JPWO2023095669A1 - - Google Patents
Info
- Publication number
- JPWO2023095669A1 JPWO2023095669A1 JP2023563631A JP2023563631A JPWO2023095669A1 JP WO2023095669 A1 JPWO2023095669 A1 JP WO2023095669A1 JP 2023563631 A JP2023563631 A JP 2023563631A JP 2023563631 A JP2023563631 A JP 2023563631A JP WO2023095669 A1 JPWO2023095669 A1 JP WO2023095669A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- H10P90/123—Preparing bulk and homogeneous wafers by grinding or lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0418—Apparatus for fluid treatment for etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021193343 | 2021-11-29 | ||
| JP2021193343 | 2021-11-29 | ||
| PCT/JP2022/042339 WO2023095669A1 (ja) | 2021-11-29 | 2022-11-15 | 基板処理方法及び基板処理システム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023095669A1 true JPWO2023095669A1 (https=) | 2023-06-01 |
| JPWO2023095669A5 JPWO2023095669A5 (https=) | 2024-08-01 |
| JP7690056B2 JP7690056B2 (ja) | 2025-06-09 |
Family
ID=86539553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023563631A Active JP7690056B2 (ja) | 2021-11-29 | 2022-11-15 | 基板処理方法及び基板処理システム |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240331998A1 (https=) |
| JP (1) | JP7690056B2 (https=) |
| KR (1) | KR20240110049A (https=) |
| CN (1) | CN118251752A (https=) |
| TW (1) | TW202331828A (https=) |
| WO (1) | WO2023095669A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000150431A (ja) * | 1998-11-06 | 2000-05-30 | Shin Etsu Handotai Co Ltd | 半導体ウエーハおよびその製造方法 |
| JP2000288881A (ja) * | 1999-04-06 | 2000-10-17 | Disco Abrasive Syst Ltd | 研削装置及び研削方法 |
| WO2001022484A1 (fr) * | 1999-09-20 | 2001-03-29 | Shin-Etsu Handotai Co., Ltd. | Procede de fabrication d'une tranche de semi-conducteur |
| JP2005205543A (ja) * | 2004-01-22 | 2005-08-04 | Shin Etsu Handotai Co Ltd | ウエーハの研削方法及びウエーハ |
| JP2008047697A (ja) * | 2006-08-16 | 2008-02-28 | Disco Abrasive Syst Ltd | ウエーハの研削方法 |
| WO2019013037A1 (ja) * | 2017-07-12 | 2019-01-17 | 東京エレクトロン株式会社 | 研削装置、研削方法及びコンピュータ記憶媒体 |
| CN112008595A (zh) * | 2020-09-02 | 2020-12-01 | 珠海市中芯集成电路有限公司 | 一种晶圆研磨装置及研磨方法 |
| JP2020205358A (ja) * | 2019-06-18 | 2020-12-24 | 株式会社ディスコ | 半導体ウェーハの製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118737893A (zh) | 2018-08-23 | 2024-10-01 | 东京毅力科创株式会社 | 基板处理方法 |
-
2022
- 2022-11-15 US US18/711,900 patent/US20240331998A1/en active Pending
- 2022-11-15 JP JP2023563631A patent/JP7690056B2/ja active Active
- 2022-11-15 WO PCT/JP2022/042339 patent/WO2023095669A1/ja not_active Ceased
- 2022-11-15 CN CN202280076289.8A patent/CN118251752A/zh active Pending
- 2022-11-15 KR KR1020247020680A patent/KR20240110049A/ko active Pending
- 2022-11-17 TW TW111143897A patent/TW202331828A/zh unknown
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000150431A (ja) * | 1998-11-06 | 2000-05-30 | Shin Etsu Handotai Co Ltd | 半導体ウエーハおよびその製造方法 |
| JP2000288881A (ja) * | 1999-04-06 | 2000-10-17 | Disco Abrasive Syst Ltd | 研削装置及び研削方法 |
| WO2001022484A1 (fr) * | 1999-09-20 | 2001-03-29 | Shin-Etsu Handotai Co., Ltd. | Procede de fabrication d'une tranche de semi-conducteur |
| JP2005205543A (ja) * | 2004-01-22 | 2005-08-04 | Shin Etsu Handotai Co Ltd | ウエーハの研削方法及びウエーハ |
| JP2008047697A (ja) * | 2006-08-16 | 2008-02-28 | Disco Abrasive Syst Ltd | ウエーハの研削方法 |
| WO2019013037A1 (ja) * | 2017-07-12 | 2019-01-17 | 東京エレクトロン株式会社 | 研削装置、研削方法及びコンピュータ記憶媒体 |
| JP2020205358A (ja) * | 2019-06-18 | 2020-12-24 | 株式会社ディスコ | 半導体ウェーハの製造方法 |
| CN112008595A (zh) * | 2020-09-02 | 2020-12-01 | 珠海市中芯集成电路有限公司 | 一种晶圆研磨装置及研磨方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240110049A (ko) | 2024-07-12 |
| WO2023095669A1 (ja) | 2023-06-01 |
| TW202331828A (zh) | 2023-08-01 |
| US20240331998A1 (en) | 2024-10-03 |
| CN118251752A (zh) | 2024-06-25 |
| JP7690056B2 (ja) | 2025-06-09 |
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