TW202312295A - 半導體元件封裝之製造方法及半導體元件封裝 - Google Patents

半導體元件封裝之製造方法及半導體元件封裝 Download PDF

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Publication number
TW202312295A
TW202312295A TW111133027A TW111133027A TW202312295A TW 202312295 A TW202312295 A TW 202312295A TW 111133027 A TW111133027 A TW 111133027A TW 111133027 A TW111133027 A TW 111133027A TW 202312295 A TW202312295 A TW 202312295A
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TW
Taiwan
Prior art keywords
sheet
semiconductor element
porous body
substrate
porous
Prior art date
Application number
TW111133027A
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English (en)
Chinese (zh)
Inventor
石井恭子
田中栄作
井上健郎
菅谷陽輔
紺谷友広
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日商日東電工股份有限公司
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Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202312295A publication Critical patent/TW202312295A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Measuring Fluid Pressure (AREA)
TW111133027A 2021-08-31 2022-08-31 半導體元件封裝之製造方法及半導體元件封裝 TW202312295A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-141967 2021-08-31
JP2021141967 2021-08-31

Publications (1)

Publication Number Publication Date
TW202312295A true TW202312295A (zh) 2023-03-16

Family

ID=85412276

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111133027A TW202312295A (zh) 2021-08-31 2022-08-31 半導體元件封裝之製造方法及半導體元件封裝

Country Status (5)

Country Link
JP (1) JPWO2023033090A1 (ko)
KR (1) KR20240052777A (ko)
CN (1) CN117897806A (ko)
TW (1) TW202312295A (ko)
WO (1) WO2023033090A1 (ko)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3669782B2 (ja) * 1996-08-14 2005-07-13 ジャパンゴアテックス株式会社 Ｉｃパッケージ接着用シート及びｉｃパッケージ
JP3801601B2 (ja) * 2004-06-15 2006-07-26 シャープ株式会社 蓋部を備えた半導体ウェハの製造方法及び半導体装置の製造方法
JP2006344903A (ja) * 2005-06-10 2006-12-21 Fujifilm Holdings Corp 半導体モジュール
JP2007157792A (ja) * 2005-11-30 2007-06-21 Matsushita Electric Works Ltd ウェハースケール半導体パッケージの製造方法
JP4091969B1 (ja) * 2007-07-12 2008-05-28 住友ベークライト株式会社 受光装置および受光装置の製造方法
JP2009043893A (ja) 2007-08-08 2009-02-26 Fujikura Ltd 半導体パッケージ及びその製造方法
JP5605258B2 (ja) * 2011-02-16 2014-10-15 オムロン株式会社 ウエハレベルパッケージ、チップサイズパッケージデバイス及びウエハレベルパッケージの製造方法

Also Published As

Publication number Publication date
JPWO2023033090A1 (ko) 2023-03-09
CN117897806A (zh) 2024-04-16
WO2023033090A1 (ja) 2023-03-09
KR20240052777A (ko) 2024-04-23

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