TW202317689A - 樹脂組成物、接著薄膜、層間接著用黏合片、帶天線的半導體封裝用樹脂組成物及帶天線的半導體封裝 - Google Patents

樹脂組成物、接著薄膜、層間接著用黏合片、帶天線的半導體封裝用樹脂組成物及帶天線的半導體封裝 Download PDF

Info

Publication number
TW202317689A
TW202317689A TW111131714A TW111131714A TW202317689A TW 202317689 A TW202317689 A TW 202317689A TW 111131714 A TW111131714 A TW 111131714A TW 111131714 A TW111131714 A TW 111131714A TW 202317689 A TW202317689 A TW 202317689A
Authority
TW
Taiwan
Prior art keywords
heat resistance
resin composition
resistance test
loss tangent
dielectric loss
Prior art date
Application number
TW111131714A
Other languages
English (en)
Chinese (zh)
Inventor
宇佐美遼
高杉寛史
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202317689A publication Critical patent/TW202317689A/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/18—Homopolymers or copolymers or tetrafluoroethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW111131714A 2021-09-30 2022-08-23 樹脂組成物、接著薄膜、層間接著用黏合片、帶天線的半導體封裝用樹脂組成物及帶天線的半導體封裝 TW202317689A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021161112 2021-09-30
JP2021-161112 2021-09-30

Publications (1)

Publication Number Publication Date
TW202317689A true TW202317689A (zh) 2023-05-01

Family

ID=85782333

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111131714A TW202317689A (zh) 2021-09-30 2022-08-23 樹脂組成物、接著薄膜、層間接著用黏合片、帶天線的半導體封裝用樹脂組成物及帶天線的半導體封裝

Country Status (3)

Country Link
JP (1) JPWO2023053749A1 (https=)
TW (1) TW202317689A (https=)
WO (1) WO2023053749A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7081127B2 (ja) * 2017-12-05 2022-06-07 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
JP7137950B2 (ja) * 2018-03-28 2022-09-15 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、プリント配線板、及び樹脂付銅箔の処理方法
JP7410662B2 (ja) * 2018-12-10 2024-01-10 太陽ホールディングス株式会社 硬化性組成物、ドライフィルム、硬化物および電子部品
KR102723829B1 (ko) * 2019-08-06 2024-10-30 데쿠세리아루즈 가부시키가이샤 접착제 조성물, 열경화성 접착 시트 및 프린트 배선판
JP6909342B1 (ja) * 2020-07-31 2021-07-28 アイカ工業株式会社 樹脂組成物及びそれを用いた接着シート
CN112457651B (zh) * 2020-11-30 2022-09-20 南亚新材料科技股份有限公司 生物基树脂组合物、粘结片、覆金属箔层压板及印刷线路板
JP7550248B2 (ja) * 2021-02-10 2024-09-12 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔及びプリント配線板

Also Published As

Publication number Publication date
WO2023053749A1 (ja) 2023-04-06
JPWO2023053749A1 (https=) 2023-04-06

Similar Documents

Publication Publication Date Title
KR102323672B1 (ko) 수지 조성물 및 이를 사용한 절연 필름 및 반도체 장치
KR102138174B1 (ko) 수지 조성물, 그리고, 그것에 의한 접착 필름, 커버레이 필름, 층간 접착제
JP5463110B2 (ja) カバーレイフィルム
JP6022893B2 (ja) カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法
TWI910362B (zh) 樹脂組成物及其製造方法以及接著薄膜及層間接著用黏合片
JP7521715B2 (ja) 成形用樹脂組成物及び電子部品装置
KR102912082B1 (ko) 안테나 부착 반도체 패키지 및 안테나 부착 반도체 패키지용 수지 조성물
JP5422235B2 (ja) エポキシ樹脂組成物、エポキシ樹脂硬化物、エポキシ樹脂系導電性組成物およびエポキシ樹脂系導電性硬化物
KR101797723B1 (ko) 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체
TW202317689A (zh) 樹脂組成物、接著薄膜、層間接著用黏合片、帶天線的半導體封裝用樹脂組成物及帶天線的半導體封裝
TW202411329A (zh) 樹脂組成物、接著薄膜、層間接著用黏合片及帶天線的半導體封裝用樹脂組成物
CN101531805A (zh) 树脂组合物以及使用该树脂组合物的半导体装置
JP7540554B1 (ja) 成形用樹脂組成物及び電子部品装置
JP7710267B2 (ja) 樹脂組成物、並びに接着フィルム、積層基板、電子部品、及び半導体装置
WO2025204162A1 (ja) 樹脂組成物、それを用いた熱硬化性フィルム、熱硬化性フィルムの硬化物、及び半導体装置
KR20240100349A (ko) 수지 구비 금속박, 프린트 배선판 및 그 제조 방법, 그리고 반도체 패키지