TW202311569A - 表面處理銅箔、覆銅積層板、及印刷線路板 - Google Patents

表面處理銅箔、覆銅積層板、及印刷線路板 Download PDF

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Publication number
TW202311569A
TW202311569A TW111120222A TW111120222A TW202311569A TW 202311569 A TW202311569 A TW 202311569A TW 111120222 A TW111120222 A TW 111120222A TW 111120222 A TW111120222 A TW 111120222A TW 202311569 A TW202311569 A TW 202311569A
Authority
TW
Taiwan
Prior art keywords
copper foil
silane coupling
coupling agent
treated copper
agent layer
Prior art date
Application number
TW111120222A
Other languages
English (en)
Chinese (zh)
Inventor
篠崎淳
中津川達也
佐野惇郎
片平周介
Original Assignee
日商古河電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商古河電氣工業股份有限公司 filed Critical 日商古河電氣工業股份有限公司
Publication of TW202311569A publication Critical patent/TW202311569A/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW111120222A 2021-05-31 2022-05-31 表面處理銅箔、覆銅積層板、及印刷線路板 TW202311569A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-091276 2021-05-31
JP2021091276A JP7366436B2 (ja) 2021-05-31 2021-05-31 表面処理銅箔、銅張積層板、及びプリント配線板

Publications (1)

Publication Number Publication Date
TW202311569A true TW202311569A (zh) 2023-03-16

Family

ID=84323278

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111120222A TW202311569A (zh) 2021-05-31 2022-05-31 表面處理銅箔、覆銅積層板、及印刷線路板

Country Status (5)

Country Link
JP (1) JP7366436B2 (ja)
KR (1) KR20240016989A (ja)
CN (1) CN117396639A (ja)
TW (1) TW202311569A (ja)
WO (1) WO2022255335A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7492206B1 (ja) 2023-11-28 2024-05-29 オロル株式会社 半導体製造装置用ステンレス鋼部材およびその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5219952U (ja) 1975-07-30 1977-02-12
JP3300160B2 (ja) 1994-06-06 2002-07-08 株式会社ジャパンエナジー 銅箔の処理方法
JPH0851281A (ja) * 1994-08-08 1996-02-20 Nikko Gould Foil Kk 印刷回路用高高温伸び銅箔の製造方法
JP3670185B2 (ja) 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3103683U (ja) 2004-03-01 2004-08-19 睡眠科技有限公司 枕
JP2007098732A (ja) * 2005-10-03 2007-04-19 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔の製造方法並びにその表面処理銅箔を用いた銅張積層板
JP2018121085A (ja) * 2018-05-09 2018-08-02 Ｊｘ金属株式会社 プリント配線板の製造方法
JP7114500B2 (ja) * 2019-01-30 2022-08-08 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery

Also Published As

Publication number Publication date
WO2022255335A1 (ja) 2022-12-08
JP2022183791A (ja) 2022-12-13
CN117396639A (zh) 2024-01-12
JP7366436B2 (ja) 2023-10-23
KR20240016989A (ko) 2024-02-06

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