TW202330724A - 感光性樹脂組成物、電子裝置之製造方法、電子裝置及光學裝置 - Google Patents

感光性樹脂組成物、電子裝置之製造方法、電子裝置及光學裝置 Download PDF

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Publication number
TW202330724A
TW202330724A TW111136983A TW111136983A TW202330724A TW 202330724 A TW202330724 A TW 202330724A TW 111136983 A TW111136983 A TW 111136983A TW 111136983 A TW111136983 A TW 111136983A TW 202330724 A TW202330724 A TW 202330724A
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TW
Taiwan
Prior art keywords
photosensitive resin
resin composition
composition according
mass
meth
Prior art date
Application number
TW111136983A
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English (en)
Chinese (zh)
Inventor
井上和紀
片山敏彦
杉山広道
Original Assignee
日商住友電木股份有限公司
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Application filed by 日商住友電木股份有限公司 filed Critical 日商住友電木股份有限公司
Publication of TW202330724A publication Critical patent/TW202330724A/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Led Device Packages (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Formation Of Insulating Films (AREA)
TW111136983A 2021-09-30 2022-09-29 感光性樹脂組成物、電子裝置之製造方法、電子裝置及光學裝置 TW202330724A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-161640 2021-09-30
JP2021161640 2021-09-30

Publications (1)

Publication Number Publication Date
TW202330724A true TW202330724A (zh) 2023-08-01

Family

ID=85782748

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111136983A TW202330724A (zh) 2021-09-30 2022-09-29 感光性樹脂組成物、電子裝置之製造方法、電子裝置及光學裝置

Country Status (3)

Country Link
JP (2) JP7507311B2 (enExample)
TW (1) TW202330724A (enExample)
WO (1) WO2023054381A1 (enExample)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5640864B2 (ja) 2011-03-31 2014-12-17 日本ゼオン株式会社 ネガ型感光性樹脂組成物および電子部品
CN107407871B (zh) 2015-03-27 2021-09-03 东丽株式会社 感光性树脂组合物、感光性树脂组合物膜、固化物、绝缘膜及多层布线基板
KR20190109383A (ko) * 2017-02-15 2019-09-25 미쯔비시 케미컬 주식회사 감광성 착색 조성물, 경화물, 착색 스페이서, 화상 표시 장치
JP2018203959A (ja) * 2017-06-09 2018-12-27 日鉄ケミカル＆マテリアル株式会社 ポリイミド及び感光性樹脂組成物
JP6984322B2 (ja) * 2017-11-01 2021-12-17 東レ株式会社 光重合性モノマー、それを用いた感光性樹脂組成物および感光性樹脂組成物の硬化膜
KR102813455B1 (ko) * 2019-03-29 2025-05-27 다이요 홀딩스 가부시키가이샤 포토레지스트 조성물 및 이의 경화물
JP2021148891A (ja) * 2020-03-18 2021-09-27 東レ株式会社 感光性樹脂組成物、硬化膜、表示装置及び硬化膜の製造方法

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Publication number Publication date
JP2024012299A (ja) 2024-01-30
WO2023054381A1 (ja) 2023-04-06
JP7507311B2 (ja) 2024-06-27
JPWO2023054381A1 (enExample) 2023-04-06

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