CN114334925A - Method for repairing light-emitting chip after glue sealing and display panel - Google Patents
Method for repairing light-emitting chip after glue sealing and display panel Download PDFInfo
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- CN114334925A CN114334925A CN202111637826.5A CN202111637826A CN114334925A CN 114334925 A CN114334925 A CN 114334925A CN 202111637826 A CN202111637826 A CN 202111637826A CN 114334925 A CN114334925 A CN 114334925A
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Abstract
The application provides a light-emitting chip glue-sealed repair method and a display panel, the position of a fault chip on a substrate is detected and obtained, the sealant covering the fault chip is cut and taken out, after a new light-emitting chip is placed back to the position of the fault chip, the cut and taken-out sealant covers the filled light-emitting chip again, so that damage to the sealant is avoided, the risk of failure of the light-emitting chip can be reduced, and the optical consistency of the sealant covering the filled light-emitting chip and the surrounding uncut sealant is ensured.
Description
Technical Field
The application relates to the technical field of display manufacturing, in particular to a method for repairing a light-emitting chip after being sealed by a glue and a display panel.
Background
With the gradual maturity of micro and Micro Lighting Emitting Diode (MLED) technology, the main development direction thereof is divided into two major fields of backlight and direct display. From the packaging perspective, the current-stage MLED is also divided into three fields of Surface Mounted Devices (SMDs), integrated matrix packages (IMDs) and Chip On Board (COB), wherein the IMD and COB schemes are widely applied to the direct display field, and the COB scheme has become the mainstream scheme of small-size direct display due to short process route and low cost.
Because the COB scheme adopts the process of firstly punching and then packaging the whole surface, the fault-tolerant rate is low, and once the fault occurs in the process of sealing glue, the repairing can hardly be carried out. With the size of the light emitting chips of the direct display product becoming smaller and smaller, the number of the light emitting chips on the substrate becomes larger and larger, the possibility of failure of the light emitting chips is also increased due to expansion and contraction of the glue material generated in the glue sealing process, and if the light emitting chips cannot be repaired, the cost of a Surface Mount Technology (SMT) section is greatly increased.
The current glue-sealing post-repair machine on the market is laser repair, the glue material at the position of a damaged lamp is removed by laser, and then glue injection curing is carried out again. Adopt this scheme to have two problems, one is that laser heating gasification temperature can radiate the region around, leads to around gluey material to yellow or luminous chip damage, and the other is that although adopting the same kind of gluey material when here is sealed glues, still has optics nonconformity, because base plate secondary heating has also increased the risk that the base plate became invalid simultaneously.
In summary, the problem of failure of the light emitting chip caused by high temperature exists in the repair process of the light emitting chip after being sealed with glue. Therefore, it is necessary to provide a method for repairing the light emitting chip after encapsulation to improve the defect.
Disclosure of Invention
The embodiment of the application provides a method for repairing a light-emitting chip after being sealed with glue, which is used for solving the problem that the light-emitting chip fails due to high temperature in the process of repairing the light-emitting chip after being sealed with glue.
The embodiment of the application provides a method for repairing a light-emitting chip after being sealed by glue, wherein a plurality of light-emitting chips and a sealing glue layer coating the light-emitting chips are arranged on a substrate, and the method for repairing the light-emitting chips after being sealed by the glue comprises the following steps:
identifying a fault chip in the light-emitting chips and acquiring the position of the fault chip on the substrate;
cutting the sealant covering the fault chip and taking out;
removing the fault chip, and filling a new light-emitting chip at the position of the fault chip; and
and placing the cut and taken sealant back to the position of the fault chip, and coating the filled light-emitting chip.
According to an embodiment of the present application, the step of cutting and taking out the sealant covering the faulty chip includes:
cutting the sealant coating the fault chip in a physical cutting mode; and
and taking out the cut sealant in a negative pressure adsorption mode.
According to an embodiment of the application, the step of cutting the sealant which coats the fault chip by adopting a physical cutting mode comprises the following steps of:
cutting the sealant coating the fault chip along the thickness direction of the sealant layer by using a cutter;
the cutter comprises a hollow structure positioned in the middle and a cutter face surrounding the hollow structure.
According to an embodiment of the present application, a plurality of light emitting units are disposed on the substrate, each of the light emitting units includes at least two light emitting chips with different colors, and the method for repairing the light emitting chips after sealing the adhesive includes:
cutting and taking out the sealant which coats the light-emitting unit where the fault chip is located; and
and placing the cut and taken sealant back to the position of the fault chip, and coating the light-emitting unit filled with the light-emitting chip.
According to an embodiment of the application, the width of the cutter is larger than the width of the light emitting unit.
According to an embodiment of the application, a ratio of the width of the tool to the width of the light emitting unit is greater than or equal to 1.2.
According to an embodiment of the application, will be cut and take out sealed glue place back the position that trouble chip place to the cladding is filled the step of luminous chip includes:
coating a normal-temperature adhesive on the sealing adhesive; and
and placing the sealant back to the position of the fault chip, coating the filled light-emitting chip, and bonding the sealant with the light-emitting chip and the uncut sealant at the periphery.
According to an embodiment of the application, refractive indexes of the sealant and the normal-temperature adhesive are both greater than or equal to 1.5 and less than or equal to 1.7.
According to an embodiment of the present application, the material of the room temperature adhesive includes any one of vinyl acetate, allyl, polyurethane, and acrylate.
According to the method for repairing the light-emitting chip after being sealed with the adhesive, the embodiment of the application also provides a display panel, and the display panel is obtained by adopting the method for repairing the light-emitting chip after being sealed with the adhesive.
The beneficial effects of the embodiment of the application are as follows: the embodiment of the application provides a method for repairing a light-emitting chip after being sealed with glue and a display panel, wherein the position of a fault chip on a substrate is detected and obtained, the sealant covering the fault chip is cut and taken out, and after a new light-emitting chip is placed back to the position of the fault chip, the cut and taken-out sealant is covered with the filled light-emitting chip again, so that the sealant is prevented from being damaged, the risk of failure of the light-emitting chip can be reduced, and the optical consistency of the sealant covering the filled light-emitting chip and the surrounding uncut sealant is ensured.
Drawings
Fig. 1 is a schematic structural view of a light emitting chip provided in an embodiment of the present application after being encapsulated with a sealant;
fig. 2 is a flowchart of a method for repairing a light emitting chip after being encapsulated with an adhesive according to an embodiment of the present disclosure;
fig. 3a to 3e are schematic flow charts illustrating a first method for repairing a light emitting chip after being encapsulated with an encapsulant according to an embodiment of the present disclosure; and
fig. 4a to 4e are schematic flow charts illustrating a second method for repairing a light emitting chip after being encapsulated with an encapsulant according to an embodiment of the present application.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments that can be implemented by the application. Directional phrases used in this application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., refer only to the directions of the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and understanding, and is in no way limiting. In the drawings, elements having similar structures are denoted by the same reference numerals.
The present application will be further described with reference to the following drawings and specific examples.
An embodiment of the present application provides a method for repairing a light emitting chip after being sealed with an adhesive, as shown in fig. 1, fig. 1 is a schematic structural diagram of the light emitting chip provided in the embodiment of the present application after being sealed with an adhesive, and a substrate 10 is provided with a plurality of light emitting chips 20 and a sealant layer 30 covering the light emitting chips.
The substrate 10 may be an array substrate, and the substrate 10 may include a substrate and a thin film transistor array layer formed on the substrate, in which a pixel driving circuit for controlling and driving the light emitting chip 20 to emit light is formed.
The light emitting chip 20 may be any one of a Micro LED (Micro LED) and a Mini LED (Mini LED). In the embodiment of the present application, the light emitting chip 20 is a Micro LED, and the light emitting chip 20 may be directly bonded on the substrate 10 and electrically connected to the pixel driving circuit in the substrate 10.
The light emitting chips 20 may include red, green and blue light emitting chips 21, 22 and 23, and the red, green and blue light emitting chips 21, 22 and 23 may be disposed on the substrate 10 in a predetermined pixel arrangement manner.
After the light emitting chip 20 is transferred onto the substrate 10, the light emitting chip 20 may be packaged by a Chip On Board (COB) manner through the entire surface-coated sealant layer 30, so as to prevent the light emitting chip 20 from being damaged by water vapor, oxygen and other external environments.
With reference to fig. 2 and fig. 3a to 3e, fig. 2 is a flowchart of a repair method after a light emitting chip is encapsulated, and fig. 3a to 3e are schematic flowcharts of a repair method after a light emitting chip is encapsulated, according to an embodiment of the present application, where the repair method after the light emitting chip is encapsulated includes:
step S10: a defective chip among the light emitting chips 20 is identified, and a position of the defective chip on the substrate 10 is acquired.
In the embodiment of the present application, the faulty chip refers to the light emitting chip 20 in which a dead light, a dim light, or a flashing light condition occurs. The dead light means that the failed chip does not emit light, and the dark light means that the brightness of light emitted by the failed chip is lower than that of light emitted by other light emitting chips 20 when the chips operate normally.
In the step S10, the specific operation of identifying the faulty chip in the light emitting chips 20 and obtaining the position of the faulty chip on the substrate 10 is as follows:
the light-emitting chips 20 on the substrate 10 are subjected to a lighting test by the detection device, the light-emitting chips 20 on the substrate 10 except for the failed chip start to work normally, and the position of the failed chip and the type of the failed chip are detected and recorded.
For example, fig. 3a only shows that one red light emitting chip 21 on the substrate 10 is a failed chip. When 1 or more faulty chips are present on the substrate 20, the faulty chips may be any one or more of the red light-emitting chips 21, the green light-emitting chips 22, and the blue light-emitting chips 23.
Step S20: and cutting the sealant covering the fault chip and taking out.
In step S20, the step of cutting and taking out the sealant covering the faulty chip includes: s201, cutting the sealant 31 covering the fault chip in a physical cutting mode; and S202: and taking out the cut sealant 31 in a negative pressure adsorption mode.
In the step S201, the specific operation of cutting the sealant 31 covering the faulty chip by using a physical cutting method is as follows:
and cutting the sealant 31 covering the faulty chip along the thickness direction of the sealant layer 30 by using a cutter 40.
With reference to fig. 3a and 3b, the cutter 40 includes a hollow structure located in the middle and a knife surface surrounding the hollow structure, the hollow structure is used for accommodating and covering the faulty chip of the sealant, and the knife surface is used for cutting the sealant 31.
In the embodiment shown in fig. 3a, the cutter 40 only cuts the sealant covering the failed chip, which requires high precision and thickness of the cutter 40, the thickness of the blade surface of the cutter 40 needs to be smaller than the distance between any two adjacent light emitting chips 20, and the width of the cutter 40 is larger than the width of the light emitting chips, so as to avoid damage to the failed chip when the cutter 40 cuts the sealant.
It should be noted that, in the embodiment of the present application, fig. 3a to fig. 3e only illustrate the repair process of 1 faulty chip, and in practical applications, a plurality of cutters 40 may be used to simultaneously cut the packaging adhesive covering a plurality of faulty chips and simultaneously repair a plurality of faulty chips. For the cutting and repairing processes of other faulty chips, reference may be made to fig. 3a to 3e, which are not described herein again.
After the sealant is cut with the knife, the cut sealant needs to be removed from the substrate 10. As shown in fig. 3a, the adhesive sealant can be sucked out of the substrate 10 by a suction tool 50 through negative pressure suction.
The adsorption tool 50 can be communicated with the hollow structure of the cutter 40, after the cutter 40 finishes cutting the sealant 31, the adsorption tool 50 extracts gas in the hollow structure, so that the air pressure in the hollow structure is smaller than the atmospheric pressure in the external environment, the cut sealant 31 can be absorbed by the cutter 40 and the adsorption tool 50, and the cut sealant is removed from the substrate 10 without damaging the sealant.
The pressure of the adsorption tool 50 when adsorbing the sealant 31 may be between 10 to 100 Pa.
It should be noted that, in the embodiment of the present application, the sealant 31 is cut by using the cutter as shown in fig. 3a, so that damage to other normal light emitting chips caused by high temperature generated by cutting the sealant by using laser can be avoided, a problem of failure of the light emitting chips due to high temperature in a repair process after the light emitting chips are sealed can be solved, and meanwhile, it can be ensured that the shape and material of the cut sealant 31 are not damaged.
In other embodiments, the cutter for cutting the sealant 31 is not limited to the type shown in fig. 3a, and may also use a water jet cutter or other physical cutting methods to cut the sealant, so that high temperature is not generated, and the appearance and material of the sealant 31 are not damaged.
Step S30: and removing the fault chip, and filling a new light-emitting chip at the position of the fault chip.
In step S30, the specific operation of removing the faulty chip is as follows:
scraping the fault chip to form a part to be repaired; and cleaning the bonding pad exposed on the part to be repaired. Specifically, the faulty chip may be heated by laser to melt solder paste on the pad of the substrate 10, and the faulty chip may be taken out by a mechanical arm, or the faulty chip may be taken out from the substrate by blowing air to form a portion to be repaired on the substrate 10.
In step S30, the specific operation of filling a new light emitting chip at the position of the failed chip is as follows:
and carrying out crystal supplementing treatment on the part to be supplemented. Specifically, single-point crystal supplement processing is carried out on each part to be supplemented through the crystal fixing machine, the normal light-emitting chips are placed on the parts to be supplemented, and the color of light emitted by the normal light-emitting chips is the same as that of light emitted by the fault chips.
In step S30, the specific operation of performing the crystal repairing process on the part to be repaired is as follows:
solder paste is poured into the part to be repaired; specifically, the solder paste is dotted on the bonding pad of the substrate at the part to be repaired through the die bonder, and other types of solder can be dotted on the bonding pad of the substrate at the part to be repaired according to the requirement to replace the function of the solder paste;
placing a normal light-emitting chip on a part to be compensated; specifically, a normal light emitting chip can be placed on the part to be repaired through a die bonder;
the solder paste is melted and then solidified, so that the operation of crystal supplement treatment on the part to be supplemented is realized, and the normal light-emitting chip placed on the part to be supplemented is stably attached to the substrate, thereby achieving the effect of repairing the light-emitting chip; specifically, the melting operation of the solder paste can be realized by high-temperature heating such as reflow soldering, laser soldering or hot air blowing, and the solder paste is cooled and solidified after the operation is stopped.
As shown in fig. 3c, after the failed chip is removed, the normal red light emitting chip 21 'is moved into the position where the failed red light emitting chip 21 is located, and the normal red light emitting chip 21' is bound on the substrate 10 by the above-mentioned manner.
Step S40: and placing the cut and taken sealant back to the position of the fault chip, and coating the filled light-emitting chip.
As shown in fig. 3d to fig. 3e, in step S40, the step of placing the cut and taken-out sealant 31 back to the position where the faulty chip is located and covering the filled light emitting chip includes:
step S401: coating a normal-temperature adhesive 32 on the sealant 31; and
step S402: and placing the sealant 31 back to the position of the fault chip, coating the filled light-emitting chip, and bonding the sealant 31 with the light-emitting chip and the uncut sealant on the periphery.
The refractive indexes of the sealant 31 and the normal-temperature adhesive 32 are both greater than or equal to 1.5 and less than or equal to 1.7. Preferably, the refractive index of the sealant 31 is the same as or similar to that of the normal temperature adhesive 32, so that the refraction of light at the interface between the sealant layer 30 and the normal temperature adhesive 32 can be reduced, and the light utilization rate of the display panel can be ensured. For example, the refractive indexes of the sealant 31 and the normal temperature adhesive 32 may be 1.5, 1.6, 1.7, and the like, and the refractive index of the sealant 31 may be different from the refractive index of the normal temperature adhesive 32, and only needs to be between 1.5 and 1.7, which is not limited herein.
Specifically, in the step S401, the material of the normal temperature adhesive 32 may include any one of vinyl acetate, allyl, polyurethane, and acrylate. In the embodiment of the application, the normal temperature adhesive can be a common interface adhesive, and the material of the common interface adhesive is vinyl acetate. In other embodiments, the normal temperature adhesive may also be an ultraviolet curing adhesive, and the material thereof includes at least one of allyl, polyurethane, and acrylate.
It should be noted that, in the embodiment of the present application, the cut adhesive material is used to re-coat the filled light emitting chip, and since the shape and material of the cut adhesive material are not damaged, the normal temperature adhesive is used to bond the cut sealant with the light emitting chip and the uncut sealant, so that thermal expansion caused by heating the adhesive material and secondary damage caused by high temperature to the substrate can be avoided, and meanwhile, it can be ensured that the optical characteristics of the repair area of the substrate are consistent with those of other unrepaired areas.
As shown in fig. 4a to 4e, fig. 4a to 4e are schematic flow diagrams of a second method for repairing a light emitting chip after being encapsulated, which is provided by the embodiment of the present application, and it should be noted that the method for repairing a light emitting chip after being encapsulated provided by the embodiment of the present application is substantially the same as the method for repairing a light emitting chip after being encapsulated provided by the embodiment of the present application, except that:
as shown in fig. 4a, a plurality of light emitting units EU are disposed on the substrate 10, and each of the light emitting units EU includes at least two light emitting chips 20 with different colors. For example, the light emitting unit EU may be composed of a red light emitting chip 21, a green light emitting chip 22, and a blue light emitting chip 23. In each of the light emitting units EU, the red light emitting chips 21, the green light emitting chips 22, and the blue light emitting chips 23 may be arranged side by side at intervals, or may be distributed in a triangular shape or other geometric shapes.
In step S20, the specific operation of cutting and taking out the sealant covering the faulty chip is as follows:
and cutting and taking out the sealant 31 covering the light-emitting unit EU where the fault chip is located.
For example, as shown in fig. 4a and 4b, the light-emitting unit EU in which the failed chip is located includes three light-emitting chips, namely a red light-emitting chip 21, a green light-emitting chip 22 and a blue light-emitting chip 23, wherein the red light-emitting chip 21 is the failed chip. When the sealant 31 covering the faulty chip is cut by the cutter, the sealant 31 covering the light-emitting unit EU where the faulty chip is located can be cut off, so that the requirements on the precision of the cutter and the thickness of the cutter surface can be reduced, and the difficulty in cutting the sealant is reduced.
In the embodiment of the present application, the width of the cutter 40 needs to be greater than the width of the light emitting unit EU.
Further, the ratio of the width of the cutter 40 to the width of the light emitting unit EU should be greater than or equal to 1.2, so as to prevent the cutter 40 from damaging the normal light emitting chip 20 in the light emitting unit EU during the cutting process. Meanwhile, the thickness of the cutter 40 should be smaller than the distance between adjacent light-emitting units EU, so as to prevent the cutter from damaging the light-emitting chips in the adjacent light-emitting units EU during the cutting process.
Step S30: and removing the fault chip, and filling a new light-emitting chip at the position of the fault chip.
In step S30, the specific operation of removing the faulty chip is as follows:
scraping the fault chip to form a part to be repaired; and cleaning the bonding pad exposed on the part to be repaired. Specifically, the faulty chip may be heated by laser to melt solder paste on the pad of the substrate 10, and the faulty chip may be taken out by a mechanical arm, or the faulty chip may be taken out from the substrate by blowing air to form a portion to be repaired on the substrate 10.
In step S30, the specific operation of filling a new light emitting chip at the position of the failed chip is as follows:
and carrying out crystal supplementing treatment on the part to be supplemented. Specifically, single-point crystal supplement processing is carried out on each part to be supplemented through the crystal fixing machine, the normal light-emitting chips are placed on the parts to be supplemented, and the color of light emitted by the normal light-emitting chips is the same as that of light emitted by the fault chips.
In step S30, the specific operation of performing the crystal repairing process on the part to be repaired is as follows:
solder paste is poured into the part to be repaired; specifically, the solder paste is dotted on the bonding pad of the substrate at the part to be repaired through the die bonder, and other types of solder can be dotted on the bonding pad of the substrate at the part to be repaired according to the requirement to replace the function of the solder paste;
placing a normal light-emitting chip on a part to be compensated; specifically, a normal light emitting chip can be placed on the part to be repaired through a die bonder;
the solder paste is melted and then solidified, so that the operation of crystal supplement treatment on the part to be supplemented is realized, and the normal light-emitting chip placed on the part to be supplemented is stably attached to the substrate, thereby achieving the effect of repairing the light-emitting chip; specifically, the melting operation of the solder paste can be realized by high-temperature heating such as reflow soldering, laser soldering or hot air blowing, and the solder paste is cooled and solidified after the operation is stopped.
As shown in fig. 4c, after the failed chip is removed, the normal red light emitting chip 21 'is moved into the position where the failed red light emitting chip 21 is located, and the normal red light emitting chip 21' is bound on the substrate 10 by the above-mentioned manner.
As shown in fig. 4d to 4e, in step S40, the specific operations of placing the cut and taken-out sealant back to the position where the faulty chip is located and coating the filled light emitting chip are as follows:
and placing the cut and taken sealant back to the position of the fault chip, and coating the filled light-emitting unit EU where the light-emitting chip is located.
As shown in fig. 4d, a normal temperature adhesive is coated on both the surface of the cut sealant in contact with the light emitting chip and the surface of the cut sealant in contact with the adjacent uncut sealant, and the cut sealant is bonded to the light emitting chip and the uncut sealant by the normal temperature adhesive.
According to the method for repairing the light-emitting chip after being sealed with the adhesive, the embodiment of the application also provides a display panel, the display panel is obtained by repairing the light-emitting chip after being sealed with the adhesive through the method for repairing the light-emitting chip provided by the embodiment, the structure of the display panel can be shown in fig. 4e, the display panel is repaired through the method for repairing the display panel provided by the embodiment, the damage to the adhesive coating covering the fault chip can be avoided, the adhesive coating covering the fault chip is used for sealing the normally-generated chip after being filled, and the optical consistency of a repaired area and an unrepaired area in the display panel can be ensured.
The embodiment of the application provides a method for repairing a light-emitting chip after being sealed with glue and a display panel, wherein the position of a fault chip on a substrate is detected and obtained, the sealant covering the fault chip is cut and taken out, and after a new light-emitting chip is placed back to the position of the fault chip, the cut and taken-out sealant is covered with the filled light-emitting chip again, so that the sealant is prevented from being damaged, the risk of failure of the light-emitting chip can be reduced, and the optical consistency of the sealant covering the filled light-emitting chip and the surrounding uncut sealant is ensured.
In summary, although the present application has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application is defined by the appended claims.
Claims (10)
1. A method for repairing a light-emitting chip after being sealed by glue is characterized in that a plurality of light-emitting chips and a sealing glue layer for coating the light-emitting chips are arranged on a substrate, and the method for repairing the light-emitting chips after being sealed by the glue comprises the following steps:
identifying a fault chip in the light-emitting chips and acquiring the position of the fault chip on the substrate;
cutting the sealant covering the fault chip and taking out;
removing the fault chip, and filling a new light-emitting chip at the position of the fault chip; and
and placing the cut and taken sealant back to the position of the fault chip, and coating the filled light-emitting chip.
2. The method for repairing the light emitting chip after the encapsulant is used as claimed in claim 1, wherein the step of cutting and removing the encapsulant covering the faulty chip comprises:
cutting the sealant coating the fault chip in a physical cutting mode; and
and taking out the cut sealant in a negative pressure adsorption mode.
3. The method for repairing the light emitting chip after the encapsulant is applied, wherein the step of cutting the encapsulant covering the faulty chip by physical cutting comprises:
cutting the sealant coating the fault chip along the thickness direction of the sealant layer by using a cutter;
the cutter comprises a hollow structure positioned in the middle and a cutter face surrounding the hollow structure.
4. The method for repairing a light-emitting chip after being sealed and encapsulated as claimed in claim 3, wherein a plurality of light-emitting units are disposed on the substrate, each light-emitting unit includes at least two light-emitting chips with different colors, and the method for repairing a light-emitting chip after being sealed and encapsulated includes:
cutting and taking out the sealant which coats the light-emitting unit where the fault chip is located; and
and placing the cut and taken sealant back to the position of the fault chip, and coating the light-emitting unit filled with the light-emitting chip.
5. The method of claim 4, wherein the width of the tool is greater than the width of the light-emitting unit.
6. The method of claim 5, wherein the ratio of the width of the tool to the width of the light-emitting unit is greater than or equal to 1.2.
7. The method for repairing the light emitting chip after being encapsulated with the sealant according to claim 1, wherein the step of placing the cut and taken out sealant back to the position of the failed chip and encapsulating the filled light emitting chip comprises:
coating a normal-temperature adhesive on the sealing adhesive; and
and placing the sealant back to the position of the fault chip, coating the filled light-emitting chip, and bonding the sealant with the light-emitting chip and the uncut sealant at the periphery.
8. The method for repairing a light emitting chip after being encapsulated according to claim 7, wherein refractive indexes of the encapsulant and the normal temperature adhesive are both greater than or equal to 1.5 and less than or equal to 1.7.
9. The method for repairing a light emitting chip after being sealed with an encapsulant as claimed in claim 7, wherein the material of the normal temperature adhesive includes any one of vinyl acetate, allyl, polyurethane and acrylate.
10. A display panel, which is obtained by repairing the light emitting chip according to any one of claims 1 to 9 by the method for repairing the light emitting chip after being encapsulated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111637826.5A CN114334925A (en) | 2021-12-29 | 2021-12-29 | Method for repairing light-emitting chip after glue sealing and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111637826.5A CN114334925A (en) | 2021-12-29 | 2021-12-29 | Method for repairing light-emitting chip after glue sealing and display panel |
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| CN114334925A true CN114334925A (en) | 2022-04-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024000706A1 (en) * | 2022-06-29 | 2024-01-04 | 深圳市华星光电半导体显示技术有限公司 | Light-emitting plate, display device, and manufacturing method for light-emitting plate |
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2021
- 2021-12-29 CN CN202111637826.5A patent/CN114334925A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024000706A1 (en) * | 2022-06-29 | 2024-01-04 | 深圳市华星光电半导体显示技术有限公司 | Light-emitting plate, display device, and manufacturing method for light-emitting plate |
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