WO2023042736A1 - 基板の製造方法および昇華乾燥方法 - Google Patents

基板の製造方法および昇華乾燥方法 Download PDF

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Publication number
WO2023042736A1
WO2023042736A1 PCT/JP2022/033662 JP2022033662W WO2023042736A1 WO 2023042736 A1 WO2023042736 A1 WO 2023042736A1 JP 2022033662 W JP2022033662 W JP 2022033662W WO 2023042736 A1 WO2023042736 A1 WO 2023042736A1
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Prior art keywords
film
substrate
sublimable
manufacturing
solvent
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PCT/JP2022/033662
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English (en)
French (fr)
Japanese (ja)
Inventor
貴陽 照井
彩香 吉田
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Central Glass Co Ltd
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Central Glass Co Ltd
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Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Priority to IL311467A priority Critical patent/IL311467A/en
Priority to US18/685,849 priority patent/US20240371627A1/en
Priority to EP22869883.3A priority patent/EP4404243A4/en
Priority to KR1020247012086A priority patent/KR20240067920A/ko
Priority to JP2023548436A priority patent/JPWO2023042736A1/ja
Publication of WO2023042736A1 publication Critical patent/WO2023042736A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • F26B5/041—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum for drying flowable materials, e.g. suspensions, bulk goods, in a continuous operation, e.g. with locks or other air tight arrangements for charging/discharging

Definitions

  • the present invention relates to a substrate manufacturing method and a sublimation drying method.
  • the sublimation drying method is one of the drying methods used in the cleaning process of fine semiconductor structures, that is, patterns.
  • the sublimation drying method is used to prevent pattern collapse by forming a film made of a sublimable substance on a pattern formed on a substrate surface and volatilizing and removing the film.
  • Patent Document 1 describes a technique related to the above sublimation drying method.
  • a solution of a sublimation substance is supplied to the substrate to fill the recesses of the pattern.
  • a sublimable substance filling step of filling the solution a solvent drying step of drying the solvent in the solution and filling the recesses of the pattern with the sublimable substance in a solid state; and a sublimable substance removing step of removing the sublimable substance from the substrate by heating to a temperature higher than the sublimation temperature of the substrate (Claim 1 of Patent Document 1).
  • a composition for forming a sublimation film having the same composition (hereinafter sometimes referred to as a "sublimation film forming composition”) was used to form a pattern. It was found that even if sublimation drying is performed on the test pieces that have been subjected to sublimation, it is sometimes difficult to find reproducibility and trends regarding whether or not pattern collapse can be suppressed and the degree of suppression. Specifically, when an attempt was made to suppress pattern collapse using the sublimable film-forming composition, the result was that pattern collapse could be suppressed over almost the entire surface of the test piece, the result was that pattern collapse could not be suppressed, and the region where pattern collapse could be suppressed. and poorly suppressed regions on the scale of micrometers to millimeters were randomly obtained in some cases.
  • the sublimable film-forming composition As a result of further investigation, it was found that after the sublimable film-forming composition was supplied onto the wafer, it tended to be affected by the dew point of the atmosphere in contact with the surface of the formed coating film. If the dew point temperature of the atmosphere is high, it is speculated that moisture contained in the atmosphere is absorbed on the coating film surface over the entire surface or locally, or dew condensation occurs over the entire surface or locally on the surface of the coating film. be. Moreover, especially when the sublimable film-forming composition contains a solvent, it is presumed that the heat of the coating film and the wafer is taken away by the heat of vaporization when the solvent evaporates, and dew condensation is likely to occur.
  • the dew point temperature (T dp ) at 1 atm of the atmosphere in the chamber in which the film is arranged is It was found that by controlling the surface temperature of the film to be lower than the minimum temperature (T min ), pattern collapse can be stably suppressed in a substrate manufacturing method using a sublimation drying method. was completed.
  • T dp and T min are T.
  • T dp and T min are controlled so as to satisfy T min ⁇ T dp ⁇ 20.
  • T dp and T up are controlled so as to satisfy T min ⁇ T dp ⁇ 20.
  • T up >T dp .
  • 8. 7 A method for manufacturing the substrate according to A method for manufacturing a substrate, comprising a solvent A1 having a saturated solubility of the sublimable substance of more than 10% by mass and a boiling point lower than the boiling point of the sublimable substance at 1 atm by 5° C. or more. 9. 7.
  • a method of manufacturing a substrate comprising: 10. 1. ⁇ 9. A method for manufacturing a substrate according to any one of A method for manufacturing a substrate, wherein the heat of solidification of the sublimable substance is 200 J/g or less. 11. 1. ⁇ 10. A method for manufacturing a substrate according to any one of The substrate manufacturing method, wherein the cleaning liquid contains an alcohol having 3 or less carbon atoms. 12. 1.
  • 13. 12 A method for manufacturing the substrate according to A method of manufacturing a substrate, wherein the substrate has the concave-convex structure with the pattern dimension of 20 nm or less on the surface.
  • 14. 1. ⁇ 13 A method for manufacturing a substrate according to any one of A method for producing a substrate, wherein the sublimable film-forming composition does not contain water or contains water in a content of 10% by mass or less with respect to 100% by mass of the sublimable substance. 15.
  • a sublimation drying method comprising a sublimation drying step of solidifying and removing by sublimation a film composed of a sublimation substance or a sublimation film-forming composition containing a sublimation substance,
  • T dp ° C. when the dew point temperature at 1 atmospheric pressure of the atmosphere in the vicinity of the film is T dp ° C., and the minimum surface temperature of the film in the solidification process is T min ° C., T dp and T min are:
  • a substrate manufacturing method and a sublimation drying method that are excellent in stability in suppressing pattern collapse during sublimation drying.
  • FIG. 1 is a cross-sectional view schematically showing an example of a substrate processing apparatus
  • the method for manufacturing a substrate according to the present embodiment includes a preparation step of preparing a substrate having an uneven structure on its surface, an arrangement step of placing a substrate holding a cleaning liquid in at least concave portions of the uneven structure in a chamber, and an arrangement step of placing the substrate in the chamber.
  • T min ° C. T dp and T min are controlled so as to satisfy T min >T dp .
  • the film surface may absorb water or condense, resulting in poor solidification. , it is difficult to observe poor coagulation itself.
  • the surface temperature of the film and the dew point temperature of the atmosphere in contact with the film as indicators, it has become possible to evaluate the tendency of the pattern collapse rate with good reproducibility.
  • Calculation of the collapse rate which is an index for evaluating the state of collapse of a concave-convex pattern, can be performed by scanning a test piece with a pattern formed on it with a scanning electron microscope, for example, if it has a convex cylindrical shape that allows easy judgment of collapse from a bird's-eye view. It is possible by observing with (SEM), counting the protrusion collapse (pattern collapse) in the concave-convex structure, and calculating the ratio (collapse rate) to the number of convex shapes within the observed range.
  • SEM scanning electron microscope
  • each SEM image was measured at observation points separated from each other by one millimeter or more. Also, the magnification of the SEM was adjusted so that 500 to 600 patterns were observed in each SEM image.
  • An example of the substrate manufacturing method of the present embodiment includes a preparation process, an arrangement process, a supply process, and a sublimation drying process.
  • a method for manufacturing a substrate will be described with reference to FIGS. 1(a) to 1(c), taking the case of manufacturing a semiconductor chip as an example.
  • a fine uneven pattern is formed on the surface of a substrate (wafer) through film formation, lithography, etching, etc. After that, water and organic solvents are used to clean the wafer surface.
  • a wet process such as a cleaning process using , is performed, and a drying process is generally performed to remove liquid such as a cleaning liquid and a rinse liquid adhering to the wafer due to the wet process. It is known that during such a drying process, deformation and collapse of the uneven pattern tend to occur in a semiconductor substrate having a fine uneven pattern.
  • a step of replacing residual liquid such as a cleaning liquid remaining in the concave-convex pattern with a treatment liquid containing a sublimating substance is generally performed.
  • the substrate 10 having the uneven structure 20 on its surface is prepared (preparation step).
  • the following method which is an example of a method for forming the uneven structure 20 on the surface of the substrate 10, may be used.
  • the resist is exposed through a resist mask, and the exposed or unexposed resist is removed to form a resist having a desired uneven pattern.
  • a resist having an uneven pattern can also be obtained by pressing a mold having a pattern against the resist.
  • the wafer is then etched.
  • the substrate surface corresponding to the concave portions of the resist pattern is selectively etched.
  • the resist is removed to obtain a wafer (substrate 10) having an uneven structure 20 on its surface.
  • the wafer on which the concave-convex structure 20 is formed and the material of the concave-convex structure 20 are not particularly limited, and the wafer may be a silicon wafer, a silicon carbide wafer, a wafer composed of a plurality of components containing silicon, a sapphire wafer, or various compounds. Various wafers such as semiconductor wafers and plastic wafers can be used.
  • silicon-based materials such as silicon oxide, silicon nitride, polycrystalline silicon, and single-crystal silicon
  • metal-based materials such as titanium nitride, tungsten, ruthenium, tantalum nitride, and tin, and combinations thereof. materials, resist (photoresist) materials, and the like can be used.
  • FIG. 1A is a cross-sectional view showing an example of the uneven structure 20.
  • FIG. 1A In the cross-sectional structure (in the substrate thickness direction) of the pattern of the uneven structure 20, at least one pattern dimension of width and height, or in the three-dimensional structure (XYZ three-dimensional coordinates) of the pattern of the uneven structure 20, the width At least one or more pattern dimensions of (length in the X-axis direction), height (length in the Y-axis direction), and depth (length in the Z-axis direction) may be, for example, 30 nm or less, or 20 nm or less. , 10 nm or less.
  • the pattern collapse rate can be reduced by using the sublimation drying method of the present embodiment.
  • the inclination of the uneven structure 20 is parallel (does not intersect) with the thickness direction of the substrate. Even when not parallel, it can be used suitably.
  • the above-mentioned “non-parallel” means that the inclination of the uneven structure 20 is perpendicular to the thickness direction of the substrate, or the inclination of the uneven structure 20 intersects the thickness direction of the substrate (excluding the orthogonal direction). ), it is also suitable for use in such cases.
  • the lower limit of the aspect ratio of the projections 22 may be, for example, 3 or more, 5 or more, or 10 or more. Pattern collapse can be suppressed even in the uneven structure 20 having the convex portion 22 with a fragile structure.
  • the upper limit of the aspect ratio of the projections 22 is not particularly limited, but may be 100 or less.
  • the aspect ratio of the convex portion 22 is represented by the value obtained by dividing the height of the convex portion 22 by the width of the convex portion 22 .
  • the substrate 10 holding the cleaning liquid in at least the concave portions 24 of the concave-convex structure 20 is placed in the chamber (placement step).
  • placement step a method is used in which the substrate 10 is placed in the chamber 1 of the processing apparatus 100 of FIG.
  • FIG. 2 is a cross-sectional view schematically showing the configuration of a processing apparatus 100 that processes the surface of the substrate 10.
  • the processing apparatus 100 of FIG. 2 comprises a chamber 1, a rotating mechanism 3, a table 2, a nozzle 4, a nozzle 5, a gas inlet 6 and a gas outlet 7.
  • a substrate 10 is detachably placed on a table 2 in the chamber 1 .
  • the table 2 includes substrate holding mechanisms such as holding pins and spin chucks (not shown).
  • the table 2 is rotatable about the thickness direction of the table 2 by a rotating mechanism 3 .
  • a cleaning liquid can be supplied from a nozzle 4 and a liquid sublimation substance or a liquid sublimation film-forming composition can be supplied from a nozzle 5 to the surface of a substrate 10 placed on a table 2 .
  • the arrangement positions and orientations of the nozzles 4 and 5 are not particularly limited as long as the liquid can be efficiently supplied to the surface of the substrate 10 .
  • the sublimable substance can take a solid state, if it is cooled while remaining at the tip of the nozzle or the like, it will solidify into a solidified body. There is concern about the possibility of affecting the stability of pattern collapse suppression.
  • a gas such as a dry gas can be supplied into the chamber 1 through a gas inlet 6 installed in the chamber 1 , and a gas remaining in the chamber 1 and the supplied gas can be discharged through a gas outlet 7 .
  • Each of the gas inlet 6 and the gas outlet 7 may be provided with a gas amount variable mechanism.
  • one or more gas supply ports may be provided for directly supplying gas to the surface of the substrate 10 .
  • the gas supply port may eject the gas so as to collide with the surface of the substrate 10 or may eject the gas along the surface of the substrate 10 .
  • the gas inlet 6 may also serve as a gas supply port.
  • the chamber 1 may be provided with a temperature adjusting device capable of raising or lowering the temperature of the atmosphere in the chamber 1 and the substrate 10, and sensors such as a surface thermometer and a dew-point thermometer. .
  • Water, an organic solvent, or the like is used as the cleaning liquid, but it is usually preferable to use at least one selected from alcohols having 3 or less carbon atoms, such as methanol, 1-propanol, and 2-propanol. This makes it possible to relatively easily replace the cleaning liquid remaining on the uneven structure 20 of the substrate 10 with the sublimable substance in the liquid state or the sublimable film-forming composition in the liquid state.
  • a sublimable substance in a liquid state or a sublimable film-forming composition in a liquid state 30 is applied to at least the concave portion 24 of the substrate 10 in the chamber 1.
  • the sublimable substance and the sublimable film-forming composition 30 in the supply step are preferably liquid in an environment of 20 to 30° C., more preferably a solution.
  • it may be supplied so as to fill part or all of the concave portions 24 of the concave-convex structure 20 (referred to as “the step of supplying the sublimable film-forming composition” or simply “filling step” or “supplying step”). may be stated).
  • Supply may be carried out, for example, under an environment of 20-30°C.
  • a method for supplying the sublimable substance and the sublimable film-forming composition 30 known means can be used. For example, as shown in FIG. A single-wafer method, typified by a spin method, in which a composition is supplied to the vicinity of the center of rotation to replace the cleaning liquid or the like held in the concave-convex pattern of the substrate, and the composition is filled, or a plurality of substrates are placed in a composition tank. A batch method or the like may be used in which the wafer is immersed to replace the cleaning liquid or the like held in the concave-convex pattern of the wafer, and the composition is filled.
  • the sublimation substance used may be purified in advance. Separation means such as sublimation purification, filter purification, or distillation are used to purify the sublimable substance.
  • the film 50 formed from the supplied sublimable substance or sublimable film-forming composition is solidified in the chamber 1, and ), the sublimable film formed by solidifying the film 50 is sublimated and removed (sublimation drying step).
  • a film 50 made of a sublimable substance or a sublimable film-forming composition refers to both a coating film and a sublimable film. At this time, even if the composition of the film 50 is the same as that of the sublimable substance or the sublimable film-forming composition 30 immediately after being supplied, the components volatilize from the sublimable substance or the sublimable film-forming composition 30 to return to the original state. It may be different from the component ratio of the composition.
  • a “sublimable film” as used herein refers to a sublimable substance formed on the substrate 10 in the form of a film. This sublimation film does not need to be fluid like a liquid, and may contain a non-volatilized solvent or the like in the film.
  • a sublimable substance in a liquid state or a sublimable film-forming composition 30 in a liquid state is supplied onto the substrate 10 and spread in the form of a film.
  • a liquid film liquid film
  • the liquid film is referred to as a "coating film”.
  • the sublimable substance in the liquid state or the sublimable substance in the sublimable film-forming composition 30 is solidified to form a film 50 containing the solidified substance of the sublimable substance on the uneven structure 20 (hereinafter referred to as “sublimation It may be described as a “step of forming a thick film” or simply “a coagulation step”).
  • the pattern collapse of the uneven structure 20 can be suppressed by the film 50 filled in the recesses 24 of the uneven structure 20 .
  • the formed film 50 is preferably arranged so that the surface of the film 50 covers at least the convex portions 22 of the concave-convex structure 20 in order to more stably suppress pattern collapse.
  • the film 50 only needs to be present in the recesses 24 to such an extent that pattern collapse can be suppressed, and the recesses 24 need not necessarily be completely filled.
  • a solid sublimation substance may be precipitated by cooling.
  • the solvent is volatilized by heating or applying appropriate environmental conditions, and the A solid sublimable substance may be precipitated by the heat of vaporization.
  • the sublimable film-forming composition 30 preferably contains a sublimable substance and a solvent.
  • the type of solvent contained in the sublimable film-forming composition 30 it is also possible to volatilize (dry) the solvent, for example, under normal temperature and normal pressure (20° C. to 25° C., 1 atm). Become.
  • the lower limit of the freezing point of the sublimable substance is, for example, 5° C. or higher, preferably 20° C.
  • the lower limit of the freezing point of the sublimable substance equal to or higher than the above lower limit, extreme cooling becomes unnecessary, the sublimable substance can be solidified by the heat of vaporization of the solvent, and the dew point temperature in the chamber 1 can be reduced. It also becomes unnecessary to keep it extremely low.
  • the film 50 is solidified under normal temperature and normal pressure, the evaporation of the solvent may be accelerated by, for example, rotating the substrate 10, blowing an inert gas onto the substrate 10, or the like, if necessary. good.
  • T dp the dew point temperature at 1 atm of the atmosphere in the chamber 1 in which the film 50 is arranged
  • T min ° C. the minimum surface temperature of the film 50
  • T dp and T min are: Control is performed to satisfy T min >T dp .
  • T min >T dp be satisfied at least until the surface of the film 50 is solidified, and more preferably, the solidification of the film 50 is completed and the sublimation film is formed.
  • T min >T dp may be satisfied until obtained.
  • the “solidification process” may be defined as a period during which the solidification phenomenon of the film 50 is occurring (progressing). Alternatively, as will be described later, it may refer to the time from when the surface temperature of the film 50 begins to drop until when the surface temperature of the film 50 no longer rises.
  • the “atmosphere” of the atmosphere in contact with the film 50 usually refers to air, gas, etc. that come into contact with the surface of the film 50 during the solidification process.
  • the “atmosphere” of the atmosphere in contact with the film 50 usually refers to air, gas, etc. that come into contact with the surface of the film 50 during the solidification process.
  • it may refer to the fluid existing up to a position 10 mm away from the reference to the outside of the membrane.
  • the dew point temperature Tdp is the dew point temperature of the atmosphere described above under 1 atm (atmospheric pressure), and can be measured using a dew point meter or the like. Any known method can be used for the dew point meter as long as it can evaluate that Tdp is an appropriate value. Specifically, a cooling mirror dew point meter and a capacitance dew point meter can be exemplified. Alternatively, a method of measuring relative humidity or absolute humidity and converting it to dew point temperature may be used. A known method can be used to measure relative humidity or absolute humidity, and a specific example is an electric hygrometer.
  • the fluid having a desired dew point temperature when supplied into the chamber 1 and brought into contact with the surface of the film 50 (the coating film and the sublimable film), the fluid is supplied from the supply port of the fluid and during the contact. If the change in dew point temperature is negligibly small, the dew point temperature of the fluid at the time of supply may be regarded as the dew point temperature T dp of the atmosphere within the chamber 1 .
  • a known gas drying method is used as a method for adjusting the dew point temperature to a low value.
  • the solidification process of the film in the sublimation drying process may include one or more treatments selected from the group consisting of these treatments.
  • the dry gas is preferably supplied not only to the area near the membrane 50 but also to the entire chamber in which the membrane 50 is installed, and more preferably to fill the entire chamber. This makes it possible to stably maintain the environmental conditions in the vicinity of the membrane 50 during the solidification process.
  • the adjustment to lower the dew point temperature is preferably performed after the disposing step and before the supplying step because it can suppress the absorption of water by the supplied sublimable substance or sublimable film-forming composition in a liquid state.
  • the dew point temperature in the solidification process may satisfy T min >T dp , and the end time of the adjustment is not limited, but may be until solidification is completed and a sublimable film is formed.
  • the sublimation drying process may include a process of supplying dry gas to the interior of the chamber 1 and discharging the gas from the interior of the chamber 1 at least during the solidification process of the film 50 . Also, when removing the sublimable film, the dew point temperature may continue to be adjusted to be low.
  • Dry gas can be supplied into the chamber 1 of the processing apparatus 100 of FIG. For example, a process of blowing a gas toward the surface of the substrate 10, a process of flowing or blowing a dry gas parallel to the surface, or filling the chamber with the dry gas may be performed. good. Further, when the dry gas is supplied, the gas may be exhausted at the same time, and new dry gas may be continuously supplied. When a sublimable film-forming composition is used, since the volatilized solvent is released into the chamber 1, dry gas is supplied and the chamber 1 is evacuated at the same time, at least until the film 50 is solidified. Preferably, fresh, dry gas is supplied into the chamber 1 at all times.
  • dry gas may be used as long as it does not interfere with sublimation drying.
  • dry air and dry inert gas dry inert gas is particularly preferable, but is not limited thereto.
  • gas species of the dry inert gas include, for example, nitrogen gas and rare gases such as argon gas.
  • the surface temperature of the film 50 from the coating film to the sublimation film can be measured using a non-contact radiation thermometer or the like.
  • the temperature of the coating film and the temperature of the sublimation film are not particularly distinguished.
  • the surface temperature of the film 50 decreases after the sublimable substance or the sublimable film-forming composition 30 is supplied to the substrate 10, and the substrate 10 is not heated after reaching the minimum temperature Tmin .
  • T up is the surface temperature of the film 50 when the temperature rise stops.
  • T dp and T min are preferably controlled to satisfy, for example, T min ⁇ T dp ⁇ 10, preferably T min ⁇ T dp ⁇ 20, more preferably T min ⁇ T dp ⁇ 30. .
  • T min ⁇ T dp ⁇ 10 preferably T min ⁇ T dp ⁇ 20, more preferably T min ⁇ T dp ⁇ 30.
  • T dp and T up may be controlled to satisfy, for example, T up >T dp , preferably T up ⁇ T dp ⁇ 20, more preferably T up ⁇ T dp ⁇ 30.
  • T up >T dp preferably T up ⁇ T dp ⁇ 20, more preferably T up ⁇ T dp ⁇ 30.
  • T up >T dp preferably T up ⁇ T dp ⁇ 20, more preferably T up ⁇ T dp ⁇ 30.
  • the dew point temperature Tdp may be relatively lowered by raising the temperatures of the coating film and the sublimation film.
  • the sublimable substance and the sublimable film-forming composition to be supplied onto the substrate 10 are preheated before use in the coating film forming process, and the substrate 10 to be dried is heated in advance. heating, or heating the substrate 10 to be dried and/or the composition in the step of forming the coating film and/or the sublimable film.
  • the sublimable film formed by solidifying the film 50 is sublimated and removed. That is, a solid sublimation substance is sublimated to remove the film 50 on the uneven structure 20 (hereinafter, for the sake of explanation, it may be referred to as a “step of removing the sublimation film” or simply a “removal step”. ).
  • a method for sublimating the sublimable substance can be appropriately selected according to the boiling point of the sublimable substance. For example, when the boiling point is relatively low, sublimation may be performed at normal temperature and normal pressure, but if necessary, heating or pressure reduction may be performed.
  • the solidification step and the removal step are described separately for the sake of explanation, but they do not need to be clearly separated, and the solidification of the film and the removal of the sublimable film may occur continuously. , may occur in such a short time that separation is difficult.
  • the present invention is not limited to this.
  • the sublimation film-forming composition of the present invention is used in the cleaning and drying steps of a resist pattern, so that collapse of the resist pattern can be suppressed.
  • the manufacturing method described above is performed after the cleaning step
  • the supply step is not limited to this, and may be performed after various treatments performed on the concave-convex structure 20 .
  • the supply step may be performed after the concave-convex structure 20 is treated with the water-repellent protective film-forming chemical solution.
  • the substrate manufacturing method may use one or a combination of two or more known treatments.
  • the sublimation drying method of the present embodiment can be applied to various uses other than the substrate manufacturing method described above.
  • the sublimation drying method includes a sublimation drying step of solidifying and removing by sublimation a film composed of a sublimation substance or a sublimation film-forming composition containing a sublimation substance described later.
  • the sublimable film-forming composition contains one or more sublimable substances.
  • the sublimable substance may be one that disappears as a whole film by a predetermined heat treatment, or one that disappears when left standing at 23°C under 1 atmosphere.
  • the sublimation film is used not as a permanent film that remains permanently on the substrate, but as a sacrificial film that is removed in subsequent steps. Therefore, the sublimable film-forming composition can be used as a sublimable sacrificial film-forming composition.
  • the lower limit of the content of the sublimable substance is, for example, 0.1% by mass or more, preferably 0.5% by mass or more, more preferably 0.8% by mass or more in the sublimable film-forming composition. This makes it easier to uniformly solidify the sublimable substance in the sublimable film-forming composition.
  • the upper limit of the content of the sublimable substance is, for example, 80% by mass or less, preferably 50% by mass or less, more preferably 40% by mass or less in the sublimable film-forming composition. This is preferable because the cooling effect due to the heat of vaporization of the solvent tends to be easily obtained, and the solidification of the sublimable substance tends to be facilitated. Moreover, it is preferable because the time required for sublimation (sublimation time) can be easily kept short.
  • the sublimable film-forming composition 30 does not contain water or contains water in a content of 10% by mass or less with respect to 100% by mass of the sublimable substance. This makes it possible to improve the ability of the sublimable film-forming composition 30 to suppress pattern collapse.
  • the sublimable substance has a polar site, if the mass ratio is less than 10/100 that of the sublimable substance, pattern collapse can be stably suppressed even if the sublimable film-forming composition contains water.
  • the sublimable film-forming composition contains as little water as possible.
  • the specific mechanism is unknown, if the sublimable substance is non-polar, the sublimable substance and water are phase-separated, and as a result, the collapse of the pattern cannot be stably suppressed.
  • the sublimable film-forming composition may be less than 0.01/100 in mass ratio to the sublimable substance.
  • the first sublimable film-forming composition (which will be described later as the "sublimable film-forming composition of the first embodiment") may contain a solvent A1 having moderate dissolving power for a sublimable substance and moderate volatility.
  • the second sublimable film-forming composition (to be described later as a “sublimable film-forming composition of the second embodiment”) comprises a solvent A2 having an appropriate dissolving power for a sublimable film and a solvent having an appropriate volatility and B2.
  • sublimable substance refers to a substance that has a vapor pressure in the solid state.
  • Sublimable substances can in principle be substances that are solid at a certain temperature and have a vapor pressure.
  • the lower limit of the freezing point of the sublimable substance is, for example, 5° C. or higher, preferably 20° C. or higher, more preferably 50° C. or higher under 1 atm.
  • the upper limit of the freezing point of the sublimable substance is, for example, 220° C. or less, preferably 200° C. or less, more preferably 180° C. or less under 1 atmosphere.
  • the lower limit of the heat of solidification of the sublimable substance is not particularly limited, it may be, for example, 1 J/g or more, preferably 5 J/g or more, and more preferably 10 J/g or more.
  • the upper limit of the heat of solidification of the sublimable substance is, for example, 200 J/g or less, preferably 100 J/g or less, more preferably 50 J/g or less.
  • the sublimable substance may be configured so as not to substantially contain a non-volatile substance that becomes a residue after sublimation.
  • Non-volatile materials can be removed from sublimable materials by separation means such as sublimation purification or distillation.
  • Substantially free means 1% by mass or less, preferably 0.5% by mass or less, based on 100% by mass of the sublimable substance, or may be allowed to be unavoidably mixed.
  • the lower limit of the boiling point of the sublimable substance is, for example, 60° C. or higher, preferably 100° C. or higher, more preferably 110° C. or higher under 1 atmosphere. This makes it possible to stably form a sublimable film containing a sublimable substance.
  • the upper limit of the boiling point of the sublimable substance is, for example, 300° C. or less, preferably 280° C. or less, more preferably 250° C. or less under 1 atmosphere. This facilitates purification of the sublimable substance. Also, in the normal temperature and normal pressure process, the sublimation of the sublimable substance is facilitated, and the production efficiency can be enhanced.
  • the boiling point or sublimation point of a sublimable substance containing multiple types For the boiling point or sublimation point of a sublimable substance containing multiple types, the boiling point or sublimation point of the component with the highest content rate (% by mass) among the components contained in the sublimable substance is adopted (however, the highest content rate is If there are two or more types of high-abundance components, the boiling point or sublimation point with the highest temperature is adopted).
  • the boiling point of the sublimable substance adopts the initial boiling point defined in JIS K 2254:2018 (ISO 3405).
  • the sublimation point is commonly used depending on the substance, the sublimation point is used.
  • the solidification start temperature obtained using DSC under the condition of -10°C/min is adopted.
  • the freezing point of the component with the highest content rate (% by mass) among the components contained in the sublimable substance is adopted (however, two or more of the components with the highest content rate If present, take the freezing point of the higher temperature)
  • the temperature range in which the sublimable substance is solid and has a vapor pressure may be, for example, 10°C or higher.
  • the sublimable substance can be solidified by cooling due to the heat of vaporization of the solvent in the sublimable film-forming composition.
  • the sublimation temperature range is in the range of 20 to 25° C.
  • sublimation promotion treatment such as heating and pressure reduction becomes unnecessary, and the sublimation substance can be sublimated relatively easily while adopting the conditions of the current substrate manufacturing process. and the sublimable film can be removed.
  • the vapor pressure when defining the sublimation temperature range is, for example, 10 Pa or higher, preferably 50 Pa or higher.
  • "-" means including upper and lower limits unless otherwise specified.
  • the sublimable substance is not limited as long as it can be applied to a substrate material such as a semiconductor. , a sublimable substance S3 having a relatively small difference between the freezing point and the boiling point, and a halogen-containing sublimable substance S4 containing a halogen element. These may be used alone or in combination of two or more.
  • the heat of solidification of the non-halogen sublimable substance S1 is preferably 50 J/g or less, more preferably 40 J/g or less. Since S1 tends to have a relatively large difference between the freezing point and the boiling point, it can be purified by distillation as a liquid. By using S1, it is possible to suppress the occurrence of streaky collapse.
  • the heat of solidification of the non-halogen sublimable substance S2 is preferably greater than 50 J/g.
  • the difference between the freezing point and boiling point of the sublimable substance S3 is, for example, 50° C. or less, preferably 40° C. or less, more preferably 30° C. or less.
  • the halogen-containing sublimable substance S4 may be a fluorine-containing sublimable substance containing fluorine as a halogen element. Among these, from the viewpoint of suppressing pattern collapse, it is preferable to use the sublimable substances S1 to S3.
  • sublimable substances include norbornene, norbornane, camphor, pyrazine, 2,3-dichloropyrazine, 2,6-dichloropyrazine, 2,6-dichloropyridine, tetrahydrodicyclopentadiene, dimethyl oxalate, and isoborneol.
  • neopentyl alcohol, neopentyl glycol, ethylene carbonate, and the like Among these, neopentyl alcohol, camphor, pyrazine, tetrahydrodicyclopentadiene, dimethyl oxalate, isoborneol, and ethylene carbonate may be used. These may be used alone or in combination of two or more. Also, when there are optical isomers, one or both may be used.
  • the sublimable film-forming composition of the present embodiment preferably contains one or more solvents A in which the sublimable substance has a saturated solubility of more than 10% by mass.
  • Solvent A is defined to encompass solvent A1 and solvent A2 above.
  • the saturated solubility is obtained from the saturated concentration (% by mass) of the sublimable substance dissolved in the solvent.
  • the saturated solubility adopts the value defined individually for each solvent.
  • the saturated solubility is the saturated concentration of the sublimable substance with the highest content (% by mass) in the composition (however, the If there are two or more types of sublimable substances with a large amount, the value of the largest saturation concentration is adopted).
  • the lower limit of the saturation solubility of the sublimable substance in solvent A is, for example, more than 10% by mass, preferably 30% by mass or more, more preferably 40% by mass or more, still more preferably 50% by mass or more, and even more preferably 60% by mass. That's it. As a result, the pattern collapse rate can be reduced.
  • the upper limit of the saturation solubility of the sublimable substance in solvent A may be, for example, 99% by mass or less, or 95% by mass or less.
  • the sublimable film-forming composition may use a solvent A that is compatible with the residual liquid remaining on the substrate surface.
  • a solvent A that is compatible with the residual liquid remaining on the substrate surface.
  • the remaining liquid can be efficiently replaced with the sublimable film-forming composition in the supply step, and the remaining liquid can be stably dried.
  • the residual liquid as described above, general solvents used in the semiconductor cleaning process, specifically, water, alcohols having 3 or less carbon atoms (e.g., methanol, 1-propanol, 2-propanol, etc.), Alternatively, a mixed liquid thereof may be used. Having compatibility means that, at 25° C. and 1 atm, the amount of the solvent used in the washing step dissolved in 1 part by mass of solvent A is, for example, 0.05 parts by mass or more.
  • Sublimation of the first embodiment includes one or more solvents A1 having a saturation solubility of the sublimable substance of more than 10% by mass and a boiling point lower than the boiling point of the sublimable substance at 1 atm by 5°C or more. It is called a film-forming composition.
  • the solvent A1 is selected from among the solvents A that satisfy the condition (1) that the boiling point is 5° C. or more lower than the boiling point of the sublimable substance at 1 atm.
  • (boiling point of sublimable substance at 1 atm - boiling point of solvent A1) may be 5°C or higher, preferably 50°C or higher, more preferably 80°C or higher, while it may be 200°C or lower, preferably It may be 180°C or lower.
  • the azeotropic point is adopted as the boiling point of each solvent when multiple types of solvents are included.
  • the boiling point specified individually for each solvent is taken.
  • the solvent A1 with high dissolving power suppresses excessive early precipitation of the sublimable substance, and sublimation It is considered that the solvent A1, which has a higher volatility than the volatile substance, can accelerate the formation of the sublimable film (solidification of the sublimable substance) by the heat of vaporization. As a result, after the sublimation film is formed and removed, the pattern collapse rate can be reduced, and in addition, streaky collapse can be suppressed.
  • the sublimable film-forming composition of the present embodiment can contain one or more solvents B having a boiling point lower than the boiling point of the sublimable substance at 1 atm.
  • Solvent B is defined to include solvent B1 and solvent B2 above.
  • the sublimable film-forming composition of the first embodiment may contain one or more of the solvent A1 and one or more of the solvent B1 having a boiling point lower than that of the solvent A1.
  • the saturation solubility of the sublimable substance of solvent B1 is not particularly limited as long as the boiling point of solvent B1 is lower than that of solvent A1, but the saturation solubility of solvent B1 may be lower than that of solvent A1.
  • the difference between the boiling point of solvent A1 and solvent B1 is, for example, 5° C. or higher, preferably 10° C. or higher, more preferably 15° C. or higher, and may be 200° C. or lower or 150° C. or lower.
  • the boiling point of solvent B1 is, for example, 15°C to 85°C, preferably 20°C to 80°C, more preferably 25°C to 70°C.
  • the lower limit of the content of solvent A1 is, for example, 0.5% by mass or more, preferably 0.8% by mass or more, more preferably 0.9% by mass or more in the sublimable film-forming composition.
  • the content of the solvent A1 in the sublimable film-forming composition may be 50% by mass or more, more preferably 80% by mass. % or more, more preferably 90 mass % or more.
  • solvent B1 it is preferable to use solvent B1 as the solvent.
  • the content of solvent A1 in the sublimable film-forming composition may be set to a value greater than that of solvent B1.
  • the upper limit of the content of the solvent A1 is when the solvent of the sublimable film-forming composition substantially contains only the solvent A1 and/or when the main component of the solvent of the sublimable film-forming composition is the solvent A1. , for example, 99.9% by mass or less, preferably 99.5% by mass or less, more preferably 99.2% by mass or less. Further, when the sublimable film-forming composition contains solvent A1 and solvent B1 and A1 is not the main component of the solvent, the content of solvent A1 in the sublimable film-forming composition is preferably less than 50% by mass, preferably may be 30% by mass or less, more preferably 15% by mass or less.
  • One or two or more solvents A2 in which the sublimable substance has a saturated solubility of more than 10% by mass, and the content in the sublimable film-forming composition is greater than the content of the solvent A2, and the boiling point is the sublimable A composition containing one or more solvents B2 having a boiling point lower than the boiling point of the substance at 1 atm and lower than the boiling point of the solvent A2 is hereinafter referred to as a sublimable film-forming composition of the second embodiment.
  • the solvent A2 is selected from the solvents A above.
  • Boiling point of sublimable substance at 1 atm - Boiling point of solvent A2 may be 0°C, 0°C or higher and lower than 5°C, or 5°C or higher and 200°C or lower.
  • the temperature is preferably 0° C. or higher and 200° C. or lower, and more preferably 5° C. or higher and 200° C. or lower.
  • Solvent B2 is a solvent that can promote formation of a sublimable film by volatilizing earlier than solvent A2.
  • the saturation solubility of the sublimation substance is not particularly limited, and even if it is lower than the saturation solubility of the sublimation substance in solvent A2, it can be used.
  • the content of solvent B2 in the sublimable film-forming composition is a larger value than the content of solvent A2.
  • Solvent B2 may preferably be included as a major component in the sublimable film-forming composition.
  • the main component means that the lower limit of the content of solvent B2 in the sublimable film-forming composition is, for example, 50% by mass or more, preferably 70% by mass or more, and more preferably 90% by mass or more.
  • the upper limit of the content of the solvent B2 may be, for example, 99.8% by mass or less, 99.5% by mass or less, or 99% by mass or less.
  • the content of solvent A2 is, for example, 0.1% by mass to 30% by mass, preferably 0.5% by mass to 10% by mass.
  • the solvent B2 is relatively volatilized and the sublimable film is formed by the heat of vaporization. (coagulation of sublimable substances) is promoted. At this time, the sublimable substance and the solvent A2 remain, but since the solvent A2 can dissolve the sublimable substance in this residue, it is considered possible to suppress excessive early precipitation of the sublimable substance. be done. As a result, after the sublimation film is formed and removed, the pattern collapse rate can be reduced, and in addition, streaky collapse can be suppressed.
  • the solvent B2 as a main component in the sublimable film-forming composition of the second embodiment, it is possible to reduce the time required to form the sublimable film, and to reduce the manufacturing cost of the above-described substrate. .
  • the difference between the boiling point of solvent A2 and the boiling point of solvent B2 is not particularly limited as long as solvent A2 can remain after solvent B2 volatilizes. It is preferably 15° C. or higher, more preferably higher than 20° C., while it may be 200° C. or lower, or 150° C. or lower.
  • the upper limit of the boiling point of solvent B2 is, for example, 85° C. or lower, preferably 80° C. or lower, more preferably 70° C. or lower.
  • the lower limit of the boiling point of solvent B2 may be, for example, 15° C. or higher, preferably 20° C. or higher, more preferably 25° C. or higher.
  • the second and subsequent solvents A1 are selected from those having a saturated solubility of the sublimable substance in the solvent A1 of 40% by mass or more and a boiling point of 200° C. or less.
  • the sublimable substance has a saturated solubility of 75% by mass or more and a boiling point of 180° C. or less.
  • the second and subsequent solvents A2 have a saturated solubility of the sublimable substance in the solvent A2 of 40% by mass or more and a sublimable boiling point It may be selected from those having a boiling point or lower of the substance, preferably having a saturated solubility of the sublimable substance of 50% by mass or more and having a boiling point of 210° C. or lower, more preferably having a saturated solubility of the sublimable substance. of 60% by mass or more and a boiling point of 200° C. or less, more preferably a saturated solubility of the sublimable substance of 75% by mass or more and a boiling point of 180° C. or less.
  • the difference between the highest boiling point and the lowest boiling point of the two or more solvents A2 is preferably It may be 20° C. or lower, more preferably 15° C. or lower, and even more preferably 10° C. or lower. That is, the difference in boiling point between the second and subsequent solvents A2 and the first solvent A1 may be, for example, 10° C. or less, 15° C. or less, or 20° C. or less.
  • the boiling point of solvent B2 is lower than the lowest boiling point of solvent A2.
  • the second and subsequent solvents B2 may be selected from those having a boiling point of, for example, 83° C. or lower, preferably 80° C. or lower, more preferably 70° C. or lower.
  • Solvents used in the sublimable film-forming composition include hydrocarbons, ethers, alcohols, ketones, esters, sulfoxides, nitrogen-containing compounds, and the like. Each of these solvent species may have one or more halogen atoms such as fluorine atoms and chlorine atoms in the molecule. These may be used alone or in combination of two or more.
  • Hydrocarbons include, for example, alkanes or cycloalkanes having 4 to 10 carbon atoms, alkenes or cycloalkenes having 4 to 10 carbon atoms, and aromatic hydrocarbons having 6 to 10 carbon atoms.
  • hydrocarbons include pentane, 3-methylpentane, hexane, heptane, octane, nonane, decane, isododecane, cyclopentane, cyclohexane, methylcyclohexane, 1,1-dichloroethane, 1,2-dichloroethane, 1,2-dichloroethylene, cis-1-chloro-3,3,3-trifluoropropene (1233Z), trans-1-chloro-3,3,3-trifluoropropene (1233E), toluene, benzene, xylene, etc. is mentioned.
  • ethers for example, chain or cyclic ether compounds having 3 to 10 carbon atoms are used.
  • Specific examples of ethers include tetrahydrofuran, diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, tert-butyl methyl ether, dioxane, 1,1,1,2,2,3,3,4,4 - nonafluorobutyl methyl ether (Novec 7100), ethylene glycol monomethyl ether, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, propylene glycol monomethyl ether, propylene glycol dimethyl ether and the like.
  • alcohols for example, primary, secondary and tertiary alcohols having 1 to 10 carbon atoms are used.
  • specific examples of alcohols include methanol, ethanol, 1-propanol, 2-propanol (IPA), 1-butanol, 2-butanol, cyclopentanol, cyclohexanol, 2-methyl-2-butanol, 4- methyl-2-pentanol, ethylene glycol, propylene glycol, 2,2,2-trifluoroethanol, 1,1,1,3,3,3-hexafluoro-2-propanol, 1,3-propanediol, etc. mentioned.
  • ketones for example, ketone compounds having 3 to 6 carbon atoms are used. Specific examples of ketones include acetone, acetylacetone, methyl ethyl ketone, methyl propyl ketone, methyl butyl ketone and the like.
  • esters include linear or cyclic ester compounds having 3 to 6 carbon atoms. Specific examples of esters include methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, butyl acetate, methyl lactate, ethyl lactate, ethyl acetoacetate, ethyl trifluoroacetate, ⁇ -butyrolactone, ethylene glycol acetate, Propylene glycol acetate, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate and the like.
  • sulfoxides include dimethylsulfoxide and the like.
  • nitrogen-containing compounds include formamide, N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, pyridine and the like.
  • solvent A1 and solvent A2 are used from the viewpoint of achieving both high dissolving power for sublimable substances and compatibility with, for example, water and alcohols having 3 or less carbon atoms, which are often used as residual liquids remaining on the substrate surface.
  • it preferably contains at least one selected from the group consisting of ethers, alcohols, ketones, esters, and hydrocarbons having one or more halogen atoms such as fluorine atoms and chlorine atoms in the molecule.
  • Specific examples thereof include tetrahydrofuran, methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-2-butanol, acetone, methyl acetate, ethyl acetate, 1,1-dichloroethane. , 1,2-dichloroethane, 1,2-dichloroethylene, cis-1-chloro-3,3,3-trifluoropropene, and trans-1-chloro-3,3,3-trifluoropropene.
  • Solvents B1 and B2 are highly volatile and are often used as residual liquids remaining on the substrate surface, for example, from the viewpoint of compatibility with water and alcohols having 3 or less carbon atoms, hydrocarbons, It preferably contains at least one selected from the group consisting of ethers, alcohols, ketones and esters.
  • Specific examples thereof include pentane, 3-methylpentane, hexane, heptane, cyclopentane, cyclohexane, methylcyclohexane, 1,1-dichloroethane, 1,2-dichloroethane, 1,2-dichloroethylene, cis-1-chloro- 3,3,3-trifluoropropene, trans-1-chloro-3,3,3-trifluoropropene, toluene, benzene, xylene, diethyl ether, dipropyl ether, diisopropyl ether, tetrahydrofuran, methanol, ethanol, 1- Examples include propanol, 2-propanol, 1-butanol, 2-butanol, acetone, methyl acetate, and ethyl acetate.
  • the sublimable film-forming composition may be adjusted for wettability to the substrate and/or the uneven pattern in addition to the above solvent A1, solvent A2, solvent B1, and solvent B2 within the range that does not impair the effects of the present invention.
  • the solvent C may be further included, and the sublimable film-forming composition may be configured so as not to substantially include the solvent C.
  • the solvent C include water, hydrocarbons, esters, ethers, ketones, sulfoxide solvents, alcohols, polyhydric alcohol derivatives, nitrogen-containing compounds, etc.
  • Solvents that do not correspond to the above solvents point to Examples of the above hydrocarbons include toluene, benzene, xylene, pentane, 3-methylpentane, hexane, heptane, octane, nonane, decane, cyclopentane, cyclohexane, methylcyclohexane, 1,1-dichloroethane, 1,2- dichloroethane, 1,2-dichloroethylene, cis-1-chloro-3,3,3-trifluoropropene (1233Z), trans-1-chloro-3,3,3-trifluoropropene (1233E), etc.
  • Examples of esters include ethyl acetate, butyl acetate, methyl acetate, n-propyl acetate, isopropyl acetate, butyl acetate, methyl lactate, ethyl lactate, ethyl acetoa
  • ethers include diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, tert-butyl methyl ether, tetrahydrofuran, dioxane, 1,1,1,2,2,3,3,4,4-nonafluoro
  • ketones include acetone, acetylacetone, methyl ethyl ketone, methyl propyl ketone, and methyl butyl ketone
  • examples of the sulfoxide solvent include dimethyl sulfoxide.
  • Examples of alcohols include methanol, ethanol, 1-propanol, 2-propanol, butanol, 4-methyl-2-pentanol, 2-methyl-2-butanol, 4-methyl-2-pentanol, ethylene glycol , propylene glycol, 2,2,2-trifluoroethanol, 1,1,1,3,3,3-hexafluoro-2-propanol, 1,3-propanediol, etc., and derivatives of the above polyhydric alcohols.
  • Examples are diethylene glycol monoethyl ether, ethylene glycol monomethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, etc.
  • Examples of the above nitrogen-containing compounds include formamide, N,N-dimethylformamide, amide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, pyridine, etc.
  • solvents other than solvents A1, A2, B1 and B2 are exemplified.
  • a suitable lower limit for the total content of the solvent in the sublimable film-forming composition is, for example, 20% by mass or more, preferably 50% by mass or more, and more preferably 60% by mass or more. This is preferable because the cooling effect due to the heat of vaporization of the solvent tends to be easily obtained, and the solidification of the sublimable substance tends to be facilitated.
  • the upper limit of the total solvent content in the sublimable film-forming composition is, for example, 99.9% by mass or less, preferably 99.5% by mass or less, and more preferably 99.2% by mass or less. . This tends to facilitate uniform solidification of the sublimable substance on the substrate, which is preferable.
  • the sublimable film-forming composition is in a liquid state at least when it is supplied to the substrate surface, and is preferably a solution. From the viewpoint of easy and stable supply, it is preferably a liquid (preferably a solution) at -15°C to 50°C, and more preferably a liquid (preferably a solution) at 0°C to 50°C. Furthermore, from the viewpoint of simplification of the device configuration such that the storage container and the liquid transfer mechanism for supplying to the nozzles 4 and 5 need not be kept warm or heated, the liquid (preferably solution) at 20 to 50 ° C. It is particularly preferred to have In addition, from the viewpoint of ease of handling (manufacturing, storage, transportation, etc.), it may be a liquid (preferably a solution) at -15 ° C.
  • a liquid preferably a solution
  • the liquid is present at 20 to 30°C.
  • the pressure inside the glove bag was equal to atmospheric pressure (approximately 1 atmosphere).
  • the atmosphere inside the glove bag was adjusted to meet one of the conditions of atmospheres A, B, and C below.
  • the dew point temperatures of the atmospheres A, B, and C were converted to dew point temperatures by measuring the relative humidity of the gas supplied into the glove bag. Specifically, using the temperature-saturated vapor pressure correspondence table shown in JIS Z 8806: 2001, first, the relative humidity of the gas supplied into the glove bag was converted to water vapor pressure, and then the water vapor The temperature at which the pressure becomes the saturated vapor pressure was defined as the dew point temperature of the gas supplied into the glove bag.
  • Nitrogen gas (dew point temperature ⁇ 20° C.) supplied from a pressure swing adsorption nitrogen gas supply device was supplied into the glove bag from the gas inlet under the conditions of a flow rate of 20 L/min and about 30 to 60 minutes. By supplying nitrogen gas and exhausting it from the gas outlet of the glove bag, the dew point temperature in the glove bag was made equal to that of the supplied nitrogen gas.
  • the substrate for evaluation was rotated by a spin coater at a rotation speed of 100 rpm, and after 5 to 10 seconds of rotation, the following sublimation film-forming composition at 23° C. in a solution state was applied while maintaining the rotation speed.
  • the substance was dropped onto the surface of the uneven structure, and the remaining 2-propanol liquid described above was replaced with the sublimable film-forming composition (supply step).
  • any one of sublimable film-forming compositions 1 to 4 below was used as the sublimable film-forming composition.
  • Sublimable film-forming composition 1 A composition obtained by mixing neopentyl alcohol and 1233Z at a mass ratio of 10:90. A water content of 0.5% by mass with respect to 100% by mass of the sublimable substance.
  • Sublimable film-forming composition 2 A composition obtained by mixing camphor and IPA at a mass ratio of 1:99. A water content of 0.8% by mass with respect to 100% by mass of the sublimable substance.
  • Sublimable film-forming composition 3 A composition obtained by mixing HFCPA and Novec 7100 at a mass ratio of 80:20.
  • Sublimable film-forming composition 4 A composition obtained by mixing HDCP and heptane at a mass ratio of 12:88. A water content of 0.2% by mass based on 100% by mass of the sublimable substance.
  • the saturated solubility means the saturated concentration of the sublimable substance dissolved in the solvent, and was measured as follows. First, a sublimable substance and a solvent were mixed at a mass ratio of about 3:1, heated to 40° C. once, and then cooled to room temperature (about 25° C.) to prepare a mixture. When the mixture becomes a coexistence of solid and liquid at room temperature, 10 ⁇ L of the liquid portion is collected with a microsyringe, diluted 100 times (volume ratio) with a dilution solvent, and then analyzed by gas chromatography. It was converted into the saturated solubility (% by mass).
  • the amount of the sublimable substance with respect to the solvent was increased and the same operation was performed.
  • the amount of the solvent for the sublimable substance was increased and the same operation was performed.
  • Calculation of the mass ratio based on gas chromatography is performed by using a model GC-2010 gas chromatograph manufactured by Shimadzu Corporation and a capillary column (model TC-1, manufactured by GL Sciences Co., Ltd., length 30 m, liquid phase thickness 5 ⁇ m, inner diameter of 0.32 mm) was attached, and the area ratio detected by the FID detector was converted to a mass ratio based on the area ratio of the diluted solution in which 1% by mass of the sublimable substance and the solvent were dissolved.
  • the diluting solvent used in gas chromatography must be selected from a solvent that provides a well-separated peak from the sublimable substance to be measured and the solvent by gas chromatography. Specifically, the development time on the chromatogram Those separated by 0.1 minute or more were selected.
  • the rotational speed of the spin coater was maintained during the supply step, and after the sublimable film-forming composition was spread over the substrate, formation of a coating film was visually confirmed. Further, the rotation was continued, and formation of a sublimable film (coagulated film of sublimable substance) was visually confirmed.
  • the temperature of the surface of the coating film and the sublimation film was measured under atmospheric pressure (about 1 atm) with a non-contact radiation thermometer (MT-11, Mother Tool Co., Ltd.).
  • MT-11 Mother Tool Co., Ltd.
  • the surface temperature of the substrate immediately before coating was about 22° C.
  • the surface temperature of the film composed of the sublimable film-forming composition 1 began to decrease from the start of volatilization of the solvent, and after it decreased to a minimum of about 12° C.
  • the minimum temperature T min gradually increased with the solidification of the sublimable substance, and finally the surface temperature of the sublimable film reached about 20° C. (final temperature T up ).
  • Pattern collapse rate is measured by taking an electron microscope image (secondary electron image) using an SEM at a magnification such that 500 to 600 convex parts are included in the field of view, and the occurrence of collapse in the obtained image. The number of protrusions was counted, and the percentage of the number of protrusions in the visual field was calculated.

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PCT/JP2022/033662 2021-09-15 2022-09-08 基板の製造方法および昇華乾燥方法 Ceased WO2023042736A1 (ja)

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JP2020136355A (ja) * 2019-02-14 2020-08-31 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置
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