WO2023112721A1

WO2023112721A1 - Wiring tool

Info

Publication number: WO2023112721A1
Application number: PCT/JP2022/044541
Authority: WO
Inventors: 純輝山本; 智士鈴木; 思含董
Original assignee: パナソニックＩｐマネジメント株式会社
Priority date: 2021-12-17
Filing date: 2022-12-02
Publication date: 2023-06-22
Also published as: TW202332147A; JP2023090461A

Abstract

The present disclosure addresses the problem of providing a wiring tool that can effectively use the limited space inside the tool. This wiring tool (1) comprises: a first substrate (e.g., parent substrate 100) on which a first circuit block (2) is disposed; and a second substrate (e.g., child substrate 200) on which a second circuit block (3) is disposed. The first circuit block (2) includes at least one circuit among: a circuit that outputs a signal to the second circuit block (3); and a circuit that receives a signal from the second circuit block (3). The second substrate is electrically connected to the first substrate.

Description

Wiring device

TECHNICAL FIELD The present disclosure relates generally to wiring devices, and more particularly to wiring devices including substrates.

Conventionally, a USB (Universal Serial Bus) outlet (wiring device) shown in Patent Document 1 is known as a wiring device. A USB outlet disclosed in Patent Document 1 includes a housing having a cover and a body. The body has a storage recess. Circuit components are housed in the housing recess.

JP 2016-178097 A

In recent years, USB outlets (wiring devices) are equipped with a large number of electronic components, etc., and there is a tendency for USB outlets to become larger. In order to avoid increasing the size of the USB outlet, it is necessary to effectively utilize the limited space.

The present disclosure has been made in view of the above problems, and aims to provide a wiring device that can effectively utilize the limited space inside the device.

A wiring accessory according to one aspect of the present disclosure includes a first substrate on which a first circuit block is arranged and a second substrate on which a second circuit block is arranged. The first circuit block includes at least one of a circuit that outputs a signal to the second circuit block and a circuit that receives a signal from the second circuit block. The second substrate is electrically connected to the first substrate.

Drawing 1 is a block diagram showing composition of wiring accessories concerning one embodiment. FIG. 2 : is another block diagram which shows the structure of wiring accessories same as the above. FIG. 3 : is a perspective view of wiring accessories same as the above. FIG. 4 is an exploded perspective view of the same wiring accessory. 5 is a cross-sectional view taken along line X1-X1 in FIG. 3. FIG. 6 is a cross-sectional view taken along the line X2-X2 in FIG. 3. FIG.

The embodiments and modifications described below are merely examples of the present disclosure, and the present disclosure is not limited to the following embodiments and modifications. Other than the following embodiments and modifications, various modifications can be made according to the design and the like within the scope of the technical idea of the present disclosure.

(embodiment)
A wiring accessory 1 according to the present embodiment will be described below with reference to FIGS. 1 to 6. FIG.

(1) Overview The wiring device 1 according to the present embodiment is, for example, a USB outlet to which a USB plug provided at the tip of a USB (Universal Serial Bus) cable can be connected, and satisfies the USB-PD (Power Delivery) standard. . For example, the wiring accessory 1 conforms to the charging standard after USB-PD3.0. Since the wiring device 1 complies with the USB-PD charging standard, it can output relatively large power such as 240 W (48 V, 5 A) and 100 W (20 V, 5 A). A wiring accessory 1 according to the present embodiment supplies power to an electrical device (for example, a smart phone) electrically connected to a USB cable. Moreover, the wiring accessories 1 which concern on this embodiment are indoor wiring accessories attached to the wall of a building, for example. The building in which the wiring device 1 is installed is, for example, a detached house, each dwelling unit of an apartment complex, an office, a store, or a nursing care facility.

The wiring device 1 is attached to the construction surface (here, the wall surface of the building) with the wires electrically connected to the wiring device 1 . In this wiring device 1, the USB plug of the USB cable is electrically connected by inserting the USB plug into the through hole 80 (see FIG. 3) formed in the front surface of the cover C2 (see FIG. 3) of the wiring device 1. , and power can be supplied from the wiring accessory 1 to the electrical equipment. Here, the wiring device 1 is an embedded wiring device, and is attached to a construction surface using an attachment frame. Specifically, the wiring device 1 is attached to the construction surface by fixing the mounting frame to which the wiring device 1 is attached, for example, to an embedded box. The embedded box here is a box-shaped member with an open front surface, and is installed in the wall so that the front surface is exposed forward through a construction hole formed in the construction surface.

As shown in FIG. 2, the wiring device 1 includes a parent board 100 (first board) on which the first circuit block 2 is arranged and a child board 200 (second board) on which the second circuit block 3 is arranged. And prepare. The first circuit block 2 includes at least one of circuits that output signals to the second circuit block 3 and circuits that receive signals from the second circuit block 3 . The child board 200 is electrically connected to the parent board 100 . In this embodiment, the first circuit block 2 includes both a circuit that outputs signals to the second circuit block 3 and a circuit that receives signals from the second circuit block 3 .

According to this configuration, the circuits included in the wiring device 1 are arranged separately on the parent board 100 and the child board 200 . That is, the circuit included in the wiring accessory 1 is divided into the parent board 100 and the child board 200 . Therefore, the child board 200 can be arranged in the empty space when the parent board 100 is arranged. As a result, the limited space inside the wiring accessory 1 can be effectively utilized. Thereby, enlargement of the wiring accessories 1 can be avoided.

Further, as shown in FIG. 5, the wiring device 1 includes a substrate (mother substrate 100) on which a plurality of electronic components are arranged, a case (body C3) that accommodates the substrate, a spacer 9, a heat dissipation member 60, Prepare. A spacer 9 is arranged between the substrate and the case and is in contact with the substrate and the case. The heat dissipation member 60 is arranged between the substrate and the case. The substrate, case and spacer 9 are fastened with screws 6 .

According to this configuration, the heat generated by the multiple electronic components can be radiated from the case via the heat radiation member 60. Furthermore, since the substrate, case and spacer 9 are fastened with screws 6, positioning of the substrate can be easily performed. Therefore, it is possible to improve the heat dissipation while ensuring the internal volume.

(2) Configuration Hereinafter, wiring accessories 1 according to the present embodiment will be described in detail. In the following description, unless otherwise specified, the arrows shown in FIGS. 3 to 6 define the up-down, left-right, and front-rear directions of the wiring device 1. As shown in FIG. That is, when viewed from the front of the wiring device 1 attached to the construction surface, the vertical direction is the up-down direction, the normal direction of the construction surface is the front-back direction, and the direction orthogonal to both the up-down direction and the front-back direction is the left-right direction. direction. However, these directions are not the meaning which prescribe|regulates the usage direction of the wiring accessories 1. FIG. Also, the arrows shown in FIGS. 3 to 6 are merely described for the purpose of assisting the explanation, and are not substantial.

A wiring device 1 according to this embodiment includes a common filter 10, a diode bridge 20, a normal filter 30, an insulated DC/DC converter 40, and an output circuit 50, as shown in FIG. The wiring accessories 1 are provided with the power supply unit 5, as shown in FIG.3 and FIG.4.

The power supply unit 5 is provided on the lower right side of the wiring device 1. The power supply unit 5 includes quick-connect terminals. The quick-connect terminals are electrically connected to a distribution board connected to the commercial power source 1000 . The quick-connect terminal is electrically connected to the common filter 10 via

wires

5a and 5b.

The common filter 10 filters the power (current) supplied from the commercial power supply 1000 to pass the current with reduced common mode noise.

The diode bridge 20 includes multiple rectifying diodes 21 . A plurality of rectifying diodes 21 constitute a bridge circuit. Diode bridge 20 rectifies the current passed through common filter 10 . The AC power rectified by the diode bridge 20 is converted to DC power by the normal filter 30 .

The normal filter 30 includes a coil 31 and a plurality of (one in the illustrated example) capacitors 32, as shown in FIGS. The normal filter 30 filters the rectified current and passes the current with reduced normal mode noise. Furthermore, the normal filter 30 converts the AC power rectified by the diode bridge 20 into DC power.

The isolated DC/DC converter 40 is an active clamp flyback circuit. The isolated DC/DC converter 40 includes an active clamp circuit having a regeneration capacitor 41, an isolation transformer 42 and a switching device 43, as shown in FIGS. Switching device 43 includes, for example, a GaN device, as shown in FIG. The switching device 43 may be an IGBT (Insulated Gate Bipolar Transistor), a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), or the like. The insulated DC/DC converter 40 converts DC power with reduced common mode noise and normal mode noise into DC power with a predetermined voltage. For example, the isolated DC/DC converter 40 converts DC power with a voltage of 20V into DC power with a voltage of 5V. Alternatively, the insulated DC/DC converter 40 converts DC power with a voltage of 5V into DC power with a voltage of 20V. 4 to 6, the switching device 43 is omitted.

The output circuit 50 includes a plurality of (two in the illustrated example) output terminals 51, as shown in FIG. The output terminal 51 is, for example, a USB socket. The output terminal 51 is, for example, a USB Type-C terminal. The output terminal 51 is electrically connected to the insulated DC/DC converter 40 . The output terminal 51 can be connected to a USB plug of a USB cable. By connecting the USB plug of the USB cable to the output terminal 51, it becomes possible to supply electric power of a predetermined voltage to the electric device.

As shown in FIG. 2, the wiring device 1 includes a parent board 100 on which the first circuit block 2 is arranged, and a child board 200 on which the second circuit block 3 is arranged. The first circuit block 2 includes at least one of circuits that output signals to the second circuit block 3 and circuits that receive signals from the second circuit block 3 . The child board 200 is electrically connected to the parent board 100 .

The mother board 100 is, for example, a printed wiring board including an insulating plate made of glass-epoxy resin and pattern conductors formed on the insulating plate. A plurality of electronic components are arranged on the mother board 100 . The multiple electronic components include multiple heat generating components 4 . Here, each of the plurality of heat-generating components 4 is a component having a heat value equal to or greater than a predetermined value. The multiple heat-generating components 4 include switching devices 43 . The multiple heat-generating components 4 include diode bridges 20 . Diode bridge 20 includes rectifying diodes 21 . That is, the multiple heat-generating components 4 include rectifying diodes 21 . Note that the diode bridge 20 may be packaged with a plurality of rectifying diodes 21 . In this case, the packaged diode bridge 20 is placed on the parent substrate 100 . Also, the plurality of heat-generating components 4 includes an isolation transformer 42 . That is, the first circuit block 2 includes multiple electronic components. In other words, the first circuit block 2 includes the rectifying diode 21 and the isolation transformer 42 . Here, a circuit included in the first circuit block 2 and outputting a signal to the second circuit block 3 corresponds to a circuit composed of the rectifying diodes 21 , ie, the diode bridge 20 . A circuit that is included in the first circuit block 2 and receives a signal from the second circuit block 3 corresponds to a circuit that constitutes the diode bridge 20 and the isolation transformer 42 .

The child board 200 includes a first child board 201 (third board) and a second child board 202 (fourth board). The first child board 201 and the second child board 202 are, for example, printed wiring boards including an insulating plate made of glass-epoxy resin and pattern conductors formed on the insulating plate.

The second circuit block 3 includes at least part of the common filter functions of the common filter 10 . Here, a circuit including all common filter functions is arranged on the first slave board 201 . That is, all the circuits forming the common filter 10 are arranged on the first child board 201 .

The second circuit block 3 includes at least part of the normal filter functions of the normal filter 30 . Here, part of the normal filter function circuit is arranged on the second child board 202 . In other words, part of the circuits that constitute the normal filter 30 are arranged on the second slave board 202 . For example, the rest of the circuits that make up the normal filter 30 are arranged on the mother board 100 .

In short, the second circuit block 3 includes a first function that is at least part of the common filter function and a second function that is at least part of the normal filter function. A circuit constituting the first function of the second circuit block 3 is arranged on the first slave board 201 . A circuit constituting the second function of the second circuit block 3 is arranged on the second slave board 202 . In this embodiment, the first function is all common filter functions and the second function is all normal filter functions.

Also, a regeneration capacitor 41 included in the insulated DC/DC converter 40 is arranged on the second child board 202 . In other words, some of the functions of the isolated DC/DC converter 40 are arranged on the mother board 100 . In this embodiment, the heat-generating components among the electronic components that make up the insulated DC/DC converter 40 are arranged on the mother board 100 , and the other electronic components are arranged on the child board 200 . That is, the other electronic components arranged on the child board 200 include electronic components that generate less than a predetermined amount of heat. Note that all the functions of the isolated DC/DC converter 40 may be arranged on the mother board 100 . That is, the regeneration capacitor 41 may be arranged on the mother board 100 .

A plurality of pin connectors 210 for connecting to the parent board 100 are provided on the child board 200 (the first child board 201 and the second child board 202). Further, the mother board 100 is provided with a plurality of connecting portions 110 for inserting a plurality of pin connectors 210 provided on each of the first child board 201 and the second child board 202 . That is, by inserting the plurality of pin connectors 210 into the plurality of connecting portions 110 one-to-one, the parent board 100 and the child board 200 are electrically connected. A plurality of (one in FIG. 5) pin connectors 210 of the first child board 201 are arranged behind the first child board 201 . A plurality of (one in FIG. 6) pin connectors 210 of the second slave board 202 are arranged behind the second slave board 202 . A plurality of (one in FIG. 5) connecting portions 110 connected to the plurality of pin connectors 210 of the first child board 201 are arranged below the mother board 100 . That is, the first child board 201 is electrically connected to the parent board 100 below the parent board 100 . A plurality of (one in FIG. 6) connecting portions 110 connected to a plurality of pin connectors 210 of the second child board 202 are arranged at the upper left end portion of the mother board 100 . That is, the second child board 202 is electrically connected to the mother board 100 at the upper left end portion of the mother board 100 .

When the parent board 100 and the child board 200 are connected by the pin connector 210, the normal line A1 of the parent board 100 and the normal line of the child board 200 intersect. Specifically, the normal line A1 of the mother board 100 and the normal line A2 of the first daughter board 201 intersect, and the normal line A1 of the mother board 100 and the normal line A2 of the second daughter board 202 intersect. .

The wiring accessory 1 includes an output circuit board 300, as shown in FIGS. The output circuit board 300 is, for example, a printed wiring board including an insulating plate made of glass-epoxy resin and pattern conductors formed on the insulating plate. An output circuit 50 is arranged on the output circuit board 300 . That is, a plurality of output terminals 51 are arranged on the output circuit board 300 .

The wiring device 1 includes a housing C1, as shown in FIG. The housing C1 includes a cover C2 and a body C3 (case). The body C3 is formed in a box shape with one surface (front surface) open. The cover C2 is attached to the body C3 so as to close the opening. In this embodiment, the cover C2 is attached to the body C3 by being screwed with a plurality of screws 8. As shown in FIG. The cover C2 is made of PBT (polybutylene terephthalate) resin. The body C3 is made of die-cast aluminum.

A plurality of (two in the illustrated example) through holes 80 are formed in the cover C2. The plurality of through holes 80 correspond to the plurality of output terminals 51 on a one-to-one basis. The plurality of output terminals 51 face the plurality of through holes 80 of the cover C2 in the assembled wiring device 1 . Therefore, by inserting the USB plug of the USB cable into the through-hole 80, the USB plug is electrically connected to the output terminal 51, and power can be supplied from the wiring device 1 to the electrical equipment.

The body C3 accommodates the parent board 100 and the child board 200 . Body C3 accommodates output circuit board 300 .

Also, the wiring device 1 includes a spacer 9 and a heat dissipation member 60 . Furthermore, the wiring device 1 includes screws 6 and nuts 7 .

The spacer 9 is resin-molded. For example, the spacer 9 is made of PBT resin. The spacer 9 has a rectangular tubular shape. The spacer 9 is arranged between the mother board 100 and the body C3 (case), and is in contact with the mother board 100 and the body C3 when the wiring device 1 is assembled. Mother board 100 , body C 3 and spacer 9 are fastened with screws 6 . By fastening the mother substrate 100, the body C3 and the spacer 9 with screws 6, the positioning of the mother substrate 100 can be easily performed.

The mother board 100 (board), body C3 (case) and spacer 9 are fastened with screws 6 and nuts 7 . The screws 6 are, for example, countersunk machine screws 6a, and are molded from resin. The nut 7 is resin-molded and used in combination with the screw 6 . For example, the screws 6 and nuts 7 are made of PBT resin.

A countersunk hole 81 penetrating in the front-rear direction is formed in the bottom portion C31 of the body C3. Further, a through hole 101 is formed through the mother substrate 100 in the front-rear direction. The screws 6 are sequentially inserted through the countersunk holes 81 of the body C3, the spacers 9, and the through holes of the mother board 100. As shown in FIG. The screws 6 inserted through the countersunk holes 81 of the body C3, the spacers 9, and the through holes of the mother board 100 are combined with the nuts 7, so that the mother board 100, the body C3, and the spacers 9 are fastened. As a result, the mother board 100 is fixed to the housing C1 by the screws 6, and the distance between the bottom portion C31 of the body C3 and the mother board 100 is maintained at the dimension of the spacer 9 in the front-rear direction.

The heat dissipation member 60 is arranged between the mother board 100 and the body C3 (case). The heat radiating member 60 is, for example, a thermal sheet, and is made of stretchable silicon. The heat radiating member 60 radiates heat from the heat generating component 4 arranged on the mother board 100 to the outside through the body C3. In this embodiment, a plurality of (three in FIG. 4) heat dissipation members 60 are arranged between the mother board 100 and the body C3 (case). That is, the child board 200 is arranged on the side opposite to the heat radiation member 60 with respect to the mother board 100 . Further, when the mother board 100 is viewed from above in the front-rear direction, the plurality of heat dissipation members 60 overlap at least a portion of the mother board 100 (see FIGS. 4 and 5). More specifically, in at least one heat dissipation member 60 (for example, heat dissipation member 61) among the plurality of heat dissipation members 60, at least part of the heat dissipation member 61 is provided on the mother substrate 100 (substrate). (for example, the isolation transformer 42). In addition, the wiring accessories 1 may be configured to include one heat dissipation member 60 .

Since the mother board 100 (board), the body C3 (case) and the spacer 9 are fastened with screws 6 and nuts 7, the heat dissipation member 60 is compressed by the mother board 100 and the bottom portion C31 of the body C3. As a result, it is possible to improve the heat radiation performance of the heat-generating component 4 which is an electronic component arranged on the mother board 100 .

As described above, a plurality of electronic components are arranged on the mother board 100 . The plurality of electronic components include heat-generating components arranged between the mother board 100 (substrate) and the body C3 (case). The heat dissipation member 60 is provided so as to cover the heat generating components arranged between the mother board 100 and the body C3. A heat-generating component arranged between the mother board 100 and the body C3 is, for example, a rectifying diode 21 (see FIGS. 4 and 5).

The wiring device 1 includes a plurality of insulating sheets 70, as shown in FIGS. The plurality of insulating sheets 70 provide insulation between the electronic components arranged on the parent substrate 100 or the child substrate 200 and other components or members. The plurality of insulation sheets 70 includes a first insulation sheet 71 , a second insulation sheet 72 and a third insulation sheet 73 .

The first insulating sheet 71 includes a side sheet 75 covering the side surface C32 of the body C3 and a bottom sheet 76 covering the bottom portion C31 of the body C3. That is, the first insulating sheet 71 insulates the electronic components arranged on the parent board 100, the electronic components arranged on the child board 200 (the first child board 201 and the second child board 202), and the body C3. do. A plurality of openings are formed in the first insulating sheet 71 . The plurality of openings correspond to the plurality of heat dissipation members 60 on a one-to-one basis. A corresponding heat dissipation member 60 is fitted in each of the plurality of openings. That is, the heat dissipation member 60 contacts the bottom of the body C3 (see FIGS. 5 and 6).

The second insulating sheet 72 is arranged between the insulating transformer 42 and the output circuit board 300 so as to cover the front of the insulating transformer 42 arranged on the mother board 100 . That is, the second insulating sheet 72 insulates the output circuit board 300 from the insulating transformer 42 , which is an electronic component arranged on the mother board 100 .

The third insulating sheet 73 is arranged between the common filter 10 and the output circuit board 300 so as to cover the front of the common filter 10 arranged on the first child board 201 . That is, the third insulating sheet 73 insulates the output circuit board 300 from the common filter 10, which is an electronic component arranged on the child board 200 (first child board 201).

Note that the wiring device 1 may be configured to include one insulating sheet 70 , for example, to include only the first insulating sheet 71 .

(3) Effect As described above, in the wiring device 1 according to the present embodiment, the mother board 100 (first board) on which the first circuit block 2 is arranged and the second circuit block 3 are arranged. and a child board 200 (second board). The first circuit block 2 includes at least one of circuits that output signals to the second circuit block 3 and circuits that receive signals from the second circuit block 3 . The child board 200 is electrically connected to the parent board 100 . In this embodiment, the first circuit block 2 includes both a circuit that outputs signals to the second circuit block 3 and a circuit that receives signals from the second circuit block 3 .

Moreover, the wiring device 1 according to the present embodiment includes a substrate (mother substrate 100) on which a plurality of electronic components are arranged, a case (body C3) that houses the substrate, a spacer 9, and a heat dissipation member 60. . A spacer 9 is arranged between the substrate and the case and is in contact with the substrate and the case. The heat dissipation member 60 is arranged between the substrate and the case. The substrate, case and spacer 9 are fastened with screws 6 .

With this configuration, the heat generated by the multiple electronic components can be radiated from the case through the heat radiation member. Furthermore, since the substrate, the case and the spacer 9 are fastened with screws 6, the substrate can be easily positioned while compressing the heat radiating member 60. FIG. Therefore, it is possible to improve the heat dissipation while ensuring the internal volume.

(4) Modifications Modifications are listed below. It should be noted that the modified examples described below can be applied in appropriate combination with the above-described embodiment.

In the embodiment, the mother board 100 and the body C3 are configured to be fastened together with a screw at one point via the spacer 9, but the configuration is not limited to this. The mother board 100 and the body C3 may be fastened with screws 6 (countersunk screws 6a) via a plurality of spacers 9 corresponding to each of the plurality of screwed locations provided with a plurality of screwed locations.

The screw 6 may be a screw of a different kind than the countersunk machine screw 6a.

In the embodiment, the child board 200 is configured to include the first child board 201 and the second child board 202, but is not limited to this configuration. There may be one child board 200 . In this case, both the common filter 10 and the normal filter may be arranged on one child board 200 . Alternatively, one of the common filter 10 and the normal filter may be arranged on one child board 200 . When one of the common filter 10 and the normal filter is arranged on one child board 200 , the other is arranged on the parent board 100 .

In the embodiment, the child board 200 (first child board 201, second child board 202) is configured to be electrically connected to the parent board 100 via a plurality of pin connectors 210, but the configuration is not limited to this. . The child board 200 (the first child board 201 and the second child board 202 ) may be electrically connected to the parent board 100 via one pin connector 210 . Alternatively, the child board 200 (first child board 201, second child board 202) may be electrically connected to the parent board 100 via one or more wires.

(5) Conclusion Based on the embodiments and the like described above, the present specification discloses the following aspects.

(5.1) First Summary The wiring device (1) of the first aspect includes a first substrate (mother substrate 100) on which a first circuit block (2) is arranged, and a second circuit block (3). and a second board (child board 200) on which is arranged. The first circuit block (2) includes at least one of a circuit that outputs a signal to the second circuit block (3) and a circuit that receives a signal from the second circuit block (3). The second substrate is electrically connected to the first substrate.

According to this configuration, it is possible to arrange the second substrate in the empty space when the first substrate is arranged. As a result, the limited space inside the wiring device (1) can be effectively utilized. Thereby, an increase in the size of the wiring device (1) can be avoided.

In the wiring device (1) of the second aspect, in the first aspect, the normal (A1) of the first substrate and the normal (A2, A3) of the second substrate intersect.

According to this configuration, the limited space inside the wiring device (1) can be effectively used.

In the wiring device (1) of the third aspect, in the second aspect, the first board and the second board are connected by a pin connector (210).

According to this configuration, it is possible to easily connect the first substrate and the second substrate.

In the wiring device (1) of the fourth aspect, in any one of the first to third aspects, the first circuit block (2) includes a plurality of heat generating components (4).

According to this configuration, a plurality of heat generating components (4) can be arranged on one substrate.

In the wiring device (1) of the fifth aspect, in the fourth aspect, the plurality of heat generating components (4) include rectifying diodes (21).

According to this configuration, the rectifying diode (21) can be arranged on one substrate along with other heat-generating components (4).

In the wiring device (1) of the sixth aspect, in the fourth or fifth aspect, the plurality of heat generating components (4) includes an isolation transformer (42).

According to this configuration, the isolation transformer (42) can be arranged on one substrate together with other heat-generating components (4).

In the wiring device (1) of the seventh aspect, in any one of the fourth to sixth aspects, the plurality of heat-generating components (4) include switching devices (43).

According to this configuration, the switching device (43) can be arranged on one substrate together with other heat-generating components (4).

In the wiring device (1) of the eighth aspect, in the seventh aspect, the switching device (43) includes a GaN device (44).

According to this configuration, the GaN device (44) can be arranged on one substrate together with other heat-generating components (4).

In the wiring device (1) of the ninth aspect, in any one of the first to eighth aspects, the second circuit block (3) includes at least part of the common filter function.

According to this configuration, at least part of the functions of the common filter (10) can be included in the second circuit block (3).

In the wiring device (1) of the tenth aspect, in any one of the first to eighth aspects, the second circuit block (3) includes at least part of the normal filter function.

In the wiring device (1) of the eleventh aspect, in any one of the first to eighth aspects, the second substrate includes a third substrate (first child substrate 201) and a fourth substrate (second child substrate 202). including. The second circuit block (3) includes a first function that is at least part of the common filter function and a second function that is at least part of the normal filter function. A circuit constituting the first function of the second circuit block (3) is arranged on the third substrate. A circuit constituting the second function of the second circuit block (3) is arranged on the fourth substrate.

According to this configuration, the first function of the common filter (10) and the second function of the normal filter (30) can be included in the second circuit block (3).

The wiring device (1) of the twelfth aspect, in any one of the first to eleventh aspects, further comprises a case (eg, body C3) and a heat radiating member (60). The case accommodates the first substrate and the second substrate. A heat dissipation member (60) is arranged between the case and the first substrate. The second substrate is arranged on the opposite side of the first substrate from the heat dissipation member (60).

(5.2) Second Summary The wiring device (1) of the first aspect consists of a board (for example, mother board 100) on which a plurality of electronic components are arranged and a case (for example, body C3) that houses the board. , a spacer (9), and a heat dissipation member (60). A spacer (9) is arranged between the substrate and the case and is in contact with the substrate and the case. A heat dissipation member (60) is arranged between the substrate and the case. The substrate, case and spacer (9) are fastened with screws (6).

With this configuration, the heat generated by the multiple electronic components can be radiated from the case through the heat radiation member. Furthermore, since the substrate, case and spacer (9) are fastened with screws (6), positioning of the substrate can be easily performed. Therefore, it is possible to improve the heat dissipation while ensuring the internal volume.

In the wiring device (1) of the second aspect, in the first aspect, the board, the case and the spacer (9) are fastened together with screws (6) and nuts (7). The screw (6), nut (7) and spacer (9) are resin-molded.

According to this configuration, since the screw (6), nut (7) and spacer (9) are resin-molded, it is possible to secure an insulation distance.

In the wiring device (1) of the third aspect, in the second aspect, the screws (6) are countersunk screws (6a). A countersunk hole (81) is formed in the case.

According to this configuration, by using the screw (6) as a countersunk screw (6a), it is possible to prevent the screw (6) from protruding from the case.

In the wiring device (1) of the fourth aspect, in any one of the first to third aspects, the plurality of electronic components include rectifying diodes (21).

According to this configuration, the heat dissipation of the rectifying diode (21) can be improved.

In the wiring device (1) of the fifth aspect, in any one of the first to fourth aspects, the plurality of electronic components includes an isolation transformer (42).

According to this configuration, it is possible to improve the heat dissipation of the insulating transformer (42).

In the wiring device (1) of the sixth aspect, in any one of the first to fifth aspects, the plurality of electronic components includes switching devices (43).

According to this configuration, the heat dissipation of the switching device (43) can be improved.

In the wiring device (1) of the seventh aspect, in the sixth aspect, the switching device (43) includes a GaN device (44).

According to this configuration, the heat dissipation of the GaN device (44) can be improved.

In the wiring device (1) of the eighth aspect, in any one of the first to seventh aspects, the case is made of die-cast aluminum.

According to this configuration, the efficiency of heat dissipation can be improved.

In the wiring device (1) of the ninth aspect, in any one of the first to eighth aspects, the plurality of electronic components includes heat-generating components (4) arranged between the board and the case. A heat radiation member (60) is provided so as to cover the heat generating component (4).

According to this configuration, it is possible to improve the heat dissipation of the heat-generating component (4) covered with the heat-dissipating member (60).

In the wiring device (1) of the tenth aspect, in any one of the first to ninth aspects, the plurality of electronic components includes heat-generating components (4). When the substrate is viewed from above, at least a portion of the heat radiating member (60) overlaps at least a portion of the heat generating component (4) provided on the substrate.

According to this configuration, it is possible to improve the heat dissipation of the heat-generating component (4) provided on the substrate.

REFERENCE SIGNS LIST 1 Wiring device 2 First circuit block 3 Second circuit block 4 Heat-generating component 6 Screw 6a Countersunk screw 7 Nut 9 Spacer 10 Common filter 21 Rectification diode 30 Normal filter 42 Insulation transformer 43 Switching device 44 GaN device 60 Heat dissipation member 61 Heat dissipation Member 81 Countersunk hole 100 Mother substrate (substrate, first substrate)
200 slave board (second board)
201 first slave board (third board)
202 second child board (fourth board)
210-pin connector A1 Normal A2 Normal A3 Normal C3 Body (Case)

Claims

a first substrate on which the first circuit block is arranged;
a second substrate on which the second circuit block is arranged;
the first circuit block includes at least one circuit out of a circuit that outputs a signal to the second circuit block and a circuit that receives a signal from the second circuit block;
the second substrate is electrically connected to the first substrate;
Wiring device.
a normal to the first substrate and a normal to the second substrate intersect;
The wiring device according to claim 1.
The first board and the second board are connected by a pin connector,
The wiring device according to claim 2.
the first circuit block includes a plurality of heat-generating components,
The wiring device according to any one of claims 1 to 3.
The plurality of heat-generating components include rectifying diodes,
The wiring device according to claim 4.
wherein the plurality of heat-generating components includes an isolation transformer;
The wiring device according to claim 4 or 5.
the plurality of heat-generating components include switching devices;
The wiring device according to any one of claims 4 to 6.
the switching device comprises a GaN device;
The wiring device according to claim 7.
the second circuit block includes at least part of a common filter function,
The wiring device according to any one of claims 1 to 8.
the second circuit block includes at least part of a normal filter function,
The wiring device according to any one of claims 1 to 8.
the second substrate includes a third substrate and a fourth substrate;
the second circuit block includes a first function that is at least part of a common filter function and a second function that is at least part of a normal filter function,
A circuit constituting the first function of the second circuit block is arranged on the third substrate,
A circuit constituting the second function among the second circuit blocks is arranged on the fourth substrate,
The wiring device according to any one of claims 1 to 8.
a case that accommodates the first substrate and the second substrate;
further comprising a heat dissipation member disposed between the case and the first substrate;
The second substrate is arranged on the side opposite to the heat dissipation member with respect to the first substrate,
The wiring device according to any one of claims 1 to 11.