TWI706525B - Apparatus for reducing moisture of front opening unified pod in load port module and semiconductor process device comprising the same - Google Patents

Abstract

The invention relates to a humidity reduction device for a wafer container of a load port module and a semiconductor manufacturing process device provided with the same. The humidity reduction device is arranged on the load port module and in front of the wafer container to form air at the entrance and exit of the wafer The film is used to reduce the humidity of the wafer container. It includes: the main body, which is arranged on the upper front of the wafer container; the air blowing part, which blows air by supplying air to the inside of the main body; and the dispersing part, which is arranged on the lower part of the main body, The air supplied to the inside of the main body portion is discharged straight downward and uniformly dispersed to form an air film. Therefore, by providing a main body, a blower, and a dispersing part in front of the wafer container of the load port module of the present invention, and forming an air film at the entrance and exit of the wafer container, it is possible to provide a blocking air film at the entrance and exit to block external air. Inflow to reduce the humidity of the wafer container.

Description

Humidity reducing device for front-opening wafer transfer box of load port module and semiconductor manufacturing process device with same

The present invention relates to a humidity reduction device for a wafer container of a load port module and a semiconductor process device provided with the same, in particular to the formation of an air film at the entrance and exit of the wafer in front of the wafer container provided on the load port module The humidity reduction device of the wafer container of the load port module to reduce the humidity of the wafer container and the semiconductor process device provided with the same.

As far as the semiconductor manufacturing process is concerned, wafers and semiconductor components formed on the wafers are high-precision items, so care should be taken to avoid damage from external contaminants and impacts during storage and handling. In particular, during the storage and handling of wafers, management is required to prevent the surface from being contaminated by impurities such as dust, moisture, and various organic substances.

In the past, in order to improve the yield and quality of semiconductor manufacturing, wafer processing was performed in an absolute clean room. However, with the progress of highly integrated components, miniaturization, and large-scale wafers, there are difficulties in terms of cost and technology in terms of an absolute clean room with a large management space.

In response to this, recently, instead of improving the overall cleanliness of the clean room, a cleaning method that applies a mini-environment is a method of intensively improving the cleanliness of a local space around the wafer.

On the other hand, various unit processes such as etching, deposition, and etching are repeated in sequence in the semiconductor manufacturing process. During each process, foreign matter or contaminants will remain on the wafer, which may cause defects or reduce the yield of the semiconductor process.

Therefore, in the semiconductor manufacturing process, the wafer is moved to multiple processing chambers or semiconductor processing spaces. At this time, there is a device for minimizing the adhesion of foreign matter or contaminants during the movement of the wafer from one processing space to another. Various devices on the wafer.

The semiconductor process equipment including the Equipment Front End Module (EFEM), as shown in Figure 1, includes a load port module (110; LPM (Load Port Module)), a wafer container (120; FOUP (Front Opening) Unified Pod), fan filter unit (130; FFU (Fan Filter Unit)) and wafer transfer chamber 140.

In order to store wafers in a high-definition environment, a wafer container 120 called Front-Opening Unified Pod (FOUP) is used to move the wafer from the wafer container 120 to the semiconductor processing space. A wafer transfer chamber 140 is formed, and the wafer transfer chamber 140 is maintained as a clean space by the fan filter unit 130.

The wafers in the wafer container 120 are transported into the wafer transport chamber 140 or received from the wafer transport chamber 140 through the load port module 110 through a wafer transport unit such as a robot arm installed in the wafer transport chamber 140 Into the wafer container 120 is constructed.

The door 111 of the load port module 110 and the door provided in front of the wafer container 120 are opened at the same time in a state where they are in close contact with each other, and the wafers are carried out or stored through the open area.

Generally, the surface of a wafer that has undergone a semiconductor processing process will have residual fumes (fume) generated after the process, and a chemical reaction will occur as a result, resulting in a decrease in the productivity of the semiconductor wafer.

In addition, when the door of the wafer container 120 is opened for carrying out or storing wafers, the concentration of the purge gas inside the wafer container 120 is controlled to maintain a certain level, and the outside air flowing into the wafer container is filtered .

However, due to the external air flowing into the wafer container 120, there is unfiltered air inside the wafer container 120. Although the atmospheric environment of the wafer transfer chamber 140 is clean air with controlled particles, it contains oxygen, moisture, etc. In addition, the air flows into the wafer container 120 to increase the internal humidity, and the surface of the wafer may be oxidized by the moisture or oxygen contained in the external air.

Therefore, as a means to effectively block the flow of external air from the wafer transfer chamber 140 into the wafer container 120, the opening and closing of the load port module 110 and the cover of the wafer container 120 have previously provided a double door opening and closing means, which can block Outside air, there is a problem that the structure of the loading port becomes quite complicated due to the door assembly that slides up and down.

Not only that, as the door assembly is moved up and down to block external air, the wafer is moved The time required for delivery and storage has increased a lot, so the internal humidity of the wafer container changes, which leads to the problem of reduced semiconductor manufacturing yield.

In particular, in the wafer container 120, external air flows into the wafer container 120 through the inlet and outlet of the wafer to increase the humidity inside the inlet and outlet, and the surface of the wafer is damaged by the moisture or oxygen contained in the external air. There is a problem that leads to a decrease in yield.

[Prior Technical Document]

[Patent Document]

Korean Published Patent No. 10-2003-0011536 (February 11, 2003)

Korea Public Utility Model No. 20-2017-0003211 (September 15, 2017)

Korean Registered Patent No. 10-1924185 (November 30, 2018)

The present invention is proposed in order to solve the above-mentioned conventional problems, and its object is to provide a wafer container with a load port module that can block the inflow of external air by forming an air blocking film at the entrance and exit to reduce the humidity of the wafer container The humidity reduction device and the semiconductor process device equipped with it.

In addition, another object of the present invention is to provide a method for forming multiple air films through the downward flow of the air blowing section and the upward flow or inward flow of the nozzle section, which can reduce the interference caused by the air flow in the wafer transfer chamber. The humidity reduction device of the wafer container of the load port module that controls the flow of the gas blocking the air film formed by the external air, and the semiconductor process device provided with the same.

In addition, another object of the present invention is to provide a solution to the problem of the increase in time required for the removal and storage of wafers caused by the conventional complicated load ports, and to effectively block external air while increasing the semiconductor manufacturing yield. A humidity reduction device for a wafer container of a load port module and a semiconductor process device provided with the same.

In addition, another object of the present invention is to provide a wafer container with a load port module that can finely control the air supply volume in the upper part of the inlet and outlet according to the area to improve the maintenance performance of the air film while maintaining the air film evenly according to the area. The humidity reduction device and the semiconductor process device equipped with it.

In addition, another object of the present invention is to provide a wafer container capable of uniformly distributing gas in a straight-line manner and then throwing it toward the upper part of the inlet and outlet, and uniformly maintaining the load port module of the air film. Low humidity device and semiconductor process device equipped with it.

In addition, another object of the present invention is to provide a device capable of filtering the air supplied from the air blowing section to remove impurities such as foreign matter or fine dust contained in the air through filtration to prevent pollution of the air supplied from the blowing section and the dispersion section. The humidity reduction device of the wafer container of the load port module to improve the yield of the wafer container and the semiconductor process device provided with the same.

In order to achieve the above-mentioned object, the present invention is a wafer container which is installed on the load port module and in front of the wafer container and forms an air film at the entrance and exit of the wafer by reducing the humidity of the wafer container. The humidity reduction device is characterized by comprising: a main body portion 10 disposed on the upper front part of the wafer container; an air blowing portion 20 blowing air by supplying air to the inside of the main body portion 10; and a dispersing portion 30 disposed At the lower part of the main body portion 10, the air supplied to the inside of the main body portion 10 is discharged straight downward and uniformly dispersed to form an air film.

In addition, the present invention is characterized by further comprising: a nozzle portion 40 provided at the lower front portion of the wafer container and supplying gas in an upward direction or an inward direction. The nozzle unit 40 of the present invention is characterized by being constituted by gas nozzles that are respectively provided at both ends of the lower portion of the inlet and outlet to inject gas into the wafer container.

In addition, the present invention is characterized in that it further includes a gas injection part 50 which is provided on the upper part or the side part of the main body part 10 and injects nitrogen gas into the upper part of the inlet and outlet.

The main body 10 of the present invention is characterized in that it comprises: a main body formed in a manner to penetrate through the upper and lower directions; an inclined piece provided in an inclined manner on the upper part of the main body; and a cover piece to be combined with the upper part of the inclined piece The way is set, and perforated with multiple through holes.

The air blowing unit 20 of the present invention is characterized by being constituted by an air blowing unit that is provided inside the main body 10 or connected by connecting a connecting pipe to the outside.

The air blowing unit of the present invention is characterized by comprising: a first blowing fan arranged in one or more rows at a side portion of the main body 10; a second blowing fan arranged in a central portion of the main body 10 And the third blower is arranged in one or more rows on the other side portion of the main body portion 10. The air blowing unit of the present invention is characterized by being constituted by a column-type blowing fan that rotates on a horizontal axis.

The dispersing part 30 of the present invention is characterized in that it is composed of a distribution pipe formed in a honeycomb shape with a plurality of through-holes in cross section, so that the air is uniformly distributed in a straight line and then directed to the upper part of the inlet.

In addition, the present invention is characterized by further including a filter unit 60 provided between the air blowing unit 20 and the dispersion unit 30 to filter the air supplied by the air blowing unit 20.

In addition, the present invention is characterized in that it further includes a control unit 70 connected to the air blowing unit 20 to adjust the air volume of the air blowing unit 20.

In addition, the present invention is a semiconductor processing device characterized by a humidity reduction device for a wafer container equipped with the load port module.

As described above, in the present invention, the main body part, the air blowing part, and the dispersing part are provided on the load port module and in front of the wafer container to form an air film at the entrance and exit of the wafer container, thereby providing a blocking air film that can be formed at the entrance and exit. The effect of cutting off the inflow of external air to reduce the humidity of the wafer container.

In addition, it is also provided with a nozzle section that is provided at the lower front portion of the wafer container and supplies gas in an upward or inward direction, so as to provide a downward flow through the air blowing section, an upward flow through the nozzle section, or an inward flow. The multiple air films can reduce the interference of the air flow in the wafer transfer chamber and reduce the effect of blocking the flow of air in the air film by forming external air.

In addition, it is equipped with a gas injection part that injects nitrogen gas from the upper part or the side part of the main body part to the upper part of the inlet and outlet, so as to solve the problem of the increase in the time required to carry out and store the wafer caused by the conventional complicated load port, and provide It can effectively block external air and improve the yield of semiconductor manufacturing.

In addition, a plurality of blower fans are provided as the blower, and the blower volume of each blower is individually controlled by the control section, so as to provide a device that can finely control the blower volume on the upper part of the entrance and exit according to the area to improve the maintenance performance of the air film At the same time, the air film is uniformly maintained in accordance with the area.

In addition, the dispersing part is provided with a distribution pipe formed in a honeycomb shape with a plurality of through-holes in cross section, thereby providing the effect of uniformly distributing the gas straightly and throwing it toward the upper part of the inlet and outlet to maintain the air film uniformly.

In addition, a filter part is provided between the air blowing part and the dispersing part to filter the air supplied by the air blowing part and to remove impurities such as foreign matter or fine dust contained in the air through filtration, thereby preventing the air blowing part and the dispersing part. The effect of dispersing air pollution and improving the yield of wafer containers.

10: Body part

11: body

12: Tilt sheet

13: cover sheet

20: Air supply department

20-1: Horizontal axis

20-2: Column fan

20-3: Connecting piping

21: The first blower

22: The second blower

23: Third blower

30: Decentralized Department

40: Nozzle

41: The first nozzle

42: second nozzle

50: Gas injection part

60: Filter

70: Control Department

71: Controller

72: Connection terminal

73: connecting cable

110: Load port module

111: door

120: Wafer container

130: fan filter unit

140: Wafer handling room

FIG. 1 shows a semiconductor process apparatus equipped with a normal load port module.

2 is a block diagram showing a humidity reduction device for a wafer container of a load port module according to an embodiment of the present invention and a semiconductor process device equipped with it.

FIG. 3 is a perspective view of the lower-view perspective view of the humidity reduction device for the wafer container of the load port module according to the embodiment of the present invention.

FIG. 4 is a perspective view showing a top perspective view of a humidity reduction device for a wafer container of a load port module according to an embodiment of the present invention.

5 is an exploded perspective view showing a humidity reduction device for a wafer container of a load port module according to an embodiment of the present invention.

6 is a cross-sectional view showing a humidity reduction device for a wafer container of a load port module according to an embodiment of the present invention.

FIG. 7 is a configuration diagram showing an example of the air blowing part of the humidity reduction device of the wafer container of the load port module according to the embodiment of the present invention.

8 and 9 are structural diagrams showing an example of the air blowing part of the humidity reduction device of the wafer container of the load port module according to the embodiment of the present invention.

10 is a configuration diagram showing another example of the air blowing part of the humidity reduction device of the wafer container of the load port module according to the embodiment of the present invention.

11 and 12 are diagrams showing the structure of the nozzle part of the humidity reduction device of the wafer container of the load port module according to the embodiment of the present invention.

13 and 14 are diagrams showing the structure of the gas injection part of the humidity reduction device of the wafer container of the load port module according to the embodiment of the present invention.

15 is a graph showing the dehumidification state of the humidity reduction device of the wafer container of the load port module according to the embodiment of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described in more detail with reference to the accompanying drawings.

2 is a diagram showing the structure of a humidity reduction device for a wafer container of a load port module according to an embodiment of the present invention and a semiconductor manufacturing process device equipped with it; FIG. 3 is a diagram showing an embodiment of the present invention The lower perspective perspective view of the humidity reduction device for the wafer container of the load port module; FIG. 4 is a top perspective perspective view of the humidity reduction device for the wafer container of the load port module according to an embodiment of the present invention; An exploded perspective view of a humidity reduction device for a wafer container of a load port module according to an embodiment of the present invention; FIG. 6 is a cross-sectional view showing a humidity reduction device for a wafer container of a load port module according to an embodiment of the present invention; 7 is a configuration diagram showing an example of the air blowing part of the humidity reduction device of the wafer container of the load port module according to the embodiment of the present invention; FIGS. 8 and 9 are diagrams showing the load port module according to the embodiment of the present invention A configuration diagram of an example of the air blowing part of the humidity reduction device of a wafer container; FIG. 10 is a configuration diagram showing another example of the air blowing part of the humidity reduction device of a wafer container of a load port module according to an embodiment of the present invention; 11 and 12 are diagrams showing the structure of the nozzle portion of the humidity reduction device of the wafer container of the load port module according to the embodiment of the present invention; FIGS. 13 and 14 are diagrams showing the load port module according to the embodiment of the present invention The structure diagram of the gas injection part of the humidity reduction device of the wafer container; and FIG. 15 is a chart showing the humidity reduction state of the humidity reduction device of the wafer container of the load port module according to an embodiment of the present invention.

The semiconductor process device of the present invention is a semiconductor process device equipped with the humidity reduction device of the wafer container of the load port module of this embodiment, as shown in FIG. 2, includes a load port module (110; LPM (Load Port Module)) , Wafer container (120; FOUP (Front Opening Unified Pod)), fan filter unit (130; FFU (Fan Filter Unit)) and wafer transfer chamber 140, which can be composed of wafers equipped with load port modules The equipment front end module (EFEM) of the humidity reduction device of the container is constructed.

The load port module (110; LPM) is a device that enables wafers to be transported when the door 111 of the wafer container (120; FOUP) containing semiconductor manufacturing wafers is opened or closed.

This load port module (110; LPM) is configured as follows: when the wafer container (120; FOUP) is mounted on the table unit, nitrogen is injected into the wafer container 120, and the inside of the wafer container 120 The contaminants are discharged to the outside of the wafer container 120 to prevent the wafers stored in the wafer container 120 to be transferred from being damaged by the contaminants.

With regard to the humidity reduction device for the wafer container of the load port module of this embodiment, it is arranged in front of the wafer container 120 between the wafer container 120 and the wafer transfer chamber 140, thereby forming the entrance and exit of the wafer. The external air blocks the air film or air curtain to maintain the internal humidity of the wafer container 120 at a set value.

The wafer container 120 forms a loading space in which a plurality of wafers are loaded, and when the door is opened, the wafers are moved out or stored. This wafer container 120 can be constructed from a front-opening wafer transfer box (Front-Opening Unified Pod; FOUP) composition.

The wafer transfer chamber 140 is a space formed between the wafer container 120 in which a plurality of wafers are loaded and a processing space (not shown) in which the wafers are processed through a semiconductor process. The wafer transfer chamber 140 is maintained as a clean space in order to minimize foreign matter or contaminants attached to the wafer during the transfer of the wafer from one processing space to another processing space by a transfer device such as a transfer robot .

The fan filter unit 130 is disposed at the upper part of the wafer transfer chamber 140, and cleanly maintains the air in the wafer transfer chamber 140 by removing molecular contaminants such as smoke and particles such as dust. Generally, the air flow in the wafer transfer chamber 140 is formed from the upper part to the lower part where the fan filter unit 130 is provided.

As shown in FIGS. 2-6, the humidity reduction device of the wafer container of the load port module according to the present embodiment includes a main body 10, an air blowing part 20, and a dispersing part 30, so that the humidity is reduced The device is installed on the load port module (LPM: LoadPortModule), in front of the wafer container (FOUP: Front Opening Unified Pod), so it is formed at the entrance and exit of the wafer by reducing the humidity of the inner space of the wafer container The humidity reduction device of the wafer container of the load port module of the air film such as air curtain or air curtain.

The main body 10 is a main body assembly installed on the load port module (110; LPM) at the upper front part of the wafer container 120 and installed at the entrance and exit of the wafer, and is composed of a main body 11, an inclined sheet 12, and a cover sheet 13.

The main body 11 is a barrel-shaped main body assembly with a through hole formed in the vertical direction through the inside. The main body 11 is installed at the upper part of the entrance and is arranged in a straight line along the length direction between the upper end and the other end of the entrance. It is formed by a rectangular bucket assembly. Of course, the process of flowing in from the upper part and flowing out from the lower part according to the purified gas of the fan filter unit 130 or according to the flow of pure air can also be performed.

The inclined piece 12 is an inclined member installed obliquely on the upper part of the main body 11. It is provided in such a way as to communicate with the upper part of the main body 11 and is formed of a communicating member that is cut in a manner inclined downward in the front and rear directions of the entrance and exit, so that the flow in The inflow of purified gas or pure air becomes easy.

The cover sheet 13 is a cover assembly installed on the upper part of the inclined sheet 12 to be combined with the inclined part. It is formed by a cover assembly perforated with a plurality of through holes to disperse the purified gas or pure air flowing in from the upper part of the inlet and outlet. .

The air blowing unit 20 is used to supply gas such as purified gas or pure air to the inside of the main body 10 In a supply unit for blowing air in a manner, the air blowing unit 20 is constituted by an air blowing unit that is provided inside the main body 10 or connected to the outside by connecting a connecting pipe.

This type of air blowing unit, as shown in FIGS. 5 and 7, includes a first blowing fan 21 arranged in one or more rows at a side portion of the main body 10; and a first blowing fan 21 arranged in more than one row in the central portion of the main body 10. The second blower 22; the third blower 23 is arranged in one or more rows on the other side of the main body 10 to connect each drive motor and the control board, so that the blowing volume and the amount of air can be controlled individually or according to the installed position. Wind speed.

And, as shown in FIGS. 8 to 10, the air blowing unit can of course be composed of and connected to a column-type blowing fan 20-2 that rotates on the basis of a horizontal shaft 20-1 horizontally arranged between one end and the other end of the upper portion of the inlet and outlet. To a drive motor and control board.

Such a column fan 20-2 can of course be composed of a straight column fan at the upper part of the entrance and exit, and a drive motor and a control board can uniformly and accurately control the air flow and wind speed to the entire upper part of the entrance and exit.

In particular, the column fan 20-2 is provided on the outer side of the main body 10 and communicates with the connecting pipe 20-3 on the upper part of the main body 10, so that it is of course possible to pass a drive motor and The control panel uniformly and accurately controls the air volume and wind speed to the entire upper part of the entrance and exit.

The dispersing part 30 is a dispersing unit that is provided at the lower part of the main body 10 and removes the gas supplied into the main body 10 in a straight downward manner to uniformly disperse to form an air film. Preferably, the cross-section is provided with a honeycomb The formed distribution pipe of the plurality of distribution holes is formed so that the gas is injected to the upper part of the inlet and outlet so that the gas is uniformly dispersed in a straight line.

In addition, the humidity reduction device of the wafer container of the load port module of the present invention, as shown in FIGS. 11 and 12, of course, can also include the lower part of the front of the wafer container 120 and supply in the upward or inward direction. The nozzle unit 40 is configured to purify gas or pure air.

The nozzle section 40 is a supply unit that is provided at the lower front portion of the wafer container 120 and supplies gases such as purge gas or pure air upward or inward. The inside of the gas nozzle is formed to inject gas such as purge gas or pure air, and is installed to adjust the spray angle in the front and rear directions and the left and right directions.

This gas nozzle is composed of a first nozzle 41 and a second nozzle 42. The first nozzle 41 is installed at the lower end of the inlet and outlet and sprays purge gas or pure gas to the center of the wafer container. For gases such as air, the second nozzle 42 is provided at the other end of the lower part of the inlet and outlet and sprays gas such as purge gas or pure air into the center of the wafer container.

In addition, the humidity reduction device of the wafer container of the load port module of the present invention, as shown in FIGS. 13 and 14, of course, can also include a gas that is installed on the upper or side of the main body 10 and injects nitrogen into the upper part of the inlet and outlet. The injection part 50 is constituted.

The gas injection part 50 is an injection unit that is installed on the upper or side of the main body 10 and injects nitrogen gas into the upper part of the inlet and outlet. As shown in FIG. 13, it is installed on the upper part of the main body 10, preferably on the upper part of the air blowing part 20. The nitrogen gas is sprayed through the air blowing part 20 and the dispersing part 30 to form an air film at the inlet and outlet, and the injection angle is installed to adjust the front-back direction and the left-right direction.

Moreover, such a gas injection part 50, as shown in FIG. 14, is preferably provided at the lower end of the side portion of the main body part 10 and linearly injects nitrogen gas to the upper part of the inlet and outlet to form an air film at the inlet and outlet so as to interact with the air blowing part 20 and the dispersing part. 30 The air film formed at the entrance and exit together forms a double air film, and is installed to adjust the injection angle in the front-rear direction and the left-right direction.

Therefore, as shown in FIG. 15(a), the result of measuring the internal humidity of the wafer container 120 of the humidity reduction device for the wafer container of the load port module according to the present invention shows that the internal humidity varies from the front, back, left, and right directions. The state of the conventional device maintained uniformly high, as shown in Figure 15 (b) and (c), in the four directions of the front, back, left, and right, is gradually maintained uniformly low at about 5% or less, so it can be seen that there is a wafer container The internal humidity of 120 is maintained at a low level of about 5% or less evenly in the four directions, front, back, left, and right according to the set value.

In addition, the humidity reduction device for the wafer container of the load port module of the present invention, as shown in FIGS. 5 and 6, of course, can also include a filter part 60 which is provided in the air blowing part 20 and the dispersing part 30 In between, the air supplied through the air blowing unit 20 is filtered.

The filter unit 60 is a filter unit that is installed between the air blowing unit 20 and the dispersing unit 30 to filter the air supplied through the air blowing unit 20, and is composed of a filter unit such as an ultra-high efficiency filter or a high-efficiency filter to filter and remove the air contained in it. Impurities such as foreign matter or dust in the

In addition, preferably, one of the main bodies 11 of the main body 10 is provided with an opening and closing piece to open and close a part of the main body 11 when the filter assembly of the filter 60 provided in the internal space of the main body 11 is replaced.

In addition, the humidity reduction device of the wafer container of the load port module of the present invention, as shown in FIGS. 5 and 6, of course, can also include a control unit 70 connected to the air blowing unit 20 and adjusting the air volume of the air blowing unit 20 constitute.

The control unit 70 is a control unit provided on the outside of the main body 10 and connected to the air blowing unit 20 to adjust the air volume of the air blowing unit 20, and is composed of a controller 71, a connection terminal 72 and a connection cable 73.

The controller 71 is a control unit installed on the outside of the main body 10 or inside the box outside the main body 11 of the main body 10. A measurement value measured by a measuring device such as a humidity sensor is compared with a set value to control the air blowing volume of the air blowing unit 20 to each blowing fan so that the internal humidity of the wafer container 120 is maintained at the set value.

The connection terminal 72 is a connection unit provided inside the box provided on the outside of the main body 11 of the main body 10, and connects cables to the respective blower fans of the blower section 20 in a manner that controls the air flow to each blower fan of the blower section 20 The connection is composed of terminals such as terminals.

The connecting cable 73 is a connecting unit connected between the controller 71 and the connecting terminal 72, and transmits the control signal according to the controller 71 by connecting the connecting cable 73 to the connecting terminal 72 to control each blower to the air blowing section 20 The air supply volume.

As described above, according to the present invention, the main body part, the air blowing part, and the dispersing part are provided on the load port module and in front of the wafer container to form an air film at the entrance and exit of the wafer container, thereby providing an air blocking film that can be formed at the entrance and exit. To block the inflow of external air and reduce the humidity of the wafer container.

In addition, it is equipped with a nozzle section that is installed at the lower front of the wafer container and supplies gas in an upward or inward direction, thereby providing multiple air flow through the downward flow of the air blowing section, and upward or inward flow of the nozzle section. The film can reduce the interference of the air flow in the wafer transfer chamber and reduce the effect of forming the external air to block the air flow of the air film.

In addition, it is equipped with a gas injection part that injects nitrogen gas from the upper part or the side part of the main body part to the upper part of the inlet and outlet, so as to solve the problem of the increase in time required for the removal and storage of wafers caused by the conventional complicated load ports, and provide It can effectively block external air and improve the yield of semiconductor manufacturing.

In addition, it is equipped with a plurality of blower fans as the blower, and the blower volume of each blower is individually controlled through the control section, so as to provide a device that can finely control the blower volume on the upper part of the entrance and exit according to the area and improve the maintenance performance of the air film At the same time, the air film is uniformly maintained in accordance with the area.

In addition, the dispersing part is provided with a distribution pipe formed in a honeycomb shape with a plurality of through-holes in cross section, thereby providing the effect of uniformly distributing the gas straightly and throwing it toward the upper part of the inlet and outlet to maintain the air film uniformly.

In addition, a filter part is provided between the air blowing part and the dispersing part to filter the air supplied by the air blowing part and to remove impurities such as foreign matter or fine dust contained in the air through filtration, thereby preventing the air blowing part and the dispersing part. The effect of dispersing air pollution and improving the yield of wafer containers.

The invention described above can be implemented in various forms without departing from its technical idea or main features. Therefore, the embodiments are merely mere examples in all aspects, and cannot be interpreted restrictively.

10: Body part

20: Air supply department

30: Decentralized Department

60: Filter

110: Load port module

111: door

120: Wafer container

130: fan filter unit

140: Wafer handling room

Claims (12)

A humidity reduction device for a wafer container of a load port module. The humidity reduction device is arranged on the load port module and in front of the wafer container, and the humidity of the wafer container is lowered in the wafer container. The entrance and exit of the circle form an air film, including: The body part is arranged on the upper front part of the wafer container; An air blowing part for blowing air by supplying air to the inside of the main body part; and The dispersing part is provided at the lower part of the main body, and discharges the air supplied to the inside of the main body in a straight downward manner to uniformly disperse and form an air film. According to claim 1, the humidity reduction device of the wafer container of the load port module further includes: a nozzle part arranged at the lower front portion of the wafer container and supplying gas in an upward or inward direction. The humidity reduction device of the wafer container of the load port module of claim 2, wherein the nozzle portion is composed of gas nozzles that are respectively provided at both ends of the lower portion of the inlet and outlet and spray gas into the wafer container . According to claim 1, the humidity reduction device of the wafer container of the load port module further includes: a gas injection part arranged on the upper part or the side part of the main body part to inject nitrogen gas into the upper part of the inlet and outlet. According to claim 1, the humidity reduction device of a wafer container of a load port module, wherein the main body includes: The main body is formed through the upper and lower directions; The inclined piece is arranged in an inclined manner on the upper part of the main body; and The cover sheet is arranged in a manner of combining the upper part of the inclined sheet, and is perforated with a plurality of through holes. The humidity reduction device for a wafer container of a load port module according to claim 1, wherein the air blowing unit is composed of an air blowing unit that is provided inside the main body or connected by connecting a connecting pipe to the outside. According to claim 6, the humidity reduction device of the wafer container of the load port module, wherein the air supply unit includes: The first blower is arranged in more than one row at a side portion of the main body part; The second blower is arranged in one or more rows at the center of the main body; and The third blower is arranged in one or more rows at the other lateral part of the main body. According to claim 6, the humidity reduction device of the wafer container of the load port module, wherein the air blowing unit is constituted by a column-type air blowing fan that rotates on a horizontal axis. The humidity reduction device for a wafer container of a load port module according to claim 1, wherein the dispersing part is composed of a distribution pipe formed in a honeycomb shape in cross-sections of a plurality of through holes, so that the air is uniformly distributed and directed toward The upper part of the entrance. According to claim 1, the humidity reduction device of the wafer container of the load port module further includes: a filter part arranged between the air blowing part and the dispersing part to filter the air supplied by the air blowing part. For example, the humidity reduction device of the wafer container of the load port module of claim 1, further comprising: a control part connected to the air blowing part to adjust the air volume of the air blowing part. A semiconductor manufacturing process device is provided with a humidity reduction device for a wafer container of a load port module as in claim 1.

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