TW202314811A - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TW202314811A
TW202314811A TW111128057A TW111128057A TW202314811A TW 202314811 A TW202314811 A TW 202314811A TW 111128057 A TW111128057 A TW 111128057A TW 111128057 A TW111128057 A TW 111128057A TW 202314811 A TW202314811 A TW 202314811A
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TW
Taiwan
Prior art keywords
substrate
wafer
dust collecting
collecting part
substrate processing
Prior art date
Application number
TW111128057A
Other languages
English (en)
Chinese (zh)
Inventor
川口義広
山脇陽平
中野征二
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202314811A publication Critical patent/TW202314811A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
    • B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Cleaning In General (AREA)
TW111128057A 2021-08-06 2022-07-27 基板處理裝置及基板處理方法 TW202314811A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021130306 2021-08-06
JP2021-130306 2021-08-06

Publications (1)

Publication Number Publication Date
TW202314811A true TW202314811A (zh) 2023-04-01

Family

ID=85154472

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111128057A TW202314811A (zh) 2021-08-06 2022-07-27 基板處理裝置及基板處理方法

Country Status (4)

Country Link
KR (1) KR20240035619A (ja)
CN (1) CN117729985A (ja)
TW (1) TW202314811A (ja)
WO (1) WO2023013469A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61182894A (ja) * 1985-02-07 1986-08-15 Hitachi Ltd アルミナ基板のレ−ザスクライブ法
US5132510A (en) * 1990-09-04 1992-07-21 Trumpf, Inc. Laser machine assembly for flow of workpieces therethrough and method of using same
JP3441244B2 (ja) * 1995-06-08 2003-08-25 株式会社アマダ 熱切断加工機のワークテーブル
JP2000343269A (ja) * 1999-06-07 2000-12-12 Hitachi Via Mechanics Ltd レーザー加工機
JP2001347433A (ja) * 2000-06-07 2001-12-18 Hitachi Ltd 吸着システム
JP4993886B2 (ja) 2005-09-07 2012-08-08 株式会社ディスコ レーザー加工装置
JP2010120038A (ja) * 2008-11-18 2010-06-03 Sugino Mach Ltd レーザー加工装置及びレーザー加工方法
JP7210001B2 (ja) * 2018-10-05 2023-01-23 株式会社アフレアー 気体供給吸引装置およびレーザ処理装置

Also Published As

Publication number Publication date
WO2023013469A1 (ja) 2023-02-09
KR20240035619A (ko) 2024-03-15
CN117729985A (zh) 2024-03-19

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