TW202329567A - 配線器具 - Google Patents
配線器具 Download PDFInfo
- Publication number
- TW202329567A TW202329567A TW111148127A TW111148127A TW202329567A TW 202329567 A TW202329567 A TW 202329567A TW 111148127 A TW111148127 A TW 111148127A TW 111148127 A TW111148127 A TW 111148127A TW 202329567 A TW202329567 A TW 202329567A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- heat dissipation
- dissipation member
- wiring device
- casing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 331
- 230000017525 heat dissipation Effects 0.000 claims abstract description 206
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000010292 electrical insulation Methods 0.000 description 17
- 125000006850 spacer group Chemical group 0.000 description 12
- 238000012986 modification Methods 0.000 description 9
- 230000004048 modification Effects 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000010276 construction Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 241000755266 Kathetostoma giganteum Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/02—Details
- H02G3/08—Distribution boxes; Connection or junction boxes
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/02—Details
- H02G3/08—Distribution boxes; Connection or junction boxes
- H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- Civil Engineering (AREA)
- Architecture (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Connection Or Junction Boxes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-205423 | 2021-12-17 | ||
JP2021205423A JP2023090460A (ja) | 2021-12-17 | 2021-12-17 | 配線器具 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202329567A true TW202329567A (zh) | 2023-07-16 |
Family
ID=86774604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111148127A TW202329567A (zh) | 2021-12-17 | 2022-12-15 | 配線器具 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2023090460A (ja) |
CN (1) | CN118318508A (ja) |
TW (1) | TW202329567A (ja) |
WO (1) | WO2023112720A1 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0851291A (ja) * | 1994-08-05 | 1996-02-20 | Sony Corp | 電子機器 |
CN204271707U (zh) * | 2014-12-22 | 2015-04-15 | 杭州汉克电源有限公司 | 一种车载电动汽车充电机 |
JP6796783B2 (ja) * | 2017-03-31 | 2020-12-09 | パナソニックIpマネジメント株式会社 | 配線器具 |
KR102030824B1 (ko) * | 2017-11-01 | 2019-10-10 | 현대오트론 주식회사 | 전자 제어 장치 |
JP7487550B2 (ja) * | 2020-05-13 | 2024-05-21 | マツダ株式会社 | 移動体用演算装置の冷却構造 |
-
2021
- 2021-12-17 JP JP2021205423A patent/JP2023090460A/ja active Pending
-
2022
- 2022-12-02 CN CN202280079031.3A patent/CN118318508A/zh active Pending
- 2022-12-02 WO PCT/JP2022/044540 patent/WO2023112720A1/ja active Application Filing
- 2022-12-15 TW TW111148127A patent/TW202329567A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN118318508A (zh) | 2024-07-09 |
WO2023112720A1 (ja) | 2023-06-22 |
JP2023090460A (ja) | 2023-06-29 |
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