cooperation with the discharge port. It arrange | positions in the said micro space continuously with said 1st opening part, covers the movement space of the said door, comprises a 2nd micro space, and makes the said 1st opening part and the said micro space communicate. An enclosure having a second opening through which the mechanism for transporting the object to be stored can pass along with the object to be stored;
A curtain nozzle disposed inside the enclosure and above the upper side of the first opening, and capable of supplying the predetermined gas along a direction from the upper side toward the lower side of the first opening; Have
The enclosure according to any one of claims 1 to 3 wherein the predetermined gas into the small space along the direction of flow the predetermined gas is characterized by having a gas outlet which can flow out Lid opening / closing system. A substantially box-shaped main body capable of accommodating an object to be contained therein and having an opening on one side thereof; a lid which is separable from the main body and closes the opening to form a sealed space with the main body; A plurality of supply ports that enable gas supply from the outside provided on the wall surface, and by removing the lid from the storage container, the opening is opened to allow insertion and removal of the object to be stored. A lid opening and closing system comprising:
A mounting table on which the container is mounted;
A minute space that is disposed adjacent to the mounting table and that accommodates a mechanism for transporting the object to be contained by managing particles.
A substantially rectangular shape that is formed on a wall that defines a part of the micro space adjacent to the mounting table, and that is provided in an arrangement that can face the opening in the storage container mounted on the mounting table. A first opening;
The lid can be held and the first opening can be substantially closed, and the opening and the first opening are communicated by holding the lid and opening the first opening. Door to make
Open / close detecting means for detecting opening / closing of the opening using the lid by the door;
A supply valve for supplying gas into the container in cooperation with the supply port;
Regard flow rate of the supply port and the supply valve in a state in which the container is placed on the mounting table, a predetermined gas flow rate supplied via a single said supply port and the supply valve as 1~20L / min A gas supply system for supplying
A purge nozzle capable of supplying the predetermined gas to the storage container through the opening of the storage container;
Have a, and control means for controlling the supply of the predetermined gas from said supply of said predetermined gas through the supply port and the supply valve purge nozzle,
The control means, in response to closing of the opening the open-close detection unit detects, Ru said switched from the supply of the predetermined gas to the supply of the predetermined gas through the supply port and the supply valve from the purge nozzle A lid opening and closing system characterized by that. Further comprising an exhaust valve capable of discharging the gas inside the container in cooperation with an exhaust port provided in the container;
The lid opening / closing system according to claim 5 , wherein the exhaust valve is a differential pressure valve that is opened when a pressure inside the storage container becomes higher than a predetermined pressure . The container has at least one discharge port that allows discharge of gas to the outside provided on the wall surface of the main body,
The lid opening / closing system according to claim 5 or 6 , further comprising a discharge valve for discharging gas from the inside of the container in cooperation with the discharge port. It arrange | positions in the said micro space continuously with said 1st opening part, covers the movement space of the said door, comprises a 2nd micro space, and makes the said 1st opening part and the said micro space communicate. An enclosure having a second opening through which the mechanism for transporting the object to be stored can pass along with the object to be stored;
A curtain nozzle disposed inside the enclosure and above the upper side of the first opening, and capable of supplying the predetermined gas along a direction from the upper side toward the lower side of the first opening; Have
The enclosure according to any one of claims 5-7 wherein the predetermined gas into the small space along a direction in which the predetermined gas flow and having a gas outlet which can flow out Lid opening / closing system.

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