CN117108945A - Sealing device and method for Mini LED lamp panel - Google Patents

Sealing device and method for Mini LED lamp panel Download PDF

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Publication number
CN117108945A
CN117108945A CN202311108213.1A CN202311108213A CN117108945A CN 117108945 A CN117108945 A CN 117108945A CN 202311108213 A CN202311108213 A CN 202311108213A CN 117108945 A CN117108945 A CN 117108945A
Authority
CN
China
Prior art keywords
mini led
lamp panel
led lamp
optical lens
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311108213.1A
Other languages
Chinese (zh)
Inventor
易伟华
张迅
黄幸浩
黄燕鸿
吴明飞
贺道兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WG Tech Jiangxi Co Ltd
Original Assignee
WG Tech Jiangxi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WG Tech Jiangxi Co Ltd filed Critical WG Tech Jiangxi Co Ltd
Priority to CN202311108213.1A priority Critical patent/CN117108945A/en
Publication of CN117108945A publication Critical patent/CN117108945A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

The invention discloses a glue sealing device and a glue sealing method for a Mini LED lamp panel, wherein the glue sealing device for the Mini LED lamp panel comprises a bearing plate, an optical lens cavity for pouring transparent glue is arranged on the bearing plate, the open end of the optical lens cavity can be contacted with the Mini LED lamp panel, and an optical lens formed after the transparent glue is solidified can be bonded with the Mini LED lamp panel into a whole. The sealing device of the Mini LED lamp panel not only can improve the sealing efficiency of the Mini LED lamp panel, but also can effectively improve the sealing consistency of the Mini LED lamp panel, and finally increases the luminous angle of the Mini LED lamp panel to improve the final light-emitting uniformity.

Description

Sealing device and method for Mini LED lamp panel
Technical Field
The invention relates to the technical field of sealing glue, in particular to a sealing glue device and method for a Mini LED lamp panel.
Background
At present, aiming at the sealing mode of the Mini LED lamp panel, most of the dispensing machines dispense glue in an LENS mode, but the glue sealing mode is low in glue sealing efficiency and poor in consistency, and the shape of the sealed LED lamp panel is difficult to control.
Therefore, how to improve the sealing efficiency of the Mini LED lamp panel, and effectively improve the sealing consistency of the Mini LED lamp panel, and finally increase the light emitting angle of the Mini LED lamp panel to improve the uniformity of the final light emission is a technical problem to be solved by the technicians in the field.
Disclosure of Invention
Therefore, the invention aims to provide the sealing device for the Mini LED lamp panel, which can not only improve the sealing efficiency of the Mini LED lamp panel, but also effectively improve the sealing consistency of the Mini LED lamp panel, and finally increase the light emitting angle of the Mini LED lamp panel to improve the final light emitting uniformity.
The invention further aims at providing a glue sealing method of the Mini LED lamp panel.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the utility model provides a seal gum device of Mini LED lamp plate, includes the loading board, be provided with the optical lens cavity that is used for pouring transparent glue on the loading board, the open end of optical lens cavity can be contacted with the Mini LED lamp plate, the optical lens that forms after the transparent glue solidification can bond as an organic wholely with the Mini LED lamp plate.
Optionally, the Mini LED lamp panel includes a glass substrate and Mini LED chips, and the Mini LED chips are multiple and uniformly fixed on the glass substrate.
Optionally, the optical lens assembly further comprises a support column cavity for pouring the transparent glue, wherein the support column cavity is arranged on the bearing plate and is arranged on the same side of the bearing plate as the optical lens cavity, and the length of the support column cavity is larger than that of the optical lens cavity.
Optionally, the optical lens cavity is convex or concave.
Optionally, the bearing plate is a plane, or a curved plate.
Optionally, the optical lens cavity is a plurality of, and the equipartition is in the middle part of loading board, the optical lens cavity with Mini LED wafer one-to-one sets up.
Optionally, the support column cavity is disposed at an edge portion of the carrier plate and surrounds the optical lens cavity.
Optionally, the support column cavity is a conical structure, and the diameter gradually decreases from the direction close to the bearing plate to the direction far away from the bearing plate.
The sealing method of the Mini LED lamp panel adopts the sealing device for sealing the Mini LED lamp panel, and comprises the following steps:
s100: pouring transparent glue into the cavity of the optical lens;
s200: placing a Mini LED lamp panel on the bearing plate, wherein the Mini LED lamp panel is contacted with the open end of the optical lens cavity;
s300: and curing the transparent glue to form an optical lens, wherein the optical lens and the Mini LED lamp panel are bonded into a whole.
Optionally, before the step S100, or between the step S100 and the step S200, fixing a Mini LED wafer on a glass substrate, and producing the Mini LED lamp panel to be encapsulated.
Optionally, in step S100, the transparent glue is further poured into the cavity of the support column, the support column is formed after curing, and the transparent glue is further poured into the surface of the carrier plate, and the surface sealing glue is formed after curing.
According to the technical scheme, when the Mini LED lamp panel is sealed, transparent glue is poured into the cavity of the optical lens, the Mini LED lamp panel is placed on the bearing plate, the open end of the cavity of the optical lens is contacted with the Mini LED lamp panel, the transparent glue is cured to form the optical lens, and the formed optical lens and the Mini LED lamp panel are bonded into an integrated structure.
Compared with the dispensing mode in the prior art, the sealing device for the Mini LED lamp panel disclosed by the embodiment of the invention not only can improve the sealing efficiency of the Mini LED lamp panel, but also can effectively improve the sealing consistency of the Mini LED lamp panel, and can effectively control the structural shape of the sealing of the Mini LED lamp panel, and finally increase the luminous angle of the Mini LED lamp panel to improve the final light-emitting uniformity.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the prior art are briefly introduced below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a front view structure of a Mini LED lamp panel disclosed in an embodiment of the present invention;
fig. 2 is a schematic side view structure of a Mini LED lamp panel according to an embodiment of the present invention;
fig. 3 is a schematic front view of a glue sealing device of a Mini LED lamp panel according to an embodiment of the present invention;
fig. 4 is a schematic side view of a glue sealing device of a Mini LED lamp panel according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a front view structure of a Mini LED lamp panel after sealing according to an embodiment of the present invention;
fig. 6 is a schematic side view structure of a Mini LED lamp panel after sealing according to an embodiment of the present invention.
Wherein, each part name is as follows:
100-glass substrate, 200-Mini LED wafer, 300-bearing plate, 400-optical lens cavity, 500-support column cavity, 600-surface sealing glue and 700-support column.
Detailed Description
Accordingly, the core of the invention is to provide a sealing device for Mini LED lamp panels, which can not only improve the sealing efficiency of the Mini LED lamp panels, but also effectively improve the sealing consistency of the Mini LED lamp panels, and finally increase the light emitting angle of the Mini LED lamp panels to improve the final light emitting uniformity.
The invention further provides a glue sealing method of the Mini LED lamp panel.
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art without making any inventive effort, are within the scope of the present invention, based on the embodiments of the present invention, and reference is made to fig. 1-6.
The glue sealing device for the Mini LED lamp panel disclosed by the embodiment of the invention comprises the bearing plate 300, wherein an optical lens cavity 400 for pouring transparent glue is arranged on the bearing plate 300, the open end of the optical lens cavity 400 can be contacted with the Mini LED lamp panel, and the transparent glue can be bonded with the Mini LED lamp panel into a whole after being solidified.
When the Mini LED lamp panel is sealed, transparent glue is poured into the optical lens cavity 400, and then the Mini LED lamp panel is placed on the carrier plate 300, so that the open end of the optical lens cavity 400 is contacted with the Mini LED lamp panel, the transparent glue is cured, and the optical lens formed after curing and the Mini LED lamp panel are bonded into an integrated structure.
Compared with the dispensing mode in the prior art, the sealing device for the Mini LED lamp panel disclosed by the embodiment of the invention not only can improve the sealing efficiency of the Mini LED lamp panel, but also can effectively improve the sealing consistency of the Mini LED lamp panel, and can effectively control the structural shape of the sealing of the Mini LED lamp panel, and finally increase the luminous angle of the Mini LED lamp panel to improve the final light-emitting uniformity. .
The embodiment of the invention does not limit the specific structure of the Mini LED lamp panel, and the structure meeting the use requirement of the invention is within the protection scope of the invention.
As a preferred embodiment, the Mini LED lamp panel disclosed in the embodiment of the present invention includes a glass substrate 100 and Mini LED chips 200, wherein the Mini LED chips 200 are plural and uniformly fixed on the glass substrate 100.
Because the glass substrate 100 has small warpage and high flatness, and the circuit pad adopts a photomask-opening mode, the accuracy is high, and therefore, after the Mini LED wafer 200 is fixed on the glass substrate 100, the following technical effects can be achieved: the expansion is smaller during reflow soldering, the die bonding yield of the Mini LED wafer 200 is higher, and the flatness of the sealing compound is higher.
The glue sealing device for the Mini LED lamp panel disclosed by the embodiment of the invention further comprises a support column cavity 500 for pouring transparent glue, wherein the support column cavity 500 is arranged on the bearing plate 300 and is arranged on the same side of the bearing plate 300 as the optical lens cavity 400 in order to effectively protect the optical lens formed in the optical lens cavity 400 after the transparent glue is solidified.
It should be noted that the length of the support post cavity 500 is greater than the length of the optical lens cavity 400. By such arrangement, the support column 700 formed in the support column cavity 500 can prevent the membrane from being pressed to the optical lens when the module assembly is performed, thereby playing the roles of supporting the membrane and protecting the optical lens, and compared with the mode of pasting the support column in the prior art, the arrangement of the structure can effectively improve the sealing efficiency, reduce the cost,
the specific structural shape of the optical lens is not limited in the embodiment of the present invention, and the optical lens cavity 400 may be a convex lens or a concave lens, as long as the structure meeting the use requirement of the present invention is within the protection scope of the present invention.
The structure of the carrier plate 300 is not particularly limited in the embodiment of the present invention, as long as the structure meets the use requirements of the present invention.
The carrying plate 300 may be a plane or a curved surface, and when the Mini LED lamp panel is a plane, the carrying plate 300 may be set to be a plane structure; when the Mini LED lamp panel is a curved surface, the carrier plate 300 may be set to a curved surface structure.
The number and position of the optical lens cavities 400 are not limited in the embodiments of the present invention, and all structures meeting the use requirements of the present invention are within the scope of the present invention.
As a preferred embodiment, the optical lens cavities 400 disclosed in the embodiments of the present invention are multiple and uniformly distributed in the middle part of the carrier plate 300, wherein the optical lens cavities 400 are arranged in one-to-one correspondence with the Mini LED chips 200. Thus, the optical lenses formed by the optical lens cavity 400 and the Mini LED chip 200 are disposed on two sides of the carrier 300 in a one-to-one correspondence.
The number and positions of the supporting column cavities 500 are not limited in the embodiment of the present invention, and all structures meeting the use requirements of the present invention are within the scope of the present invention.
As a preferred embodiment, the support column cavity 500 disclosed in the embodiment of the present invention is disposed at the edge portion of the carrier plate 300 and around the optical lens cavity 400. So arranged, the support post 700 formed in the support post cavity 500 can play a role in supporting the membrane and protecting the optical lens, and the membrane can not be directly pressed to the optical lens when the module assembly is performed.
The specific structure of the support column cavity 500 is not limited in the embodiment of the present invention, and the structure meeting the use requirement of the present invention is within the protection scope of the present invention.
As a preferred embodiment, the support column cavity 500 disclosed in the embodiment of the present invention has a tapered structure, and the diameter of the support column 700 is gradually reduced from the direction close to the carrier plate 300 to the direction far from the carrier plate 300, so that the diameter of the support column 700 is gradually reduced from the direction close to the carrier plate 300 to the direction far from the carrier plate 300, which not only has a good supporting effect, but also can effectively save space.
The embodiment of the invention also discloses a sealing method of the Mini LED lamp panel, which adopts the sealing device of the Mini LED lamp panel to seal, and comprises the following steps: s100: pouring transparent glue into the optical lens cavity 400;
s200: placing a Mini LED lamp panel on the bearing plate 300, wherein the Mini LED lamp panel is contacted with the open end of the optical lens cavity 400;
s300: and curing the transparent glue to form an optical lens, and bonding the optical lens and the Mini LED lamp panel into a whole.
When the Mini LED lamp panel is sealed, transparent glue is poured into the optical lens cavity 400, and then the Mini LED lamp panel is placed on the carrier plate 300, so that the open end of the optical lens cavity 400 is contacted with the Mini LED lamp panel, the transparent glue is cured, and the optical lens formed after curing and the Mini LED lamp panel are bonded into an integrated structure.
Compared with the dispensing mode in the prior art, the sealing device for the Mini LED lamp panel disclosed by the embodiment of the invention not only can improve the sealing efficiency of the Mini LED lamp panel, but also can effectively improve the sealing consistency of the Mini LED lamp panel, and can effectively control the structural shape of the sealing of the Mini LED lamp panel, and finally increase the luminous angle of the Mini LED lamp panel to improve the final light-emitting uniformity.
Before the step S100, or between the step S100 and the step S200, mini LED chips are fixed on the glass substrate, and Mini LED lamp panels to be sealed are produced.
As a further embodiment, in the sealing method of the Mini LED lamp panel disclosed in the embodiment of the present invention, in step S100, transparent glue is further poured into the support column cavity 500, and after curing, the support column 700 is formed, and after curing, the transparent glue is further poured into the surface of the carrier plate 300, and then surface sealing is formed. By such arrangement, the support column 700 formed in the support column cavity 500 can prevent the diaphragm from being pressed to the optical lens when the module assembly is performed, thereby playing a role in supporting the diaphragm and protecting the optical lens. Meanwhile, the surface sealing adhesive 600 can increase the light mixing between the LEDs, so that the final light output is more uniform.
Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article that comprises a list of elements does not include only those elements but may include other elements not expressly listed.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. The sealing device for the Mini LED lamp panel is characterized by comprising a bearing plate, wherein an optical lens cavity used for pouring transparent glue is arranged on the bearing plate, the open end of the optical lens cavity can be in contact with the MiniLED lamp panel, and an optical lens formed after the transparent glue is solidified can be bonded with the Mini LED lamp panel into a whole.
2. The method for sealing the Mini LED lamp panel according to claim 1, wherein the Mini LED lamp panel comprises a glass substrate and a plurality of Mini LED wafers, and the Mini LED wafers are uniformly fixed on the glass substrate.
3. The glue sealing device of the Mini LED lamp panel according to claim 1, further comprising a support column cavity for pouring the transparent glue, wherein the support column cavity is arranged on the bearing plate and is arranged on the same side of the bearing plate as the optical lens cavity, and the length of the support column cavity is greater than that of the optical lens cavity.
4. The sealing device of the Mini LED lamp panel according to claim 1, wherein the optical lens cavity is in a convex lens shape or a concave lens shape;
the bearing plate is a plane or a curved plate.
5. The glue sealing device of the Mini LED lamp panel according to claim 3, wherein the number of the optical lens cavities is multiple, the optical lens cavities are uniformly distributed at the middle part of the bearing plate, and the optical lens cavities are arranged in one-to-one correspondence with the Mini LED wafers.
6. The glue sealing device of the Mini LED lamp panel according to claim 5, wherein the support column cavity is disposed at an edge portion of the carrier plate and surrounds the optical lens cavity.
7. The sealing device of the Mini LED lamp panel according to claim 3, wherein the support column cavity is of a conical structure, and the diameter of the support column cavity gradually decreases from the direction close to the bearing plate to the direction far away from the bearing plate.
8. The sealing method of the Mini LED lamp panel adopts the sealing device of the MiniLED lamp panel as claimed in claims 1-7 for sealing, and is characterized by comprising the following steps:
s100: pouring transparent glue into the cavity of the optical lens;
s200: placing a Mini LED lamp panel on the bearing plate, wherein the Mini LED lamp panel is contacted with the open end of the optical lens cavity;
s300: and curing the transparent glue to form an optical lens, wherein the optical lens and the Mini LED lamp panel are bonded into a whole.
9. The method for sealing a Mini LED lamp panel according to claim 8, wherein before the step S100, or before the step S100-the step S200, further comprises fixing a Mini LED wafer on a glass substrate, so as to produce the Mini LED lamp panel to be sealed.
10. The method of sealing MiniLED lamp panel according to claim 8, wherein in the step S100, the transparent glue is further poured into a cavity of a support column, the support column is formed after curing, and the transparent glue is further poured into a surface of the bearing plate, and the surface sealing glue is formed after curing.
CN202311108213.1A 2023-08-30 2023-08-30 Sealing device and method for Mini LED lamp panel Pending CN117108945A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311108213.1A CN117108945A (en) 2023-08-30 2023-08-30 Sealing device and method for Mini LED lamp panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311108213.1A CN117108945A (en) 2023-08-30 2023-08-30 Sealing device and method for Mini LED lamp panel

Publications (1)

Publication Number Publication Date
CN117108945A true CN117108945A (en) 2023-11-24

Family

ID=88808884

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311108213.1A Pending CN117108945A (en) 2023-08-30 2023-08-30 Sealing device and method for Mini LED lamp panel

Country Status (1)

Country Link
CN (1) CN117108945A (en)

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