TW202336121A - 電子零件用膏 - Google Patents

電子零件用膏 Download PDF

Info

Publication number
TW202336121A
TW202336121A TW111145894A TW111145894A TW202336121A TW 202336121 A TW202336121 A TW 202336121A TW 111145894 A TW111145894 A TW 111145894A TW 111145894 A TW111145894 A TW 111145894A TW 202336121 A TW202336121 A TW 202336121A
Authority
TW
Taiwan
Prior art keywords
cellulose
binder
paste
terminal
single terminal
Prior art date
Application number
TW111145894A
Other languages
English (en)
Chinese (zh)
Inventor
鶴明大
池嶋康二
青木一良
Original Assignee
日商村田製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商村田製作所股份有限公司 filed Critical 日商村田製作所股份有限公司
Publication of TW202336121A publication Critical patent/TW202336121A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L1/00Compositions of cellulose, modified cellulose or cellulose derivatives
    • C08L1/08Cellulose derivatives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Conductive Materials (AREA)
  • Ceramic Capacitors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111145894A 2021-12-01 2022-11-30 電子零件用膏 TW202336121A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021-195053 2021-12-01
JP2021195053 2021-12-01
WOPCT/JP2022/038492 2022-10-15
PCT/JP2022/038492 WO2023100503A1 (ja) 2021-12-01 2022-10-15 電子部品用ペースト

Publications (1)

Publication Number Publication Date
TW202336121A true TW202336121A (zh) 2023-09-16

Family

ID=86611987

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111145894A TW202336121A (zh) 2021-12-01 2022-11-30 電子零件用膏

Country Status (5)

Country Link
JP (1) JP7652287B2 (https=)
KR (1) KR102934404B1 (https=)
CN (1) CN118120032A (https=)
TW (1) TW202336121A (https=)
WO (1) WO2023100503A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4881193B2 (ja) 2007-03-09 2012-02-22 三菱樹脂株式会社 導電性ペースト組成物
JP6795362B2 (ja) 2016-09-15 2020-12-02 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company 接合用の導電性ペースト
JP2018131681A (ja) 2017-02-14 2018-08-23 住友金属鉱山株式会社 ニッケルペースト及びその製造方法、並びにニッケル有機スラリー及びその製造方法
JP6939015B2 (ja) 2017-03-29 2021-09-22 住友金属鉱山株式会社 積層セラミックコンデンサ内部電極用のグラビア印刷用導電性ペースト
JP6810778B1 (ja) * 2019-09-25 2021-01-06 株式会社ノリタケカンパニーリミテド 導電性ペーストとこれを用いた電子部品の製造方法

Also Published As

Publication number Publication date
WO2023100503A1 (ja) 2023-06-08
CN118120032A (zh) 2024-05-31
KR20240100390A (ko) 2024-07-01
KR102934404B1 (ko) 2026-03-06
JP7652287B2 (ja) 2025-03-27
JPWO2023100503A1 (https=) 2023-06-08

Similar Documents

Publication Publication Date Title
KR101696947B1 (ko) 슬러리 조성물의 제조 방법
KR101109809B1 (ko) 도공 페이스트용 결합제 수지
TWI637994B (zh) 陶瓷成形用或導電糊用黏合劑、及彼等之用途、以及陶瓷胚片及塗敷片、及彼等之製造方法
TWI658109B (zh) 黏著劑樹脂之製造方法及樹脂組成物之製造方法以及黏著劑樹脂及樹脂組成物
JP7061795B2 (ja) 高分子化合物及びそれを含む高分子組成物、並びに無機粒子含有組成物
JP5224722B2 (ja) 樹脂組成物、導電ペースト及びセラミックペースト
JP5965808B2 (ja) ペースト及び積層セラミックコンデンサ
KR102937110B1 (ko) 전자부품용 페이스트
JP6542476B2 (ja) 共重合体及びその製造方法、並びに共重合体組成物
JP5767923B2 (ja) 導電ペースト
JP5824388B2 (ja) 導電ペースト
TW202336121A (zh) 電子零件用膏
JP7457487B2 (ja) 導電ペースト
WO2013081077A1 (ja) 導電ペースト及び積層セラミックコンデンサ
JP5809505B2 (ja) 導電ペースト
WO2022265080A1 (ja) 樹脂、及び樹脂組成物
TWI902583B (zh) 導電性漿料、電子零件以及積層陶瓷電容器
TW202601683A (zh) 導電性糊料、電子零件及層合陶瓷電容器
TW202532465A (zh) 聚乙烯縮醛樹脂、陶瓷生片用漿料及陶瓷生片
JP2012072256A (ja) エポキシ変性ポリビニルアセタール樹脂、セラミックスラリー及びセラミックグリーンシート
TW202604985A (zh) 聚乙烯縮醛樹脂
CN119894970A (zh) 导电性浆料、电子部件以及叠层陶瓷电容器
JP2013114891A (ja) 導電ペーストおよび積層セラミックコンデンサ