TW202311514A - 用於cmp步驟後之清潔劑組成物 - Google Patents

用於cmp步驟後之清潔劑組成物 Download PDF

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Publication number
TW202311514A
TW202311514A TW111125551A TW111125551A TW202311514A TW 202311514 A TW202311514 A TW 202311514A TW 111125551 A TW111125551 A TW 111125551A TW 111125551 A TW111125551 A TW 111125551A TW 202311514 A TW202311514 A TW 202311514A
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TW
Taiwan
Prior art keywords
cmp step
acid
cleaning agent
agent composition
cleaning
Prior art date
Application number
TW111125551A
Other languages
English (en)
Chinese (zh)
Inventor
殿谷大輔
水島千帆
張替尊子
藤井裕大
蘇亞德瓦拉 Ｖ 巴布
宋志訓
斯里 西法 拉馬 奎師那 漢普 維吉
阿里 奧斯曼
格拉哈里 阿倫庫瑪 芬卡他洛納帕
Original Assignee
日商日本觸媒股份有限公司
克拉克森大學
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021113727A external-priority patent/JP2023009993A/ja
Priority claimed from JP2021113728A external-priority patent/JP2023009994A/ja
Application filed by 日商日本觸媒股份有限公司, 克拉克森大學 filed Critical 日商日本觸媒股份有限公司
Publication of TW202311514A publication Critical patent/TW202311514A/zh

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    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/72—Ethers of polyoxyalkylene glycols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/722—Ethers of polyoxyalkylene glycols having mixed oxyalkylene groups; Polyalkoxylated fatty alcohols or polyalkoxylated alkylaryl alcohols with mixed oxyalkylele groups
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/28—Heterocyclic compounds containing nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/30—Amines; Substituted amines ; Quaternized amines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW111125551A 2021-07-08 2022-07-07 用於cmp步驟後之清潔劑組成物 TW202311514A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021113727A JP2023009993A (ja) 2021-07-08 2021-07-08 Ｃｍｐ工程用後洗浄剤組成物
JP2021-113728 2021-07-08
JP2021113728A JP2023009994A (ja) 2021-07-08 2021-07-08 Ｃｍｐ工程用後洗浄剤組成物
JP2021-113727 2021-07-08

Publications (1)

Publication Number Publication Date
TW202311514A true TW202311514A (zh) 2023-03-16

Family

ID=84801748

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111125551A TW202311514A (zh) 2021-07-08 2022-07-07 用於cmp步驟後之清潔劑組成物

Country Status (2)

Country Link
TW (1) TW202311514A (fr)
WO (1) WO2023282287A1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160122696A1 (en) * 2013-05-17 2016-05-05 Advanced Technology Materials, Inc. Compositions and methods for removing ceria particles from a surface
WO2016111990A1 (fr) * 2015-01-05 2016-07-14 Entegris, Inc. Formulations destinées au post-polissage mécano-chimique et procédé d'utilisation
JP6594201B2 (ja) * 2015-12-28 2019-10-23 花王株式会社 半導体デバイス用基板用の酸性洗浄剤組成物
JP2020504460A (ja) * 2017-01-18 2020-02-06 インテグリス・インコーポレーテッド セリア粒子を表面から除去するための組成物及び方法
WO2019073931A1 (fr) * 2017-10-10 2019-04-18 三菱ケミカル株式会社 Fluides de nettoyage, procédé de nettoyage et procédé de production de tranche de semi-conducteur
JP7330668B2 (ja) * 2018-03-08 2023-08-22 株式会社フジミインコーポレーテッド 表面処理組成物、表面処理組成物の製造方法、表面処理方法および半導体基板の製造方法

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WO2023282287A1 (fr) 2023-01-12

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