JPWO2023042736A1 - - Google Patents
Info
- Publication number
- JPWO2023042736A1 JPWO2023042736A1 JP2023548436A JP2023548436A JPWO2023042736A1 JP WO2023042736 A1 JPWO2023042736 A1 JP WO2023042736A1 JP 2023548436 A JP2023548436 A JP 2023548436A JP 2023548436 A JP2023548436 A JP 2023548436A JP WO2023042736 A1 JPWO2023042736 A1 JP WO2023042736A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
- F26B5/041—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum for drying flowable materials, e.g. suspensions, bulk goods, in a continuous operation, e.g. with locks or other air tight arrangements for charging/discharging
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021150186 | 2021-09-15 | ||
| PCT/JP2022/033662 WO2023042736A1 (ja) | 2021-09-15 | 2022-09-08 | 基板の製造方法および昇華乾燥方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023042736A1 true JPWO2023042736A1 (https=) | 2023-03-23 |
| JPWO2023042736A5 JPWO2023042736A5 (https=) | 2024-06-05 |
Family
ID=85602156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023548436A Pending JPWO2023042736A1 (https=) | 2021-09-15 | 2022-09-08 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240371627A1 (https=) |
| EP (1) | EP4404243A4 (https=) |
| JP (1) | JPWO2023042736A1 (https=) |
| KR (1) | KR20240067920A (https=) |
| IL (1) | IL311467A (https=) |
| TW (1) | TW202332994A (https=) |
| WO (1) | WO2023042736A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025125474A (ja) * | 2024-02-15 | 2025-08-27 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法、基板処理装置及び基板処理液 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012243869A (ja) * | 2011-05-17 | 2012-12-10 | Tokyo Electron Ltd | 基板乾燥方法及び基板処理装置 |
| JP2020136355A (ja) * | 2019-02-14 | 2020-08-31 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板乾燥方法および基板処理装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6022829B2 (ja) * | 2012-07-03 | 2016-11-09 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板乾燥方法および基板乾燥装置 |
| WO2020189688A1 (ja) * | 2019-03-19 | 2020-09-24 | セントラル硝子株式会社 | 凹凸パターン乾燥用組成物、及び表面に凹凸パターンを有する基板の製造方法 |
| JP2021150186A (ja) | 2020-03-19 | 2021-09-27 | 東芝ライテック株式会社 | 推定装置、推定システム、推定方法および推定プログラム |
-
2022
- 2022-09-08 US US18/685,849 patent/US20240371627A1/en active Pending
- 2022-09-08 EP EP22869883.3A patent/EP4404243A4/en not_active Withdrawn
- 2022-09-08 KR KR1020247012086A patent/KR20240067920A/ko active Pending
- 2022-09-08 IL IL311467A patent/IL311467A/en unknown
- 2022-09-08 JP JP2023548436A patent/JPWO2023042736A1/ja active Pending
- 2022-09-08 WO PCT/JP2022/033662 patent/WO2023042736A1/ja not_active Ceased
- 2022-09-14 TW TW111134772A patent/TW202332994A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012243869A (ja) * | 2011-05-17 | 2012-12-10 | Tokyo Electron Ltd | 基板乾燥方法及び基板処理装置 |
| JP2020136355A (ja) * | 2019-02-14 | 2020-08-31 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板乾燥方法および基板処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240371627A1 (en) | 2024-11-07 |
| TW202332994A (zh) | 2023-08-16 |
| EP4404243A1 (en) | 2024-07-24 |
| IL311467A (en) | 2024-05-01 |
| KR20240067920A (ko) | 2024-05-17 |
| WO2023042736A1 (ja) | 2023-03-23 |
| EP4404243A4 (en) | 2025-09-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231115 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250613 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260414 |