TW202323367A - 組成物、硬化物、硬化物的製造方法、結構體及元件 - Google Patents
組成物、硬化物、硬化物的製造方法、結構體及元件 Download PDFInfo
- Publication number
- TW202323367A TW202323367A TW111136596A TW111136596A TW202323367A TW 202323367 A TW202323367 A TW 202323367A TW 111136596 A TW111136596 A TW 111136596A TW 111136596 A TW111136596 A TW 111136596A TW 202323367 A TW202323367 A TW 202323367A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- composition
- compound
- fluorine atom
- preferable
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F10/00—Homopolymers and copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021161594 | 2021-09-30 | ||
JP2021-161594 | 2021-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202323367A true TW202323367A (zh) | 2023-06-16 |
Family
ID=85782590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111136596A TW202323367A (zh) | 2021-09-30 | 2022-09-27 | 組成物、硬化物、硬化物的製造方法、結構體及元件 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2023054222A1 (ja) |
TW (1) | TW202323367A (ja) |
WO (1) | WO2023054222A1 (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1464676B2 (en) * | 2001-12-17 | 2020-05-13 | Daikin Industries, Ltd. | Crosslinkable elastomer composition and formed product comprising the same |
WO2016171104A1 (ja) * | 2015-04-20 | 2016-10-27 | 旭硝子株式会社 | 絶縁被膜付き電磁鋼板および水系表面処理剤 |
JP6859736B2 (ja) * | 2017-02-16 | 2021-04-14 | 三菱マテリアル株式会社 | 電着液及びこれを用いた絶縁皮膜付き導体の製造方法 |
JP2020037662A (ja) * | 2018-09-05 | 2020-03-12 | Agc株式会社 | フッ素樹脂膜、分散液の製造方法およびフッ素樹脂膜付基材の製造方法 |
-
2022
- 2022-09-26 WO PCT/JP2022/035571 patent/WO2023054222A1/ja active Application Filing
- 2022-09-26 JP JP2023551450A patent/JPWO2023054222A1/ja active Pending
- 2022-09-27 TW TW111136596A patent/TW202323367A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JPWO2023054222A1 (ja) | 2023-04-06 |
WO2023054222A1 (ja) | 2023-04-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI758415B (zh) | 感光性樹脂組成物、含雜環聚合物前體、硬化膜、積層體、硬化膜的製造方法及半導體裝置 | |
TWI728137B (zh) | 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體裝置、積層體的製造方法、半導體裝置的製造方法及聚醯亞胺前驅物 | |
JP5064950B2 (ja) | 新規な感光性樹脂組成物、それから得られる感光性樹脂組成物溶液、感光性フィルム、絶縁膜及び絶縁膜付きプリント配線板 | |
KR20190033582A (ko) | 수지 조성물 및 그 응용 | |
US8063245B2 (en) | Phosphazene compound, photosensitive resin composition and use thereof | |
TWI751341B (zh) | 感光性樹脂組成物、聚合物前驅物、硬化膜、積層體、硬化膜的製造方法及半導體裝置 | |
TWI802640B (zh) | 感光性樹脂組成物、樹脂、硬化膜、積層體、硬化膜之製造方法、半導體元件 | |
JP7422763B2 (ja) | 硬化性樹脂組成物、硬化性樹脂組成物の製造方法、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス | |
CN111094397B (zh) | 聚酰亚胺树脂及包含其的负型感光性树脂组合物 | |
TW202116876A (zh) | 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件、樹脂及樹脂的製造方法 | |
WO2008007673A1 (fr) | Guide de lumière souple et carte stratifiée pour carte de circuit composite optique/électrique | |
JP2005154643A (ja) | 活性エネルギー線硬化型アルカリ可溶性イミド樹脂、活性エネルギー線硬化型アルカリ可溶性イミド樹脂組成物、ソルダーレジスト用組成物、プリント配線板および感光性ドライフィルム | |
JP5644068B2 (ja) | 感光性樹脂組成物、レジストパターンの製造法、及びハードディスクサスペンション | |
JP7431050B2 (ja) | 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス | |
TWI819121B (zh) | 硬化膜的製造方法、硬化膜、積層體的製造方法及半導體元件的製造方法 | |
WO2021039782A1 (ja) | 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、樹脂、及び、樹脂の製造方法 | |
JP5576181B2 (ja) | 感光性樹脂組成物及びそれを用いた感光性フィルム | |
WO2010110335A1 (ja) | 感光性樹脂組成物及び硬化膜 | |
CN112805317A (zh) | 树脂组合物、固化膜、层叠体、固化膜的制造方法及半导体器件 | |
JP2008007623A (ja) | ナノインプリント用組成物 | |
JP2011208025A (ja) | ポリイミド前駆体及びポリイミド前駆体を用いた感光性樹脂組成物 | |
CN113892058B (zh) | 感光性树脂组合物和其固化膜 | |
TWI836067B (zh) | 負型硬化性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件 | |
JP7078744B2 (ja) | 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、および半導体デバイス | |
US20240176240A1 (en) | Photosensitive resin composition, production method for polyimide cured film using same, and polyimide cured film |