TW202348988A - 缺陷檢查裝置及缺陷檢查方法 - Google Patents
缺陷檢查裝置及缺陷檢查方法 Download PDFInfo
- Publication number
- TW202348988A TW202348988A TW112111142A TW112111142A TW202348988A TW 202348988 A TW202348988 A TW 202348988A TW 112111142 A TW112111142 A TW 112111142A TW 112111142 A TW112111142 A TW 112111142A TW 202348988 A TW202348988 A TW 202348988A
- Authority
- TW
- Taiwan
- Prior art keywords
- image
- mentioned
- defect
- difference
- area
- Prior art date
Links
- 230000007547 defect Effects 0.000 title claims abstract description 99
- 238000007689 inspection Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000003287 optical effect Effects 0.000 claims abstract description 113
- 238000003384 imaging method Methods 0.000 claims abstract description 12
- 235000012431 wafers Nutrition 0.000 claims description 65
- 230000035945 sensitivity Effects 0.000 claims description 29
- 238000005286 illumination Methods 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 10
- 230000002950 deficient Effects 0.000 description 45
- 238000011156 evaluation Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 6
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-050008 | 2022-03-25 | ||
| JP2022050008A JP2023142884A (ja) | 2022-03-25 | 2022-03-25 | 欠陥検査装置及び欠陥検査方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202348988A true TW202348988A (zh) | 2023-12-16 |
Family
ID=88100786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112111142A TW202348988A (zh) | 2022-03-25 | 2023-03-24 | 缺陷檢查裝置及缺陷檢查方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2023142884A (ja) |
| TW (1) | TW202348988A (ja) |
| WO (1) | WO2023181918A1 (ja) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5212779B2 (ja) * | 2007-12-18 | 2013-06-19 | 株式会社ニコン | 表面検査装置および表面検査方法 |
| JP2010054269A (ja) * | 2008-08-27 | 2010-03-11 | Toshiba Corp | 外観検査方法、プログラムおよび外観検査装置 |
| JP5275017B2 (ja) * | 2008-12-25 | 2013-08-28 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
| WO2014149197A1 (en) * | 2013-02-01 | 2014-09-25 | Kla-Tencor Corporation | Detecting defects on a wafer using defect-specific and multi-channel information |
-
2022
- 2022-03-25 JP JP2022050008A patent/JP2023142884A/ja active Pending
-
2023
- 2023-03-07 WO PCT/JP2023/008619 patent/WO2023181918A1/ja unknown
- 2023-03-24 TW TW112111142A patent/TW202348988A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023181918A1 (ja) | 2023-09-28 |
| JP2023142884A (ja) | 2023-10-06 |
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