TW202312416A - 在封裝基板中的（諸）金屬結構中具有空隙定義區段以減小晶粒－基板機械應力的半導體晶粒模組封裝以及相關方法 - Google Patents

在封裝基板中的（諸）金屬結構中具有空隙定義區段以減小晶粒－基板機械應力的半導體晶粒模組封裝以及相關方法 Download PDF

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Publication number
TW202312416A
TW202312416A TW111124694A TW111124694A TW202312416A TW 202312416 A TW202312416 A TW 202312416A TW 111124694 A TW111124694 A TW 111124694A TW 111124694 A TW111124694 A TW 111124694A TW 202312416 A TW202312416 A TW 202312416A
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Taiwan
Prior art keywords
metal
void
die
metal structure
voids
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TW111124694A
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English (en)
Chinese (zh)
Inventor
安德列斯 德特萊森
杰崙 比倫
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美商高通公司
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Publication of TW202312416A publication Critical patent/TW202312416A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structure Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
TW111124694A 2021-09-09 2022-07-01 在封裝基板中的（諸）金屬結構中具有空隙定義區段以減小晶粒－基板機械應力的半導體晶粒模組封裝以及相關方法 TW202312416A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/470,961 US20230076844A1 (en) 2021-09-09 2021-09-09 Semiconductor die module packages with void-defined sections in a metal structure(s) in a package substrate to reduce die-substrate mechanical stress, and related methods
US17/470,961 2021-09-09

Publications (1)

Publication Number Publication Date
TW202312416A true TW202312416A (zh) 2023-03-16

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Family Applications (1)

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TW111124694A TW202312416A (zh) 2021-09-09 2022-07-01 在封裝基板中的（諸）金屬結構中具有空隙定義區段以減小晶粒－基板機械應力的半導體晶粒模組封裝以及相關方法

Country Status (7)

Country Link
US (1) US20230076844A1 (enExample)
EP (1) EP4399744A1 (enExample)
JP (1) JP2024533137A (enExample)
KR (1) KR20240057407A (enExample)
CN (1) CN117836937A (enExample)
TW (1) TW202312416A (enExample)
WO (1) WO2023039312A1 (enExample)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6175158B1 (en) * 1998-09-08 2001-01-16 Lucent Technologies Inc. Interposer for recessed flip-chip package
JP2003168848A (ja) * 2001-11-30 2003-06-13 Nec Kansai Ltd 配線基板
JP2009500830A (ja) * 2005-06-30 2009-01-08 サンディスク コーポレイション 封止された集積回路パッケージにおける歪みを減らす方法
US20100263914A1 (en) * 2009-04-16 2010-10-21 Qualcomm Incorporated Floating Metal Elements in a Package Substrate
US9659884B2 (en) * 2015-08-14 2017-05-23 Powertech Technology Inc. Carrier substrate
US9978699B1 (en) * 2017-04-07 2018-05-22 Dr Technology Consulting Company, Ltd. Three-dimensional complementary-conducting-strip structure
JP7357436B2 (ja) * 2017-04-10 2023-10-06 日東電工株式会社 撮像素子実装基板、その製造方法、および、実装基板集合体
JP7407498B2 (ja) * 2017-09-15 2024-01-04 日東電工株式会社 配線回路基板およびその製造方法

Also Published As

Publication number Publication date
CN117836937A (zh) 2024-04-05
WO2023039312A1 (en) 2023-03-16
JP2024533137A (ja) 2024-09-12
EP4399744A1 (en) 2024-07-17
KR20240057407A (ko) 2024-05-02
US20230076844A1 (en) 2023-03-09

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