WO2022270499A1 - フラックス及びソルダペースト - Google Patents

フラックス及びソルダペースト Download PDF

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Publication number
WO2022270499A1
WO2022270499A1 PCT/JP2022/024711 JP2022024711W WO2022270499A1 WO 2022270499 A1 WO2022270499 A1 WO 2022270499A1 JP 2022024711 W JP2022024711 W JP 2022024711W WO 2022270499 A1 WO2022270499 A1 WO 2022270499A1
Authority
WO
WIPO (PCT)
Prior art keywords
acid
flux
mass
rosin
thixotropic agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/024711
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
裕 橋本
睦記 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to CN202280043460.5A priority Critical patent/CN117500632A/zh
Priority to EP22828415.4A priority patent/EP4361302A4/en
Priority to US18/568,943 priority patent/US20240278360A1/en
Priority to JP2023530479A priority patent/JP7730045B2/ja
Publication of WO2022270499A1 publication Critical patent/WO2022270499A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
    • C08L93/04—Rosin

Definitions

  • the present invention relates to fluxes and solder pastes. This application claims priority based on Japanese Patent Application No. 2021-104992 filed in Japan on June 24, 2021, the content of which is incorporated herein.
  • the content of the specific thixotropic agent in the flux is preferably 5% by mass or more and 100% by mass or less, and 11% by mass or more and 100% by mass of the total content (100% by mass) of the thixotropic agent. % or less, more preferably 30% by mass or more and 100% by mass or less, particularly preferably 50% by mass or more and 100% by mass or less, and 60% by mass or more and 100% by mass or less. is most preferred.
  • the ratio of the content of the specific thixotropic agent is within the above range, it is possible to suppress the increase in viscosity when stored at 30°C and to reduce the decrease in viscosity when stored at 30°C.
  • halogenated heterocyclic compounds include tris-(2,3-dibromopropyl) isocyanurate.
  • a solvent may be used individually by 1 type, and may be used in mixture of 2 or more types.
  • As the solvent it is preferable to use a glycol ether solvent.
  • As the glycol ether-based solvent it is preferable to use hexyldiglycol.
  • surfactants other than the above include polyoxyalkylene acetylene glycols, polyoxyalkylene glyceryl ethers, polyoxyalkylene alkyl ethers, polyoxyalkylene esters, polyoxyalkylene alkylamines, polyoxyalkylene alkylamides, and the like.
  • the flux content in the solder paste is preferably 5 to 30% by mass, more preferably 5 to 15% by mass, based on the total mass of the solder paste.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PCT/JP2022/024711 2021-06-24 2022-06-21 フラックス及びソルダペースト Ceased WO2022270499A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202280043460.5A CN117500632A (zh) 2021-06-24 2022-06-21 助焊剂及焊膏
EP22828415.4A EP4361302A4 (en) 2021-06-24 2022-06-21 FLUX AND SOLDER PASTE
US18/568,943 US20240278360A1 (en) 2021-06-24 2022-06-21 Flux and solder paste
JP2023530479A JP7730045B2 (ja) 2021-06-24 2022-06-21 フラックス及びソルダペースト

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021104992 2021-06-24
JP2021-104992 2021-06-24

Publications (1)

Publication Number Publication Date
WO2022270499A1 true WO2022270499A1 (ja) 2022-12-29

Family

ID=84545769

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/024711 Ceased WO2022270499A1 (ja) 2021-06-24 2022-06-21 フラックス及びソルダペースト

Country Status (6)

Country Link
US (1) US20240278360A1 (https=)
EP (1) EP4361302A4 (https=)
JP (1) JP7730045B2 (https=)
CN (1) CN117500632A (https=)
TW (1) TW202308781A (https=)
WO (1) WO2022270499A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7410445B1 (ja) * 2023-05-31 2024-01-10 千住金属工業株式会社 フラックス及びソルダペースト

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07144293A (ja) * 1993-11-22 1995-06-06 Fujitsu Ten Ltd 窒素リフロー用低残渣クリームはんだ
JPH10249577A (ja) 1997-03-10 1998-09-22 Nippon Superia Shiya:Kk ハンダクリーム
JPH10328882A (ja) * 1997-06-03 1998-12-15 Matsushita Electric Ind Co Ltd クリームはんだ
JP2001138089A (ja) * 1999-11-19 2001-05-22 Nippon Genma:Kk はんだ用フラックスおよびソルダペースト
JP2004202518A (ja) * 2002-12-24 2004-07-22 Nof Corp はんだ付け用フラックス組成物、はんだペースト及びはんだ付け方法
JP2006167802A (ja) * 2004-03-31 2006-06-29 Nof Corp はんだペースト
JP2008100262A (ja) * 2006-10-19 2008-05-01 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2014117745A (ja) 2012-12-19 2014-06-30 Tamura Seisakusho Co Ltd はんだ付け用フラックスおよびそれを用いたプリント配線基板
JP6575709B1 (ja) * 2019-03-05 2019-09-18 千住金属工業株式会社 フラックス及びソルダペースト
JP2020175415A (ja) * 2019-04-18 2020-10-29 日立化成株式会社 金属組成物、接着剤、焼結体、接合構造、接合体及びその製造方法、並びに焼結体付き支持部材及びその製造方法
JP2021104992A (ja) 2019-12-26 2021-07-26 株式会社トクヤマ ７−オクテン酸エステルのアシルオキシ体の製造方法、及び該アシルオキシ体を用いたα−リポ酸中間体の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007190583A (ja) * 2006-01-18 2007-08-02 Nof Corp はんだペースト

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07144293A (ja) * 1993-11-22 1995-06-06 Fujitsu Ten Ltd 窒素リフロー用低残渣クリームはんだ
JPH10249577A (ja) 1997-03-10 1998-09-22 Nippon Superia Shiya:Kk ハンダクリーム
JPH10328882A (ja) * 1997-06-03 1998-12-15 Matsushita Electric Ind Co Ltd クリームはんだ
JP2001138089A (ja) * 1999-11-19 2001-05-22 Nippon Genma:Kk はんだ用フラックスおよびソルダペースト
JP2004202518A (ja) * 2002-12-24 2004-07-22 Nof Corp はんだ付け用フラックス組成物、はんだペースト及びはんだ付け方法
JP2006167802A (ja) * 2004-03-31 2006-06-29 Nof Corp はんだペースト
JP2008100262A (ja) * 2006-10-19 2008-05-01 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2014117745A (ja) 2012-12-19 2014-06-30 Tamura Seisakusho Co Ltd はんだ付け用フラックスおよびそれを用いたプリント配線基板
JP6575709B1 (ja) * 2019-03-05 2019-09-18 千住金属工業株式会社 フラックス及びソルダペースト
JP2020175415A (ja) * 2019-04-18 2020-10-29 日立化成株式会社 金属組成物、接着剤、焼結体、接合構造、接合体及びその製造方法、並びに焼結体付き支持部材及びその製造方法
JP2021104992A (ja) 2019-12-26 2021-07-26 株式会社トクヤマ ７−オクテン酸エステルのアシルオキシ体の製造方法、及び該アシルオキシ体を用いたα−リポ酸中間体の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4361302A4

Also Published As

Publication number Publication date
CN117500632A (zh) 2024-02-02
JPWO2022270499A1 (https=) 2022-12-29
US20240278360A1 (en) 2024-08-22
EP4361302A4 (en) 2025-06-18
JP7730045B2 (ja) 2025-08-27
TW202308781A (zh) 2023-03-01
EP4361302A1 (en) 2024-05-01

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