TW202341122A - Display apparatus and manufacturing method thereof - Google Patents

Abstract

A display apparatus includes a carrier substrate, a pixel driving circuit, an insulating layer, a pad group, a light-emitting element and a first fixing element. The pixel driving circuit is disposed on the carrier substrate. The insulating layer is disposed on the pixel driving circuit. The pad group is disposed on the insulating layer and is electrically connected to the pixel driving circuit. The light-emitting element is electrically connected to the pad group. The first fixing elements are disposed on the insulating layer and at least located on two opposite sides of the pad group. The light emitting element has a height H _LEDin a direction perpendicular to the carrier substrate. The first fixing element has a height H _PS1in the direction perpendicular to the carrier substrate. A pad of the pad group has a thickness H _PADin the direction perpendicular to the carrier substrate. H _LED, H _PS1and H _PADsatisfy: H _LED≦H _PS1≦1.4∙(H _LED+H _PAD). Or, H _LED, H _PS1and H _PADsatisfy: H _LED+90μm≦H _PS1≦1.4∙(H _LED+H _PAD+90μm).

Description

display device

The present invention relates to an optoelectronic device, and in particular to a display device.

The light-emitting diode display panel includes a driving backplane and a plurality of light-emitting diode elements transferred on the driving backplane. Inheriting the characteristics of light-emitting diodes, light-emitting diode display panels have the advantages of power saving, high efficiency, high brightness and fast response time. In addition, compared with organic light-emitting diode display panels, light-emitting diode display panels also have the advantages of easy color adjustment, long luminous life, and no image imprinting. Therefore, light-emitting diode display panels are regarded as the next generation of display technology.

In the manufacturing process of a light-emitting diode display panel, a large number of light-emitting diode elements on a temporary substrate must be transferred to the driving backplane, and the electrodes of the light-emitting diode elements must be connected to the pads of the driving backplane. Electrical connection. When transferring the light-emitting diode elements, a laser can be used to irradiate the temporary substrate and the light-emitting diode elements, so that the electrodes of the light-emitting diode elements are eutectic-joined to the pads of the driving backplane, and the light-emitting diodes are The component is separated from the base of the temporary base. However, during the process of irradiating the temporary substrate with laser, the adhesive layer of the temporary substrate will be heated and undergo thermal expansion, causing the position of the light-emitting diode element disposed on the adhesive layer of the temporary substrate to shift. When the position of the light-emitting diode element is shifted, the electrodes of the light-emitting diode element cannot smoothly connect with the pads of the driving backplane, resulting in the failure to light up in some areas of the subsequently formed display device.

The present invention provides a manufacturing method of a display device, which can improve the bonding yield.

The invention provides a display device with high yield rate.

The manufacturing method of the display device of the present invention includes the following steps: providing a light-emitting element substrate, wherein the light-emitting element substrate includes a temporary base, an adhesive layer and a light-emitting element, the adhesive layer is arranged on the temporary base, and the light-emitting element is arranged on the adhesive layer ; Provide a driving backplane, wherein the driving backplane includes a carrying substrate, a pixel driving circuit, an insulating layer, a pad group and a first fixed component, the pixel driving circuit is provided on the carrying substrate, and the insulating layer is provided on the pixel driving circuit , the pad group is disposed on the insulating layer and electrically connected to the pixel driving circuit, the first fixing element is disposed on the insulating layer and is at least located on opposite sides of the pad group; and the light-emitting element of the light-emitting element substrate is transferred to On the driving backplane, the light-emitting element is electrically connected to the pad group of the driving backplane. During the process of transferring the light-emitting element of the light-emitting element substrate to the driving backplane, the first fixing element abuts against the light-emitting element substrate. Adhesive layer.

The display device of the present invention includes a carrying substrate, a pixel driving circuit, an insulating layer, a pad group, a light-emitting element and a first fixing element. The pixel driving circuit is arranged on the carrying substrate. The insulating layer is arranged on the pixel driving circuit. The pad group is disposed on the insulating layer and electrically connected to the pixel driving circuit. The light-emitting element is electrically connected to the pad group. The first fixing element is disposed on the insulating layer and is located at least on opposite sides of the pad group. The light-emitting element includes an electrode and a solder disposed on the electrode. The solder is located between the electrode and a pad of the pad set. The electrode of the light-emitting element and a surface of the light-emitting element facing away from the carrying substrate have a distance H _LED in a direction perpendicular to the carrying substrate. The first fastening element has a height H _PS1 in a direction perpendicular to the carrying base. The solder has a thickness _HPAD in a direction perpendicular to the carrying substrate. H _LED , H _PS1 and H _PAD satisfy: H _LED ≦H _PS1 ≦1.4∙(H _LED +H _PAD ). Or, H _LED , H _PS1 and H _PAD satisfy: H _LED +90μm≦H _PS1 ≦1.4∙(H _LED +H _PAD +90μm).

Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or similar parts.

It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection. Furthermore, "electrical connection" or "coupling" may mean the presence of other components between two components.

As used herein, "about," "approximately," or "substantially" includes the stated value and the average within an acceptable range of deviations from the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the A specific amount of error associated with a measurement (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the terms "about", "approximately" or "substantially" used herein may be used to select a more acceptable deviation range or standard deviation based on optical properties, etching properties or other properties, and one standard deviation may not apply to all properties. .

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed to have meanings consistent with their meanings in the context of the relevant technology and the present invention, and are not to be construed as idealistic or excessive Formal meaning, unless expressly defined as such herein.

1A to 1C are schematic cross-sectional views of the manufacturing process of a display device according to an embodiment of the present invention. FIG. 2 is a schematic top view of a display device according to an embodiment of the present invention.

Referring to FIG. 1A , first, a light emitting element substrate 100 is provided. The light-emitting element substrate 100 includes a temporary base 110, an adhesive layer 120 and a light-emitting element 130. The adhesive layer 120 is disposed on the temporary storage substrate 110 . The light-emitting element 130 is disposed on the adhesive layer 120 . The adhesive layer 120 is located between the temporary substrate 110 and the light emitting element 130 .

Specifically, in this embodiment, the light-emitting element 130 includes a first semiconductor layer 131, a second semiconductor layer 132, an active layer 133 disposed between the first semiconductor layer 131 and the second semiconductor layer 132, and electrically connected components respectively. to the plurality of electrodes 134 and 135 of the first semiconductor layer 131 and the second semiconductor layer 132 , and the active layer 133 of the light-emitting element 130 is located between the temporary substrate 110 and the plurality of electrodes 134 and 135 of the light-emitting element 130 . That is, the plurality of electrodes 134 and 135 of the light-emitting element 130 face outward. In this embodiment, the light-emitting element 130 further includes a plurality of solders 138 and 139 respectively disposed on the plurality of electrodes 135 and 134. For example, the material of the solders 138 and 139 may include tin (Sn), but the present invention is not limited thereto.

In this embodiment, the light-emitting element 130 may further include an insulating layer 136 disposed on the second semiconductor layer 132 and having a plurality of contact windows 136a, 136b respectively overlapping the first semiconductor layer 131 and the second semiconductor layer 132; The electrodes 134 and 135 are electrically connected to the first semiconductor layer 131 and the second semiconductor layer 132 respectively through the plurality of contact windows 136a and 136b of the insulating layer 136. In this embodiment, the light-emitting element 130 may optionally include an epitaxial layer 137. The first semiconductor layer 131 is formed on the epitaxial layer 137. The epitaxial layer 137 is located between the adhesive layer 120 and the first semiconductor layer 131, and the first semiconductor layer 137 is formed on the epitaxial layer 137. Layer 131 is located between epitaxial layer 137 and active layer 133 . For example, in this embodiment, the epitaxial layer 137 is undoped gallium nitride, the first semiconductor layer 131 is n-type gallium nitride, the active layer 133 is multiple quantum wells, and the second semiconductor layer 132 is p type gallium nitride, but the present invention is not limited to this.

Please refer to FIG. 1A. Next, a driving backplane 200 is provided. The driving backplane 200 includes a carrying substrate 210, a pixel driving circuit 220, an insulating layer 230 and a pad group 240. The pixel driving circuit 220 is disposed on the carrying substrate 210 . The insulating layer 230 is disposed on the pixel driving circuit 220. The pad group 240 is disposed on the insulating layer 230 and is electrically connected to the pixel driving circuit 220 . The pad group 240 includes a plurality of pads 241 and 242 that are structurally separated from each other.

For example, in this embodiment, the pixel driving circuit 220 may include a data line (not shown), a scanning line (not shown), a power line (not shown), a common line (not shown), a third A transistor (not shown), a second transistor (not shown) and a capacitor (not shown), wherein the first terminal of the first transistor is electrically connected to the data line, and the control terminal of the first transistor is electrically connected to the data line. is electrically connected to the scan line, the second terminal of the first transistor is electrically connected to the control terminal of the second transistor, the first terminal of the second transistor is electrically connected to the power line, and the capacitor is electrically connected to the first transistor The second terminal of the second transistor and the first terminal of the second transistor are electrically connected to one of the plurality of pads 241 and 242 of the pad group 240, and the common line is electrically connected to the pad. The other one of the plurality of pads 241 and 242 of the pad set 240 . However, the present invention is not limited to this. In other embodiments, the pixel driving circuit 220 can also be other types of circuits.

Referring to FIG. 1A and FIG. 2 , it is worth noting that the driving backplane 200 further includes a first fixing component 250 , which is disposed on the insulating layer 230 and located at least on opposite sides of the pad group 240 . For example, in this embodiment, the driving backplane 200 has a pixel area 200a (marked in FIG. 2). A plurality of pad groups 240 are provided in the pixel area 200a. The multiple pad groups 240 in the same pixel area 200a The pad set 240 is used to electrically connect to a plurality of light-emitting elements 130 that emit light of different colors. The first fixing component 250 may include a plurality of fixing structures 252, and the plurality of fixing structures 252 are respectively disposed at multiple connections in the same pixel area 200a. Opposite sides of the pad set 240 . However, the present invention is not limited thereto, and in other embodiments, the first fixing element 250 may also be configured in other ways.

In this embodiment, the fixing structure 252 of the first fixing element 250 may optionally be a cone. However, the present invention is not limited thereto. In other embodiments, the fixed structure 252 may also be in other shapes, such as but not limited to: cylinder, triangular prism, quadrangular prism, trapezoidal quadrangular prism, other polygonal corner prism or retaining wall. The material of the first fixing element 250 is preferably elastic and compressible. For example, in this embodiment, the material of the first fixing element 250 can be photoresist, but the invention is not limited thereto. In this embodiment, the compression ratio of the first fixing element 250 can fall in the range of 60% to 90%, but the invention is not limited thereto. In this embodiment, the number ratio of the first fixing element 250 to the pads 241 and 242 can fall in the range of 1/64 to 1, but the invention is not limited thereto.

Referring to FIGS. 1A to 1C , the light-emitting element 130 of the light-emitting element substrate 100 is then transferred to the driving backplane 200 , and the light-emitting element 130 is electrically connected to the pad group 240 of the driving backplane 200 . In particular, during the process of transferring the light-emitting element 130 to the driving backplane 200, the first fixing element 250 of the driving backplane 200 will resist the adhesive layer 120 of the light-emitting element substrate 100.

Please refer to FIG. 1B . Specifically, in this embodiment, the laser L can be caused to penetrate the temporary base 110 and the adhesive layer 120 of the light-emitting element substrate 100 sequentially and irradiate the solders 138 , 139 and the driving back of the light-emitting element 130 . The pads 241 and 242 of the board 200 are connected to the solders 138 and 139 of the light emitting element 130 and the pads 241 and 242 of the driving backplane 200 .

It is worth noting that while the laser L irradiates the solders 138 and 139 of the light-emitting element 130 and the pads 241 and 242 of the driving backplane 200, the first fixing element 250 will continue to press against the adhesive layer 120 of the light-emitting element substrate 100. . That is to say, the first fixing element 250 functions like a fixing anchor and can fix the adhesive layer 120 so that the light-emitting element 130 disposed on the adhesive layer 120 is not easily deviated from its original position. In this way, when the light-emitting element 130 and the driving backplane 200 are bonded using the laser L, although the adhesive layer 120 will be heated due to the irradiation of the laser L, the adhesive layer 120 will not easily undergo excessive thermal expansion and contraction, resulting in The light-emitting element 130 deviates from its original position. Thereby, the bonding yield of the light-emitting element 130 and the driving backplane 200 can be significantly improved.

Please refer to FIG. 1A and FIG. 1B. In addition, in this embodiment, the first fixing element 250 can also be used as an alignment stop between the light-emitting element 130 and the pad group 240, to assist in the alignment of the light-emitting element 130 and the pad group 240. . Furthermore, when the coplanarity difference between the light-emitting element substrate 100 and the driving backplane 200 is large and the light-emitting element substrate 100 needs to press the driving backplane 200 harder, the first fixing element 250 can also be used as a buffer material.

Please refer to FIG. 1B and FIG. 1C. When the light-emitting element 130 is bonded to the driving backplane 200, the interface between the part of the adhesive layer 120 irradiated by the laser L and the temporary base 110 will be dissociated, so that the light-emitting element 130 and the temporary base 110 will be dissociated. are separated and transferred to the driving backplane 200 to form the display device 10 .

Referring to FIG. 1C , the light-emitting element 130 includes an electrode 135 and a solder 138 disposed on the electrode 135 . The solder 138 is located between the electrode 135 and the pads 241 of the pad group 240 . The electrode 135 of the light-emitting element 130 and the surface 137a of the light-emitting element 130 facing away from the carrying substrate 210 have a distance H _LED in the direction z perpendicular to the carrying substrate 210. The first fixing element 250 has a distance H LED in the direction z perpendicular to the carrying substrate 210. The solder 138 has a height H _PS1 and a thickness H _PAD in the direction z perpendicular to the carrier substrate 210 . In this embodiment, H _LED , H _PS1 and H _PAD satisfy: H _LED ≦H _PS1 ≦1.4∙(H _LED +H _PAD ).

It must be noted here that the following embodiments follow the component numbers and part of the content of the previous embodiments, where the same numbers are used to represent the same or similar elements, and descriptions of the same technical content are omitted. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be repeated in the following embodiments.

FIG. 3 is a schematic top view of a display device according to another embodiment of the present invention. The display device 10A of FIG. 3 is similar to the display device 10 of FIG. 2 , and the difference between the two is: the position of the fixing structure 252 of the first fixing element 250A of FIG. 3 and the position of the fixing structure 252 of the first fixing element 250 of FIG. 2 different.

Referring to FIG. 3 , a pixel area 200a includes a plurality of sub-pixel areas 200a-1, and a plurality of pad groups 240 are respectively provided in the plurality of sub-pixel areas 200a-1. What is different from the embodiment of FIG. 2 is that in this embodiment, a corresponding fixed structure 252 can be provided next to each sub-pixel area 200a-1.

FIG. 4 is a schematic top view of a display device according to another embodiment of the present invention. The display device 10B of FIG. 4 is similar to the display device 10 of FIG. 2 . The difference between the two is that the first fixing element 250B of FIG. 4 is different from the first fixing element 250 of FIG. 2 . Please refer to Figure 4. Specifically, in this embodiment, the fixing structure 252 of the first fixing element 250B may be a retaining wall. Furthermore, in this embodiment, the fixed structure 252 may optionally include a plurality of vertical retaining walls 252-1 interspersed between the plurality of sub-pixel regions 200a-1.

FIG. 5 is a schematic top view of a display device according to yet another embodiment of the present invention. The display device 10C of FIG. 5 is similar to the display device 10B of FIG. 4 . The difference between the two is that the first fixing element 250C of FIG. 5 is different from the first fixing element 250B of FIG. 4 . Specifically, in this embodiment, the first fixing element 250C not only includes a plurality of vertical blocking walls 252-1, but also includes a plurality of lateral blocking walls 252-2 intersecting the plurality of vertical blocking walls 252-1.

6A to 6C are schematic cross-sectional views of the manufacturing process of a display device according to an embodiment of the present invention. FIG. 7 is a schematic top view of a display device according to an embodiment of the present invention. FIG. 7 corresponds to FIG. 6B and shows the recess 122 of the adhesive layer 120D of FIG. 6B. Figure 7 omits the first fixing element 250.

The manufacturing process of the display device 10D of FIGS. 6A to 6C is similar to the manufacturing process of the display device 10 of FIGS. 1A to 1C , and the differences between the two are as follows. Please refer to FIG. 6A , FIG. 6B and FIG. 7 . In this embodiment, the adhesive layer 120D has a depression 122 . During the process of transferring the light-emitting element 130 to the driving backplane 200, a part of the first fixing element 250 will extend into the recess 122 of the adhesive layer 120D of the light-emitting element substrate 100. By using the recess 122 of the adhesive layer 120D to fit into the first fixing element 250, the first fixing element 250 can better fix the adhesive layer 120D, so that the degree of thermal expansion and contraction of the adhesive layer 120D caused by the laser L is reduced, and thus The degree of deflection of the light emitting element 130 is reduced.

Referring to FIG. 6B , the recess 122 of the adhesive layer 120D has a depth H _G in the direction z perpendicular to the temporary substrate 110 . Please refer to FIG. 6C , the electrode 135 of the light-emitting element 130 and the surface 137a of the light-emitting element 130 facing away from the carrying substrate 210 have a distance H _LED in the direction z perpendicular to the carrying substrate 210 , and the first fixing element 250 is perpendicular to the carrying substrate 210 has a height H _PS1 in the direction z, and the solder 138 has a thickness H _PAD in the direction z perpendicular to the carrier substrate 210 . Please refer to FIG. 6B and FIG. 6D. In this embodiment, H _LED , H _PS1 , H _PAD and _HG satisfy: H _LED +H _G ≦H _PS1 ≦1.4∙(H _LED +H _PAD +H _G ).

Please refer to Figure 6B. Specifically, in this embodiment, 0μm<H _G ≦90μm. Please refer to FIG. 6D , that is to say, in this embodiment, H _LED , H _PS1 and H _PAD satisfy: H _LED +90 μm≦H _PS1 ≦1.4∙(H _LED +H _PAD +90 μm).

FIG. 8 is a schematic top view of a display device according to another embodiment of the present invention. FIG. 8 further shows the recess 122E of the adhesive layer 120E corresponding to the display device 10E. Please refer to FIGS. 7 and 8 . The embodiment of FIG. 8 is similar to the embodiment of FIG. 7 . The difference between the two is that the recess 122E of the adhesive layer 120E of FIG. 8 is different from the recess 122 of the adhesive layer 120D of FIG. 7 . Specifically, in the embodiment of FIG. 7 , the depressions 122 of the adhesive layer 120D are in the shape of strips; in the embodiment of FIG. 8 , the depressions 122E of the adhesive layer 120E are in the shape of points.

9A to 9C are schematic cross-sectional views of the manufacturing process of a display device according to another embodiment of the present invention. FIG. 10 is a schematic top view of a display device according to another embodiment of the present invention.

The display device 10F of FIGS. 9A to 9C and FIG. 10 and its manufacturing process are similar to the display device 10 of FIGS. 1A to 1C and FIG. 2 . The difference between the two is that in the embodiment of FIGS. 9A to 9C and FIG. 10 , the driving backplane 200F further includes a second fixing component 260, which is disposed on the insulating layer 230 and located outside the pad group 240 and the first fixing component 250. The second fixing element 260 has a height H _PS2 in the direction z perpendicular to the carrying substrate 210 , H _PS2 > H _LED , and H _PS2 < H _PS1 . Please refer to FIG. 9B . In this embodiment, if the light-emitting element substrate 100 presses down the driving backplane 200F with a large force, the second fixing element 260 can act as a buffer to prevent the first fixing element 250 from being excessively compressed and deformed. Restore resilience. For example, in this embodiment, the quantity ratio of the first fixing elements 250 and the second fixing elements 260 can be 1:8 or 1:32, but the invention is not limited thereto.

FIG. 11 is a schematic top view of the first fixing component according to yet another embodiment of the present invention. Figure 12 is a schematic side view of the first fixing element according to yet another embodiment of the present invention.

The first fixing element 250G of Figures 11 and 12 is similar to the aforementioned first fixing element 250. The difference between the two is that the first fixing element 250G of Figures 11 and 12 has a back-facing bearing base 210 (see Figure 1B) The surface 250s has a plurality of micro-protrusions 250v. Please refer to FIG. 1B, FIG. 11 and FIG. 12. During the process of transferring the light-emitting element 130 of the light-emitting element substrate 100 to the driving backplane 200, the micro-protrusions 250v of the first fixing element 250G can extend into the light-emitting element substrate 100. Adhesive layer 120. Thereby, the first fixing element 250G can better fix the adhesive layer 120, reduce the degree of thermal expansion and contraction of the adhesive layer 120 caused by the laser L, and thereby reduce the degree of deflection of the light-emitting element 130. In this embodiment, the micro-protrusions 250v are, for example, arc-shaped protruding structures, but the invention is not limited to this.

FIG. 13 is a schematic top view of the first fixing component according to an embodiment of the present invention. Figure 14 is a schematic side view of the first fixing element according to an embodiment of the present invention. The first fixing element 250H of Figures 13 and 14 is similar to the first fixing element 250G of Figures 11 and 12. The difference between the two is that the micro-protrusions 250v of the first fixing element 250H of Figures 13 and 14 are sharp. Raised structure.

FIG. 15 is a schematic top view of the first fixing component according to another embodiment of the present invention. Figure 16 is a schematic side view of the first fixing element according to another embodiment of the present invention. The first fixing element 250I of Figures 15 and 16 is similar to the first fixing element 250H of Figures 13 and 14. The difference between the two is that the volume of the micro-protrusion 250v of the first fixing element 250I of Figures 15 and 16 is larger than The volume of the micro-protrusions 250v of the first fixing element 250H of FIGS. 13 and 14 is smaller, and the arrangement density of the micro-protrusions 250v of the first fixing element 250I of FIGS. 15 and 16 is smaller than that of the first fixing element 250H of FIGS. 250H micro bumps 250v setting density.

Figure 17 is a schematic top view of the first fixing element according to another embodiment of the present invention. Figure 18 is a schematic side view of the first fixing element according to another embodiment of the present invention.

The first fixing element 250J in Figures 17 and 18 is similar to the first fixing element 250 mentioned above. The difference between the two is that the first fixing element 250J in Figures 17 and 18 has a base facing away from the bearing base 210 (see Figure 1B). The surface 250s has at least one groove 250c. Please refer to FIG. 1B , FIG. 17 and FIG. 18 . During the process of transferring the light-emitting element 130 of the light-emitting element substrate 100 to the driving backplane 200 , a part of the adhesive layer 120 of the light-emitting element substrate 100 will sink into the first fixing element 250J. At least one groove 250c. Thereby, the first fixing element 250J can better fix the adhesive layer 120, reduce the degree of thermal expansion and contraction of the adhesive layer 120 caused by the laser L, and thereby reduce the degree of deflection of the light-emitting element 130. In this embodiment, at least one groove 250c of the first fixing element 250J is, for example, a plurality of transverse grooves, but the invention is not limited thereto.

Figure 19 is a schematic top view of the first fixing element according to yet another embodiment of the present invention. Figure 20 is a schematic side view of the first fixing element according to yet another embodiment of the present invention. The first fixing element 250K of Figures 19 and 20 is similar to the first fixing element 250J of Figures 17 and 18. The difference between the two is that at least one groove 250c of the first fixing element 250K of Figures 19 and 20 includes an intersection with each other. of multiple grooves.

FIG. 21 is a schematic top view of the first fixing component according to an embodiment of the present invention. Figure 22 is a schematic side view of the first fixing element according to an embodiment of the present invention. The first fixing element 250L of Figures 21 and 22 is similar to the first fixing element 250J of Figures 17 and 18. The difference between the two is that at least one groove 250c of the first fixing element 250L of Figures 21 and 22 includes a ring. shaped groove.

10, 10A, 10B, 10C, 10D, 10E: display device 100: light-emitting element substrate 110: temporary storage substrate 120, 120D, 120E: adhesive layer 122, 122E: recess 130: light-emitting element 131: first semiconductor layer 132: third Two semiconductor layers 133: active layer 134, 135: electrode 136: insulating layer 136a, 136b: contact window 137: epitaxial layer 137a: surface 138, 139: solder 200, 200F: driving backplane 200a: pixel area 200a-1: Sub-pixel area 210: Carrying substrate 220: Pixel driving circuit 230: Insulating layer 240: Pad group 241, 242: Pads 250, 250A, 250B, 250C, 250G, 250H, 250I, 250J, 250K, 250L: No. One fixed component 250c: Groove 250s: Surface 250v: Micro-protrusion 252: Fixed structure 252-1: Vertical retaining wall 252-2: Horizontal retaining wall 260: Second fixing component L: Laser H _LED : Distance H _PS1 , H _PS2 : height H _PAD : thickness H _G : depth z: direction

1A to 1C are schematic cross-sectional views of the manufacturing process of a display device according to an embodiment of the present invention. FIG. 2 is a schematic top view of a display device according to an embodiment of the present invention. FIG. 3 is a schematic top view of a display device according to another embodiment of the present invention. FIG. 4 is a schematic top view of a display device according to another embodiment of the present invention. FIG. 5 is a schematic top view of a display device according to yet another embodiment of the present invention. 6A to 6C are schematic cross-sectional views of the manufacturing process of a display device according to an embodiment of the present invention. FIG. 7 is a schematic top view of a display device according to an embodiment of the present invention. FIG. 8 is a schematic top view of a display device according to another embodiment of the present invention. 9A to 9C are schematic cross-sectional views of the manufacturing process of a display device according to another embodiment of the present invention. FIG. 10 is a schematic top view of a display device according to another embodiment of the present invention. FIG. 11 is a schematic top view of the first fixing component according to yet another embodiment of the present invention. Figure 12 is a schematic side view of the first fixing element according to yet another embodiment of the present invention. FIG. 13 is a schematic top view of the first fixing component according to an embodiment of the present invention. Figure 14 is a schematic side view of the first fixing element according to an embodiment of the present invention. FIG. 15 is a schematic top view of the first fixing component according to another embodiment of the present invention. Figure 16 is a schematic side view of the first fixing element according to another embodiment of the present invention. Figure 17 is a schematic top view of the first fixing element according to another embodiment of the present invention. Figure 18 is a schematic side view of the first fixing element according to another embodiment of the present invention. Figure 19 is a schematic top view of the first fixing element according to yet another embodiment of the present invention. Figure 20 is a schematic side view of the first fixing element according to yet another embodiment of the present invention. Figure 21 is a schematic top view of the first fixing component according to an embodiment of the present invention. Figure 22 is a schematic side view of the first fixing element according to an embodiment of the present invention.

100:Light-emitting element substrate

110: Temporary base

120:Adhesive layer

130:Light-emitting component

131: First semiconductor layer

132: Second semiconductor layer

133:Active layer

134, 135: Electrode

136:Insulation layer

136a, 136b: Contact window

137: Epitaxial layer

138, 139: solder

200:Drive backplane

210: Bearing base

220: Pixel drive circuit

230:Insulation layer

240: Pad set

241, 242: pad

250: first fixed element

252: Fixed structure

L:Laser

Claims (10)

A manufacturing method of a display device, including: Provide a light-emitting element substrate, wherein the light-emitting element substrate includes a temporary base, an adhesive layer and a light-emitting element, the adhesive layer is arranged on the temporary base, and the light-emitting element is arranged on the adhesive layer; A driving backplane is provided, wherein the driving backplane includes a carrying substrate, a pixel driving circuit, an insulating layer, a pad group and a first fixed component, the pixel driving circuit is disposed on the carrying substrate, the The insulating layer is disposed on the pixel driving circuit, the pad group is disposed on the insulating layer and is electrically connected to the pixel driving circuit, and the first fixing element is disposed on the insulating layer and is at least located on the pad group. opposite sides of; and The light-emitting element of the light-emitting element substrate is transferred to the driving backplane, and the light-emitting element is electrically connected to the pad group of the driving backplane, wherein the light-emitting element of the light-emitting element substrate is transferred to During part of the process of driving the backplane, the first fixing element presses against the adhesive layer of the light-emitting element substrate. The manufacturing method of a display device as claimed in claim 1, wherein the light-emitting element of the light-emitting element substrate is transferred to the driving backplane and the light-emitting element is electrically connected to the pad group of the driving backplane. Steps include: Let a laser penetrate the temporary base and the adhesive layer of the light-emitting element substrate in sequence, and irradiate an electrode of the light-emitting element and a pad of the pad group of the driving backplane, so that the light-emitting element The electrode is bonded to the pad of the driving backplane, and during the period when the laser irradiates the electrode of the light-emitting element and the pad of the driving backplane, the first fixing element continues to press against the light-emitting element. The adhesive layer of the substrate. The manufacturing method of a display device as claimed in claim 1, wherein the first fixing element has a surface facing away from the carrying substrate, and the surface has a plurality of micro-protrusions; the light-emitting element on the light-emitting element substrate is transferred to During part of the process of driving the backplane, the slight protrusions of the first fixing element extend into the adhesive layer of the light-emitting element substrate. The manufacturing method of a display device according to claim 1, wherein the first fixing element has a surface facing away from the carrying base, and the surface has at least one groove; the light-emitting element on the light-emitting element substrate is transferred to the During part of the process of driving the backplane, a part of the adhesive layer of the light-emitting element substrate sinks into the at least one groove of the first fixing element. The manufacturing method of a display device as claimed in claim 1, wherein the adhesive layer of the light-emitting element substrate has a recess; during the process of transferring the light-emitting element of the light-emitting element substrate to the driving backplane, the first A part of the fixing element extends into the recess of the adhesive layer of the light-emitting element substrate. The manufacturing method of a display device according to claim 5, wherein the light-emitting element includes an electrode and a solder disposed on the electrode, and the solder is located between the electrode and a pad of the pad group, and the light-emitting element The electrode and a surface of the light-emitting element facing away from the carrying substrate have a distance H _LED in a direction perpendicular to the carrying substrate, and the depression of the adhesive layer has a depth in a direction perpendicular to the temporary storage substrate. H _G , the first fixing element has a height H _{PS 1} in the direction perpendicular to the carrying substrate, the solder has a thickness H _PAD in the direction perpendicular to the carrying substrate, and H _LED +H _G ≦ H _PS1 ≦1.4∙(H _LED +H _PAD +H _G ). The manufacturing method of a display device as claimed in claim 1, wherein the light-emitting element includes an electrode and a solder disposed on the electrode, the solder is located between the electrode and a pad of the pad group, and the light-emitting element The electrode and a surface of the light-emitting element facing away from the carrying substrate have a distance H _LED in a direction perpendicular to the carrying substrate, and the first fixing element has a height H in the direction perpendicular to the carrying substrate. _PS1 , the solder has a thickness H _PAD in the direction perpendicular to the carrying substrate, and H _LED ≦H _PS1 ≦1.4∙(H _LED +H _PAD ). A display device includes: a carrying substrate; a pixel driving circuit arranged on the carrying substrate; an insulating layer arranged on the pixel driving circuit; a pad group arranged on the insulating layer and electrically Connected to the pixel driving circuit; a light-emitting element electrically connected to the pad group; and a first fixing element disposed on the insulating layer and at least on opposite sides of the pad group; the light-emitting element includes An electrode and a solder disposed on the electrode, the solder is located between the electrode and a pad of the pad group, the electrode of the light-emitting element and a surface of the light-emitting element facing away from the carrying substrate are vertically There is a distance H _LED in one direction of the carrying substrate, the first fixing element has a height H _PS1 in the direction perpendicular to the carrying substrate, and the solder has a thickness H in the direction perpendicular to the carrying substrate. _PAD ; H _LED , H _PS1 and H _PAD satisfy: H _LED ≦H _PS1 ≦1.4∙(H _LED +H _PAD ); or H _LED , H _PS1 and H _PAD satisfy: H _LED +90μm≦H _PS1 ≦1.4∙( H _LED +H _PAD +90μm). The display device of claim 8, wherein the first fixing element has a surface facing away from the carrying base, and the surface has a plurality of micro-protrusions. The display device of claim 8, wherein the first fixing element has a surface facing away from the carrying base, and the surface has at least one groove.

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