JPWO2023153390A1 - - Google Patents

Info

Publication number
JPWO2023153390A1
JPWO2023153390A1 JP2023509675A JP2023509675A JPWO2023153390A1 JP WO2023153390 A1 JPWO2023153390 A1 JP WO2023153390A1 JP 2023509675 A JP2023509675 A JP 2023509675A JP 2023509675 A JP2023509675 A JP 2023509675A JP WO2023153390 A1 JPWO2023153390 A1 JP WO2023153390A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023509675A
Other languages
Japanese (ja)
Other versions
JPWO2023153390A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023153390A1 publication Critical patent/JPWO2023153390A1/ja
Publication of JPWO2023153390A5 publication Critical patent/JPWO2023153390A5/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2023509675A 2022-02-14 2023-02-07 Pending JPWO2023153390A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022020213 2022-02-14
PCT/JP2023/003951 WO2023153390A1 (ja) 2022-02-14 2023-02-07 感光性樹脂シート、硬化膜、及び多層配線基板

Publications (2)

Publication Number Publication Date
JPWO2023153390A1 true JPWO2023153390A1 (https=) 2023-08-17
JPWO2023153390A5 JPWO2023153390A5 (https=) 2026-02-09

Family

ID=87564416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023509675A Pending JPWO2023153390A1 (https=) 2022-02-14 2023-02-07

Country Status (3)

Country Link
JP (1) JPWO2023153390A1 (https=)
TW (1) TW202340860A (https=)
WO (1) WO2023153390A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026031012A (ja) * 2024-08-09 2026-02-24 日東電工株式会社 ポリイミド前駆体組成物、ポリイミド樹脂、配線回路基板、および、電子機器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG173468A1 (en) * 2009-01-29 2011-09-29 Toray Industries Resin composition and display device formed using same
JP2016180929A (ja) * 2015-03-25 2016-10-13 日立化成株式会社 感光性樹脂組成物、感光性フィルム、感光性シート、樹脂パターン、樹脂層付半導体ウェハ及び半導体装置。
JP7300619B2 (ja) * 2019-01-11 2023-06-30 太陽ホールディングス株式会社 積層構造体、ドライフィルム、その硬化物および電子部品
CN110431484B (zh) * 2019-01-23 2021-11-02 律胜科技股份有限公司 感光性聚酰亚胺树脂组合物及其聚酰亚胺膜
JP2020148815A (ja) * 2019-03-11 2020-09-17 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルムおよび硬化物、これを有する電子部品並びに硬化性樹脂組成物の硬化物の製造方法
WO2020203790A1 (ja) * 2019-03-29 2020-10-08 太陽インキ製造株式会社 フォトレジスト組成物およびその硬化物
JP7443000B2 (ja) * 2019-09-06 2024-03-05 太陽ホールディングス株式会社 硬化性樹脂組成物

Also Published As

Publication number Publication date
WO2023153390A1 (ja) 2023-08-17
TW202340860A (zh) 2023-10-16

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Legal Events

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