TWM602722U - Mass transfer fixture of micro-LED - Google Patents

Abstract

A miniature light-emitting diode mass transfer jig includes a soft rubber substrate and a huge transfer area on the soft rubber substrate. The mass transfer area includes a plurality of soft glue adhesion bumps, a plurality of first partition walls and a plurality of second partition walls. The soft adhesive bumps are located on the carrying surface of the soft adhesive substrate. The first partition wall is located on the carrying surface of the soft rubber substrate, extends along the first direction, and is connected between the two adhesion bumps. The height of the first partition wall is lower than the soft glue adhesion bump. The second partition wall is located on the carrying surface of the soft plastic substrate, extends along the second direction, and is connected between the two adhesive bumps. The height of the second partition wall is lower than the soft adhesive bump, and the first direction is substantially The upper side is perpendicular to the second direction, and the cross section of the soft glue adhesion bump, the first partition wall, or the second partition wall is trapezoidal.

Description

Miniature LED Mass Transfer Fixture

This creation relates to the field of displays, especially a miniature light-emitting diode mass transfer fixture.

In the field of displays, current commercial display technologies include liquid crystal displays (Liquid Crystal Display, LCD) and organic light emitting diode (Organic Light Emitting Diode) displays. However, each has its advantages and disadvantages. The LCD display needs a backlight module, which has a thicker overall thickness, poor color saturation, and consumes more power. But because its manufacturing process has been standardized and mass-produced, the overall cost is lower. OLED displays have become a new choice for a new generation of portable electronic devices because of their active luminescence, high color saturation, power saving, and flexible area. However, OLED displays are organic components in nature, and their materials are degraded, and they are prone to "burn in" after a long display.

In order to solve the aforementioned problems, the existing method is to use inorganic LEDs, reduce the size, arrange them on the substrate in an array arrangement, and actively emit light to achieve the effects of high color saturation, power saving, and low thickness. However, the current problem lies in the mass transfer process of transferring the finished inorganic LED to the substrate.

The current mass transfer process of miniLEDs is to cut the wafers of miniLEDs, place the wafers upside down on a viscous carrier, and then transfer them to the circuit board through a transfer jig, and then heat to produce a eutectic. Break away. The distribution of the die on the carrier corresponds to the die layout of each manufacturer on the wafer. Since the die layouts of various manufacturers are different, the current transfer jig is manufactured through a compression molding method, which must correspond to different die layouts, which requires re-molding, and the cost is high. For soft plastic materials, the embossing method may cause poor adhesion or poor accuracy of the entire fixture due to the rebound of the material and the damage of the material by heat.

Here, a miniature light emitting diode mass transfer jig is provided. The miniature light-emitting diode mass transfer jig is made by laser cutting soft plastic materials. The miniature light-emitting diode mass transfer jig includes a soft rubber substrate and a mass transfer area on the soft rubber substrate. The mass transfer area includes a plurality of soft glue adhesion bumps, a plurality of first partition walls and a plurality of second partition walls. The soft adhesive bumps are located on the carrying surface of the soft adhesive substrate. The first partition wall is located on the carrying surface of the soft rubber substrate, extends along the first direction, and is connected between the two adhesion bumps. The height of the first partition wall is lower than the soft glue adhesion bump. The second partition wall is located on the carrying surface of the soft plastic substrate, extends along the second direction, and is connected between the two adhesive bumps. The height of the second partition wall is lower than the soft adhesive bump, and the first direction is substantially The upper side is perpendicular to the second direction, and the cross section of the soft glue adhesion bump, the first partition wall, or the second partition wall is trapezoidal.

In some embodiments, the trapezoid includes at least one arc angle.

In some embodiments, the angle between the trapezoid and the bearing surface is 50 to 90 degrees.

In some embodiments, the height difference between the top surface of the first partition wall and the carrying surface of the soft rubber substrate is 10 to 60 um.

In some embodiments, the height difference between the top surface of the second partition wall and the carrying surface of the soft rubber substrate is 10-60 um.

In some embodiments, the height difference between the top surface of the soft adhesive bump and the carrying surface of the soft adhesive substrate is 40 to 120 um. Preferably, the height difference between the top surface of the soft adhesive bump and the carrying surface of the soft adhesive substrate is 60 to 100 um.

In some embodiments, the miniature light-emitting diode mass transfer jig further includes an outer frame area, the outer frame area is located at the outer periphery of the mass transfer area, and the height of the outer frame area is lower than that of the soft glue adhesion bump and is higher On the bearing surface.

In some embodiments, the mass transfer area includes a plurality of array patterns continuously arranged, and each array pattern is composed of four soft adhesive bumps, two first partition walls, and two second partition walls, and each array pattern Enclose part of the bearing surface. Further, the bearing surface enclosed in the array pattern is a rough surface, and the roughness height difference is 2-10um.

In the foregoing embodiment, the micro-light-emitting diode mass transfer jig is formed by laser cutting to directly form the mass transfer area on the soft plastic substrate, and the bumps, the first partition wall, and the second partition are adhered to the soft plastic substrate. The cross section of the partition wall is in a trapezoidal shape, so that the micro light emitting diode can be easily separated after transferring. In this way, the mass transfer area can be matched with the die wiring on the micro light emitting diode on the die carrier to customize the micro light emitting diode mass transfer jig without opening the mold for each die wiring. During transfer, the production cost can be greatly reduced.

Figure 1 is a top view of a miniature light-emitting diode mass transfer fixture. Figure 2 is a partial three-dimensional view of a miniature light-emitting diode mass transfer jig. Figure 3 is a cross-sectional view of the section 3-3 of Figure 1; Figure 4 is a cross-sectional view of section 4-4 of Figure 1; Figure 5 is a cross-sectional view of section 5-5 of Figure 1; As shown in FIGS. 1 to 5, the micro light emitting diode mass transfer jig 1 includes a flexible substrate 10 and a mass transfer area 20 on the flexible substrate 10. The mass transfer area 20 includes a plurality of soft adhesive bumps 21, a plurality of first partition walls 23 and a plurality of second partition walls 25. The soft adhesive bump 21 is located on the carrying surface 11 of the soft adhesive substrate 10. The first partition wall 23 is located on the carrying surface 11 of the soft rubber substrate 10, extends along the first direction A1, and is connected between the two soft rubber adhesion bumps 21. The height of the first partition wall 23 is lower than the soft glue adhesion bump 21. The second partition wall 25 is located on the bearing surface 11 of the soft plastic substrate 10, extends along the second direction A2, and is connected between the two soft adhesive protrusions 21. The height of the second partition wall 25 is lower than that of the soft adhesive In the bump 21, the first direction A1 is substantially perpendicular to the second direction A2, and the cross section of the soft adhesive bump 21, the first partition wall 23, or the second partition wall 25 is trapezoidal.

The miniature light-emitting diode mass transfer jig 1 is made by laser cutting soft plastic materials. The entire miniature light-emitting diode mass transfer jig 1 is actually the same soft gel, which can be designed according to different die layouts. The soft glue sticks to the position of the bump 21. In addition, therefore, the shape of the soft glue adhesion bump 21, the first partition wall 23, or the second partition wall 25 can be effectively controlled. By controlling the laser energy, the edge is trapezoidal, and the soft glue adhesion protrusion can be controlled. After the block 21 is transferred, because there is an air gap, it is easy to leave the jig after pressure to complete the transfer.

Generally speaking, the mass transfer area 20 includes a plurality of array patterns continuously arranged, and each array pattern S is composed of four soft adhesive bumps 21, two first partition walls 23, and two second partition walls 25. , And each array pattern S surrounds a part of the bearing surface 11. The soft adhesive bumps 21 can be arranged corresponding to the positions of the micro LEDs on different die layouts, and through the connection of the first partition wall 23 and the second partition wall 25, it can effectively achieve support and avoid deformation.

Since the edge of the soft glue adhesion bump 21, the first partition wall 23, or the second partition wall 25 can be cut by reducing the laser energy (about 30-50%), it can not only ensure the shape of the edge, but also Avoid laser cutting dust and debris remaining on the soft adhesive bump 21.

Further, due to laser cutting, the laser source is focused in a point-like manner. Since the focal length during cutting may change, the bearing surface 11 enclosed in the array pattern S is a rough surface, and the rough height difference is 2-10um. This is also the main feature caused by laser cutting.

In more detail, in some embodiments, a trapezoidal cross-sectional soft adhesion bumps 21 and the bearing surface 11 of the angle [theta] _1, the angle [theta] 23 of trapezoidal cross-section with a first bearing surface 11 of the partition wall _2, the second partition wall, or The angle θ ₃ between the trapezoid of the section 25 and the bearing surface 11 may be 50 to 90 degrees, preferably 60 to 75 degrees. Further, the trapezoid may have a leading angle of arc.

In addition, the height difference between the top surface of the soft adhesive bump 21 and the carrying surface 11 of the soft adhesive substrate 10 is 40 to 120 um, preferably 60 to 100 um, and more preferably 75 to 90 um. In addition, the height difference between the top surface of the first partition wall 23 and the bearing surface 11 of the flexible substrate 10 is 10 to 60um, and the height difference between the top surface of the second partition wall 23 and the bearing surface 11 of the flexible substrate 10 is 10 to 60um. Preferably, the height difference between the soft adhesive bump 21 and the first partition wall 23 or the second partition wall 25 is preferably 20 um to 60 um, more preferably 20 to 30 um, or 40 to 50 um. In this way, the first partition wall 23 or the second partition wall 25 can be prevented from adhering to other micro light emitting diodes, and at the same time, the support strength of the soft glue adhesion bump 21 is provided.

1 again, the miniature light-emitting diode mass transfer jig 1 further includes an outer frame area 30, the outer frame area 30 is located at the outer periphery of the mass transfer area 20, the height of the outer frame area 30 is lower than the soft glue adhesion bump 21, and higher than the bearing surface 11. Through the outer frame area 30, the mass transfer area 20 and the die carrier 500 or the circuit substrate 600 can be mutually positioned, and the height of the outer frame area 30 can be reduced by laser cutting, and the outer frame area 30 can also be prevented from sticking to the Other miniature light emitting diodes 550 (see Figure 6).

Fig. 6 is a schematic diagram of the use state of the miniature light-emitting diode mass transfer jig. As shown in FIG. 6, the micro-light-emitting diode mass transfer jig 1 is used to transfer the micro-light-emitting diode 550 on the die carrier 500 to the circuit substrate 600. The micro-light-emitting diode mass transfer jig 1 It can be installed on the robotic arm 800. The soft adhesive bump 21 on the micro-light-emitting diode mass transfer jig 1 corresponds to the position of the micro-light-emitting diode 550 on the die carrier 500. The micro-light-emitting diode The outer frame area 30 of the mass transfer jig 1 can also be used for mutual positioning with the die carrier 500 and/or the circuit substrate 600. After the positioning is completed, the micro light emitting diode 550 is removed from the die by adhesion. The pellet carrier 500 is extracted, and then transferred to the circuit substrate 600, and then pressurized or thermally pressed so that the micro light emitting diode 550 forms a eutectic on the circuit substrate 600 and is fixed. Finally, pressure is applied to separate the micro light emitting diode 550 from the micro light emitting diode mass transfer jig 1. The massive transfer of batches of miniature light-emitting diodes 550 is achieved.

In summary, the micro-light-emitting diode mass transfer jig 1 uses laser cutting to directly form the mass transfer area 20 on the soft plastic substrate 10, and adhere the bumps 21 and the first partition wall 23 on the soft plastic substrate. The cross section of, and the second partition wall 25 is a trapezoid, so that the micro light emitting diode 550 can be easily separated after transferring. In this way, the mass transfer region 20 can match the die layout of the micro light emitting diode 550 on the die carrier 500 to customize the micro light emitting diode mass transfer jig 1 without wiring various die Opening the mold and then transferring it can greatly reduce the production cost.

Although the technical content of this creation has been disclosed in a preferred embodiment as above, it is not intended to limit this creation. Anyone who is familiar with this technique, who does not deviate from the spirit of this creation, makes some changes and modifications, should be covered in this creation Therefore, the scope of protection of this creation shall be subject to the scope of the attached patent application.

1: Miniature LED Mass Transfer Fixture 10: Soft substrate 11: Bearing surface 20: Mass transfer area 21: Soft glue adhesion bump 23: The first dividing wall 25: The second dividing wall 30: Outer frame area 500: Die Carrier 550: Miniature LED 600: Circuit board 800: robotic arm θ1: included angle θ2: included angle θ3: included angle A1: First direction A2: Second direction S: array pattern

[Figure 1] A top view of a miniature light-emitting diode mass transfer jig. [Figure 2] A partial three-dimensional view of a miniature light-emitting diode mass transfer jig. [Fig. 3] is a cross-sectional view of the 3-3 section of Fig. 1. [Fig. 4] is a cross-sectional view of the 4-4 section of Fig. 1. [Fig. 5] is a cross-sectional view of the section 5-5 of Fig. 1. [Figure 6] is a schematic diagram of the state of use of the miniature light-emitting diode mass transfer jig.

10: Soft substrate

11: Bearing surface

21: Soft glue adhesion bump

23: The first dividing wall

25: The second dividing wall

A1: First direction

A2: Second direction

S: array pattern

Claims (10)

A miniature light-emitting diode mass transfer jig, including: A flexible substrate; and A massive transfer area, located on the flexible substrate, includes: A plurality of soft glue adhesion bumps are located on a bearing surface of the soft glue substrate; A plurality of first partition walls are located on the carrying surface of the soft plastic substrate, extend along a first direction, and are connected between two of the soft adhesive protrusions. The height of the first partition walls Lower than these soft glue sticking bumps; and A plurality of second partition walls are located on the carrying surface of the soft plastic substrate, extend along a second direction, and are connected between two of the soft adhesive protrusions. The height of the second partition walls Lower than the soft adhesive bumps, where the first direction is substantially perpendicular to the second direction, and each of the soft adhesive bumps, the first partition walls, or the second partition walls is a cross section It is a ladder shape. The micro light emitting diode mass transfer jig according to claim 1, wherein the trapezoid includes at least one arc lead angle. The micro light-emitting diode mass transfer jig according to claim 1, wherein the angle between the trapezoid and the carrying surface is 50 to 90 degrees. The micro light-emitting diode mass transfer jig according to claim 1, wherein the height difference between the top surface of the first partition walls and the carrying surface of the flexible substrate is 10-60um. The micro light-emitting diode mass transfer jig according to claim 1, wherein the height difference between the top surface of the second partition walls and the carrying surface of the flexible substrate is 10 to 60 um. The micro light emitting diode mass transfer jig according to claim 1, wherein the height difference between the top surface of the soft adhesive bumps and the carrying surface of the soft adhesive substrate is 40 to 120 um. The micro light emitting diode mass transfer jig according to claim 6, wherein the height difference between the top surface of the soft adhesive bumps and the carrying surface of the soft adhesive substrate is 60 to 100 um. The miniature light-emitting diode mass transfer jig according to claim 1, further comprising an outer frame area located on the outer periphery of the mass transfer area, and the height of the outer frame area is lower than the soft The glue sticks to the bumps and is higher than the bearing surface. The micro-light-emitting diode mass transfer jig according to claim 1, wherein the mass transfer area includes a plurality of array patterns continuously arranged, each of the array patterns is composed of four soft adhesive bumps and two The first partition wall and the two second partition walls are composed, and each of the array patterns surrounds a part of the bearing surface. The micro-light-emitting diode mass transfer jig according to claim 9, wherein the bearing surface enclosed in the array pattern is a rough surface with a roughness of 2-10um.

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