TW202340860A - 感光性樹脂片、硬化膜及多層配線基板 - Google Patents

感光性樹脂片、硬化膜及多層配線基板 Download PDF

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Publication number
TW202340860A
TW202340860A TW112104927A TW112104927A TW202340860A TW 202340860 A TW202340860 A TW 202340860A TW 112104927 A TW112104927 A TW 112104927A TW 112104927 A TW112104927 A TW 112104927A TW 202340860 A TW202340860 A TW 202340860A
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TW
Taiwan
Prior art keywords
photosensitive resin
resin sheet
transmittance
film
resin layer
Prior art date
Application number
TW112104927A
Other languages
English (en)
Chinese (zh)
Inventor
濱野翼
小森悠佑
Original Assignee
日商東麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東麗股份有限公司 filed Critical 日商東麗股份有限公司
Publication of TW202340860A publication Critical patent/TW202340860A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW112104927A 2022-02-14 2023-02-13 感光性樹脂片、硬化膜及多層配線基板 TW202340860A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-020213 2022-02-14
JP2022020213 2022-02-14

Publications (1)

Publication Number Publication Date
TW202340860A true TW202340860A (zh) 2023-10-16

Family

ID=87564416

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112104927A TW202340860A (zh) 2022-02-14 2023-02-13 感光性樹脂片、硬化膜及多層配線基板

Country Status (3)

Country Link
JP (1) JPWO2023153390A1 (https=)
TW (1) TW202340860A (https=)
WO (1) WO2023153390A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026031012A (ja) * 2024-08-09 2026-02-24 日東電工株式会社 ポリイミド前駆体組成物、ポリイミド樹脂、配線回路基板、および、電子機器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG173468A1 (en) * 2009-01-29 2011-09-29 Toray Industries Resin composition and display device formed using same
JP2016180929A (ja) * 2015-03-25 2016-10-13 日立化成株式会社 感光性樹脂組成物、感光性フィルム、感光性シート、樹脂パターン、樹脂層付半導体ウェハ及び半導体装置。
JP7300619B2 (ja) * 2019-01-11 2023-06-30 太陽ホールディングス株式会社 積層構造体、ドライフィルム、その硬化物および電子部品
CN110431484B (zh) * 2019-01-23 2021-11-02 律胜科技股份有限公司 感光性聚酰亚胺树脂组合物及其聚酰亚胺膜
JP2020148815A (ja) * 2019-03-11 2020-09-17 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルムおよび硬化物、これを有する電子部品並びに硬化性樹脂組成物の硬化物の製造方法
WO2020203790A1 (ja) * 2019-03-29 2020-10-08 太陽インキ製造株式会社 フォトレジスト組成物およびその硬化物
JP7443000B2 (ja) * 2019-09-06 2024-03-05 太陽ホールディングス株式会社 硬化性樹脂組成物

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Publication number Publication date
JPWO2023153390A1 (https=) 2023-08-17
WO2023153390A1 (ja) 2023-08-17

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