TW202332994A - 基板的製造方法及昇華乾燥方法 - Google Patents

基板的製造方法及昇華乾燥方法 Download PDF

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Publication number
TW202332994A
TW202332994A TW111134772A TW111134772A TW202332994A TW 202332994 A TW202332994 A TW 202332994A TW 111134772 A TW111134772 A TW 111134772A TW 111134772 A TW111134772 A TW 111134772A TW 202332994 A TW202332994 A TW 202332994A
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TW
Taiwan
Prior art keywords
film
sublimable
substrate
solvent
forming composition
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Application number
TW111134772A
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English (en)
Chinese (zh)
Inventor
照井貴陽
吉田彩香
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日商中央硝子股份有限公司
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Application filed by 日商中央硝子股份有限公司 filed Critical 日商中央硝子股份有限公司
Publication of TW202332994A publication Critical patent/TW202332994A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • F26B5/041—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum for drying flowable materials, e.g. suspensions, bulk goods, in a continuous operation, e.g. with locks or other air tight arrangements for charging/discharging

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  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
TW111134772A 2021-09-15 2022-09-14 基板的製造方法及昇華乾燥方法 TW202332994A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021150186 2021-09-15
JP2021-150186 2021-09-15

Publications (1)

Publication Number Publication Date
TW202332994A true TW202332994A (zh) 2023-08-16

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ID=85602156

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111134772A TW202332994A (zh) 2021-09-15 2022-09-14 基板的製造方法及昇華乾燥方法

Country Status (7)

Country Link
US (1) US20240371627A1 (https=)
EP (1) EP4404243A4 (https=)
JP (1) JPWO2023042736A1 (https=)
KR (1) KR20240067920A (https=)
IL (1) IL311467A (https=)
TW (1) TW202332994A (https=)
WO (1) WO2023042736A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025125474A (ja) * 2024-02-15 2025-08-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置及び基板処理液

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5681560B2 (ja) 2011-05-17 2015-03-11 東京エレクトロン株式会社 基板乾燥方法及び基板処理装置
JP6022829B2 (ja) * 2012-07-03 2016-11-09 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板乾燥装置
JP7265879B2 (ja) * 2019-02-14 2023-04-27 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置
WO2020189688A1 (ja) * 2019-03-19 2020-09-24 セントラル硝子株式会社 凹凸パターン乾燥用組成物、及び表面に凹凸パターンを有する基板の製造方法
JP2021150186A (ja) 2020-03-19 2021-09-27 東芝ライテック株式会社 推定装置、推定システム、推定方法および推定プログラム

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Publication number Publication date
US20240371627A1 (en) 2024-11-07
JPWO2023042736A1 (https=) 2023-03-23
EP4404243A1 (en) 2024-07-24
IL311467A (en) 2024-05-01
KR20240067920A (ko) 2024-05-17
WO2023042736A1 (ja) 2023-03-23
EP4404243A4 (en) 2025-09-24

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