KR20240082968A - Efem for managing humidity including local dehumidification module - Google Patents

Abstract

In one embodiment, a FOUP in which a substrate to be processed is loaded, a chamber that communicates with the FOUP through a door and where the substrate temporarily resides, and a chamber that dehumidifies the input compressed gas and supplies the dehumidified gas to a transport pipe. a local dehumidifying module, and a vertical laminar flow generator connected to the transport pipe and disposed inside the chamber, which equalizes the flow of the incoming dehumidified gas, converts it into a vertical laminar flow, and sprays it on the inner side of the chamber of the door. EFEM can be provided.

Description

Humidity control including local dehumidification device EFEM{EFEM FOR MANAGING HUMIDITY INCLUDING LOCAL DEHUMIDIFICATION MODULE}

This embodiment relates to EFEM (Equipment Front End Module) technology, and more specifically, to a humidity control EFEM including a local dehumidification device.

Recently, as the transition to an information society has accelerated, demand for highly integrated electronic devices is rapidly increasing. Representative examples of highly integrated electronic devices include high-resolution display devices and high-density, high-performance semiconductor devices, which are manufactured by integrating multiple electronic structures in a single area through a high-precision surface treatment process.

Processes used to manufacture highly integrated electronic devices include thin film deposition processes, photolithography processes, and etching processes. Highly integrated electronic devices are manufactured through a complex process in which these different processes are applied more than once.

The process system may have process processing devices such as EFEM (Equipment Front End Module), transfer robot, and process chamber to apply multiple processes to highly integrated electronic devices. The substrate to be processed - for example, a semiconductor wafer - is waiting in the EFEM among these process processing devices, and is then moved to an appropriate process chamber by a transfer robot and then undergoes the necessary processes.

EFEM may have a Load Port Module (LPM), a Front-Opening Unified Pod (FOUP), an EFEM chamber, etc.

The load port module is a device that combines a semiconductor wafer storage container called a poo. A plurality of semiconductor wafers can be loaded on the pooh, and a transfer device including a transfer robot sequentially delivers the semiconductor wafers loaded on the pooh to the process chamber. Processing of semiconductor wafers is carried out in a clean room with high cleanliness, but semiconductor wafers can be loaded on the poof to provide even higher cleanliness.

Meanwhile, moisture can react with fumes generated from process equipment and oxidize or etch the device. Additionally, moisture may react with fine reactive particles to form foreign substances. Oxidation of the device, etching of the device, and/or formation of foreign substances may cause a decrease in the yield of the device. Since the substrate that is the subject of processing - for example, a semiconductor wafer - stays in the EFEM foo for a significant amount of time, the industrial field recognizes humidity management inside the EFEM foo as an important factor in improving yield.

Against this background, the purpose of this embodiment is, in one aspect, to provide a technology for managing the humidity of a local space within an EFEM. In another aspect, the purpose of this embodiment is to provide a technique for managing humidity in EFEM while minimizing cost. In another aspect, the purpose of this embodiment is to provide a technique for managing humidity in key areas affecting the substrate without replacing an existing EFEM chamber. In another aspect, the purpose of this embodiment is to provide a technology for managing the humidity of the EFEM without taking up a lot of space. In another aspect, the purpose of this embodiment is to provide a technique for managing humidity in EFEM while significantly reducing power consumption.

In order to achieve the above-described object, one embodiment includes a FOUP on which a substrate to be processed is loaded; a chamber in communication with the poo through a door and in which the substrate temporarily resides; A local dehumidification module that dehumidifies the injected compressed gas and supplies the dehumidified gas to the transportation pipe; and a vertical laminar flow generator connected to the transport pipe and disposed inside the chamber, which homogenizes the flow of the incoming dehumidified gas, converts it into a vertical laminar flow, and sprays it on the inner side of the chamber of the door. can do.

As an example, the local dehumidification module is a membrane dehumidification module, and the membrane dehumidification module may include at least one foreign matter removal filter that removes foreign matter from the compressed gas and a membrane that dehumidifies the compressed gas and discharges the dehumidified gas. You can.

As an example, the vertical laminar flow generator includes a dehumidifying gas inlet space formed inside the chamber, separated from the chamber interior space, and connected to the transport pipe into which the dehumidified gas flows; a diffusing filter tightly coupled to the dehumidifying gas inlet space and uniformizing the flow of the dehumidified gas; and a vertical laminar flow forming pipe that is tightly coupled to the diffusing filter and forms a vertical laminar flow of the dehumidified gas homogenized through the diffusing filter and sprays it on the inner side of the chamber of the door. .

As an example, the diffusing filter may include a HEPA filter or ULPA filter.

One embodiment further includes a load port module disposed below the foop to support the foop, wherein the load port module can provide an EFEM that purges the inner space of the foop with nitrogen (N2). .

One embodiment may provide an EFEM that further includes a control unit that adjusts at least one of the gas flow amount and gas flow pressure in the dehumidifying gas inflow space.

As an example, there are a plurality of dehumidifying gas inflow spaces, and the control unit can individually adjust at least one of the gas flow amount and gas flow pressure of each dehumidifying gas inlet space.

As an example, the vertical laminar flow generator may be disposed on an inner side of the chamber but above the door, and the vertical laminar flow generator may include a porous pipe formed in the direction of the door.

As an example, the vertical laminar flow generator may spray gas to an area larger than the inner side of the chamber of the door.

As an example, the chamber is formed with a first gas inlet and a second gas inlet that are separated from each other, and the first gas inlet is formed on a side of the chamber and is connected to the transport pipe to allow the dehumidified gas to flow in, The second gas inlet is formed on the upper surface of the chamber through which gas that has not been dehumidified can be introduced.

As an example, the inside of the chamber is divided into a first space adjacent to the door in the chamber and a second space different from the first space, and the gas dehumidified by the membrane dehumidification module is perpendicular to the first gas inlet. The non-dehumidified gas supplied to the first space through the laminar flow generator and introduced through the second gas inlet may be supplied to the second space by a fan filter unit (FFU).

As an example, the wind speed of the dehumidified gas output from the vertical laminar flow generator may be greater than the wind speed of the non-dehumidified gas produced by the fan filter unit.

As described above, according to this embodiment, a technology for managing the humidity of a local space within the EFEM can be provided. Additionally, according to this embodiment, the humidity of the EFEM can be managed while minimizing costs, and the humidity in key areas that affect the substrate can be managed without replacing the existing EFEM chamber. And, according to this embodiment, the humidity of the EFEM can be managed without taking up a lot of space, and the humidity of the EFEM can be managed while significantly reducing power consumption.

1 is a side view showing the configuration of a process system according to an embodiment.
Figure 2 is a top view showing the configuration of a process system according to an embodiment.
Figure 3 is a diagram for explaining a first example technology for humidity management of EFEM.
Figure 4 is a diagram for explaining a second example technology for humidity management of EFEM.
Figure 5 is a side perspective view of a first example of EFEM according to an embodiment.
Figure 6 is a top perspective view of a first example of EFEM according to an embodiment.
Figure 7 is a front perspective view of a first example of an EFEM according to an embodiment.
Figure 8 is an exemplary cross-sectional view of a vertical laminar flow forming pipe of an EFEM according to an embodiment.

Hereinafter, some embodiments of the present invention will be described in detail through illustrative drawings. When adding reference numerals to components in each drawing, it should be noted that identical components are given the same reference numerals as much as possible even if they are shown in different drawings. Additionally, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description will be omitted.

Additionally, when describing the components of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, order, or order of the component is not limited by the term. When a component is described as being “connected,” “coupled,” or “connected” to another component, that component may be directly connected or connected to that other component, but there is another component between each component. It will be understood that elements may be “connected,” “combined,” or “connected.”

FIG. 1 is a side view showing the configuration of a process system according to an embodiment, and FIG. 2 is a top view showing the configuration of a process system according to an embodiment.

Referring to FIGS. 1 and 2 , the process system may include an EFEM 100, a load lock device 210, a transfer chamber 220, and a process chamber 230.

The EFEM (100) is an interface module for supplying a substrate (W), such as a wafer, to the process chamber 230. The substrate (W) can be inputted into and taken out of the process system through the EFEM (100).

The substrate W to be processed may remain in the EFEM 100 before being transferred to the process chamber 230 and then transferred to the process chamber 230 through the transfer chamber 220 when necessary.

The substrates (W) remaining in the EFEM (100) may be sequentially transferred to the load lock device (210). Then, the substrate (W) transferred to the load lock device 210 is transferred to the transfer chamber 220, and the transfer robot disposed in the transfer chamber 220 transfers the substrate (W) to the process chamber 230 to form the substrate. (W) to enable fair processing.

The process system may include a plurality of process chambers 230a, 230b, and 230c, and each of the process chambers 230a, 230b, and 230c may apply different processes to the substrate W. The transfer robot disposed in the transfer chamber 220 inserts the substrate W into the first process chamber 230a so that the first process can be applied to the substrate W, and the substrate W is carried out from the first process chamber 230a. The substrate W is put back into the second process chamber 230b so that the second process can be applied to the substrate W. Then, the transfer robot can input the substrate W into the third process chamber 230c to apply the third process to the substrate.

Doors D1, D2, D3, and D4 are disposed between each device (120, 100, 210, and 230), thereby minimizing mixing of gases between each device (120, 100, 210, and 230). . For example, a second door (D2) is disposed between the EFEM (100) and the load lock device (210), and a third door (D3) is disposed between the load lock device (210) and the transfer chamber 220. , a fourth door D4 may be disposed between the transfer chamber 220 and the process chamber 230. Additionally, each door D1, D2, D3, and D4 may be opened only when the substrate W is moved and may be closed at other times.

The EFEM 100 may include an EFEM chamber 110, a fob 120, a load port module 130, etc.

A plurality of substrates (W) may be loaded on the foop 120. A plurality of substrates (W) may be sequentially transferred to the EFEM chamber 110.

The foop 120 may be communicated with the EFEM chamber 110 through the first door D1. A transfer device may be disposed in the EFEM chamber 110. When the first door D1 is opened, the transfer device can unload the substrate W from the pooh 120 and transfer it to the load lock device 210. there is.

EFEM (100) may include a plurality of foos (120a, 120b, 120c). Each foop (120a, 120b, 120c) may be in communication with the EFEM chamber 110 at different positions. The transfer device disposed in the EFEM chamber 110 sequentially opens the first doors (D1a, D1b, D1c) disposed in each foop (120a, 120b, 120c) and opens each foop (120a, 120b, 120c). The substrates (W) can be taken out sequentially.

The interior space of the foof 120 may be relatively narrow compared to the EFEM chamber 110. Since the foof 120 has a relatively narrow space, the gas atmosphere surrounding the substrate W can be well controlled. For example, when a substrate (W) such as a semiconductor wafer is exposed to moisture, oxygen, etc., an oxide film may form on the surface. This problem can be minimized by purging the space inside the poof (120) with nitrogen (N2). You can.

The load port module 130 supporting the foop 120 can supply a ring element N2 to the inner space of the foop 120. The load port module 130 may include an N2 supply device, N2 pipe, MFC (Mass Flow Controller), filter, etc. N2 supplied from the N2 supply device can be delivered to the internal space of the pooh (120) through the N2 pipe. At this time, the MFC can control the flow of the N2 fluid, and the filter in the nitrogen (N2) distribution path removes foreign substances. It can be removed.

According to this structure in which the load port module 130 purges nitrogen (N2) into the inner space of the foop 120, the time to lower the internal humidity of the foop 120 can be shortened and the The contamination suppression effect can be increased, the generation of static electricity can be suppressed when transferring the substrate (W), the diffusion of fine particles can be prevented, and the possibility of corrosion of the substrate (W) by fine particles can be reduced. There will be.

On the other hand, moisture can react with fumes generated from process processing devices to oxidize or etch devices, and can react with fine reactive particles to form foreign substances, so the EFEM (100), especially the substrate (W), has many It is important to minimize moisture within the poof 120 where it resides for some time. Because the foof 120 has a relatively narrow space, it may be easy to reduce humidity, but because the EFEM chamber 110 has a relatively wide space, it may not be easy to reduce humidity.

Various technologies have been attempted to manage humidity in EFEM, but most of them have problems such as high cost or low effectiveness.

Figure 3 is a diagram for explaining a first example technology for humidity management of EFEM.

Referring to FIG. 3, the N2 circulation type EFEM chamber 110 can control the humidity in the space by circulating nitrogen (N2) in the space where the substrate W is exposed.

An N2 supply pipe 10 may be connected to the upper side of the N2 circulation type EFEM chamber 110, and a differential pressure exhaust unit 12 may be connected to the lower side. Also, the foo 120 may be connected to one side of the EFEM chamber 110.

The EFEM chamber 110 can supply nitrogen (N2) to the internal space through the N2 supply pipe 10. The internal space of the EFEM chamber 110 may have a certain path through which nitrogen (N2) can be circulated, and nitrogen (N2) supplied through the N2 supply pipe 10 circulates in the internal space along the path. can do.

The EFEM chamber 110 can control the air pressure of the internal space through the differential pressure exhaust unit 12 and control the nitrogen (N2) density in the internal space.

The poof 120 can be purged with nitrogen (N2) through the load port module 130. The inner space of the poof (120) can be communicated with the EFEM chamber (110) by opening the door (D1). At this time, since both spaces are filled with nitrogen (N2), the overall humidity of the EFEM (100) is low. status can be managed.

Meanwhile, the N2 circulating EFEM (100) can be designed as a closed structure because nitrogen (N2) should not leak outside the EFEM chamber (110). However, since the conventional EFEM chamber does not have a sealed structure, a problem may arise in that the EFEM chamber 110 must be replaced in order to introduce the N2 circulation type EFEM chamber 110. In general, replacement of process equipment in the semiconductor production process incurs enormous costs and time loss. Therefore, it may be necessary to apply other technologies that can minimize these costs and time losses.

Figure 4 is a diagram for explaining a second example technology for humidity management of EFEM.

Referring to FIG. 4, a foop 120 may be connected to one side of the EFEM chamber 110, and a dehumidifier 150 may be placed above the EFEM chamber 110.

The dehumidifier 150 disposed above the EFEM chamber 110 can create dehumidified air F1 by removing moisture from air sucked in from the outside. Additionally, the fan filter unit (FFU) 140 can inject the air (F1) dehumidified by the dehumidifier 150 into the internal space of the EFEM chamber 110. The dehumidified air (F1) may flow from the upper side to the lower side and be discharged to the outside through the lower side.

The poof 120 can be purged with nitrogen (N2) through the load port module 130. The interior space of the foof 120 may be dehumidified through nitrogen (N2) purge, and the interior space of the EFEM chamber 110 may be dehumidified through the dehumidifier 150.

Meanwhile, in this structure, the dehumidifier 150 can occupy all of the upper space of the EFEM chamber 110, but application may be difficult if the entire upper space cannot be used due to other structures. In addition, in this structure, the dehumidifier 150 must dehumidify the entire internal space of the EFEM chamber 110, which is a relatively large space, so it may have problems of high power consumption and low efficiency.

EFEM according to one embodiment can solve the problems of the above-described technology. During EFEM, the substrate spends most of its time in the inner space. And, it stays in the EFEM chamber only for a part of the time during transfer. Taking this situation into account, EFEM according to one embodiment forms a gas curtain using a local dehumidification device in the area around the foop in the internal space of the EFEM chamber, thereby maintaining the gas atmosphere inside the foop even when the door is opened for substrate transfer. It can be managed. According to this embodiment, since a gas curtain is formed in the area near the pooh, it is possible to block the gas inside the EFEM chamber from flowing into the inner space of the fooh, and thus the gas atmosphere within the inner space of the fooh can be managed. Additionally, by avoiding unnecessary excessive dehumidification in spaces far away from the foo, costs and power consumption can be minimized.

Figure 5 is a side perspective view of a first example of an EFEM according to an embodiment, Figure 6 is a top perspective view of a first example of an EFEM according to an embodiment, and Figure 7 is a first example of an EFEM according to an embodiment. This is a front perspective view of the example.

Referring to FIGS. 5 to 7 , the EFEM 100 may include a local dehumidification module, a poof 120, a load port module 130, an EFEM chamber 110, and a control unit 170.

The local dehumidification module may be a device that generates dehumidified gas and supplies the dehumidified gas to a local space for humidity management of the EFEM (100). The local dehumidification module only needs to supply EFEM (100) dehumidified gas to a local space, so it can have a small size and can be installed in a small space, reducing installation and operating costs. Here, the local space may be an area near the foof 120 in the internal space of the EFEM chamber 110.

As an example, the local dehumidification module may be a membrane dehumidification module 160. The membrane dehumidification module 160 can remove moisture from the input compressed gas (CA) and generate dehumidified gas (F1). The membrane dehumidifying module 160 may be a dehumidifying module manufactured separately at the request of the manufacturer or user of the EFEM 100, or may be a dehumidifying module generally sold in the market for dehumidifying purposes.

The membrane dehumidification module 160 includes a membrane 162 and foreign matter removal filters 163 and 165.

It can be configured to include. The membrane 162 can remove moisture from the compressed gas (CA) by using the energy of the compressed gas (CA) and discharge the dehumidified gas (F1). The foreign matter removal filters 163 and 165 are filters that remove foreign matter from the compressed gas (CA), and may be plural. Here, the foreign matter may be a material other than the compressed gas (CA), for example, fine dust particles or fine moisture particles. The membrane 162 is a device that uses the principle of time-selectively discharging moisture to the outside as compressed gas (CA) passes through the polymer separator. Therefore, to prevent the polymer separator of the membrane 162 from clogging, the foreign matter removal filter 163 is used. , 165) may include a filter capable of removing moisture particles and fine dust particles in the form of droplets.

The membrane dehumidification module 160 and the EFEM chamber 110 may be connected to each other through a transportation pipe 20. The dehumidified gas F1 generated by the membrane dehumidification module 160 may flow into the gas inlet 113 of the EFEM chamber 110 through the transport pipe 20. A control unit 170 that adjusts the flow amount of the dehumidified gas (F1) and the flow pressure of the dehumidified gas (F1) may be installed in the transport pipe 20. When the door D1 is opened to transfer the substrate W, the control unit 170 adjusts the flow pressure/flow amount of the gas so that the dehumidified gas F1 flows into the gas inlet 113 of the EFEM chamber 110. It can be adjusted.

Compared to the dehumidifier of FIG. 4, the membrane dehumidification module 160 is a lightweight product and can be installed and used in a transportation pipe without using a support, so it does not require a separate installation space above the EFEM chamber and can be installed at a low cost, thereby reducing costs. there is. Additionally, since the membrane dehumidification module 160 removes moisture from the compressed gas (CA) by using the energy of the compressed gas (CA), separate power for dehumidification may not be required. In addition, the membrane dehumidification module 160 has a module structure that allows the addition of filters, so the EFEM manufacturer or user can easily adjust the degree of dehumidification required.

A substrate (W) to be processed may be loaded on the foof 120. The foop 120 may be communicated with the EFEM chamber 110 through the first door D1. When the first door D1 is opened, the substrate W loaded in the inner space of the foof 120 can be transferred to the EFEM chamber 110. The space within the poof 120 may be purged with nitrogen (N2).

The load port module 130 is disposed on the lower side of the foop 120, supports the foop 120, and can supply nitrogen (N2) to the inner space of the foop 120. The load port module 130 may include an N2 supply device, N2 pipe, MFC (Mass Flow Controller), filter, etc. Nitrogen (N2) supplied from the N2 supply device can be delivered to the internal space of the pooh (120) through the N2 pipe. At this time, the MFC can control the flow of the nitrogen (N2) fluid and the nitrogen (N2) distribution path. The filter in can remove foreign substances.

According to this structure in which the load port module 130 purges nitrogen (N2) into the inner space of the foop 120, the time to lower the internal humidity of the foop 120 can be shortened and the The contamination suppression effect can be increased, the generation of static electricity can be suppressed when transferring the substrate (W), the diffusion of fine particles can be prevented, and the possibility of corrosion of the substrate (W) by fine particles can be reduced. There will be. Preferably, according to this structure in which the load port module 130 purges nitrogen (N2) into the inner space of the foop 120, the internal humidity of the foop 120 can be managed to 1% or less.

The EFEM chamber 110 may include a vertical laminar flow generator 190 and a fan filter unit (FFU: Fan Filter Unit, 140).

The EFEM chamber 110 may be formed with a first gas inlet 113 and a second gas inlet 115 that are separated from each other. The first gas inlet 113 may be formed on the side of the EFEM chamber 110 and may be a gas inlet through which the dehumidified gas (F1) flows, and the second gas inlet 115 may be formed on the upper surface of the EFEM chamber 100. This may be a gas inlet through which gas (F2) that has not been dehumidified flows in.

The first gas inlet 113 is connected to the vertical laminar flow generator 190 disposed inside the EFEM chamber 110, and can be connected to the membrane dehumidification module 160 through the transport pipe 20.

The vertical laminar flow generator 190 is connected to the transport pipe 20 through the first gas inlet 113 and can be placed on the upper part of the inner side door D1 of the EFEM chamber 110. The vertical laminar flow generator 190 can form a gas curtain by equalizing and vertically laminarizing the flow of the incoming dehumidified gas F1 and spraying it on the inner side of the chamber 110 of the door D1. The vertical laminar flow generator 190 forms a gas curtain that shields the opening of the door D1 of the foop 120 at the time the door D1 is opened or at a time earlier than the opening, thereby forming an EFEM chamber ( It is possible to prevent the non-dehumidified gas (F2) in 110) from flowing into the interior of the foo (120).

To this end, the vertical laminar flow generator 190 may be configured to include a dehumidifying gas inlet space 192, a diffusing filter 194, and a vertical laminar flow forming pipe 196.

More specifically, the dehumidifying gas inflow space 192 may be a separate space within the EFEM chamber 110 separated from the inner space of the EFEM chamber 110 by an isolation wall formed on the upper side of the inner side door D1 of the EFEM chamber 110. there is. The dehumidifying gas inflow space 192 may prevent the gas F1 dehumidified by the membrane dehumidifying module 160 from mixing with the non-dehumidified gas F2 in the EFEM chamber 110.

Referring to FIG. 7, the dehumidifying gas inlet space 192a may include a plurality of dehumidifying gas inlet spaces B1, B2, and B3 divided by separation walls. The dehumidifying gas inflow spaces (B1, B2, B3) may each be connected to individual transport pipes. The control unit 170a can adjust the amount of gas flow in each dehumidifying gas inflow space (B1, B2, and B3). The control unit 170a may adjust the gas flow pressure in each dehumidifying gas inlet space (B1, B2, and B3). The number of dehumidifying gas inflow spaces (B1, B2, B3) can be optimized by appropriately adjusting according to the needs of the manufacturer or user of the EFEM (100).

The diffusing filter 194 is tightly coupled to the lower end of the dehumidified gas inlet space 192, and can remove foreign substances remaining in the dehumidified gas (F1) and equalize the flow of the dehumidified gas (F1). For example, the diffusing filter 194 may include a High Efficiency Particulate Air (HEPA) filter or an Ultra Low Penetration Air (ULPA) filter. The HEPA filter is a filter that filters fine particles with high efficiency to create a clean environment such as a clean room. It can filter more than 99.97% of particles of about 0.3μm by using glass fiber or asbestos fiber materials. The ULPA filter is a filter that filters ultra-fine particles smaller than the 0.3 μm particles that HEPA filters filter out, and can filter out more than 99.99% of particles of about 0.12 μm.

The diffusing filter 194 serves as a filter to remove foreign substances contained in the dehumidified gas (F1), and at the same time, the dehumidified gas (F1) is filtered due to the pressure difference generated by the filter. It can act as a diffuser to create a uniform flow in the filter area while passing through.

The vertical laminar flow forming pipe 196 is tightly coupled to the diffusing filter 194, and vertically laminars the gas output from the diffusing filter 194 on the inner side of the EFEM chamber 110 of the first door D1. Dehumidified gas (F1) can be sprayed.

The gas inlet of the vertical laminar flow forming pipe 196 and the gas outlet of the diffusing filter 194 are closely coupled to prevent external mixing of gas. Part or all of the dehumidifying gas inflow space 192 may be extended by an isolation wall to the vertical laminar flow forming pipe 196. According to this extension, some or all of the gas F1 dehumidified from the membrane dehumidifying module 160 may be extended. External gas may not be mixed up to the gas outlet of the vertical laminar flow forming pipe 196.

The vertical laminar flow forming pipe 196 can spray the dehumidified gas F1 to a larger area than the inner side of the first door D1 - the inner side in the direction of the EFEM chamber 110. For example, when dehumidified gas (F1) is injected from the top to the bottom, the width (L1) of the vertical laminar flow forming pipes (196a, 196b, 196c) as seen from the top is parallel to the floor and communicates from the pooh to the EFEM chamber. The width in the direction perpendicular to the direction may be longer than the width of the pooh (120a, 120b, 120c) or the first door (D1), as shown in FIG. 6. Accordingly, the vertically laminarized gas is sprayed to an area larger than the area where the pooh (120a, 120b, 120c) and the EFEM chamber (110) communicate, thereby preventing the non-dehumidified gas (F2) from being transferred to the pooh (120). You can block it. Through this, it is possible to maintain the gas atmosphere of the pooh 120 and manage the humidity inside the pooh 120. The wind speed of the gas output from the vertical laminar flow forming pipe 196 may be greater than the speed of the flow of the non-dehumidified gas (F2) by the fan filter unit 130. The wind speed of the gas output from the vertical laminar flow forming pipe 196 may be 0.2 m/s to 1.5 m/s.

The wind speed of the gas output from the vertical laminar flow forming pipe 196 can be controlled by adjusting the flow amount/flow pressure of the dehumidified gas F1 in the control unit 170 installed in the transport pipe 20.

When the dehumidifying gas inflow space 192a includes a plurality of dehumidifying gas inflow spaces B1, B2, and B3, a diffusing filter 194a is formed corresponding to the plurality of dehumidifying gas inflow spaces B1, B2, and B3, respectively. ) and a vertical laminar flow forming pipe (196a) may be provided. At this time, the vertical laminar flow forming pipe 196a may be provided separately to correspond to the plurality of dehumidifying gas inlet spaces B1, B2, and B3, but may be formed integrally to cover the diffusing filters 194a at a time. .

The dehumidified gas (F1) generated by the membrane dehumidification module (160) is sprayed into a vertically laminar flow over an area larger than the area of the first door (D1) or the area where the poof (120) communicates with the EFEM chamber (110). According to this structure, by forming a gas curtain in the area near the foop, the gas atmosphere inside the foop can be maintained even if the door is opened for substrate transfer. According to this embodiment, since a gas curtain is formed using dehumidified gas in the area near the pooh, it is possible to block the gas inside the EFEM chamber from flowing into the inner space of the fooh, thereby preventing low-humidity gas from flowing into the inner space of the fooh. The atmosphere can be maintained.

The second gas inlet 115 may be formed on the upper side of the EFEM chamber 110, and non-dehumidified gas F2 may flow in through the second gas inlet 115. A fan filter unit 140 may be disposed in the gas path through which the non-dehumidified gas (F2) flows. The fan filter unit 140 may be configured to include a fan and a filter. The fan filter unit 140 supplies gas from which molecular contaminants such as fume and fine particles such as dust have been filtered out to the internal space of the EFEM chamber 110 through a filter, thereby keeping the internal space of the EFEM chamber 110 clean. The fan filter unit 140 can generate airflow through a fan. For example, the fan filter unit 140 introduces non-dehumidified gas (F2) into the EFEM chamber 110 through the second gas inlet 115, thereby maintaining the flow of gas from the top of the EFEM chamber 110 to the bottom. It can be created. The humidity of the non-dehumidified gas (F2) flowing into the second gas inlet 115 through the fan filter unit 140 may be about 45%.

The internal space of the EFEM chamber 110 may be divided into a first space (S1) and a second space (S2). The first space (S1) is a local space adjacent to the first door (D1) in communication with the poo (120), that is, the dehumidified gas (F1) is sprayed from the vertical laminar flow generator (190) to the lower part of the EFEM chamber (110). It may be a space corresponding to the gas path being discharged. The second space S2 may be a space far away from the first door D1, that is, most of the space inside the EFEM chamber 110 except for the first space S1 among the spaces inside the EFEM chamber 110. The dehumidified gas (F1) flowing into the first gas inlet 113 can flow into the first space (S1) of the EFEM chamber 110, and the non-dehumidified gas (F2) flowing into the second gas inlet 115 ) may flow into the second space (S2) of the EFEM chamber 110.

The membrane dehumidification module 160 removes moisture from the input compressed gas (CA) to generate dehumidified gas (F1) and transfers the dehumidified gas (F1) to the first gas of the EFEM chamber (110) through the transport pipe (20). It can be introduced into the inlet 113. The dehumidified gas (F1) flowing into the first gas inlet (113) is homogenized and vertically laminarized through the vertical laminar flow generator (190) to form a first door (D1) on the inner side of the EFEM chamber (112). It can form a gas curtain by spraying over a larger area than the inner side of D1).

Therefore, even if the non-dehumidified gas (F2) flowing into the EFEM chamber 110 through the second gas inlet 115 by the fan filter unit 140 flows from the top to the bottom of the EFEM chamber 110, it does not enter the door. (D1) At the time of opening, the non-dehumidified gas (F2) in the EFEM chamber 110 can be prevented from flowing into the inside of the foof 120 and the nitrogen (N2) atmosphere inside the foof 120 can be maintained, thereby maintaining the substrate This can reduce quality degradation caused by moisture or fumes.

Figure 8 is an exemplary cross-sectional view of a vertical laminar flow forming pipe of an EFEM according to an embodiment.

Referring to FIG. 8, the vertical laminar flow forming pipe 196 may include a plurality of spaces 197 formed in a straight or curved shape from the gas outlet of the dehumidifying gas inlet space toward the first door, that is, a porous pipe. . Each hollow pipe 197 included in the porous pipe may have a cylindrical or oval shape. Also, connecting the centers of three adjacent tubes 197 can form an equilateral triangle. Meanwhile, the shape of each hollow pipe 197 included in the porous pipe may be cylindrical or oval, but may also have the shape of a polygonal column, such as a triangular column or a square column. Depending on the shape of each hollow pipe 197 included in the porous pipe, the Coanda effect can be minimized at the discharge port through friction between the gas passing therein and the internal wall. In addition, vertical laminar flow can be easily formed depending on the shape of each hollow pipe 197 included in the porous pipe.

As described above, according to this embodiment, a technology for managing the humidity of a local space within the EFEM can be provided. Additionally, according to this embodiment, the humidity of the EFEM can be managed while minimizing costs, and the humidity in key areas that affect the substrate can be managed without replacing the existing EFEM chamber. And, according to this embodiment, the humidity of the EFEM can be managed without taking up a lot of space, and the humidity of the EFEM can be managed while significantly reducing power consumption.

Terms such as “include,” “comprise,” or “have,” as used above, mean that the corresponding component may be included, unless specifically stated to the contrary, and do not exclude other components. It should be interpreted that it may further include other components. All terms, including technical or scientific terms, unless otherwise defined, have the same meaning as generally understood by a person of ordinary skill in the technical field to which the present invention pertains. Commonly used terms, such as terms defined in a dictionary, should be interpreted as consistent with the meaning in the context of the related technology, and should not be interpreted in an idealized or overly formal sense unless explicitly defined in the present invention.

The above description is merely an illustrative explanation of the technical idea of the present invention, and various modifications and variations will be possible to those skilled in the art without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

100: EFEM (Equipment Front End Module)
110: EFEM chamber
113: First gas inlet
115: Second gas inlet
120: FOUP (Front Opening Unified Pod)
130: Load port module
140: Fan Filter Unit (FFU)
150: Dehumidifier
160: Membrane dehumidification module
162: membrane
163, 165: Foreign matter removal filter
170: control unit
190: Vertical laminar flow generator
192: Dehumidifying gas inlet space
194: Diffusing filter
196: Vertical laminar flow forming pipe
197: perforated pipe
210: Load lock device
220: Return chamber
230: Process chamber
W: substrate
D1: 1st door
D2: Second door
D3: Third door
D4: 4th door
N2: Nitrogen
10: N2 supply pipe
12: Differential pressure exhaust unit
F1: Dehumidified gas
F2: Gas that has not been dehumidified
S1: First space
S2: Second space

Claims (12)

FOUP where the substrate subject to processing is loaded;
a chamber in communication with the poo through a door and in which the substrate temporarily resides;
A local dehumidification module that dehumidifies the injected compressed gas and supplies the dehumidified gas to the transportation pipe; and
A vertical laminar flow generator connected to the transport pipe and disposed inside the chamber, homogenizes the flow of the incoming dehumidified gas, converts it into a vertical laminar flow, and sprays it on the inner side of the chamber of the door;
EFEM containing. According to paragraph 1,
The local dehumidification module is a membrane dehumidification module,
The membrane dehumidification module is an EFEM that includes at least one foreign matter removal filter for removing foreign matter from the compressed gas and a membrane for dehumidifying the compressed gas and discharging the dehumidified gas. According to paragraph 1,
The vertical laminar flow generator
a dehumidifying gas inflow space formed inside the chamber, separated from the chamber interior space, and connected to the transport pipe into which the dehumidified gas flows;
a diffusing filter tightly coupled to the dehumidifying gas inlet space and uniformizing the flow of the dehumidified gas; and
EFEM comprising; a vertical laminar flow forming pipe that is tightly coupled to the diffusing filter and forms a vertical laminar flow of the dehumidified gas homogenized through the diffusing filter and sprays it on the inner side of the chamber of the door. According to paragraph 1,
The diffusing filter is an EFEM including a HEPA filter or ULPA filter. According to paragraph 1,
The EFEM further includes a load port module disposed below the foop to support the foop, wherein the load port module purges the inner space of the foop with nitrogen (N2). According to paragraph 3,
EFEM further comprising a control unit that adjusts at least one of the gas flow amount and gas flow pressure in the dehumidifying gas inlet space. According to clause 6,
The EFEM has a plurality of dehumidifying gas inflow spaces, and the control unit individually adjusts at least one of a gas flow amount and a gas flow pressure of each dehumidifying gas inlet space. According to paragraph 3,
The vertical laminar flow generator is disposed on the inner side of the chamber and above the door,
EFEM, wherein the vertical laminar flow former includes a porous pipe formed in the door direction. According to paragraph 1,
The vertical laminar flow generator is an EFEM that sprays gas into an area larger than the inner side of the chamber of the door. According to paragraph 3,
The chamber is formed with a first gas inlet and a second gas inlet that are separated from each other,
The first gas inlet is formed on a side of the chamber and is connected to the transport pipe to allow the dehumidified gas to flow in,
The second gas inlet is formed on the upper surface of the chamber through which non-dehumidified gas flows into the EFEM. According to clause 10,
The interior of the chamber is divided into a first space adjacent to the door in the chamber and a second space different from the first space,
The gas dehumidified by the membrane dehumidification module is supplied to the first space through the first gas inlet and the vertical laminar flow generator,
EFEM, where the non-dehumidified gas flowing in from the second gas inlet is supplied to the second space by a fan filter unit (FFU). According to clause 11,
EFEM, wherein the wind speed of the dehumidified gas output from the vertical laminar flow generator is greater than the wind speed of the non-dehumidified gas by the fan filter unit.