TW202331828A - 基板處理方法及基板處理系統 - Google Patents

基板處理方法及基板處理系統 Download PDF

Info

Publication number
TW202331828A
TW202331828A TW111143897A TW111143897A TW202331828A TW 202331828 A TW202331828 A TW 202331828A TW 111143897 A TW111143897 A TW 111143897A TW 111143897 A TW111143897 A TW 111143897A TW 202331828 A TW202331828 A TW 202331828A
Authority
TW
Taiwan
Prior art keywords
grinding
substrate
wafer
unit
marks
Prior art date
Application number
TW111143897A
Other languages
English (en)
Chinese (zh)
Inventor
早川晋
池上和哉
金子知広
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202331828A publication Critical patent/TW202331828A/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/123—Preparing bulk and homogeneous wafers by grinding or lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
TW111143897A 2021-11-29 2022-11-17 基板處理方法及基板處理系統 TW202331828A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-193343 2021-11-29
JP2021193343 2021-11-29

Publications (1)

Publication Number Publication Date
TW202331828A true TW202331828A (zh) 2023-08-01

Family

ID=86539553

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111143897A TW202331828A (zh) 2021-11-29 2022-11-17 基板處理方法及基板處理系統

Country Status (6)

Country Link
US (1) US20240331998A1 (https=)
JP (1) JP7690056B2 (https=)
KR (1) KR20240110049A (https=)
CN (1) CN118251752A (https=)
TW (1) TW202331828A (https=)
WO (1) WO2023095669A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3664593B2 (ja) * 1998-11-06 2005-06-29 信越半導体株式会社 半導体ウエーハおよびその製造方法
JP4154067B2 (ja) * 1999-04-06 2008-09-24 株式会社ディスコ 研削装置
WO2001022484A1 (fr) 1999-09-20 2001-03-29 Shin-Etsu Handotai Co., Ltd. Procede de fabrication d'une tranche de semi-conducteur
JP4103808B2 (ja) 2004-01-22 2008-06-18 信越半導体株式会社 ウエーハの研削方法及びウエーハ
JP2008047697A (ja) 2006-08-16 2008-02-28 Disco Abrasive Syst Ltd ウエーハの研削方法
CN110809816A (zh) 2017-07-12 2020-02-18 东京毅力科创株式会社 磨削装置、磨削方法以及计算机存储介质
CN118737893A (zh) 2018-08-23 2024-10-01 东京毅力科创株式会社 基板处理方法
JP7254425B2 (ja) 2019-06-18 2023-04-10 株式会社ディスコ 半導体ウェーハの製造方法
CN112008595A (zh) * 2020-09-02 2020-12-01 珠海市中芯集成电路有限公司 一种晶圆研磨装置及研磨方法

Also Published As

Publication number Publication date
KR20240110049A (ko) 2024-07-12
WO2023095669A1 (ja) 2023-06-01
JPWO2023095669A1 (https=) 2023-06-01
US20240331998A1 (en) 2024-10-03
CN118251752A (zh) 2024-06-25
JP7690056B2 (ja) 2025-06-09

Similar Documents

Publication Publication Date Title
TWI726218B (zh) 基板處理系統、基板處理方法及電腦記錄媒體
JP6877585B2 (ja) 基板処理システム、基板処理方法及びコンピュータ記憶媒体
CN112420506B (zh) 基板处理方法和基板处理系统
TWI871372B (zh) 基板處理方法及基板處理裝置
JP6584532B2 (ja) 研削装置および研削方法
CN211681559U (zh) 晶圆的研磨装置
CN101811273A (zh) 工件加工方法和工件加工装置
TW202018794A (zh) 基板處理系統及基板處理方法
JP7763244B2 (ja) Ｃｍｐ処理のための基板ハンドリングシステム及び方法
JP3775176B2 (ja) 半導体ウェーハの製造方法及び製造装置
JP7804529B2 (ja) 基板処理方法及び基板処理システム
TW202318501A (zh) 基板處理方法及基板處理系統
JP6574373B2 (ja) 円板状ワークの研削方法
CN119137711A (zh) 基板处理方法和基板处理系统
TW202331828A (zh) 基板處理方法及基板處理系統
CN115066314B (zh) 加工方法以及加工装置
CN116529026A (zh) 基板处理系统和基板处理方法
CN121730012A (zh) 基板处理方法和基板处理系统
JP2022046137A (ja) 基板処理方法及び基板処理システム
CN114641370A (zh) 基板处理方法和基板处理装置
JP2022159931A (ja) 基板処理方法及び基板処理システム
CN121795136A (zh) 基板处理方法和基板处理系统
CN118103956A (zh) 基板处理方法和基板处理系统
JP2000190191A (ja) 半導体ウェ―ハの加工方法
JP2001121414A (ja) 半導体ウエーハの研削方法および平面研削装置