TW202308781A - 助焊劑及焊料膏 - Google Patents

助焊劑及焊料膏 Download PDF

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Publication number
TW202308781A
TW202308781A TW111123469A TW111123469A TW202308781A TW 202308781 A TW202308781 A TW 202308781A TW 111123469 A TW111123469 A TW 111123469A TW 111123469 A TW111123469 A TW 111123469A TW 202308781 A TW202308781 A TW 202308781A
Authority
TW
Taiwan
Prior art keywords
acid
flux
mass
rosin
thixotropic agent
Prior art date
Application number
TW111123469A
Other languages
English (en)
Chinese (zh)
Inventor
橋本裕
金子睦記
Original Assignee
日商千住金屬工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商千住金屬工業股份有限公司 filed Critical 日商千住金屬工業股份有限公司
Publication of TW202308781A publication Critical patent/TW202308781A/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613Polymers, e.g. resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams or slurries
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362Selection of compositions of fluxes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L93/00Compositions of natural resins; Compositions of derivatives thereof
    • C08L93/04Rosin

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW111123469A 2021-06-24 2022-06-23 助焊劑及焊料膏 TW202308781A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021104992 2021-06-24
JP2021-104992 2021-06-24

Publications (1)

Publication Number Publication Date
TW202308781A true TW202308781A (zh) 2023-03-01

Family

ID=84545769

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111123469A TW202308781A (zh) 2021-06-24 2022-06-23 助焊劑及焊料膏

Country Status (6)

Country Link
US (1) US20240278360A1 (https=)
EP (1) EP4361302A4 (https=)
JP (1) JP7730045B2 (https=)
CN (1) CN117500632A (https=)
TW (1) TW202308781A (https=)
WO (1) WO2022270499A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI882764B (zh) * 2023-05-31 2025-05-01 日商千住金屬工業股份有限公司 助焊劑及焊料膏

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07144293A (ja) * 1993-11-22 1995-06-06 Fujitsu Ten Ltd 窒素リフロー用低残渣クリームはんだ
JPH10249577A (ja) * 1997-03-10 1998-09-22 Nippon Superia Shiya:Kk ハンダクリーム
JPH10328882A (ja) * 1997-06-03 1998-12-15 Matsushita Electric Ind Co Ltd クリームはんだ
JP3105505B1 (ja) * 1999-11-19 2000-11-06 株式会社ニホンゲンマ はんだ用フラックスおよびソルダペースト
JP2004202518A (ja) * 2002-12-24 2004-07-22 Nof Corp はんだ付け用フラックス組成物、はんだペースト及びはんだ付け方法
JP2006167802A (ja) * 2004-03-31 2006-06-29 Nof Corp はんだペースト
JP2007190583A (ja) * 2006-01-18 2007-08-02 Nof Corp はんだペースト
JP4788563B2 (ja) * 2006-10-19 2011-10-05 日油株式会社 はんだ付け用フラックス組成物およびはんだペースト
JP6061664B2 (ja) 2012-12-19 2017-01-18 株式会社タムラ製作所 はんだ付け用フラックス
JP6575709B1 (ja) * 2019-03-05 2019-09-18 千住金属工業株式会社 フラックス及びソルダペースト
JP2020175415A (ja) * 2019-04-18 2020-10-29 日立化成株式会社 金属組成物、接着剤、焼結体、接合構造、接合体及びその製造方法、並びに焼結体付き支持部材及びその製造方法
JP2021104992A (ja) 2019-12-26 2021-07-26 株式会社トクヤマ 7−オクテン酸エステルのアシルオキシ体の製造方法、及び該アシルオキシ体を用いたα−リポ酸中間体の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI882764B (zh) * 2023-05-31 2025-05-01 日商千住金屬工業股份有限公司 助焊劑及焊料膏

Also Published As

Publication number Publication date
CN117500632A (zh) 2024-02-02
JPWO2022270499A1 (https=) 2022-12-29
US20240278360A1 (en) 2024-08-22
WO2022270499A1 (ja) 2022-12-29
EP4361302A4 (en) 2025-06-18
JP7730045B2 (ja) 2025-08-27
EP4361302A1 (en) 2024-05-01

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