TW202344544A - 環氧樹脂組成物、含強化纖維之環氧樹脂組成物、預浸體及使用該等之纖維強化塑膠、及熱塑性環氧樹脂 - Google Patents

環氧樹脂組成物、含強化纖維之環氧樹脂組成物、預浸體及使用該等之纖維強化塑膠、及熱塑性環氧樹脂 Download PDF

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Publication number
TW202344544A
TW202344544A TW112106158A TW112106158A TW202344544A TW 202344544 A TW202344544 A TW 202344544A TW 112106158 A TW112106158 A TW 112106158A TW 112106158 A TW112106158 A TW 112106158A TW 202344544 A TW202344544 A TW 202344544A
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TW
Taiwan
Prior art keywords
epoxy resin
resin composition
compound
weight
epoxy
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TW112106158A
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English (en)
Chinese (zh)
Inventor
山田亮
中西哲也
切替徳之
長谷修一郎
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日商日鐵化學材料股份有限公司
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Publication of TW202344544A publication Critical patent/TW202344544A/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/06Elements
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
TW112106158A 2022-03-03 2023-02-20 環氧樹脂組成物、含強化纖維之環氧樹脂組成物、預浸體及使用該等之纖維強化塑膠、及熱塑性環氧樹脂 TW202344544A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022032674 2022-03-03
JP2022-032674 2022-03-03

Publications (1)

Publication Number Publication Date
TW202344544A true TW202344544A (zh) 2023-11-16

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TW112106158A TW202344544A (zh) 2022-03-03 2023-02-20 環氧樹脂組成物、含強化纖維之環氧樹脂組成物、預浸體及使用該等之纖維強化塑膠、及熱塑性環氧樹脂

Country Status (3)

Country Link
JP (1) JPWO2023167049A1 (https=)
TW (1) TW202344544A (https=)
WO (1) WO2023167049A1 (https=)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
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JP3403987B2 (ja) * 1999-12-27 2003-05-06 京セラケミカル株式会社 ビルドアップ型多層プリント配線板とそれに用いる樹脂組成物および樹脂フィルム
JP2002171074A (ja) * 2000-12-04 2002-06-14 Toshiba Chem Corp ビルドアップ型多層プリント配線板とそれに用いる樹脂組成物および樹脂フィルム
JP2004359867A (ja) * 2003-06-05 2004-12-24 Hitachi Chem Co Ltd 絶縁樹脂組成物、これを用いたプリプレグ、樹脂付導体箔、導体張積層板及び多層配線板並びに多層配線板の製造方法
JP4601973B2 (ja) * 2004-02-27 2010-12-22 日東紡績株式会社 繊維強化樹脂の成形方法及びそれにより形成された被覆シート
JP5266598B2 (ja) * 2008-11-28 2013-08-21 ナガセケムテックス株式会社 縮環構造含有フェノキシ樹脂
KR101648999B1 (ko) * 2009-01-09 2016-08-17 나가세케무텍쿠스가부시키가이샤 가시광에 대하여 투명성을 갖는 열가소성 에폭시 수지 경화물의 제조 방법 및 열가소성 에폭시 수지 조성물
JP6672699B2 (ja) * 2014-10-29 2020-03-25 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
CN107428970B (zh) * 2015-03-26 2021-09-10 日铁化学材料株式会社 纤维增强塑料成型用材料、其制造方法和成型物
US10961363B2 (en) * 2015-12-01 2021-03-30 Nippon Steel Chemical & Material Co., Ltd. In-situ polymerized type thermoplastic prepreg, thermoplastic composite, and methods of manufacturing the same
TW201903013A (zh) * 2017-03-31 2019-01-16 日商新日鐵住金化學股份有限公司 金屬-纖維強化樹脂材料複合體及其製造方法
JP2019157027A (ja) * 2018-03-15 2019-09-19 日立化成株式会社 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法
JP7194536B2 (ja) * 2018-08-31 2022-12-22 宇部エクシモ株式会社 繊維強化熱可塑性樹脂プリプレグの製造方法、及び繊維強化熱可塑性樹脂の製造方法
JP7202136B2 (ja) * 2018-10-16 2023-01-11 旭化成株式会社 N-アルキル置換アミノピリジン・フタル酸塩及びそれを含むエポキシ樹脂組成物
JP7352462B2 (ja) * 2019-01-30 2023-09-28 タキロンシーアイ株式会社 樹脂フィルム、熱可塑性炭素繊維プリプレグ、およびその製造方法
TW202142585A (zh) * 2020-03-19 2021-11-16 日商日鐵化學材料股份有限公司 苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及苯氧基樹脂的製造方法
TW202142584A (zh) * 2020-03-27 2021-11-16 日商日鐵化學材料股份有限公司 含磷的苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及含磷的苯氧基樹脂的製造方法

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WO2023167049A1 (ja) 2023-09-07
JPWO2023167049A1 (https=) 2023-09-07

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