JP7507311B2 - 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび光デバイス - Google Patents
感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび光デバイス Download PDFInfo
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- JP7507311B2 JP7507311B2 JP2023512116A JP2023512116A JP7507311B2 JP 7507311 B2 JP7507311 B2 JP 7507311B2 JP 2023512116 A JP2023512116 A JP 2023512116A JP 2023512116 A JP2023512116 A JP 2023512116A JP 7507311 B2 JP7507311 B2 JP 7507311B2
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Images
Classifications
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Materials For Photolithography (AREA)
- Led Device Packages (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Formation Of Insulating Films (AREA)
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| JP2023172515A JP2024012299A (ja) | 2021-09-30 | 2023-10-04 | 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび光デバイス |
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| JP2012211988A (ja) | 2011-03-31 | 2012-11-01 | Nippon Zeon Co Ltd | ネガ型感光性樹脂組成物および電子部品 |
| WO2016158389A1 (ja) | 2015-03-27 | 2016-10-06 | 東レ株式会社 | 感光性樹脂組成物、感光性樹脂組成物フィルム、硬化物、絶縁膜および多層配線基板 |
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| KR20190109383A (ko) * | 2017-02-15 | 2019-09-25 | 미쯔비시 케미컬 주식회사 | 감광성 착색 조성물, 경화물, 착색 스페이서, 화상 표시 장치 |
| JP2018203959A (ja) * | 2017-06-09 | 2018-12-27 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミド及び感光性樹脂組成物 |
| JP6984322B2 (ja) * | 2017-11-01 | 2021-12-17 | 東レ株式会社 | 光重合性モノマー、それを用いた感光性樹脂組成物および感光性樹脂組成物の硬化膜 |
| KR102813455B1 (ko) * | 2019-03-29 | 2025-05-27 | 다이요 홀딩스 가부시키가이샤 | 포토레지스트 조성물 및 이의 경화물 |
| JP2021148891A (ja) * | 2020-03-18 | 2021-09-27 | 東レ株式会社 | 感光性樹脂組成物、硬化膜、表示装置及び硬化膜の製造方法 |
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2022
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- 2022-09-27 WO PCT/JP2022/035981 patent/WO2023054381A1/ja not_active Ceased
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012211988A (ja) | 2011-03-31 | 2012-11-01 | Nippon Zeon Co Ltd | ネガ型感光性樹脂組成物および電子部品 |
| WO2016158389A1 (ja) | 2015-03-27 | 2016-10-06 | 東レ株式会社 | 感光性樹脂組成物、感光性樹脂組成物フィルム、硬化物、絶縁膜および多層配線基板 |
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| JP2024012299A (ja) | 2024-01-30 |
| WO2023054381A1 (ja) | 2023-04-06 |
| TW202330724A (zh) | 2023-08-01 |
| JPWO2023054381A1 (enExample) | 2023-04-06 |
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