TW202341333A - Transferring equipment and method of transferring electronic elements - Google Patents

Abstract

A transferring equipment includes a stage, a backplane, a support kit and a substrate. The backplane is disposed on the stage. The support kit is disposed on the stage. The substrate has an area of clearance and an area of operation connected with the area of the clearance. The area of operation is configured to dispose a plurality of electronic elements. The substrate is configured to move towards the stage such that the electronic elements abut against the backplane. A vertical projection of the area of clearance towards the stage and the support kit are located on the same side of the backplane.

Description

Transfer equipment and transfer methods of electronic components

The present invention relates to an equipment and method for transferring electronic components, and in particular, to an equipment and method for transferring microscopic light-emitting diodes (microscopic light-emitting diodes; micro-LED).

With the advancement of today's technology, various types of displays have been greatly integrated into consumers' daily lives. In order to meet the needs of consumers and seize this huge business opportunity, manufacturers are committed to improving the factory quality of displays under better cost control.

Therefore, in the production process of micro-luminescent diode displays, how to effectively improve the production yield at low cost is undoubtedly a development direction that the industry attaches great importance to.

One object of the present invention is to provide a transfer device that can improve the coplanarity of the substrate with respect to the backplane and facilitate a large number of electronic components on the substrate to properly contact the backplane to complete the subsequent process of fixing the electronic components to the backplane.

According to an embodiment of the present invention, a transfer device includes a machine platform, a backplane, a support member and a base plate. The backplane is installed on the machine platform. The support member is arranged on the machine platform. The substrate has a connected blank area and a working area. The working area is configured to install a plurality of electronic components. The substrate is configured to move toward the machine platform so that the electronic components contact the backplane. The vertical projection of the blank area toward the machine platform and the support member are located on the back panel. Same side of the board.

In one or more embodiments of the present invention, the vertical projection of the above-mentioned working area toward the machine platform overlaps the back panel.

In one or more embodiments of the present invention, the above-mentioned machine platform has a surface, a back plate and a support member are respectively provided on the surface of the machine platform, the back plate has a first height, the support member has a second height, and the range of the second height It is between 0.7 times the first height and 0.95 times the first height.

In one or more embodiments of the present invention, the above-mentioned machine platform has a surface, a back plate is disposed on the surface of the machine platform, a support member is slidably connected to the surface of the machine platform, and the support member is configured to slide toward the back plate so that the blank space The vertical projection of the area toward the machine platform at least partially overlaps the support member.

In one or more embodiments of the present invention, the above-mentioned supporting member is configured to push the back plate.

In one or more embodiments of the present invention, the above-mentioned machine platform has a connected surface and an inner wall. The inner wall of the machine platform surrounds it to form a channel. The back plate is disposed on the surface of the machine platform, and the support member is at least partially located in the channel. , and is configured to move vertically relative to the surface of the machine platform to protrude from the surface of the machine platform and contact the blank area of the substrate.

One of the purposes of the present invention is to provide a method for transferring electronic components that can improve the coplanarity of the substrate with respect to the backplane, and facilitate a large number of electronic components on the substrate to properly abut the backplane to complete the subsequent fixing of the electronic components to the backplane. process.

According to an embodiment of the present invention, a method for transferring electronic components includes: arranging a backplane and a support member on a machine; providing a substrate with a connected blank area and a working area, and the vertical projection of the working area towards the machine overlaps with The backplane, the working area is configured to place a plurality of electronic components; and the substrate is moved toward the machine platform so that the electronic components contact the backplane, and the support member at least partially supports the blank area of the substrate.

In one or more embodiments of the present invention, the above-mentioned machine platform has a surface, a back plate and a support member are respectively provided on the surface of the machine platform, the back plate has a first height, the support member has a second height, and the range of the second height It is between 0.7 times the first height and 0.95 times the first height.

In one or more embodiments of the present invention, the above-mentioned step of arranging the support member includes: fixing the support member on the machine platform.

In one or more embodiments of the present invention, the above-mentioned transfer method further includes: sliding the support member toward the backplane before the substrate moves toward the machine.

In one or more embodiments of the present invention, the above-mentioned transfer method further includes: using a support member to push the backplane before the substrate moves toward the machine.

In one or more embodiments of the present invention, the step of making the support member at least partially support the blank area includes: moving the support member toward the substrate after the substrate moves toward the machine.

The above-mentioned embodiments of the present invention have at least the following advantages:

(1) Since the support at least partially supports the blank area of the substrate, when the electronic components on the substrate abut the backplane, the inclination of the substrate relative to the backplane can be effectively reduced, that is, the commonality of the substrate relative to the backplane can be improved. The surface properties facilitate a large number of electronic components on the substrate to properly contact the backplane to complete the subsequent process of fixing the electronic components to the backplane.

(2) Since the support member can be configured to contact and push the back plate before the substrate moves toward the machine, the position of the back plate relative to the machine is adjusted, for example, by aligning the back plate with the work area of the substrate, thereby improving the operation accuracy of the transfer equipment. Spend.

(3) When the support moves vertically toward the substrate relative to the surface of the machine, if the support touches the substrate before rising to the preset height, the support can play a detection role and can immediately send out an alarm to notify the user. The operator will inspect the transfer equipment.

A plurality of embodiments of the present invention will be disclosed in the drawings below. For clarity of explanation, many practical details will be explained in the following description. However, it will be understood that these practical details should not limit the invention. That is to say, in some embodiments of the present invention, these practical details are not necessary. In addition, for the sake of simplifying the drawings, some commonly used structures and components are illustrated in the drawings in a simple schematic manner, and the same reference numerals are used to represent the same or similar components in all the drawings. . And if possible in implementation, features of different embodiments can be applied interchangeably.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have their ordinary meanings that can be understood by one familiar with the art. Furthermore, the definitions of the above-mentioned words in commonly used dictionaries should be interpreted as meanings consistent with the relevant fields of the present invention in the content of this specification. Unless specifically defined, these terms will not be interpreted as having an idealized or overly formal meaning.

Please refer to picture 1. FIG. 1 is a flowchart illustrating a method 500 for transferring electronic components according to an embodiment of the present invention. In this embodiment, as shown in Figure 1 , an electronic component transfer method 500 includes the following steps (it should be understood that the steps mentioned in some embodiments, unless the order is specifically stated, can be Adjust the sequence according to actual needs, and even execute them simultaneously or partially simultaneously):

(1) Set the back plate 120 and the support member 130 on the machine platform 110 (step 510). Please refer to picture 2. FIG. 2 is a schematic diagram illustrating the transfer method 500 of FIG. 1 , in which the substrate 140 moves toward the machine 110 and is tilted relative to the back plate 120 . As shown in FIG. 2 , the machine platform 110 has a surface 111 , and the back plate 120 and the support member 130 are respectively disposed on the surface 111 of the machine platform 110 . More specifically, the back plate 120 has a first height H1 relative to the surface 111 , and the support member 130 has a second height H2 relative to the surface 111 . In this embodiment, the range of the second height H2 is between 0.7 times the first height H1 and 0.95 times the first height H1. That is to say, the back plate 120 is slightly higher than the support member 130 , and the support member 130 is slightly shorter than the back plate 120 . Furthermore, the support member 130 may be made of metal, plastic or other soft materials, but the present invention is not limited thereto.

Further, the transfer method 500 includes the following steps:

(2) Provide the substrate 140 (step 520). The base plate 140 , the machine table 110 , the back plate 120 and the support member 130 together form the transfer device 100 , that is, the transfer device 100 includes the machine table 110 , the back plate 120 , the support member 130 and the base plate 140 . In order to easily understand the operation principle of the transfer device 100, as shown in Figure 2 (and Figures 6 to 8), the base plate 140 is tilted relative to the back plate 120 at an exaggerated extent. When the substrate 140 is subjected to the pressure F, the substrate 140 moves toward the machine platform 110 . In this embodiment, before the substrate 140 moves toward the machine platform 110, the support member 130 is first fixed on the surface 111 of the machine platform 110.

Please refer to Figure 3. Figure 3 is a partial schematic diagram showing the range M in Figure 2 . As shown in FIGS. 2 and 3 , the substrate 140 has a connected blank area AC and an operating area AO. In this embodiment, the vertical projection of the working area AO toward the machine platform 110 overlaps the back panel 120 , and the working area AO is configured to install a plurality of electronic components 200 . In practical applications, the substrate 140 can be a temporary substrate, and the electronic component 200 can be a microscopic light-emitting diode (micro-LED), and the micro-light-emitting diode can be formed by the adhesive layer 300 It is temporarily adhered to the working area AO of the substrate 140, that is, the adhesive layer 300 is adhered between the substrate 140 and the micro-light emitting diode. In addition, the vertical projection of the blank area AC of the substrate 140 toward the machine 110 is located on the same side of the back plate 120 as the support member 130 . For example, as shown in FIG. 2 , the vertical projection of the blank area AC of the substrate 140 toward the machine 110 and the support member 130 are both located on the left side of the back plate 120 .

Further, the transfer method 500 includes the following steps:

(3) Move the substrate 140 toward the machine platform 110 so that the electronic component 200 contacts the back plate 120 and the support 130 at least partially supports the blank area AC of the substrate 140 (step 530 ). Please refer to Figures 4 to 5. FIG. 4 is a schematic diagram illustrating the transfer method 500 of FIG. 1 , in which the substrate 140 abuts the support 130 . Figure 5 is a partial schematic diagram showing the range N in Figure 4. In this embodiment, as shown in FIGS. 4 and 5 , since the support member 130 at least partially supports the blank area AC of the substrate 140 , when the electronic component 200 on the substrate 140 abuts the backplane 120 , the substrate 140 faces the backplane 120 . The tilt amplitude of the back plate 120 can be effectively reduced, that is, the coplanarity of the substrate 140 with respect to the back plate 120 can be improved, which is conducive to a large number of electronic components 200 on the substrate 140 properly abutting the back plate 120 to complete the subsequent fixation of the electronic components 200 on the back plate 120 . The process of back plate 120.

Please refer to Figure 6. FIG. 6 is a schematic diagram illustrating a process of a transfer method 500 according to another embodiment of the present invention, in which the support member 130 slides toward the back plate 120 . In this embodiment, as shown in FIG. 6 , the back plate 120 is disposed on the surface 111 of the machine platform 110 , and the support member 130 is slidably connected to the surface 111 of the machine platform 110 . Specifically, the support member 130 is configured to slide toward the back plate 120 before the substrate 140 moves toward the machine platform 110 (as shown in FIG. 6 , the support member 130 slides from the dotted line position to the solid line position), so that the substrate 140 The vertical projection of the blank area AC toward the machine platform 110 at least partially overlaps the support member 130 , that is, when the substrate 140 moves toward the machine platform 110 , the blank area AC of the substrate 140 can be supported by the support member 130 .

Please refer to Figure 7. FIG. 7 is a schematic diagram illustrating a process of a transfer method 500 according to yet another embodiment of the present invention, in which the support member 130 abuts and pushes the back plate 120 . In this embodiment, as shown in FIG. 7 , the back plate 120 is disposed on the surface 111 of the machine platform 110 , and the support member 130 is slidably connected to the surface 111 of the machine platform 110 (as shown in FIG. 7 , the support member 130 is 130 slides from the position of the dotted line to the position of the solid line). Specifically, the support member 130 is configured to contact and push the back plate 120 before the substrate 140 moves toward the machine platform 110 to adjust the position of the back plate 120 relative to the machine platform 110 , for example, to align the back plate 120 with the working area AO of the substrate 140 , thereby improving the operation accuracy of the transfer device 100.

Please refer to Figures 8 to 9. Figures 8-9 are schematic cross-sectional views illustrating a transfer method 500 according to another embodiment of the present invention, in which the support member 130 moves toward the substrate 140 and supports the substrate 140. In this embodiment, as shown in Figures 8-9, the machine platform 110 has a connected surface 111 and an inner wall 112. The inner wall 112 of the machine platform 110 surrounds it to form a channel C. The back plate 120 is disposed on the machine platform 110. The surface of 111. As shown in FIG. 8 , before the substrate 140 moves toward the machine platform 110 , the support member 130 is at least partially located in the channel C. In order to easily understand the operation principle of the transfer device 100, as shown in FIG. 8, the base plate 140 is inclined relative to the back plate 120 with an exaggerated amplitude. As shown in FIG. 9 , after the substrate 140 moves toward the machine 110 and before the electronic component 200 is fixed on the back plate 120 , the support member 130 is configured to move vertically toward the substrate 140 relative to the surface 111 of the machine 110 (as shown in FIG. 9 As shown, the support member 130 slides from the position of the dotted line to the position of the solid line), so that the support member 130 protrudes from the surface 111 of the machine platform 110 and abuts the blank area AC of the substrate 140, thereby reducing the tilt of the substrate 140 relative to the back plate 120 The magnitude, that is, improving the coplanarity of the substrate 140 with respect to the back plate 120, is conducive to a large number of electronic components 200 on the substrate 140 properly abutting the back plate 120 to complete the subsequent process of fixing the electronic components 200 to the back plate 120.

In practical applications, when the support member 130 moves vertically toward the base plate 140 relative to the surface 111 of the machine platform 110, if the support member 130 contacts the base plate 140 before rising to the preset height, this indicates that the inclination of the base plate 140 may be too large. . At this time, the support member 130 can play a detection role and immediately send out an alarm to notify the user to check the transfer device 100 .

To sum up, the technical solutions disclosed in the above embodiments of the present invention have at least the following advantages:

(1) Since the support at least partially supports the blank area of the substrate, when the electronic components on the substrate abut the backplane, the inclination of the substrate relative to the backplane can be effectively reduced, that is, the commonality of the substrate relative to the backplane can be improved. The surface properties facilitate a large number of electronic components on the substrate to properly contact the backplane to complete the subsequent process of fixing the electronic components to the backplane.

(2) Since the support member can be configured to contact and push the back plate before the substrate moves toward the machine, the position of the back plate relative to the machine is adjusted, for example, by aligning the back plate with the work area of the substrate, thereby improving the operation accuracy of the transfer equipment. Spend.

(3) When the support moves vertically toward the substrate relative to the surface of the machine, if the support touches the substrate before rising to the preset height, the support can play a detection role and can immediately send out an alarm to notify the user. The operator will inspect the transfer equipment.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make various modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention is The scope shall be determined by the appended patent application scope.

100:Transfer equipment 110:Machine 111:Surface 112:Inner wall 120:Back panel 130:Support 140:Substrate 200:Electronic components 300:Adhesive layer 500:Transfer method 510-530: Steps AC: blank area AO: work area C:Channel F: Pressure H1: first height H2: second height M, N: range

FIG. 1 is a flow chart illustrating a method of transferring electronic components according to an embodiment of the present invention. Figure 2 is a schematic diagram illustrating the transfer method of Figure 1, in which the substrate moves toward the machine and is tilted relative to the back plate. Figure 3 is a partial schematic diagram showing the range M in Figure 2 . Figure 4 is a schematic diagram illustrating the transfer method of Figure 1, in which the substrate abuts the support. Figure 5 is a partial schematic diagram showing the range N in Figure 4. Figure 6 is a schematic diagram illustrating a process of a transfer method according to another embodiment of the present invention, in which the support member slides toward the back plate. Figure 7 is a schematic diagram illustrating a process of a transfer method according to yet another embodiment of the present invention, in which the support member abuts and pushes the backing plate. Figures 8 to 9 are schematic cross-sectional views illustrating a transfer method according to another embodiment of the present invention, in which the support member moves toward the substrate and supports the substrate.

Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without

100:Transfer equipment

110:Machine

111:Surface

120:Back panel

130:Support

140:Substrate

AC: blank area

AO: work area

F: Pressure

N: range

Claims (12)

A transfer device containing: One machine; A backplane is provided on the machine; A support member is provided on the machine platform; and A substrate has a connected blank area and a working area. The working area is configured to place a plurality of electronic components. The substrate is configured to move toward the machine to make the electronic components contact the backplane. The blank area The vertical projection toward the machine platform is located on the same side of the backplane as the support member. The transfer equipment of claim 1, wherein the vertical projection of the working area toward the machine platform overlaps the back panel. The transfer equipment of claim 1, wherein the machine platform has a surface, the back plate and the support member are respectively disposed on the surface, the back plate has a first height, the support member has a second height, and the The range of the second height is between 0.7 times the first height and 0.95 times the first height. The transfer equipment of claim 1, wherein the machine platform has a surface, the back plate is disposed on the surface, the support member is slidably connected to the surface, and the support member is configured to slide toward the back plate so that the The vertical projection of the blank area toward the machine platform at least partially overlaps the support member. The transfer equipment of claim 4, wherein the support member is configured to push the backing plate. The transfer equipment of claim 1, wherein the machine platform has a connected surface and an inner wall, the inner wall surrounds to form a channel, the back plate is disposed on the surface, and the support member is at least partially located in the channel inside, and configured to move vertically relative to the surface to protrude from the surface and abut the blank area. A method of transferring electronic components, including: A back plate and a support member are provided on a machine platform; A substrate is provided, the substrate has a connected blank area and a working area, the vertical projection of the working area towards the machine overlaps the backplane, the working area is configured to dispose a plurality of electronic components; and The substrate is moved toward the machine platform so that the electronic components contact the backplane and the support member at least partially supports the blank area. The transfer method as described in claim 7, wherein the machine platform has a surface, the back plate and the support member are respectively disposed on the surface, the back plate has a first height, the support member has a second height, and the The range of the second height is between 0.7 times the first height and 0.95 times the first height. The transfer method as described in claim 7, wherein setting the support member includes: Fix the support member to the machine platform. The transfer method as described in request item 7 further includes: Before the base plate moves toward the machine platform, the support member is slid toward the back plate. The transfer method as described in request item 7 further includes: The support member is used to push the back plate before the base plate moves toward the machine platform. The transfer method as described in claim 7, wherein making the support member at least partially support the blank area includes: After the base plate moves toward the machine platform, the support member is moved toward the base plate.

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