TW202329567A - Wiring device - Google Patents

Abstract

The present disclosure addresses the problem of improving heat dissipation. A wiring instrument (100) comprises a first substrate (11), a second substrate (21), a case (81), a first heat dissipation member (71), and a second heat dissipation member (72). The case (81) has a bottom wall (82) and a side wall (83) intersecting the bottom wall (82). The case (81) accommodates a first substrate (11) and a second substrate (21), where the first substrate (11) faces the bottom wall (82) and the second substrate (21) faces the side wall (83). The first heat dissipation member (71) is disposed between the first substrate (11) and the bottom wall (82) of the case (81). The second heat dissipation member (72) is disposed between the second substrate (21) and the side wall (83) of the case (81).

Description

Wiring equipment

The present invention generally relates to a wiring appliance. More specifically, the present invention relates to a wiring device provided with a housing for accommodating a substrate.

A USB socket is disclosed in Japanese Patent Laid-Open No. 2016-178097. The USB socket of Patent Document 1 includes: a printed circuit board, on which a USB slot is installed; and a housing, which has a plug through hole through which a "USB plug connected to the USB slot" is inserted, and accommodates the printed circuit board. The casing includes a body and a cover that are combined with each other in the up and down direction. The main body has a storage recess opening upward, and the cover has a plug through hole. The storage recess has a pair of inner surfaces facing each other in one direction. At both ends of the main body in one of the above-mentioned directions, supporting protrusions for supporting the printed circuit board protrude upward, respectively, and position displacement prevention means for preventing positional deviation of the printed circuit board are provided at the upper ends of the supporting protrusions. Two ends of one direction of the printed circuit board are respectively provided with feet. The printed circuit board is supported by the supporting convex part by positioning the leg part on the position displacement preventing means.

In a wiring device such as the USB socket disclosed in JP-A-2016-178097, it may be desired to improve the heat dissipation performance for releasing heat generated inside to the outside. The purpose of the present invention is to improve heat dissipation.

A wiring device according to an aspect of the present invention includes: a first substrate, a second substrate, a housing, a first heat dissipation member, and a second heat dissipation member. The casing includes a bottom wall and a side wall crossing the bottom wall. The housing system accommodates the first substrate and the second substrate in such a manner that the first substrate faces the bottom wall and the second substrate faces the side wall. The first heat dissipation component is disposed between the first substrate and the bottom wall of the casing. The second heat dissipation component is disposed between the second substrate and the side wall of the casing. A wiring device according to an aspect of the present invention includes: a first substrate, a second substrate, a housing, a first heat dissipation member, and a second heat dissipation member. The casing includes a bottom wall, a first side wall and a second side wall. The first side wall and the second side wall intersect with the bottom wall. The housing system accommodates the first substrate and the second substrate in such a manner that the first substrate faces the first side wall and the second substrate faces the second side wall. The first heat dissipation component is disposed between the first substrate and the first side wall of the casing. The second heat dissipation component is disposed between the second substrate and the second side wall of the casing. The first substrate is opposite to the second substrate.

Hereinafter, a wiring device 100 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 12 . In addition, the drawings described in the following embodiments are schematic diagrams, and the ratios of the sizes and thicknesses of the constituent elements in the drawings do not necessarily reflect the actual size ratios.

(1) Summary The wiring device 100 according to the present embodiment, for example, as shown in FIG. The wiring device 100 supplies electric power to the electrically connected electric device 200 via the USB cable 300 , or charges the battery included in the electric device 200 . The electrical equipment 200 is, for example, a smart phone, a digital audio player, a notebook computer, and the like. In this embodiment, as an example, the electrical device 200 is a smartphone, and the wiring device 100 charges the battery included in the smartphone.

The wiring appliance 100 according to this embodiment is, for example, an indoor wiring appliance installed on a wall of a building. The building where the wiring device 100 is installed is, for example, individual houses, individual residents of complex houses, offices, stores, care facilities, and the like. The wiring device 100 is installed on a construction surface (for example, a wall surface of a building) in a state where the power cable 400 is electrically connected to the wiring device 100 . In the wiring device 100, the USB plug 301 of the USB cable 300 can be inserted into the through-hole 861 formed on the front surface of the cover 85 described later, and the USB plug 301 can be electrically connected, and the electrical equipment 200 can be connected from the wiring device 100. supply electricity. The wiring appliance 100 is a built-in wiring appliance, and is installed on a construction surface using an installation frame. More specifically, the wiring fixture 100 is mounted on the construction surface by fixing the mounting frame on which the wiring fixture 100 is mounted, for example, to an embedded container. The so-called embedded container here is a box-shaped member whose front surface is open, and is installed in the wall in such a manner that the front surface is exposed forward from the construction hole formed in the construction surface.

The wiring device 100 which is a USB receptacle is, for example, USB-PD (Power Delivery), and particularly complies with charging standards of USB-PD3.0 or later. When complying with the charging standard of USB-PD, the wiring device 100 needs to be able to output large power such as 240W (48V, 5A), 100W (20V, 5A), for example. When the wiring fixture 100 generates a large amount of power, the heat generated from the electronic components of the wiring fixture 100 also increases. Therefore, high heat dissipation is required for the wiring fixture 100 .

In the wiring fixture 100 of the present embodiment, in order to improve heat dissipation, for example, a part of the housing 8 (casing 81 ) is formed of a material with high thermal conductivity, such as metal. In this case, it becomes a problem to ensure electrical insulation between the electronic components and the board|substrate 11 inside the wiring fixture 100, and the case 81. As shown in FIG. Therefore, the wiring fixture 100 of this embodiment adopts the following structures. As shown in FIGS. 2 and 3 , the wiring device 100 includes a substrate 11 , a housing 81 , an insulating sheet 61 and a heat dissipation member 71 . At least one heat generating component 99 is mounted on the substrate 11 . The "heat-generating component" in the present invention refers to an electronic component that operates using electric power as energy and generates heat (more than a predetermined amount per unit time) during operation. Examples of the heat generating component 99 include semiconductor switches such as FETs, capacitors, inductors, and transformers.

The case 81 accommodates the substrate 11 . At least a part of the casing 81 is made of metal. In the wiring fixture 100 of this embodiment, the entire housing 81 is made of metal.

As shown in FIGS. 2 and 9 , the insulating sheet 61 is housed in a case 81 . The insulating sheet 61 is disposed between the substrate 11 and the housing 81 . The heat dissipation member 71 is accommodated in the case 81 . The heat dissipation member 71 is disposed between the substrate 11 and the housing 81 . The heat dissipation member 71 has electrical insulation. The heat dissipation member 71 cooperates with the insulating sheet 61 to electrically insulate the substrate 11 from the casing 81 . The heat dissipation member 71 has a higher thermal conductivity than the insulating sheet 61 . The heat dissipation member 71 is in contact with the housing 81 . In the present invention, the so-called "two components (the first component and the second component) are in contact" means that at least a part of the first component is in thermally coupled contact with at least a part of the second component. The so-called "two components are in thermally coupled contact" means that the two components are in direct contact, or that the two components are in contact only through another component that has a higher thermal conductivity than that of the two components. relatively small components.

The wiring device 100 of this embodiment can promote heat transfer from the substrate 11 to the casing 81 while electrically insulating the substrate 11 and the casing 81 by including the insulating sheet 61 and the heat dissipation member 71 . Thereby, heat dissipation and electrical insulation of the substrate 11 with respect to the housing 81 can be improved. Moreover, the wiring fixture 100 of this embodiment employ|adopts the following structure in order to improve heat dissipation.

As shown in FIGS. 2 and 3 , the wiring device 100 includes: the first substrate 11 as the substrate 11 , the first heat dissipation member 71 as the heat dissipation member 71 , the housing 81 , the second substrate 21 and the second heat dissipation member. 72.

The casing 81 includes a bottom wall 82 and a side wall 83 . The casing 81 accommodates the first substrate 11 and the second substrate 21 . The housing 81 accommodates the first substrate 11 and the second substrate 21 such that the first substrate 11 faces the bottom wall 82 and the second substrate 21 faces the side wall 83 . The first heat dissipation member 71 is disposed between the first substrate 11 and the bottom wall 82 of the casing 81 . The second heat dissipation member 72 is disposed between the second substrate 21 and the side wall 83 of the casing 81 . As shown in FIG. 7 , the normal direction A1 of the first substrate 11 intersects the normal direction A2 of the second substrate 21 .

The wiring device 100 of this embodiment, by including the first heat dissipation member 71 and the second heat dissipation member 72, can promote heat transfer from the first substrate 11 to the housing 81 through the first heat dissipation member 71, and can The two heat dissipation members 72 promote heat transfer from the second substrate 21 to the housing 81 . Moreover, the heat of the first substrate 11 and the heat of the second substrate 21 can be transferred to different parts of the casing 81 (the bottom wall 82 and the side wall 83 ). Thereby, heat dissipation can be improved.

(2) Details Hereinafter, details of the wiring device 100 according to this embodiment will be described with reference to FIGS. 1 to 12 . Hereinafter, for convenience of description, when the wiring device 100 is installed on the construction surface, the side exposed from the construction surface (wall surface of the building) is referred to as "front", and the side located inside the wall is referred to as "rear". The direction along the front and rear is referred to as "the front and rear direction D1". Also, the direction perpendicular to the front-rear direction D1 and the direction in which the two through-holes 861 formed in the top wall 86 of the cover 85 of the case 8 are arranged are referred to as the "up-down direction D2". 8, the side where the input block 4 described later is located is called "lower", and the opposite side is called "upper". Moreover, the direction perpendicular to both the front-back direction D1 and the up-down direction D2 is called "left-right direction D3". However, these directions are only defined for convenience of description, and are not limited to the directions when the wiring device 100 is used.

As shown in Figures 1 to 3, the wiring device 100 of this embodiment includes: a first block 1, a second block 2, a third block 3, an input block 4, an output block 5, an insulating sheet ( first insulating sheet) 61 , a heat dissipation member (first heat dissipation member) 71 , a second heat dissipation member 72 , and the housing 8 .

(2.1) Shell As shown in FIGS. 1 to 3 , the housing 8 includes a housing 81 and a cover 85 . The casing 81 is made of metal. The casing 81 has thermal conductivity. The casing 81 has a higher thermal conductivity than the insulating plate of the first substrate 11 described later. Case 81 is formed of, for example, aluminum. The housing 81 is, for example, die-cast aluminum.

As shown in FIGS. 2 and 3 , the housing 81 has a box shape having an opening 810 on the front surface. The shape of the opening 810 is substantially rectangular when viewed from the front. The cover body 85 has a box shape in which an opening is formed on the rear surface. The cover 85 is installed on the housing 81 to close the opening 810 of the housing 81 . The casing 81 and the cover 85 form a storage space in the casing 8 by installing the cover 85 on the casing 81 .

As shown in FIGS. 2 and 3 , the housing 81 includes a bottom wall 82 and four side walls 83 (upper wall 831 , lower wall 832 , left wall 833 , and right wall 834 ). The upper wall 831 protrudes forward from the top of the bottom wall 82 . The lower wall 832 protrudes forward from the lower side of the bottom wall 82 . The left wall 833 protrudes forward from the left side of the bottom wall 82 . The right wall 834 protrudes forward from the right side of the bottom wall 82 . The casing 81 is formed into a rectangular box shape having an opening 810 by a bottom wall 82 and four side walls 83 . A hollow portion 811 is formed in the lower right portion of the bottom wall 82 , the right portion of the lower wall 832 , and the lower portion of the right wall 834 . The input block 4 is arranged in the cutout portion 811 .

As shown in FIG. 2 , a protruding portion 813 protruding forward is formed at a position above the hollow portion 811 on the front surface of the bottom wall 82 . The protruding portion 813 extends along the vertical direction D2. The protrusion amount (dimension in the front-rear direction D1 ) of the protruding portion 813 is greater than the thickness of the first insulating sheet 61 . The protrusion amount (dimension in the front-rear direction D1 ) of the protruding portion 813 is smaller than the height (dimension in the front-rear direction D1 ) of the spacer 92 which will be described later.

As shown in FIG. 3 , a through hole 821 for passing the screw 91 is formed at the center of the bottom wall 82 . The through hole 821 is countersinked (drilled) and can accommodate the head of the screw 91 .

As shown in FIGS. 2 and 3 , at the corner 836 connecting the upper wall 831 and the left wall 833 , the corner 837 connecting the upper wall 831 and the right wall 834 , and the corner 837 connecting the lower wall 832 and the left wall 833 838, are respectively formed with through holes 841 penetrating in the front-rear direction D1. On the front surfaces of the corner portions 836 to 838 , semi-cylindrical tube portions 842 protruding forward are respectively provided. The inner surface of each cylindrical portion 842 is connected with the inner surface of the corresponding through hole 841 . A screw groove is formed on the inner surface of each cylindrical portion 842 .

The cover body 85 is made of resin. The cover body 85 is formed of, for example, PBT (polybutyleneterephthalate, polybutylene terephthalate) resin. As shown in FIGS. 2 and 3 , the cover body 85 includes a top wall 86 and four side walls 87 (upper wall 871 , lower wall 872 , left wall 873 , and right wall 874 ). The upper wall 871 protrudes rearward from the top of the top wall 86 . The lower wall 872 protrudes rearward from the bottom of the top wall 86 . The left wall 873 protrudes rearward from the left side of the top wall 86 . The right wall 874 protrudes rearward from the right side of the top wall 86 .

As shown in FIGS. 1 to 4 , the left wall 873 is formed in a stepped shape. The left wall 873 is formed in a stepped shape from the front to the rear and then to the left. On the upper part and the lower part of the outer surface (left surface) of the rearmost section of the left wall 873, there are two pairs of protrusions 851 for mounting the housing 8 on the mounting frame. As shown in FIGS. 1 to 4 , the right wall 874 is formed in a stepped shape. The right wall 874 is formed in a stepped shape from the front to the rear and then to the right. As shown in FIG. 3 , at the center of the rearmost section of the right wall 874 , a recess 875 is formed which is depressed to the left. The mounting piece 852 is arranged in the recess 875 . The mounting piece 852 is fixed on the right wall 874 in a manner capable of flexing in the left-right direction D3. On the outer surface (right surface) of the mounting piece 852, a pair of convex portions 853 for mounting the housing 8 to the mounting frame are formed (see FIG. 4 ).

As shown in FIG. 3, the inner surface of the corner 876 connecting the upper wall 871 and the left wall 873, the inner surface of the corner 877 connecting the upper wall 871 and the right wall 874, and the corner connecting the lower wall 872 and the left wall 873 The inner surface of the corner portion 878 and the inner surface of the corner portion 879 connecting the lower wall 872 and the right wall 874 are respectively semi-cylindrical. Screw grooves are formed on the inner surfaces of the corner portions 876-879, respectively. Screw holes are respectively formed on the inner surfaces of the three cylindrical portions 842 of the housing 81 and the inner surfaces of the three corner portions 876 to 878 of the cover body 85 . Also, on the front surface of the lower right corner of the terminal cover 44 (described later) of the input block 4, a semi-cylindrical cylinder protruding forward and having a screw groove formed on the inner surface is provided. The inner surface of the cylindrical portion of 44 and the inner surface of the corner portion 879 form screw holes.

As shown in FIGS. 1 to 4 , when viewed from the front, the ceiling wall 86 has a through-hole 861 formed in the shape of a long hole long in the left-right direction D3. The top wall 86 has two through holes 861 . The two through holes 861 are aligned in the vertical direction D2.

As shown in FIG. 3 , a reinforcing rib 862 is provided around the through hole 861 on the rear surface of the top wall 86 . The rear edge of the cover 85 is docked with the opening 810 of the housing 81, and the screws 90 are respectively locked into the three screw holes formed by the three cylinders 842 and the three corners 876-878 from the rear. This combines the housing 81 with the cover 85 . Also, dispose the terminal cover 44 in the hollow part 811 of the housing 81, and lock the screw 90 into the screw hole formed in the tube part and the corner part 879 of the terminal cover 44 from the rear, thereby locking the cover 85 is combined with the terminal cover 44 .

(2.2) Output block As shown in FIG. 2 and FIG. 3 , the output block 5 includes: an output substrate 51 , an output terminal 52 and an electronic component 53 . The output block 5 includes two output terminals 52 . In addition, the output block 5 includes a plurality of electronic components 53 .

The output substrate 51 is, for example, a printed circuit board including an insulating plate made of glass and epoxy resin, and pattern conductors formed on the insulating plate. The output board 51 is housed in the housing space of the housing 8 so that the normal direction A0 (see FIGS. 5 to 8 ) of the output board 51 is along the front-rear direction D1 . The shape of the output substrate 51 is a rectangular plate shape that is longer up and down than left and right. The output substrate 51 has a notch on the left side of the center of the upper and lower sides. The output substrate 51 is held by the housing 8 by being sandwiched between the housing 81 and the cover 85 . The output substrate 51 includes a first surface 511 and a second surface 512 opposite to the first surface 511 . The first surface 511 is a front surface, and the second surface 512 is a rear surface.

The output terminal 52 is, for example, a USB socket to which the USB plug 301 can be connected. The output terminal 52 is, for example, a USB Type-C terminal. The output terminal 52 is mounted on the first surface 511 of the output substrate 51 . The two output terminals 52 are respectively located in the two through holes 861 of the cover body 85 when the wiring device 100 is assembled. Accordingly, the USB plug 301 of the USB cable 300 can be connected to the output terminal 52 through the through hole 861 .

A plurality of electronic components 53 are mounted on the output substrate 51 . A plurality of electronic components 53 are mounted on the first surface 511 of the output substrate 51 . In this embodiment, the plurality of electronic components 53 are all mounted on the first surface 511 . However, it is not limited thereto, and some of the plurality of electronic components 53 may also be mounted on the second surface 512 . The plurality of electronic components 53 may include heat generating parts 99 . All of the plurality of electronic components 53 may be heat-generating parts 99 , or part of them may be heat-generating parts 99 . All of the plurality of electronic components 53 may be non-heating components 99 .

(2.3) The first block As shown in FIGS. 2 and 3 , the first block 1 includes a first substrate 11 and electronic components 12 . The first block 1 includes a plurality of electronic components 12 . Like the output substrate 51, the first substrate 11 is, for example, a printed circuit board including an insulating plate made of glass and epoxy resin, and pattern conductors formed on the insulating plate. The first substrate 11 is housed in the housing space of the casing 8 such that the normal direction A1 (see FIGS. 5 to 7 ) of the first substrate 11 is along the front-back direction D1 . The normal direction A1 of the first substrate 11 is along the normal direction A0 of the output substrate 51 . The first substrate 11 is disposed behind the output substrate 51 and parallel to the output substrate 51 . The shape of the first substrate 11 is a rectangular plate shape that is longer up and down than left and right. The lower right portion of the first substrate 11 has a rectangular cutout.

The first substrate 11 includes a first surface 111 and a second surface 112 opposite to the first surface 111 . The first surface 111 is a front surface, and the second surface 112 is a rear surface. The first substrate 11 has a through hole 113 in the center (see FIG. 5 ). The first substrate 11 is fixed to the casing 81 of the casing 8 by screws 91 . More specifically, as shown in FIGS. 5 and 6 , a spacer 92 is disposed between the bottom wall 82 of the casing 81 and the first substrate 11 . The spacer 92 has a through hole 921 penetrating in the front-rear direction D1. The spacer 92 is disposed at a position corresponding to the through hole 113 of the first substrate 11 . Then, the screw 91 is passed through the through hole 821 of the bottom wall 82 , the through hole 921 of the spacer 92 and the through hole 113 of the first substrate 11 from the rear of the bottom wall 82 . Next, on the first surface 111 side of the first substrate 11 , the tips of the screws 91 are coupled to the nuts 93 . Thereby, the first substrate 11 is fixed to the housing 8 by the screws 91 . In the front-back direction D1 , the distance between the bottom wall 82 of the housing 81 and the first substrate 11 is maintained at the height of the spacer 92 (the dimension in the front-back direction D1 ).

The screw 91 and the spacer 92 are made of resin, for example. The screw 91 and the spacer 92 have electrical insulation. Thereby, compared with the case where the screw 91 or the spacer 92 has conductivity, the insulation distance between the first substrate 11 and the bottom wall 82 can be increased, and the electrical insulation of the first substrate 11 to the casing 81 can be improved. sex. In addition, the nut 93 is made of resin, for example, and has electrical insulation. Thereby, the electrical insulation of the first substrate 11 with respect to the casing 81 can be further improved.

The first substrate 11 is electrically connected to the output substrate 51 of the output block 5 . The first substrate 11 is electrically connected to the output substrate 51 through connection terminals and wires.

A plurality of electronic components 12 are mounted on the first substrate 11 . Some of the plurality of electronic components 12 are mounted on the first surface 111 of the first substrate 11 , and the rest of the plurality of electronic components 12 are mounted on the second surface 112 of the first substrate 11 .

The plurality of electronic components 12 may include heat generating components 99 . All of the plurality of electronic components 12 may be heat-generating parts 99 , or part of them may be heat-generating parts 99 . That is, at least one heat generating component 99 is mounted on the first substrate 11 .

(2.4) The second block As shown in FIG. 2 and FIG. 3 , the second block 2 includes a second substrate 21 and electronic components 22 . The second block 2 includes a plurality of electronic components 22 . The second substrate 21 is the same as the output substrate 51, and is, for example, a printed circuit board including an insulating plate made of glass and epoxy resin, and a pattern conductor formed on the insulating plate. The second substrate 21 is housed in the housing space of the housing 8 such that the normal direction A2 (see FIG. 7 ) of the second substrate 21 is along the left-right direction D3. The normal direction A2 of the second substrate 21 intersects the normal direction A1 of the first substrate 11 . In this embodiment, the normal direction A2 of the second substrate 21 is perpendicular to the normal direction A1 of the first substrate 11 . As shown in FIG. 3 , the second substrate 21 is disposed on the upper left portion of the first surface 111 of the first substrate 11 in a direction perpendicular to the first substrate 11 . The shape of the second substrate 21 is a rectangular plate shape whose top and bottom are longer than the front and rear.

The so-called "orthogonal" in the present invention does not only mean a state of strictly intersecting at 90 degrees, but also includes a state of being substantially perpendicular within a certain degree of error range. That is, the angle between the normal direction A1 of the first substrate 11 and the normal direction A2 of the second substrate 21 converges within a certain range of error (less than 10 degrees in one example) with respect to 90 degrees. . In this embodiment, as an example, the angle between the normal direction A1 of the first substrate 11 and the normal direction A2 of the second substrate 21 is 90 degrees.

The second substrate 21 includes a first surface 211 and a second surface 212 opposite to the first surface 211 . The first surface 211 is a left surface, and the second surface 212 is a right surface. The second substrate 21 is electrically connected to the first substrate 11 . More specifically, the second substrate 21 has pin connectors 23 . In addition, the first substrate 11 has terminals 13 to which pin connectors 23 are connected. By connecting the pin connector 23 to the terminal 13 , the first substrate 11 and the second substrate 21 are electrically connected.

A plurality of electronic components 22 are mounted on the second substrate 21 . Some of the plurality of electronic components 22 are installed on the first surface 211 of the second substrate 21 , and the rest of the plurality of electronic components 22 are installed on the second surface 212 of the second substrate 21 . The plurality of electronic components 22 may include heat generating components 99 . All of the plurality of electronic components 22 may be heat-generating parts 99 , or part of them may be heat-generating parts 99 . That is, at least one heat generating component 99 is mounted on the second substrate 21 . In addition, all of the plurality of electronic components 22 may not be heat-generating components 99 .

(2.5) The third block As shown in FIG. 2 and FIG. 3 , the third block 3 includes a third substrate 31 and electronic components 32 . The third block 3 includes a plurality of electronic components 32 .

The third substrate 31 is the same as the output substrate 51, and is, for example, a printed circuit board including an insulating plate made of glass and epoxy resin, and patterned conductors formed on the insulating plate. The third substrate 31 is housed in the housing space of the housing 8 such that the normal direction A3 (see FIG. 5 ) of the third substrate 31 is along the vertical direction D2. The normal direction A3 of the third substrate 31 intersects the normal direction A1 of the first substrate 11 . In this embodiment, the normal direction A3 of the third substrate 31 is perpendicular to the normal direction A1 of the first substrate 11 . Moreover, the normal direction A3 of the third substrate 31 intersects the normal direction A2 of the second substrate 21 . In this embodiment, the normal direction A3 of the third substrate 31 is perpendicular to the normal direction A2 of the second substrate 21 . The third substrate 31 is disposed on the lower left portion of the first surface 111 of the first substrate 11 in a direction perpendicular to the first substrate 11 . The shape of the third substrate 31 is a rectangular plate shape in which the front and rear are longer than the left and right.

The third substrate 31 includes a first surface 311 and a second surface 312 opposite to the first surface 311 . The first surface 311 is a top surface, and the second surface 312 is a bottom surface. The third substrate 31 is electrically connected to the first substrate 11 . More specifically, the third substrate 31 has pin connectors. Also, the first substrate 11 has terminals to which pin connectors are connected. The pin connector is connected to a terminal of the first substrate 11 to electrically connect the first substrate 11 and the third substrate 31 .

A plurality of electronic components 32 are mounted on the third substrate 31 . A plurality of electronic components 32 are installed on the first surface 311 of the third substrate 31 . In this embodiment, the plurality of electronic components 32 are all mounted on the first surface 311 . However, it is not limited thereto, and some of the plurality of electronic components 32 may also be mounted on the second surface 312 . The plurality of electronic components 32 may include heat generating components 99 . All of the plurality of electronic components 32 may be heat-generating parts 99 , or part of them may be heat-generating parts 99 . All of the plurality of electronic components 32 may not be heat-generating parts 99 .

(2.6) Input block As shown in FIG. 2 , FIG. 3 , and FIG. 8 , the input block 4 includes: an input substrate 41 , a pair of input terminals 42 (only one is shown in FIG. 8 ), electronic components 43 and a terminal cover 44 . The input substrate 41 is the same as the output substrate 51, and is, for example, a printed circuit board including an insulating plate made of glass and epoxy resin, and patterned conductors formed on the insulating plate. The input board 41 is housed in the housing space of the housing 8 so that the normal direction A10 of the input board 41 is along the front-rear direction D1. In this embodiment, the normal direction A10 of the input substrate 41 is along the normal direction A0 of the output substrate 51 . The input substrate 41 includes a first surface 411 and a second surface 412 opposite to the first surface 411 . The first surface 411 is a front surface, and the second surface 412 is a rear surface. The input substrate 41 is electrically connected to the third substrate 31 . More specifically, the input substrate 41 is electrically connected to the third substrate 31 through a pair of wires 45 .

A pair of input terminals 42 are mounted on the input board 41 . A pair of input terminals 42 are mounted on the second surface 412 of the input substrate 41 . A pair of power lines 401 (see FIG. 1 ) of the power cable 400 are respectively connected to a pair of input terminals 42 . The pair of input terminals 42 are each a so-called quick-connect terminal. The input terminal 42 includes, for example, a flat terminal portion 421 and a terminal clip 422 formed by bending a sheet metal made of copper alloy. The terminal clip 422 includes a pressing portion 423 for pressing the power cord 401 against the terminal portion 421 by elastic force, and a locking portion 424 for preventing the power cord 401 from falling off.

The input block 4 further includes a cancel button 46 . The release button 46 is a button for releasing the connection between the pair of input terminals 42 and the pair of power lines 401 . That is, in the state where the pair of input terminals 42 are connected to the pair of power lines 401, by operating the release button 46, the locking portion 424 can be separated from the power line 401, whereby the pair of input terminals 42 can be connected to each other. The power cord 401 is removed.

The electronic component 43 is mounted on the input substrate 41 . The electronic component 43 is mounted on the first surface 411 of the input substrate 41 . But it is not limited thereto, and the electronic components 43 can also be mounted on the second surface 412 . In addition, a plurality of electronic components 43 may be mounted on the input board 41 .

The terminal cover 44 is made of resin. The terminal cover 44 is formed of, for example, PBT resin. The terminal cover 44 is disposed on the second surface 412 side of the input substrate 41 . The terminal cover 44 has a rectangular box shape. The terminal cover 44 covers the pair of input terminals 42 from the rear and accommodates the pair of input terminals 42 inside. The terminal cover 44 is disposed in the hollow portion 811 of the housing 81 . In the terminal cover 44, the rear surface of the terminal cover 44 and the rear surface of the housing 81, the right surface of the terminal cover 44 and the right surface of the housing 81, and the bottom surface of the terminal cover 44 and the bottom surface of the housing 81 are respectively It has a shape with no height difference and connection. Also, as described above, on the front surface of the lower right corner of the terminal cover 44, there is provided a semi-cylindrical cylindrical portion protruding forward and having a screw groove formed on the inner surface.

As shown in FIG. 3 , a pair of insertion holes 441 through which a pair of power cords 401 are inserted are formed on the rear wall of the terminal cover 44 . An operation hole 442 for inserting a tool (such as a flathead screwdriver) for operating the release button 46 is formed on the rear wall of the terminal cover 44 .

(2.7) Insulation sheet As described above, the wiring fixture 100 includes the insulating sheet (first insulating sheet) 61 . As shown in FIGS. 2 and 3 , the wiring device 100 further includes a second insulating sheet 65 and a third insulating sheet 66 .

The first insulating sheet 61 is formed of, for example, polycarbonate. The first insulating sheet 61 is in the shape of a rectangular box along the inner surface of the casing 81 . The first insulating sheet 61 is arranged along the inner surface of the housing 81 . As shown in FIG. 2 , FIG. 3 , and FIG. 9 , the first insulating sheet 61 includes a bottom portion 62 and four side portions 63 (upper portion 631 , lower portion 632 , left portion 633 , and right portion 634 ).

The bottom 62 is shaped along the front surface of the bottom wall 82 of the casing 81 . The bottom portion 62 has a rectangular notch 628 corresponding to the hollow portion 811 at its lower right portion. At the center of the bottom 62 , a through hole 629 for passing the screw 90 is formed at a position corresponding to the through hole 821 of the bottom wall 82 . The size of the through hole 629 is larger than that of the spacer 92 . The bottom 62 has a plurality (here five) of openings 610 . The plurality of openings 610 includes: two rectangular openings 611, 612 formed in the upper left part of the bottom 62, a rectangular opening 613 formed in the lower left part of the bottom 62, and a rectangle formed in the upper right part of the bottom 62 and extending obliquely downward to the left and a rectangular opening 615 formed at the lower right portion of the bottom 62 and connected to the notch 628 . The opening 615 is formed at a position corresponding to the protruding portion 813 of the bottom wall 82 of the housing 81 and has a shape for the protruding portion 813 to fit into.

The upper side portion 631 is shaped along the bottom surface of the upper wall 831 of the casing 81 . The lower side portion 632 is shaped along the top surface of the lower wall 832 of the casing 81 . The left side portion 633 is shaped along the right surface of the left wall 833 of the casing 81 . The right side portion 634 is shaped along the left surface of the right wall 834 of the casing 81 . The upper side part 631 , the lower side part 632 , the left side part 633 and the right side part 634 have no openings. The bottom 62 and the four side parts 63 are integrally formed.

Moreover, the first insulating sheet 61 further includes a protruding portion 635 extending in the left-right direction D3 along the upper edge of the notch 628 and protruding forward.

The first insulating sheet 61 cooperates with the first heat dissipation member 71 to electrically insulate the first substrate 11 from the casing 81 . Moreover, the first insulating sheet 61 electrically insulates the second substrate 21 from the casing 81 . The first insulating sheet 61 electrically insulates the third substrate 31 from the casing 81 . The first insulating sheet 61 suppresses external electrostatic forces, lightning surges, and the like to the first substrate 11 to third substrate 31 .

The second insulating sheet 65 is formed of polycarbonate, for example. As shown in FIGS. 2 and 3 , the second insulating sheet 65 is disposed between the output substrate 51 and the first substrate 11 . The second insulating sheet 65 is disposed between the output substrate 51 and the electronic component 12 mounted on the first substrate 11 . The second insulating sheet 65 electrically insulates the output substrate 51 from the electronic component 12 .

The third insulating sheet 66 is formed of polycarbonate, for example. As shown in FIGS. 2 and 3 , the third insulating sheet 66 is disposed between the output substrate 51 and the first substrate 11 . The third insulating sheet 66 is disposed between the output substrate 51 and the electronic component 32 mounted on the third substrate 31 . The third insulating sheet 66 electrically insulates the output substrate 51 from the electronic component 32 .

(2.8) Heat dissipation components As described above, the wiring fixture 100 includes the heat dissipation member (first heat dissipation member) 71 . Moreover, the wiring fixture 100 further includes a second heat dissipation member 72 . Moreover, as shown in FIGS. 2 and 3 , the wiring fixture 100 further includes an additional heat dissipation member 73 .

The first heat dissipation member 71 has electrical insulation. The first heat dissipation member 71 has thermal conductivity. The first heat dissipation member 71 has a sheet shape. The first heat dissipation member 71 is a heat dissipation fin. The first heat dissipation member 71 is formed of silicon, for example. The first heat dissipation member 71 has stretchability (elasticity). Since the first heat radiating member 71 is a heat radiating fin, it can have a longer life than a volatile liquid such as grease, for example.

The first heat dissipation member 71 is disposed between the bottom wall 82 of the casing 81 and the first substrate 11 . Since the first insulating sheet 61 is disposed along the inner surface of the casing 81 as described above, the first heat dissipation member 71 is disposed between the bottom 62 of the first insulating sheet 61 and the first substrate 11 . The first heat dissipation member 71 is disposed at a position corresponding to the opening 610 of the first insulating sheet 61 . To describe from another angle, the first insulating sheet 61 is disposed along the inner surface of the housing 81 at a portion of the housing 81 that is not in (direct) contact with the first heat dissipation member 71 .

The first heat dissipation member 71 is configured to fill the opening 610 . The first heat dissipation member 71 is sandwiched between the peripheral portion of the opening 610 in the first insulating sheet 61 and the first substrate 11 . The first heat dissipation member 71 cooperates with the first insulating sheet 61 to electrically insulate the first substrate 11 from the casing 81 . The first heat dissipation member 71 includes a plurality (here, three) of thin sheets 711 , 712 , and 713 . Each sheet 711, 712, 713 is sheet-like. The plurality of sheets 711 to 713 are arranged separately from each other. However, it is not limited thereto, and the plurality of sheets 711 to 713 may be arranged so as to partially overlap each other. Alternatively, the plurality of sheets 711 to 713 may also be integrally formed.

As shown in FIG. 9 , the sheet 711 is arranged at a position corresponding to the openings 611 , 612 and fills the openings 611 , 612 . The sheet 712 is disposed at a position corresponding to the opening 613 and fills the opening 613 . The sheet 713 is arranged at a position corresponding to the openings 614 , 615 and fills the openings 614 , 615 . The plural (five) openings 611 to 615 are all filled by the plural (three) thin sheets 711 to 713 .

The first heat dissipation member 71 has a thickness (dimension in the front-rear direction D1 ) greater than the height (dimension in the front-back direction D1 ) of the spacer 92 in a natural state that is not stretched. In the state where the first heat dissipation member 71 is disposed between the first insulating sheet 61 and the first substrate 11, when the first substrate 11 is fixed to the bottom wall 82 by screws 91, the first heat dissipation member 71 will be The insulating sheet 61 is sandwiched between the first substrate 11 and compressed in the front-rear direction D1. However, the portion of the first heat dissipation member 71 corresponding to the opening 610 is not compressed but is squeezed into the opening 610 and then contacts the bottom wall 82 . Thereby, the front surface of the first heat dissipation member 71 is in contact with the second surface 112 of the first substrate 11 , and the rear surface of the first heat dissipation member 71 is in contact with the bottom wall 82 (see FIG. 7 ). That is, the first heat dissipation member 71 is in contact with the bottom wall 82 of the housing 81 .

As shown in FIG. 3 and FIG. 5 , the sheet 711 in the first heat dissipation member 71 is in contact with the electronic component 12 mounted on the second surface 112 of the first substrate 11 . Thereby, heat dissipation can be further improved. This point will be described in detail with reference to FIG. 10 .

As shown in FIG. 10 , on the second surface 112 of the first substrate 11 , the electronic component 12 which is a heat generating component 99 is mounted. Moreover, the second surface 112 of the first substrate 11 is arranged to face the bottom wall 82 of the casing 81 . Next, the sheet 711 of the first heat dissipation member 71 is disposed between the first substrate 11 and the bottom wall 82 of the casing 81 , and covers the entire heat generating component 99 . In other words, the heat generating component 99 is embedded in the first heat dissipation member 71 . Thereby, the first heat dissipation member 71 is in contact with the heat generating component 99 . Also, the first heat dissipation member 71 is in contact with the first substrate 11 .

Also, as shown in FIG. 10 , the thin sheet 711 of the first heat dissipation member 71 is in contact with the bottom wall 82 of the casing 81 through the opening 610 of the first insulating sheet 61 . Thus, by bringing the first heat dissipation member 71 into contact with the case 81 and the heat-generating component 99 , heat transfer from the heat-generating component 99 to the case 81 can be promoted, and heat dissipation can be further improved.

In addition, the first heat dissipation member 71 is preferably in planar contact with the housing 81 . In the first heat dissipation member 71 , the entire portion corresponding to the opening 610 of the first insulating sheet 61 is preferably in planar contact with the housing 81 . Heat dissipation can be further improved.

Also, as shown in FIG. 6 , the thin sheet 713 in the first heat dissipation member 71 is arranged at a position corresponding to the opening 615 of the first insulating sheet 61 . The protruding portion 813 of the bottom wall 82 of the casing 81 is embedded in the opening 615 , and the sheet 713 is in contact with the protruding portion 813 . Thereby, compared with the case where there is no protrusion 813, heat dissipation can be further improved. This point will be described in detail with reference to FIG. 11 .

As shown in FIG. 11 , on the first surface 111 of the first substrate 11 , an electronic component 12 which is a heating component 99 is mounted. Moreover, the second surface 112 of the first substrate 11 is arranged to face the bottom wall 82 of the casing 81 . The bottom wall 82 of the housing 81 has a protrusion 813 protruding toward the first substrate 11 . The protruding portion 813 is inserted into the opening 610 of the first insulating sheet 61 . Next, the sheet 713 of the first heat dissipation member 71 is disposed between the first substrate 11 and the protruding portion 813 of the casing 81 . Thereby, the first heat dissipation member 71 is in contact with the first substrate 11 . In addition, the first heat dissipation member 71 comes into contact with the case 81 (the protruding portion 813 ). Thereby, the heat generated by the heat-generating component 99 will be transferred to the first substrate 11 , and the heat of the first substrate 11 will be transferred to the casing 81 through the first heat dissipation member 71 .

As shown in FIG. 11 , the distance R1 (corresponding to the thickness of the first heat dissipation member 71 ) of the heat transfer path from the first substrate 11 to the case 81 when the case 81 has the protruding portion 813 is shorter than The distance R0 of the heat transfer path when the housing 81 does not have the protruding portion 813 . Therefore, when the case 81 has the protrusion 813 , the thermal resistance of the heat transfer path between the first substrate 11 and the case 81 is smaller than when the case 81 does not have the protrusion 813 . Thereby, heat transfer from the first substrate 11 to the housing 81 can be promoted, and heat dissipation can be further improved.

The first substrate 11 preferably has a copper inlay 114 as shown in FIG. 11 . That is, the first substrate 11 is a copper inlay substrate. The copper inlay 114 is disposed on a portion of the first substrate 11 where the heat-generating component 99 is installed. The first heat dissipation member 71 is in contact with the copper inlay 114 . In this way, by making the first heat dissipation member 71 in contact with the copper inlay 114 of the first substrate 11 , the heat dissipation can be further improved.

In the wiring device 100 of this embodiment, the first insulating sheet 61 and the first heat dissipation member 71 are interposed between the first substrate 11 and the housing 81 on the entire second surface 112 of the first substrate 11 . at least one of . In more detail, as shown in FIG. 5 , if an imaginary line X1 from the first substrate 11 to the bottom wall 82 of the casing 81 is assumed along the front-rear direction D1, no matter any point on the first substrate 11 is taken as the starting point point, the imaginary line X1 crosses at least one of the first insulating sheet 61 and the first heat dissipation member 71 . That is, any imaginary line X1 from the first substrate 11 to the casing 81 along the direction in which the first substrate 11 and the casing 81 face (the front-rear direction D1) will be aligned with the first insulating sheet 61 and the first heat dissipation member 71. At least one of the crosses. Thereby, the insulation distance between the first substrate 11 and the casing 81 can be increased, and the electrical insulation of the first substrate 11 to the casing 81 can be improved.

The second heat dissipation member 72 has electrical insulation. The second heat dissipation member 72 has thermal conductivity. The second heat dissipation member 72 has a sheet shape. The second heat dissipation member 72 is a heat dissipation fin. The second heat dissipation member 72 is formed of silicon, for example. The second heat dissipation member 72 has stretchability (elasticity). The second heat dissipation member 72 is arranged between the side wall 83 (left wall 833 ) of the housing 81 and the second substrate 21 . Since the first insulating sheet 61 is disposed along the inner surface of the casing 81 as described above, the second heat dissipation member 72 is disposed between the left side portion 633 of the first insulating sheet 61 and the second substrate 21 .

The second heat dissipation member 72 is sandwiched between the left side portion 633 of the first insulating sheet 61 and the second substrate 21 . Thereby, the electronic components 22 mounted on the first surface 211 of the second substrate 21 are embedded in the second heat dissipation member 72 , so that the second heat dissipation member 72 is in contact with the electronic components 22 . Moreover, the right surface of the second heat dissipation member 72 is in contact with the first surface 211 of the second substrate 21 .

In this way, by including the first heat dissipation member 71 and the second heat dissipation member 72 in the wiring fixture 100 , two heat transfer paths for releasing the heat generated from the heat generating component 99 to the housing 81 are formed. Thereby, heat dissipation can be further improved.

The additional heat dissipation member 73 has electrical insulation. The additional heat dissipation member 73 has thermal conductivity. The additional heat dissipation member 73 has a sheet shape. The additional heat dissipation member 73 is a heat dissipation fin. The additional heat dissipation member 73 is formed of silicon, for example. The additional heat dissipation member 73 has stretchability (elasticity).

As shown in FIG. 7 , the additional heat dissipation member 73 is disposed between the cover body 85 and the output substrate 51 . The additional heat dissipation member 73 is arranged to cover the electronic component 53 mounted on the output substrate 51 . The additional heat dissipation member 73 is sandwiched between the cover body 85 and the output substrate 51 . Thereby, the electronic component 53 mounted on the first surface 511 of the output substrate 51 is in contact with the bottom surface of the additional heat dissipation member 73 .

By providing the wiring device 100 with the additional heat dissipation member 73 , the heat generated from the electronic component 53 mounted on the output substrate 51 can be released to the case 8 through the additional heat dissipation member 73 . Thereby, heat dissipation can be further improved.

(2.9) Circuit configuration The circuit configuration of the wiring device 100 (USB receptacle) will be described with reference to FIG. 12 .

As shown in FIG. 12 , the wiring device 100 includes: an input circuit 101 , a common mode filter 102 , a diode bridge 103 , a differential mode filter 104 , a DC/DC converter 105 , an output circuit 106 and a control circuit 107 . The input circuit 101 is connected to an external power source 110 . The external power source 110 is an AC power source. The input circuit 101 includes a pair of input terminals 42 in the input block 4 . The input circuit 101 is connected to the external power supply 110 by connecting the power supply cable 400 to the pair of input terminals 42 . AC input power is input to the input circuit 101 from the external power supply 110 .

The common mode filter 102 is connected to the input circuit 101 . The common mode filter 102 reduces common mode noise. The common mode filter 102 is composed of electronic components 32 mounted on the third substrate 31 . The electronic element 32 constituting the common mode filter 102 may include a capacitor and a coil (choke coil).

The diode bridge 103 is connected to the input circuit 101 via the common mode filter 102 . The diode bridge 103 converts AC input power into pulsed DC power. The diode bridge 103 is composed of electronic components 12 mounted on the first substrate 11 . The electronic components 12 constituting the diode bridge 103 may include diodes.

The differential mode filter 104 is connected to the output terminal of the diode bridge 103 . The differential mode filter 104 reduces differential mode noise. The differential mode filter 104 is composed of the electronic component 22 mounted on the second substrate 21 and the electronic component 12 mounted on the first substrate 11 . The electronic components 12, 22 making up the differential mode filter 104 may comprise capacitors.

The DC/DC converter 105 is connected to the output terminal of the diode bridge 103 via the differential mode filter 104 . Here, the DC/DC converter 105 is an isolation type DC/DC converter including an isolation transformer. The DC/DC converter 105 converts the pulsed DC power generated by the diode bridge 103 into DC power with a desired voltage value. The DC/DC converter 105 is composed of electronic components 12 mounted on the first substrate 11 . The electronic components 12 constituting the DC/DC converter 105 may include isolation transformers, semiconductor switches, and capacitors. An insulating transformer and a semiconductor switch included in the DC/DC converter 105 are heating components 99 .

The output circuit 106 is connected to the DC/DC converter 105 . The output circuit 106 includes two output terminals 52 in the output block 5 . The output circuit 106 outputs the DC power generated by the DC/DC converter 105 to the USB plug 301 connected to the output terminal 52 .

The control circuit 107 is composed of the electronic component 12 mounted on the first substrate 11 and the electronic component 53 mounted on the output substrate 51 . The control circuit 107 controls the operation of the DC/DC converter 105 (turning on/off of the semiconductor switch included in the DC/DC converter 105 ). The control circuit 10 controls the operation of the DC/DC converter 105 based on information (charging voltage, charging current, etc.) received from the electrical device 200 connected to the output terminal 52 .

Thus, the wiring device 100 includes the input circuit 101 , the conversion circuit (the diode bridge 103 and the DC/DC converter 105 ), and the output circuit 106 . The input circuit 101 is connected to an external power source 110 and receives AC input power from the external power source 110 . The conversion circuit is composed of a plurality of electronic components including heat generating parts 99, and converts input power into DC output power. The output circuit 106 outputs the output power. Thereby, the wiring appliance 100 can supply and output electric power to the electrical equipment 200 .

(3) Variations The above-mentioned implementation is only one of various implementations of the present invention. As long as the above-mentioned embodiment can achieve the purpose of the present invention, various changes can be made according to the design and the like. Hereinafter, modification examples of the embodiments will be listed. Hereinafter, the above-mentioned embodiment may be referred to as a "basic example. The above-mentioned basic example and modified examples described below may be used in combination as appropriate.

(3.1) Modification 1 A wiring harness according to this modified example will be described with reference to FIG. 13 . In the wiring fixture of this modified example, the same or corresponding code|symbol is attached|subjected to the same structure as the wiring fixture 100 of a basic example, and description is abbreviate|omitted suitably.

As shown in FIG. 13 , in the wiring fixture of this modified example, the bottom wall 82 of the housing 81 has a recessed portion 814 recessed in a direction away from the first substrate 11 . The concave portion 814 is formed at a position corresponding to the opening 610 of the first insulating sheet 61 . Next, the first heat dissipation member 71 is disposed between the first substrate 11 and the bottom wall 82 of the casing 81 in a manner of being embedded in the recessed portion 814 . That is, the first heat dissipation member 71 will be in contact with the first substrate 11 , and also be in contact with the housing 81 (recess 814 ). The heat generated by the heat generating component 99 is transferred to the first substrate 11 , and the heat of the first substrate 11 is transferred to the housing 81 through the first heat dissipation member 71 .

The distance R2 (corresponding to the thickness of the first heat dissipation member 71 ) of the heat transfer path for transferring heat from the first substrate 11 to the case 81 when the case 81 has the recessed portion 814 is longer than that of the case 81 without the protruding portion. The distance R0 of the heat transfer path at 813 hours. Therefore, compared with the case where the case 81 does not have the recess 814 , when the case 81 has the recess 814 , the thermal resistance of the heat transfer path between the first substrate 11 and the case 81 is larger. In this way, it is difficult for heat to transfer from the first substrate 11 to the housing 81 , so that the temperature of the housing 81 can be prevented from rising excessively.

(3.2) Modification 2 100 A of wiring fixtures of this modification are demonstrated with reference to FIG. 14. FIG. In the wiring fixture 100A of this modified example, the same or corresponding symbols are attached to the same configuration as that of the wiring fixture 100 of the basic example, and explanations are appropriately omitted. As shown in FIG. 14, in 100 A of wiring fixtures of this modification, case 8A is provided with case 81A and cover 85A.

The casing 81A includes a bottom wall 82A, a first side wall (right wall 834A) and a second side wall (left wall 833A). The first side wall (right wall 834A) and the second side wall (left wall 833A) intersect with the bottom wall 82A. The casing 81A accommodates the first substrate 11A and the second substrate 21A. The housing 81A accommodates the first substrate 11A and the second substrate 21A such that the first substrate 11A faces the first side wall (right wall 834A) and the second substrate 21A faces the second side wall (left wall 833A).

Heat generating components 99 are mounted on the first substrate 11A (see FIG. 2 and the like). In addition, a heat generating component 99 is mounted on the second substrate 21A. The first heat dissipation member 71A is disposed between the first substrate 11A and the first side wall (the right wall 834A). The first heat dissipation member 71A is in contact with the first substrate 11A. The second heat dissipation member 72A is disposed between the second substrate 21A and the second side wall (the left wall 833A). The second heat dissipation member 72A is in contact with the second substrate 21A. The first substrate 11A is opposite to the second substrate 21A.

Also in the wiring fixture 100A of this modified example, like the wiring fixture 100 of the basic example, two heat transfer paths for dissipating heat generated from the heat generating component 99 to the housing 81A are formed. Thereby, heat dissipation can be further improved.

(3.3) Other modifications In a modified example, the wiring device 100 may also include one or more than three output terminals 52 . In a modified example, the wiring tool 100 only needs to include the first insulating sheet 61 , and may not include one or both of the second insulating sheet 65 and the third insulating sheet 66 . In a modified example, the wiring fixture 100 may not be provided with the additional heat dissipation member 73 . In a modified example, the first heat dissipation member 71 may not be in contact with the first substrate 11 while in contact with the heat generating component 99 .

In a modified example, the peripheral portion of the opening 610 of the first insulating sheet 61 may overlap with the peripheral portion of the protruding portion 813 of the casing 81 . That is, the opening 610 of the first insulating sheet 61 can also be formed smaller than the protruding portion 813, so that the peripheral portion of the opening 610 of the first insulating sheet 61 is placed on the protruding portion 813 of the housing 81 and sandwiched between the protruding portion 813 and the protruding portion 813. between the first heat dissipation members 71 .

In a modified example, the peripheral portion of the opening 610 of the first insulating sheet 61 may also overlap with the peripheral portion of the recessed portion 814 of the casing 81 . That is, the opening 610 of the first insulating sheet 61 can also be formed smaller than the recessed portion 814, so that the peripheral portion of the opening 610 of the first insulating sheet 61 enters the recessed portion 814 of the housing 81 and is sandwiched between the recessed portion 814 and the recessed portion 814. between the first heat dissipation members 71 .

In a modified example, the second heat dissipation member 72 may also be in contact with the side wall 83 of the casing 81 . For example, the left side portion 633 of the first insulating sheet 61 may also have an opening 610 , and the second heat dissipation portion 72 is configured to fill the opening 610 . In a modified example, the heat generating part 99 may also include a resin mold. That is, the term that the first heat dissipation member 71 is in contact with the heat generating component 99 may include the concept that the first heat dissipation member 71 is in contact with the resin mold of the heat generating component 99 .

In a modified example, the material of the housing 81 is not limited to metal. The case 81 may be formed of a material having thermal conductivity and electrical conductivity.

(4 Conclusion As is clear from the embodiments and modifications described above, the following aspects are disclosed in this specification.

(4.1) First conclusion The wiring device ( 100 , 100A) of the first aspect includes: a substrate ( 11 , 11A), a case ( 81 , 81A), an insulating sheet ( 61 ), and a heat dissipation member ( 71 ). A heat generating component (99) is attached to the base plate (11, 11A). The case (81, 81A) accommodates the substrate (11, 11A). The insulating sheet (61) is disposed between the base plate (11, 11A) and the casing (81, 81A). The heat dissipation member (71) has electrical insulation. The heat dissipation member (71) is disposed between the substrate (11, 11A) and the case (81, 81A). The heat dissipation member (71) cooperates with the insulating sheet (61) to electrically insulate the substrate (11, 11A) and the casing (81, 81A). The heat dissipation member (71) has a larger thermal conductivity than the insulating sheet (61). The heat dissipation member (71) is in contact with the casing (81, 81A).

According to this aspect, heat dissipation and electrical insulation of the substrate ( 11 , 11A) from the casing ( 81 , 81A) can be improved. In the wiring device (100, 100A) of the second aspect, in the first aspect, the heat dissipation member (71) is in contact with the heat generating component (99).

According to this aspect, the heat dissipation can be further improved. In the wiring device ( 100 , 100A) of the third aspect, in the first or second aspect, the heat dissipation member ( 71 ) is in contact with the substrate ( 11 , 11A). According to this aspect, the heat dissipation can be further improved. In the wiring device (100, 100A) of the fourth aspect, in the third aspect, the substrate (11, 11A) has a copper inlay (114) at a portion where a heat generating component (99) is mounted. The heat dissipation member (71) will be in contact with the copper inlay (114).

According to this aspect, the heat dissipation can be further improved. The wiring device (100, 100A) of the fifth aspect is in any one of the first to fourth aspects, and the insulating sheet (61) is arranged on the casing (81, 81A) along the inner surface (81, 81A) is not in contact with the heat dissipation member (71). According to this aspect, the electrical insulation of the substrate ( 11 , 11A) to the case ( 81 , 81A) can be further improved. In the sixth aspect of the wiring device (100, 100A), in the fifth aspect, the insulating sheet (61) has an opening (610). The heat dissipation member (71) is arranged at a position corresponding to the opening (610) of the insulating sheet (61), so as to fill the opening (610).

According to this aspect, the electrical insulation of the substrate ( 11 , 11A) to the case ( 81 , 81A) can be further improved.

In the seventh aspect of the wiring device (100, 100A), in the sixth aspect, the heat dissipation member (71) will be sandwiched between the periphery of the opening (610) of the insulating sheet (61) and the substrate (11, 11A) between. According to this aspect, the electrical insulation of the substrate ( 11 , 11A) to the case ( 81 , 81A) can be further improved.

In the eighth aspect of the wiring device (100, 100A), in any one of the first to seventh aspects, the housing (81, 81A) has a protruding portion (813) protruding toward the substrate (11, 11A) . The heat dissipation member ( 71 ) will be in contact with the protrusion ( 813 ). According to this aspect, the heat dissipation can be further improved. In the ninth aspect of the wiring device (100, 100A), in any one of the first to eighth aspects, the housing (81, 81A) has a recessed portion that is recessed in a direction away from the substrate (11, 11A) (814). The heat dissipation member (71) is embedded in the recessed part (814).

According to this aspect, the temperature of the casing ( 81 , 81A) can be prevented from rising excessively.

In the wiring device (100, 100A) of the tenth aspect, in any one of the first to ninth aspects, the heat dissipation member (71) is a heat sink. In this way, the longevity of the wiring equipment (100, 100A) can be realized.

The eleventh aspect of the wiring device (100, 100A) is in any one of the first to tenth aspects, along the direction in which the substrate (11, 11A) and the housing (81, 81A) face each other from the substrate ( 11, 11A) An arbitrary imaginary line (X1) to the casing (81, 81A) crosses at least one of the insulating sheet (61) and the heat dissipation member (71).

According to this aspect, the electrical insulation of the substrate ( 11 , 11A) to the case ( 81 , 81A) can be further improved.

The wiring device (100, 100A) of the twelfth aspect is any one of the first to eleventh aspects, and further includes: input circuit (101), conversion circuit (diode bridge 103, DC /DC converter 105) and output circuit (106). The input circuit (101) is connected to an external power supply and receives AC input power from the external power supply. The conversion circuit is composed of a plurality of electronic components including heating parts (99). The conversion circuit converts the input power into DC output power. The output circuit (106) outputs the output power. In this way, output power can be supplied to an external device.

(4.2) The second conclusion The wiring device (100) of the first aspect includes: a first substrate (11), a second substrate (21), a housing (81), a first heat dissipation member (71) and a second heat dissipation member (72). The casing (81) includes a bottom wall (82) and a side wall (83) crossing the bottom wall (82). The casing (81) accommodates the first substrate (11) and the second substrate in such a manner that the first substrate (11) faces the bottom wall (82) and the second substrate (21) faces the side wall (83). (twenty one). The first heat dissipation member (71) is arranged between the first substrate (11) and the bottom wall (82) of the casing (81). The second heat dissipation member (72) is arranged between the second substrate (21) and the side wall (83) of the casing (81). According to this aspect, heat dissipation can be improved.

In the wiring device (100) of the second aspect, in the first aspect, the housing (81) has a larger thermal conductivity than the insulating plate of the first substrate (11). According to this aspect, the heat dissipation can be further improved.

The wiring device (100) of the third aspect is in the second aspect, and the casing (81) is made of metal. According to this aspect, the heat dissipation can be further improved.

The wiring device (100) of the fourth aspect is any one of the first to third aspects, and at least one heat-generating component (99) is mounted on the first substrate (11). According to this aspect, the heat generated by the heat-generating component (99) can be released to the bottom wall through the first heat-dissipating member (71), thereby further improving heat dissipation.

In the fifth aspect of the wiring device (100), in the fourth aspect, the first heat dissipation member (71) is in contact with the heat generating component (99) mounted on the first substrate (11). According to this aspect, the heat dissipation can be further improved.

The wiring device (100) of the sixth aspect is based on the fourth or fifth aspect, and at least one heating component (99) is installed on the second substrate (21). According to this aspect, the heat generated by the heat-generating component (99) can be released to the side wall through the second heat-dissipating member (72), thereby further improving heat dissipation.

In the seventh aspect of the wiring device (100), in the sixth aspect, the second heat dissipation member (72) is in contact with the heat generating component (99) mounted on the second substrate (21). According to this aspect, the heat dissipation can be further improved.

In the eighth aspect of the wiring device (100), in any one of the first to seventh aspects, at least one of the first heat dissipation member (71) and the second heat dissipation member (72) is stretchable. According to this aspect, the heat dissipation can be further improved.

In the ninth aspect of the wiring device (100), in any one of the first to eighth aspects, at least one of the first heat dissipation member (71) and the second heat dissipation member (72) is a heat dissipation fin. According to this aspect, the longevity of the wiring device (100) can be realized.

In the tenth aspect of the wiring device (100), in any one of the first to ninth aspects, the first heat dissipation member (71) is in contact with the bottom wall (82) of the casing (81). According to this aspect, the heat dissipation can be further improved.

In the wiring device (100) of the eleventh aspect, in any one of the first to tenth aspects, the second heat dissipation member (72) is in contact with the side wall (83) of the casing (81). According to this aspect, the heat dissipation can be further improved.

The wiring device ( 100A) of the twelfth aspect includes: a first substrate ( 11A), a second substrate ( 21A), a housing ( 81A), a first heat dissipation member ( 71A), and a second heat dissipation member ( 72A). The casing (81A) includes: a bottom wall (82A), a first side wall (right wall 834A) and a second side wall (left wall 833A). The first side wall and the second side wall intersect with the bottom wall (82A). The case (81A) accommodates the first substrate (11A) and the second substrate (21A) such that the first substrate (11A) faces the first side wall and the second substrate (21A) faces the second side wall. . The first heat dissipation member (71A) is disposed between the first substrate (11A) and the first side wall of the casing (81A). The second heat dissipation member (72) is disposed between the second substrate (21) and the second side wall of the casing (81A). The first substrate (11) and the second substrate (21) face each other. According to this aspect, heat dissipation can be improved.

The wiring device (100, 100A) of the thirteenth aspect is any one of the first to twelfth aspects, and further includes: input circuit (101), conversion circuit (diode bridge 103, DC /DC converter 105) and output circuit (106). The input circuit (101) is connected to an external power supply and receives AC input power from the external power supply. The conversion circuit is composed of a plurality of electronic components mounted on at least one of the first substrate (11, 11A) and the second substrate (21, 21A). The conversion circuit converts the input power into DC output power. The output circuit (106) outputs the output power.

In this way, output power can be supplied to an external device.

1: the first block 2: The second block 3: The third block 4: Input block 5: Output block 8,8A: shell 11: Substrate 11A: first substrate 12: Electronic components 13: terminal 21,21A: Second substrate 22: Electronic components 23: Pin connector 31: The third substrate 32: Electronic components 41: Input substrate 42: Input terminal 43: Electronic components 44: Terminal cover 45: wire 46:Release button 51: Output substrate 52: output terminal 53: Electronic components 61: insulation sheet 62: bottom 63: side 65: Second insulating sheet 66: The third insulating sheet 71: cooling components 71A: the first heat dissipation member 72, 72A: second heat dissipation member 73: Additional cooling components 81,81A: shell 82,82A: bottom wall 83: side wall 85,85A: cover body 86: top wall 87: side wall 90,91: screw 92: spacer 93:Nut 99:Heating parts 100,100A: Wiring equipment 101: Input circuit 102: Common mode filter 103:Diode bridge 104: Differential mode filter 105:DC/DC Converter 106: output circuit 107: Control circuit 110: External power supply 111: The first side 112: The second side 113: through hole 114: copper inlay 200: electrical equipment 211: The first side 212: second side 300:USB cable 301:USB plug 311: first side 312: second side 400: Power cable 401: Power cord 411: first side 412: second side 421: Terminal part 422: Terminal clip 423: Pressing part 424: lock department 441: Insertion hole 442: Operation hole 511: the first side 512: the second side 610~615: opening 628: Gap 629: Through hole 631: upper side 632: lower side 633: left side 634: the right side 635: protrusion 711~713: flakes 810: opening 811: Hollow Department 813: protrusion 814: depression 821: through hole 831: upper wall 832: lower wall 833: left wall 833A: left wall (second side wall) 834: right wall 834A: right wall (first side wall) 836~838: corners 841: through hole 842: Barrel 851: Convex 852: Installation sheet 853: Convex 861: Through hole 862: Reinforcing ribs 871: upper wall 872: lower wall 873: left wall 874: right wall 875: recess 876~879: corners 921: through hole A0~A3, A10: Normal direction D1: Front and rear direction D2: up and down direction D3: left and right directions R0~R2: Distance X1: imaginary line

Fig. 1 is a perspective view of a wiring device of an embodiment. Fig. 2 is an exploded perspective view of the same wiring appliance as above. Fig. 3 is an exploded perspective view of the same wiring appliance as above. Fig. 4 is the front view of the same wiring appliance as above. Fig. 5 is a sectional view along the line V-V in Fig. 4 of the above wiring device. Fig. 6 is a cross-sectional view along line VI-VI of Fig. 4 of the above wiring device. Fig. 7 is a cross-sectional view along line VII-VII of Fig. 4 of the above wiring device. Fig. 8 is a sectional view of the same wiring device along line VIII-VIII in Fig. 4 . Fig. 9 is a front view of the main part of the above wiring device. Fig. 10 is a diagram schematically showing a cross section of the main part of the above wiring device. Fig. 11 is a diagram schematically showing a section of another main part of the above wiring device. Fig. 12 is a block diagram showing the circuit configuration of the above wiring device. FIG. 13 is a diagram schematically showing a cross section of a main part of a wiring harness according to Modification 1. FIG. FIG. 14 is a perspective view of a wiring device according to Modification 2. FIG.

11: Substrate

12: Electronic components

13: terminal

21: Second substrate

22: Electronic components

23: Pin connector

51: Output substrate

52: output terminal

53: Electronic components

62: bottom

65: Second insulating sheet

71: cooling components

72: the second heat dissipation member

73: Additional cooling components

81: Shell

82: bottom wall

83: side wall

85: cover body

100: Wiring equipment

111: The first side

112: The second side

211: The first side

212: second side

612,614: opening

711,713: flakes

A0~A2: normal direction

D1: Front and rear directions

D3: left and right directions

Claims (13)

A wiring device, comprising: first substrate; second substrate; The casing has a bottom wall and a side wall intersecting the bottom wall, and accommodates the first substrate and the second substrate in such a manner that the first substrate faces the bottom wall and the second substrate faces the side wall ; a first heat dissipation member disposed between the first substrate and the bottom wall of the casing; and The second heat dissipation component is disposed between the second substrate and the side wall of the casing. The wiring device as described in Claim 1, wherein, The casing has a larger thermal conductivity than the insulating plate of the first substrate. The wiring device as described in Claim 2, wherein, The case is made of metal. The wiring device according to any one of Claims 1 to 3, wherein, At least one heat generating component is mounted on the first substrate. The wiring device as described in Claim 4, wherein, The first heat dissipation member is in contact with the heat generating component mounted on the first substrate. The wiring device as described in Claim 4, wherein, At least one heat generating component is mounted on the second substrate. The wiring device as described in Claim 6, wherein, The second heat dissipation member is in contact with the heat generating component mounted on the second substrate. The wiring device according to any one of Claims 1 to 3, wherein, At least one of the first heat dissipation member and the second heat dissipation member is stretchable. The wiring device according to any one of Claims 1 to 3, wherein, At least one of the first heat dissipation component and the second heat dissipation component is a heat dissipation fin. The wiring device according to any one of Claims 1 to 3, wherein, The first heat dissipation member is in contact with the bottom wall of the housing. The wiring device according to any one of Claims 1 to 3, wherein, The second heat dissipation member is in contact with the side wall of the housing. The wiring device as described in any one of claims 1 to 3, further comprising: an input circuit connected to an external power source from which AC input power is input; a conversion circuit composed of a plurality of electronic components mounted on at least one of the first substrate and the second substrate, and converts the input power into DC output power; and The output circuit outputs the output power. A wiring device, comprising: first substrate; second substrate; The casing has a bottom wall, a first side wall and a second side wall intersecting the bottom wall, and the first substrate faces the first side wall, and the second substrate faces the second side wall, and accommodates the first substrate and the second substrate; a first heat dissipation member disposed between the first substrate and the first side wall of the casing; and a second heat dissipation member disposed between the second substrate and the second side wall of the housing; The first substrate is opposite to the second substrate.

Images