TW202306396A - Sensing device - Google Patents

Abstract

Some embodiments of the present disclosure disclose a sensing device. The sensing device may include: an elastic part; a sensing cavity, wherein the elastic part constitutes a first side wall of the sensing cavity; and a transducer part configured to obtain sensing signals and transduce the sensing signal into electrical signals. The transducer part may communicate with the sensing cavity, and the sensing signal may be related to volume change of the sensing cavity. A protruding structure may be provided on a side of the elastic part facing the sensing cavity. The elastic part may make the protruding structure move in response to an external signal, and the movement of the protruding structure may change the volume of the sensing cavity.

Description

Sensing device

The invention relates to the field of sensors, in particular to a sensing device with protruding structures arranged on a thin film. Cross References to Related Applications

This application claims the priority of the Chinese patent application with application number 202110809269.4 filed on July 16, 2021, the entire contents of which are incorporated herein by reference.

The sensing device is one of the commonly used detection devices, and the collected sensing signals are converted into electrical signals or other required forms of information output through its internal conversion components. Sensitivity can represent the ratio of the output signal strength of the sensing device to the input signal strength. If the sensitivity is too small, it will affect the user experience. When the sensing device is working, the sensitivity of the sensing device is related to the volume and volume change of the sensing cavity in the sensing device.

The invention provides a sensing device, which can not only improve the reliability, but also effectively improve the sensitivity of the sensing device.

A sensing device, comprising: an elastic component; a sensing cavity, the elastic component constituting a first side wall of the sensing cavity; and a converting component, configured to acquire a sensing signal and convert the sensing signal into an electrical signal , the conversion component communicates with the sensing cavity, the sensing signal is related to the volume change of the sensing cavity, wherein the elastic component is provided with a convex structure on one side facing the sensing cavity, The elastic member moves the protruding structure in response to an external signal, and the movement of the protruding structure changes the volume of the sensing cavity.

In some embodiments, the protruding structure abuts against a second sidewall of the sensing cavity, and the second sidewall is opposite to the first sidewall.

In some embodiments, the protruding structure has elasticity, and when the protruding structure moves, the protruding structure produces elastic deformation, and the elastic deformation reduces and changes the volume of the sensing cavity.

In some embodiments, the protruding structures are arranged in an array on at least part of the surface of the elastic component.

In some embodiments, the shape of the protrusion structure is at least one of pyramid shape, hemispherical shape or stripe shape.

In some embodiments, the elastic component includes an elastic film and an elastic microstructure layer, and the protrusion structure is disposed on the elastic microstructure layer.

In some embodiments, the difference between the height of the raised structure and the height of the sensing cavity is within 10%.

In some embodiments, the sensing device further includes: a mass unit disposed on the other side surface of the elastic component, and the mass unit and the elastic component jointly generate vibrations in response to the external signal; and The casing, the elastic component, the mass unit, the sensing chamber and the conversion component are accommodated in the casing.

In some embodiments, the conversion component is an acoustic transducer, the elastic component is disposed above the acoustic transducer, and the sensing cavity is formed between the elastic component and the acoustic transducer.

In some embodiments, the outer edge of the elastic member is fixedly connected to the acoustic transducer through a sealing member, and the elastic member, the sealing member and the acoustic transducer jointly form the sensing cavity.

In some embodiments, the outer edge of the elastic component is fixedly connected to the casing, and the elastic component, the casing and the acoustic transducer jointly form the sensing cavity.

In some embodiments, the sensing device further includes: another elastic component, disposed symmetrically with the elastic component on both sides of the mass unit, and the other elastic component is fixedly connected to the housing.

A sensing assembly, comprising: an elastic component; and a first sensing cavity, the elastic component constituting a first side wall of the first sensing cavity, wherein the elastic component faces one side of the first sensing cavity A protruding structure is provided on the side, the elastic component moves the protruding structure in response to an external signal, and the movement of the protruding structure changes the volume of the first sensing cavity.

In some embodiments, the sensing component is configured to be attached to the converter, and the converter is placed opposite to the elastic member to form a closed sensing cavity, and the converter connects the closed sensing cavity The volume change is converted into an electrical signal.

A vibration sensing device, an elastic vibration component, including a diaphragm; an acoustic transducer, an acoustic cavity is formed between the acoustic transducer and the diaphragm, and the acoustic transducer is used to acquire sensing signals and convert the sensing The signal is converted into an electrical signal, and the sensing signal is related to the volume change of the acoustic cavity, wherein the diaphragm is provided with a convex structure on the side facing the acoustic cavity, and the elastic vibrating part responds to the external A signal causes the raised structure to move, and the movement of the raised structure changes the volume of the acoustic cavity.

A sensing assembly, comprising: an elastic component; and a sensing cavity, the elastic component constituting a first side wall of the sensing cavity, wherein the elastic component is provided with a protrusion on a side surface facing the sensing cavity a raised structure, the Young's modulus of the raised structure is 100 kPa to 1 MPa, the elastic member responds to an external signal to at least one of the movement and deformation of the raised structure, the movement and At least one of the deformations changes the volume of the sensing cavity.

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some examples or embodiments of the present invention, and those skilled in the art can also apply the present invention according to these drawings without making progressive efforts in other similar situations. It should be understood that these exemplary embodiments are given only to enable those skilled in the relevant art to better understand and implement the present invention, but not to limit the scope of the present invention in any way. Unless otherwise apparent from context or otherwise indicated, like reference numerals in the figures represent like structures or operations.

As shown in the specification and claims, words such as "a", "an", "an" and/or "the" do not refer to the singular, and may include the plural, unless the context clearly indicates an exception. Generally speaking, the terms "comprising" and "comprising" only suggest the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or device may also contain other steps or elements. The term "based on" is "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment". Relevant definitions of other terms will be given in the description below.

Some embodiments of the invention relate to a sensing device. The sensing device may include an elastic component, a sensing cavity and a conversion component. The elastic component constitutes a first side wall of the sensing cavity. The conversion component communicates with the sensing cavity, and is used for acquiring a sensing signal and converting it into an electrical signal, and the sensing signal is related to the volume change of the sensing cavity. The sensitivity of the sensing device increases as the volume of the sensing cavity decreases, and increases as the volume change increases. A protruding structure is provided on one side of the elastic component facing the sensing cavity. The raised structure can reduce the volume of the sensing cavity to increase the sensitivity of the sensing device. In some embodiments, the protruding structure can be configured to be in contact with the second side wall of the sensing cavity. When the sensing device is in the working state, the elastic member will drive the protruding structure to vibrate and contact the second side wall of the sensing cavity. Compression takes place, resulting in elastic deformation. When the protruding structure undergoes elastic deformation, the volume change of the sensing cavity can be increased, thereby improving the sensitivity of the sensing device. In addition, the existence of the protruding structure can effectively reduce the contact area between the elastic member and the second side wall of the sensing cavity, so it can prevent adhesion with the second side wall constituting the sensing cavity, and effectively improve the stability and reliability of the sensing device. sex.

FIG. 1 is a schematic diagram of a sensing device according to some embodiments of the present invention. The sensing device 10 can collect external signals and generate desired signals (eg, electrical signals) based on the external signals. The external signal may include a mechanical vibration signal, an acoustic signal, an optical signal, an electrical signal, and the like. Types of the sensing device 10 may include, but are not limited to, pressure sensing devices, vibration sensing devices, tactile sensing devices, and the like. In some embodiments, the sensing device 10 can be applied to a mobile device, a wearable device, a virtual reality device, an augmented reality device, etc., or any combination thereof. In some embodiments, the mobile device may include a smart phone, a tablet computer, a personal digital assistant (PDA), a game device, a navigation device, etc., or any combination thereof. In some embodiments, wearable devices may include smart bracelets, earphones, hearing aids, smart helmets, smart watches, smart clothing, smart backpacks, smart accessories, etc., or any combination thereof. In some embodiments, the virtual reality device and/or the augmented reality device may include a virtual reality helmet, virtual reality glasses, virtual reality goggles, augmented reality helmet, augmented reality glasses, augmented reality goggles, etc. or any combination thereof. For example, virtual reality devices and/or augmented reality devices may include Google Glass, Oculus Rift, Hololens, Gear VR, etc.

As shown in FIG. 1 , the sensing device 10 may include an elastic component 20 , a conversion component 30 , a housing 40 and a sensing cavity 50 . The interior of the housing 40 may have an accommodating space for accommodating at least one component of the sensing device 10 . For example, the housing 40 can accommodate the elastic component 20 and other components (eg, the mass unit 260 and the sealing unit 270 shown in FIG. 2 ). In some embodiments, the casing 40 may be connected with other components of the sensing device 10 (eg, the elastic component 20 , the conversion component 30 , etc.) to form the accommodating space. For example, in the embodiment shown in FIG. 2 , the casing 240 may be connected with the conversion component 230 to form the accommodating space 241 .

In some embodiments, the housing 40 can be configured in different shapes. For example, the housing 40 can be configured as a cube, a cuboid, an approximate cuboid (for example, replace the eight corners of a cuboid with an arc-shaped structure), an ellipsoid, a sphere, or any other shape.

In some embodiments, the housing 40 can be made of a material with certain hardness or strength, so that the housing 40 can protect the sensing device 10 and its internal components (eg, the elastic component 20 ). In some embodiments, the materials for making the housing 40 include but are not limited to PCB boards (such as FR-1 phenolic paper substrate, FR-2 phenolic paper substrate, FR-3 epoxy paper substrate, FR-4 epoxy glass cloth board , CEM-1 epoxy glass cloth-paper composite board, CEM-3 epoxy glass cloth-glass stand board, etc.), acrylonitrile-butadiene-styrene copolymer (Acrylonitrile butadiene styrene, ABS), polystyrene ( Polystyrene, PS), high impact polystyrene (High impact polystyrene, HIPS), polypropylene (Polypropylene, prepositional phrase), polyethylene terephthalate (Polyethylene terephthalate, PET), polyester (Polyester, PES) , Polycarbonate (Polycarbonate, PC), polyamide (Polyamides, PA), polyvinyl chloride (Polyvinyl chloride, polyvinyl chloride), polyurethane (Polyurethanes, PU), polyvinylidene chloride (Polyvinylidene chloride), polyethylene ( Polyethylene, PE), polymethyl methacrylate (Polymethyl methacrylate, PMMA), polyetheretherketone (Poly-ether-ether-ketone, PEEK), phenolic resin (Phenolics, PF), urea-formaldehyde resin (Urea-formaldehyde, UF), melamine formaldehyde resin (Melamine formaldehyde, MF) and some metals, alloys (such as aluminum alloy, chromium molybdenum steel, scandium alloy, magnesium alloy, titanium alloy, magnesium lithium alloy, nickel alloy, etc.), glass fiber or carbon fiber Any material or a combination of any of the above materials. In some embodiments, the material for making the shell 40 is any combination of glass fiber, carbon fiber, polycarbonate (PC), polyamide (Polyamides, PA) and other materials. In some embodiments, the material for making the housing 40 may be made by mixing carbon fiber and polycarbonate (Polycarbonate, PC) according to a certain ratio. In some embodiments, the material for making the shell 40 may be made by mixing carbon fiber, glass fiber and polycarbonate (Polycarbonate, PC) according to a certain ratio. In some embodiments, the material for making the shell 40 can be made by mixing glass fiber and polycarbonate (Polycarbonate, PC) in a certain proportion, or by mixing glass fiber and polyamides (Polyamides, PA) in a certain proportion. production.

The sensing cavity 50 is disposed inside the sensing device 10 . The sensing cavity 50 may be related to the sensing signal acquired by the converting part 30 . Sensing cavity 50 may be a closed or semi-closed chamber formed by one or more components of sensing device 10 . In some embodiments, the sensing cavity 50 may be a closed or semi-closed cavity formed by the elastic component 20 and other components. For example, the sensing cavity 50 may be a closed cavity formed by the elastic component 20 , the conversion component 30 and the housing 40 . The sensing cavity 50 has a certain volume, and its interior can be filled with gas. The gas may be a gas with stable properties (for example, a gas that is not easy to liquefy, combust, or explode). For example, the gas may include air, nitrogen, inert gases, and the like.

When the sensing device 10 is working, the volume of the sensing cavity 50 will change. The sensing chamber 50 includes at least two opposite side walls. The two opposite side walls include a first side wall and a second side wall. When the sensing device 10 is in operation, the first side wall (or part of the structure disposed thereon) and/or the second side wall (or part of the structure disposed thereon) of the sensing cavity 50 will be relatively displaced, thus causing the sensing The volume of the measuring chamber 50 changes. In some embodiments, the first sidewall and/or the second sidewall may be formed by one or more components of the sensing device 10 . Exemplarily, the first side wall may be formed by the elastic member 20 or one or more components/units thereof. The second side wall may be formed by the transition member 30 or one or more components/units thereof. For example, during the working process of the sensing device 10, the elastic member 20 forming the first side wall of the sensing cavity 50 (or the microstructure disposed on the surface (also called the inner surface) of the elastic component 20 facing the sensing cavity 50, such as , protruding structure) and/or the conversion component 30 constituting the second side wall of the sensing cavity 50 will undergo relative motion under the drive of the external vibration signal (for example, the relative motion will be generated due to the inconsistent response of the first side wall and the second side wall to the vibration ), the distance between the inner surfaces of the first side wall and the second side wall changes, thereby changing the volume of the sensing cavity 50 .

The conversion part 30 refers to a component capable of acquiring a sensing signal and converting it into a desired signal. The sensing signal may include an acoustic signal. In some embodiments, the conversion part 30 may convert the sensing signal into an electrical signal. For example, the conversion part 30 may convert an acoustic signal (eg, sound pressure) into an electrical signal. For another example, the conversion component 30 may convert mechanical vibration signals into electrical signals. The conversion component 30 can communicate with the sensing cavity 50 to obtain sensing signals. For example, one surface of the conversion component 30 or its components/units (for example, components in the conversion component 30 for acquiring sensing signals) may serve as the second side wall of the sensing cavity 50 . At this time, the conversion component 30 communicates with the inside of the sensing chamber 50 to obtain sensing signals. The sensed signal may be related to one or more parameters of the sensing cavity 50 . The one or more parameters may include cavity height, volume size, volume change, air pressure, and the like. In some embodiments, the sensing signal may be related to a volume change of the sensing cavity 50 . Exemplarily, when the volume of the sensing cavity 50 changes, the pressure of the gas (eg, air) filled in the sensing cavity 50 will change. The component for acquiring the sensing signal in the conversion component 30 can acquire the air pressure change and generate a corresponding electrical signal. In some embodiments, the conversion component 30 may be an acoustic converter. For example, the conversion component 30 may be an air conduction microphone (also known as an air conduction microphone). The air conduction microphone can acquire the sound pressure change of the sensing cavity 50 and convert it into an electrical signal.

The elastic member 20 may vibrate or elastically deform in response to an external signal (eg, vibration) (the elastic member 20 has certain elasticity). As mentioned above, the elastic member 20 can constitute the first side wall of the sensing chamber 50 . When the elastic member 20 vibrates or elastically deforms, the position of the inner surface of the first side wall changes. In some embodiments, the position of the second sidewall of the sensing cavity 50 remains fixed or substantially fixed. At this time, the distance between the inner surface of the first sidewall and the inner surface of the second sidewall changes relatively, and the volume of the sensing cavity 50 changes (assuming that the sidewall between the first sidewall and the second sidewall remains relatively fixed). In some embodiments, the position of the second sidewall of the sensing cavity 50 is also changed. For example, both the second sidewall and the first sidewall of the sensing cavity 50 vibrate. If the vibration phase of the second side wall is different from the vibration phase of the first side wall, the distance between the inner surface of the first side wall and the inner surface of the second side wall will change relatively, and the volume of the sensing cavity 50 will change. (assuming that the side walls between the first side wall and the second side wall remain relatively fixed). For another example, both the second sidewall and the first sidewall of the sensing cavity 50 are elastically deformed. If the elastic deformation of the second side wall is different from that of the first side wall, the distance between the inner surface of the first side wall and the inner surface of the second side wall changes relatively, and the volume of the sensing cavity 50 changes (assuming the sidewall remains relatively fixed between the first sidewall and the second sidewall).

Exemplarily, the elastic component 20 and the conversion component 30 or components/units thereof (for example, components in the conversion component 30 for acquiring sensing signals) may respectively constitute a first side wall and a second side wall of the sensing chamber 50 . The external signal is mechanical vibration. The mechanical vibration is transmitted to the conversion member 30 and the elastic member 20 through the housing 40 . Both the conversion member 30 and the elastic member 20 vibrate in response to the mechanical vibration. Due to the different vibration phases of the conversion component 30 and the elastic component 20 , the distance between the inner surfaces of the first side wall and the second side wall changes, and the volume of the sensing cavity 50 changes.

In some embodiments, a protruding structure 23 (for example, the protruding structure 223 shown in FIG. 2 ) may be provided on the inner surface of the elastic member 20 (ie, the surface facing the sensing cavity 50 ). The protruding structure 23 may be disposed on at least a partial area of the inner surface of the elastic component 20 . In some embodiments, the protruding structure 23 may be disposed on all areas of the inner surface of the elastic member 20 . In some embodiments, the protruding structure 23 may only be disposed on a part of the inner surface of the elastic member 20 . In some embodiments, the ratio of the area of the inner surface occupied by the protruding structure 23 to the area of the inner surface of the elastic member 20 may be less than three quarters. In some embodiments, the ratio of the area of the inner surface occupied by the protruding structure 23 to the area of the inner surface of the elastic member 20 may be less than two-thirds. In some embodiments, the ratio of the area of the inner surface occupied by the protruding structure 23 to the area of the inner surface of the elastic member 20 may be less than half. In some embodiments, the ratio of the area occupied by the protruding structure 23 to the area of the inner surface of the elastic member 20 may be less than one-third. In some embodiments, the ratio of the area occupied by the protruding structure 23 to the area of the inner surface of the elastic member 20 may be less than 1/4. In some embodiments, the ratio of the area occupied by the protruding structure 23 to the area of the inner surface of the elastic member 20 is less than one-fifth. In some embodiments, the ratio of the area occupied by the protruding structure 23 to the area of the inner surface of the elastic member 20 may be less than one-sixth. Exemplarily, the inner surface of the elastic member 20 may be divided into a central portion and a peripheral portion. The protruding structure 23 may be disposed on the peripheral portion, while the central portion is not provided with the protruding structure 23 . Wherein, the ratio of the inner surface area occupied by the peripheral portion to the inner surface area of the elastic member 20 may be less than three-quarters, two-thirds, one-half, one-third, one-fourth, or fifth One, one-sixth, etc.

The protruding structures 23 may be uniformly or non-uniformly disposed on the inner surface of the elastic component 20 . In some embodiments, the protruding structures 23 may be arranged in an array on the inner surface of the elastic member 20 . For example, adjacent protruding structures 23 are disposed on the inner surface of the elastic component 20 at equal intervals. In some embodiments, the distribution of the raised structures 23 on the inner surface of the elastic member 20 may be uneven. For example, the distance between adjacent protruding structures 23 varies with the position of the protruding structures 23 .

The protruding structure 23 may have a specific shape. In some embodiments, the specific shape includes pyramidal shape, hemispherical shape, stripe shape, terraced shape, cylindrical shape and other regular shapes. In some embodiments, the specific shape may be any irregular shape.

For the conventional elastic member that does not include the protruding structure 23, which is used as the first side wall of the sensing cavity 50, in the process of vibration, it may be separated from the second side wall of the sensing cavity 50 (for example, the conversion component) due to the large vibration amplitude. 30) Adhesion occurs, causing the sensing device 10 to fail to work normally. The presence of the protruding structure 23 can effectively reduce the contact area between the elastic member 20 and the second side wall of the sensing cavity 50, thus preventing adhesion to the second side wall constituting the sensing cavity 50 and effectively improving the stability of the sensing device 10. sex and reliability.

The raised structure 23 can affect the sensitivity of the sensing device 10 . Sensitivity is an important index reflecting the performance of the sensing device 10 . Sensitivity can be understood as the magnitude of the response of the sensing device 10 to a specific external signal during operation. For the sensing device 10 , the conversion component 30 communicates with the sensing cavity 50 . The sensing signal acquired by the conversion component 30 is related to the volume change of the sensing cavity 50 . The sensitivity of the sensing device 10 is related to the volume size and/or volume change of the sensing cavity 50 . For the same external signal, the greater the volume change of the sensing cavity 50, the greater the response of the sensing device 10, and accordingly, the higher the sensitivity of the sensing device 10; the smaller the volume of the sensing cavity 50, the greater the sensing device 10's response. The greater the response, the higher the sensitivity of the sensing device 10 is. Therefore, by changing the volume of the sensing cavity 50 and/or the variation of the volume of the sensing cavity 50 during the working process of the sensing device 10 , the sensitivity of the sensing device 10 can be changed. Since the protruding structure 23 protrudes toward the inside of the sensing cavity 50, it occupies part of the volume of the sensing cavity 50, making the volume of the sensing cavity 50 smaller than that of the elastic member 20 without the protruding structure 23, so The sensing device 10 has higher sensitivity.

In some embodiments, the protruding structure 23 may have certain elasticity. Since the protruding structure 23 has elasticity, it will be elastically deformed when pressed by an external force. In some embodiments, the raised structure 23 may abut a second sidewall of the sensing cavity 50 (eg, a surface of the conversion component 30 or one or more components thereof). When the protruding structure 23 abuts against the second side wall of the sensing cavity 50 , the vibration of the elastic component 20 will drive the protruding structure 23 to move. At this time, the protrusion structure 23 is pressed against the second side wall of the sensing cavity 50 , so that the protrusion structure 23 undergoes elastic deformation. The elastic deformation can further protrude the protruding structure 23 to the inside of the sensing cavity 50 , reducing the volume of the sensing cavity 50 . Therefore, the volume change of the sensing cavity 50 can be further increased, thereby improving the sensitivity of the sensing device 10 . For more details about the protrusion structure and the improvement of the sensitivity of the sensing device by the protrusion structure, please refer to the specific embodiments in FIG. 2 to FIG. 6 , which will not be repeated here.

In some embodiments, the elastic member 20 may include an elastic film 21 . The protruding structure 23 may be disposed on the surface (ie, the inner surface) of the elastic film 21 facing the sensing cavity 50 . In some embodiments, the material for making the elastic film 21 may include polyimide (Polyimide, PI), polydimethylsiloxane (Polydimethylsiloxane, PDMS), polytetrafluoroethylene (Poly tetrafluoroethylene, PTFE), etc. Polymer Materials. For more details about the elastic film, please refer to the embodiment shown in FIG. 2 and FIG. 7 , which will not be repeated here.

The above description of the sensing device 10 is only a specific example and should not be considered as the only possible implementation. Apparently, for those skilled in the art, after understanding the basic principle of the sensing device 10, it is possible to describe the specific manner and steps of implementing the sensing device 10 in terms of form and details without departing from this principle. Various modifications and changes, but still within the scope of the above description. In some embodiments, the sensing device 10 may include one or more other components, for example, a mass unit (mass unit 260 shown in FIG. 2 ), a sealing unit (sealing unit 270 shown in FIG. 2 ), etc. or any combination thereof. In some embodiments, multiple components of sensing device 10 may be combined into a single component. For example, the mass unit can be integrated on the elastic component 20 to form a resonant system together with the elastic component 20 . The resonant system vibrates in response to an external signal. In some embodiments, a component of sensing device 10 may be broken down into one or more subcomponents. For example, the elastic component 20 can be divided into an elastic film (the elastic film 721 shown in FIG. 7 ) and an elastic microstructure layer (the elastic microstructure layer 725 shown in FIG. 7 ). The protruding structure 23 is disposed on the elastic microstructure layer.

FIG. 2 is a schematic diagram of a sensing device according to some embodiments of the present invention. In this embodiment, the sensing device 210 may be a vibration sensing device. The vibration sensing device can collect vibration signals and convert them into electrical signals. For example, sensing device 210 may be part of a microphone, such as a bone conduction microphone (also known as a bone conduction microphone). The bone conduction microphone can convert vibration signals into voice signals, for example, collect vibration signals generated by facial muscles when the user speaks, and convert the vibration signals into electrical signals containing voice information.

As shown in FIG. 2 , the sensing device 210 may include an elastic component 220 , a conversion component 230 , a housing 240 , a mass unit 260 and a sealing unit 270 . The casing 240 may have an accommodating space 241 for accommodating one or more components of the sensing device 210 (eg, the elastic component 220 , the mass unit 260 and the sealing unit 270 ). In some embodiments, the housing 240 is a semi-closed housing, and is connected with the conversion component 230 to form the accommodating space 241 . For example, the casing 240 is disposed above the conversion component 230 to form an accommodating space 241 .

In some embodiments, the sensing device 210 shown in FIG. 2 can be used as a vibration sensing device in the field of microphones, for example, a bone conduction microphone. For example, when applied to a bone conduction microphone, the sensing cavity 250 may also be called an acoustic cavity, and the conversion component 230 may be an acoustic converter. The acoustic transducer acquires the sound pressure change of the acoustic cavity and converts it into an electrical signal. In some embodiments, the elastic member 220 is disposed above the acoustic transducer (ie, the conversion member 230 ), and a sensing cavity 250 is formed between the elastic member 220 and the acoustic transducer.

The elastic member 220 may include an elastic film 221 . A protruding structure 223 is provided on the surface (also known as the inner surface) of the elastic film 221 close to the conversion component 230 . The protruding structure 223 and the elastic film 221 (forming the first side wall of the sensing cavity 250 ) can form the sensing cavity 250 together with the conversion component 230 (forming the second side wall of the sensing cavity 250 ). For a vibration sensing device, the sensing cavity 250 may also be referred to as an acoustic cavity. The elastic film 221 can also be called a diaphragm.

As shown in FIG. 2 , the outer edge of the elastic membrane 221 may be physically connected to the conversion member 230 . The physical connection may include bonding, nailing, clamping and connection through additional connection components (eg, sealing unit 270 ). For example, the outer edge of the elastic film 221 can be bonded with the conversion component 230 by adhesive to form the sensing cavity 250 . However, the sealing performance of the adhesive bonding is poor, which reduces the sensitivity of the sensing device 210 to a certain extent. In some embodiments, the top of the protruding structure 223 abuts against the surface of the conversion component 230 . The top end refers to the end of the protruding structure 223 away from the elastic film 221 . The connection between the top of the protruding structure 223 arranged on the periphery of the elastic membrane 221 and the surface of the conversion component 230 can be sealed by the sealing unit 270, so that the protruding structure 223, the elastic membrane 221, the sealing unit 270 and the conversion component 230 jointly form a closed The sensing chamber 250. It can be understood that the location of the sealing member 270 is not limited to the above description. In some embodiments, the sealing member 270 may not be limited to be disposed at the junction between the top of the protruding structure 223 and the surface of the conversion member 230, but may also be disposed on the outside of the protruding structure 223 for forming the sensing cavity 250 (that is, the protruding the side of the lifting structure 223 away from the sensing cavity 250). In some embodiments, in order to further improve the sealing performance, a sealing structure may also be provided inside the sensing cavity 250 . Sealing the connection between the elastic component 220 and the conversion component 230 by the sealing unit 270 can ensure the sealing of the entire sensing cavity 250 , thereby effectively improving the reliability and stability of the sensing device 210 . In some embodiments, the sealing unit 270 can be made of materials such as silicon rubber and rubber, so as to further improve the sealing performance of the sealing unit 270 . In some embodiments, the type of the sealing unit 270 may include one or more of a sealing ring, a sealing gasket, and a sealing strip.

In some embodiments, the elastic film 221 may have a certain thickness, and the thickness of the elastic film 221 refers to the dimension of the elastic film 221 in the first direction. For easy understanding, the thickness of the elastic film 221 can be represented by H3 in FIG. 2 . In some embodiments, the thickness H3 of the elastic film 221 may range from 0.1 μm to 500 μm. In some embodiments, the thickness H3 of the elastic film 221 may range from 0.2 μm to 400 μm. In some embodiments, the thickness H3 of the elastic film 221 may range from 0.4 μm to 350 μm. In some embodiments, the thickness H3 of the elastic film 221 may range from 0.6 μm to 300 μm. In some embodiments, the thickness H3 of the elastic film 221 may range from 0.8 μm to 250 μm. In some embodiments, the thickness H3 of the elastic film may range from 1 μm to 200 μm.

The mass unit 260 may be connected with the elastic member 220 and located on a side of the elastic member 220 away from the sensing cavity 250 . For example, the mass unit 260 may be disposed on the elastic film 221 on a side away from the sensing cavity 250 . In response to the vibration of the casing 240 and/or the conversion component 230 , the mass unit 260 and the elastic component 220 can form a resonant system to generate vibration. The mass unit 260 has a certain mass, so the vibration amplitude of the elastic member 220 relative to the housing 240 can be increased, so that the volume change of the sensing cavity 250 can change significantly under the action of external vibrations of different intensities, thereby improving the sensitivity. Sensitivity of measuring device 210.

In some embodiments, the mass unit 260 may be a regular structure such as a cylinder, a cube, a cuboid or other irregular structures. As shown in FIG. 2 , the mass unit 260 may be a cylindrical structure.

In some embodiments, the mass unit 260 may be made of a material with a higher density. Exemplarily, the mass unit 260 may use copper, iron, stainless steel, lead, tungsten, molybdenum and other materials. In some embodiments, the mass unit 260 may be made of copper. In some embodiments, the mass unit 260 may be made of a material with certain elasticity. In some embodiments, the mass unit 260 made of the above-mentioned elastic material may be disposed on a side of the elastic member 220 facing the conversion member 230 . For example, the protruding structure 223 may be directly provided (eg, processed by cutting, injection molding, bonding, etc.) on the surface of the mass unit 260 facing the conversion component 230 . Since the mass unit 260 itself is elastic, the protruding structure 223 provided on the mass unit 260 is also elastic. In this embodiment, the mass unit 260 can reduce the volume of the sensing cavity 250 and improve the sensitivity of the sensing device 210 to a certain extent. In some embodiments, the top of the protruding structure 223 disposed on the mass unit 260 may abut against the surface of the conversion component 230 .

In some embodiments, for different types and/or sizes of sensing devices 210 , the Young's modulus of the elastic film 221 and the Young's modulus of the mass unit 260 may have different values. In some embodiments, the Young's modulus of the elastic film 221 may be less than 500Mpa. In some embodiments, the Young's modulus of the elastic film 221 may be less than 300Mpa. In some embodiments, the Young's modulus of the elastic film 221 may be less than 200Mpa. In some embodiments, the Young's modulus of the elastic film 221 may be less than 100Mpa. In some embodiments, the Young's modulus of the elastic film 221 may be less than 80 MPa. In some embodiments, the Young's modulus of the elastic film 221 may be less than 60Mpa. In some embodiments, the Young's modulus of the elastic film 221 may be less than 40Mpa. In some embodiments, the Young's modulus of the mass unit 260 may be greater than 10 GPa. In some embodiments, the Young's modulus of the mass unit 260 may be greater than 50 GPa. In some embodiments, the Young's modulus of the mass unit 260 may be greater than 80 GPa. In some embodiments, the Young's modulus of the mass unit 260 may be greater than 100 GPa. In some embodiments, the Young's modulus of the mass unit 260 may be greater than 200 GPa. In some embodiments, the Young's modulus of the mass unit 260 may be greater than 500 GPa. In some embodiments, the Young's modulus of the mass unit 260 may be greater than 1000 GPa.

In some embodiments, the mass unit 260 has a certain thickness. The thickness of the mass unit may refer to the dimension of the mass unit 260 in the first direction. For easy understanding, the thickness of the mass unit 260 can be represented by H4 in FIG. 2 . In some embodiments, the thickness H4 of the mass unit 260 is in the range of 1 μm to 1000 μm. In some embodiments, the thickness H4 of the mass unit 260 is in the range of 10 μm to 900 μm. In some embodiments, the thickness H4 of the mass unit 260 is in the range of 20 μm to 800 μm. In some embodiments, the thickness H4 of the mass unit 260 is in the range of 30 μm to 700 μm. In some embodiments, the thickness H4 of the mass unit 260 is in the range of 40 μm to 600 μm. In some embodiments, the thickness H4 of the mass unit 260 is in the range of 50 μm to 500 μm.

For sensing devices 210 of different types and/or sizes, the ratio or difference between the thickness H4 of the mass unit 260 and the thickness H3 of the elastic film 221 is within a certain range. In some embodiments, the ratio of the thickness H4 of the mass unit 260 to the thickness H3 of the elastic film 221 is in the range of 1 to 100,000. In some embodiments, the ratio of the thickness H4 of the mass unit 260 to the thickness H3 of the elastic film 221 ranges from 1 to 50,000. In some embodiments, the ratio of the thickness H4 of the mass unit 260 to the thickness H3 of the elastic membrane 221 is in the range of 10 to 10000. In some embodiments, the ratio of the thickness H4 of the mass unit 260 to the thickness H3 of the elastic film 221 is in the range of 100 to 5000. In some embodiments, the ratio of the thickness H4 of the mass unit 260 to the thickness H3 of the elastic film 221 is in the range of 100 to 1000. In some embodiments, the ratio of the thickness H4 of the mass unit 260 to the thickness H3 of the elastic film 221 is in the range of 100 to 5000. In some embodiments, the ratio of the thickness H4 of the mass unit 260 to the thickness H3 of the elastic membrane 221 is in the range of 500 to 2000.

In some embodiments, the mass unit 260 may be located in the middle of the elastic member 220 (eg, the elastic film 221 ). The middle part refers to the middle part of the elastic member 220 in the second direction. For example, the elastic membrane 221 is circular, and the mass unit 260 is a cylindrical structure. The mass unit 260 can be disposed at the middle part of the elastic film 221 . In some embodiments, the distance between the axis of the mass unit 260 and the center point of the elastic membrane 221 in the second direction may be less than a critical distance. The threshold distance may be 50 μm, 0.1 mm, 0.5 mm, 1 mm, 2 mm and so on. In some embodiments, the center point of the elastic membrane 221 is on the axis of the mass unit 260 . By arranging the mass unit 260 in the middle of the elastic film 221 , the displacement of the mass unit 260 in the second direction can be reduced and the sensitivity of the sensing device 210 can be improved.

As shown in FIG. 2 , the projected area of the mass unit 260 in the first direction may be smaller than the projected area of the elastic member 220 in the first direction. For sensing devices 210 of different types and/or sizes, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the elastic member 220 in the first direction may be within a certain range. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the elastic member 220 in the first direction may range from 0.05 to 0.95. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the elastic member 220 in the first direction may range from 0.1 to 0.9. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the elastic member 220 in the first direction may range from 0.2 to 0.9. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the elastic member 220 in the first direction may range from 0.3 to 0.8. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the elastic member 220 in the first direction may range from 0.4 to 0.7. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the elastic member 220 in the first direction may range from 0.5 to 0.6.

For sensing devices 210 of different types and/or sizes, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction may be within a certain range. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction may range from 0.05 to 0.95. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction may range from 0.1 to 0.9. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction may range from 0.2 to 0.9. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction may range from 0.3 to 0.8. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction may range from 0.4 to 0.7. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction may range from 0.5 to 0.6.

In this embodiment, the elastic component 220 (eg, the elastic film 221 ) is more likely to be elastically deformed than the casing 240 , so that the elastic component 220 can move relative to the casing 240 . When the external vibration acts on the casing 240 , the casing 240 , the conversion component 230 , the elastic component 220 and other components will all vibrate. Since the vibration phase of the elastic component 220 is different from the vibration phase of the conversion component 230, the volume of the sensing cavity 250 (that is, the acoustic cavity) changes, resulting in a change in the sound pressure of the acoustic cavity, which is converted by the conversion component 230 It is converted into an electrical signal to realize the pickup of bone conduction sound.

（1） 其中，𝑀為系統的質量，𝑅為系統的阻尼，𝐾為系統的彈性係數，𝐹為驅動力幅值，𝑥為系統的位移，𝜔為驅動力圓頻率。基於公式（1）求解穩態位移可得：

（2） 其中，

。 For the convenience of understanding, the structure composed of the elastic member 220 (including the elastic film 221 and the protruding structure 223) and the mass unit 260 can be simplified and equivalent to the mass-spring-damping system model shown in Figure 11, where the elastic member 220 is The system provides the spring and damping action, and the mass unit 260 provides the mass action for the system. When the system is working, it can be considered that the mass-spring-damping system model is forced to move under the action of the exciting force, and its vibration law conforms to the law of the mass-spring-damping system. Specifically, the motion of the system can be described by the differential equation of formula (1):

(1) Among them, 𝑀 is the mass of the system, 𝑅 is the damping of the system, 𝐾 is the elastic coefficient of the system, 𝐹 is the amplitude of the driving force, 𝑥 is the displacement of the system, and 𝜔 is the circular frequency of the driving force. Solving the steady-state displacement based on formula (1) can be obtained as follows:

(2) Among them,

.

（3） 其中，

可以表示系統的頻率，

表示系統的諧振頻率，

，

可以表示力學品質因素，

可以表示靜態位移振幅（或稱𝜔=0時的位移振幅）。 Further, the displacement amplitude ratio (normalized) equation can be obtained based on formula (1) and formula (2):

(3) Among them,

can represent the frequency of the system,

is the resonant frequency of the system,

,

can represent the mechanical quality factor,

It can represent the static displacement amplitude (or the displacement amplitude when 𝜔=0).

發生壓縮或者擴張，感測腔250在發生壓縮或擴張時體積變化量為

。感測裝置210的靈敏度

，即感測裝置210的靈敏度S正比於感測腔250體積變化量

，反比於感測腔250的體積

。基於上述原理，在一些實施例中，可以通過增大感測腔250的體積變化量

來提高感測裝置210的靈敏度及/或可以通過減小感測腔250的體積

來提高感測裝置210的靈敏度。 When the mass unit 260 vibrates under the excitation of the external vibration signal, it will cause the volume of the sensing cavity 250

Compression or expansion occurs, and the volume change of the sensing cavity 250 when compression or expansion occurs is

. The sensitivity of the sensing device 210

, that is, the sensitivity S of the sensing device 210 is proportional to the volume change of the sensing cavity 250

, which is inversely proportional to the volume of the sensing cavity 250

. Based on the above principles, in some embodiments, by increasing the volume change of the sensing cavity 250

To improve the sensitivity of the sensing device 210 and/or by reducing the volume of the sensing cavity 250

To improve the sensitivity of the sensing device 210 .

以及感測裝置210工作時感測腔250的體積變化量

。對於彈性部件220，由於在彈性薄膜221內表面上設置有凸起結構223，並且所述凸起結構223向感測腔250內凸出，減小了感測腔250的體積

，因此可以提高感測裝置210的靈敏度。 In some embodiments, the sensing cavity 250 is composed of the elastic component 220, the conversion component 230 and other components. For example, the sensing cavity 250 is composed of the elastic component 220 , the converting component 230 and the sealing unit 270 . In the above embodiments, the elastic component (eg, the elastic film 221 and the protruding structure 223 ) and the conversion component (eg, the conversion component 230 ) serve as the first sidewall and the second sidewall of the sensing cavity 250 , respectively. Therefore, the structures of the elastic member 220 and the conversion member 230 will affect the volume of the sensing cavity 250 of the sensing device 210

And the volume change of the sensing chamber 250 when the sensing device 210 is working

. As for the elastic member 220, since a protruding structure 223 is provided on the inner surface of the elastic film 221, and the protruding structure 223 protrudes into the sensing cavity 250, the volume of the sensing cavity 250 is reduced.

, so the sensitivity of the sensing device 210 can be improved.

與構成感測腔250的凸起結構223的密度有關。可以理解的是，當相鄰凸起結構223的間隔越小時，表明凸起結構223的密度越大，因此由凸起結構223構成的感測腔250的體積

也就越小。相鄰凸起結構223之間的間隔可以是指相鄰凸起結構223的中心之間的距離。這裡的中心可以理解為凸起結構223橫截面上的形心。為了方便說明，相鄰凸起結構223之間的間隔可以由圖2的L1表示，即相鄰凸起結構的頂端或中心之間的距離。在一些實施例中，相鄰的凸起結構223之間的間隔L1可以在1μm至2000μm範圍內。在一些實施例中，相鄰的凸起結構223之間的間隔L1可以在4μm至1500μm範圍內。在一些實施例中，相鄰的凸起結構223之間的間隔L1可以在8μm至1000μm範圍內。在一些實施例中，相鄰的凸起結構223之間的間隔L1可以在10μm至500μm範圍內。 In some embodiments, the volume of sensing chamber 250

It is related to the density of the protruding structures 223 constituting the sensing cavity 250 . It can be understood that when the distance between adjacent protruding structures 223 is smaller, it indicates that the density of the protruding structures 223 is greater, so the volume of the sensing cavity 250 formed by the protruding structures 223

Also smaller. The interval between adjacent protruding structures 223 may refer to the distance between centers of adjacent protruding structures 223 . The center here can be understood as the centroid on the cross section of the protruding structure 223 . For convenience of description, the interval between adjacent protruding structures 223 may be represented by L1 in FIG. 2 , that is, the distance between the tops or centers of adjacent protruding structures. In some embodiments, the interval L1 between adjacent protrusion structures 223 may be in the range of 1 μm to 2000 μm. In some embodiments, the interval L1 between adjacent protrusion structures 223 may be in the range of 4 μm to 1500 μm. In some embodiments, the interval L1 between adjacent protruding structures 223 may be in the range of 8 μm to 1000 μm. In some embodiments, the interval L1 between adjacent protrusion structures 223 may be in the range of 10 μm to 500 μm.

與凸起結構223的寬度相關。凸起結構223的寬度可以理解為凸起結構223在第二方向上的尺寸。為了方便說明，凸起結構223在第二方向上的尺寸可以通過圖2的L2表示。在一些實施例中，單個凸起結構223的寬度L2可以在1μm至1000μm範圍內。在一些實施例中，單個凸起結構223的寬度L2可以在2μm至800μm範圍內。在一些實施例中，單個凸起結構223的寬度L2可以在3μm至600μm範圍內。在一些實施例中，單個凸起結構223的寬度L2可以在6μm至400μm範圍內。在一些實施例中，單個凸起結構223的寬度可以在10μm至300μm範圍內。 In some embodiments, the volume of sensing cavity 250

It is related to the width of the protruding structure 223 . The width of the protruding structure 223 can be understood as the dimension of the protruding structure 223 in the second direction. For the convenience of description, the size of the protruding structure 223 in the second direction can be represented by L2 in FIG. 2 . In some embodiments, the width L2 of a single protrusion structure 223 may range from 1 μm to 1000 μm. In some embodiments, the width L2 of a single protrusion structure 223 may range from 2 μm to 800 μm. In some embodiments, the width L2 of a single protrusion structure 223 may range from 3 μm to 600 μm. In some embodiments, the width L2 of a single protrusion structure 223 may range from 6 μm to 400 μm. In some embodiments, the width of a single protrusion structure 223 may range from 10 μm to 300 μm.

For sensing devices 210 of different types and/or sizes, the ratio of the width L2 of the protruding structures 223 to the interval L1 between adjacent protruding structures 223 is within a certain range. In some embodiments, the ratio of the width L2 of the protruding structures 223 to the interval L1 between adjacent protruding structures 223 is in the range of 0.05 to 20. In some embodiments, the ratio of the width L2 of the protruding structures 223 to the interval L1 between adjacent protruding structures 223 ranges from 0.1 to 20. In some embodiments, the ratio of the width L2 of the protruding structures 223 to the interval L1 between adjacent protruding structures 223 is in the range of 0.1 to 10. In some embodiments, the ratio of the width L2 of the protruding structures 223 to the interval L1 between adjacent protruding structures 223 ranges from 0.5 to 8. In some embodiments, the ratio of the width L2 of the protruding structures 223 to the interval L1 between adjacent protruding structures 223 is in the range of 1-6. In some embodiments, the ratio of the width L2 of the protruding structures 223 to the interval L1 between adjacent protruding structures 223 is in the range of 2-4.

與凸起結構223的高度H1相關。凸起結構223的高度可以理解為凸起結構223處於自然狀態時（例如，凸起結構223未受擠壓而產生彈性形變的情況下）在第一方向上的尺寸。為了方便說明，凸起結構223在第一方向上的尺寸可以通過圖2的H1表示。在一些實施例中，凸起結構223的高度H1可以在1μm至1000μm範圍內。在一些實施例中，凸起結構223的高度H1可以在2μm至800μm範圍內。在一些實施例中，凸起結構223的高度H1可以在4μm至600μm範圍內。在一些實施例中，凸起結構223的高度H1可以在6μm至500μm範圍內。在一些實施例中，凸起結構223的高度H1可以在8μm至400μm範圍內。在一些實施例中，凸起結構223的高度H1可以在10μm至300μm範圍內。 In some embodiments, the volume of sensing cavity 250

It is related to the height H1 of the protruding structure 223 . The height of the protruding structure 223 can be understood as the dimension in the first direction when the protruding structure 223 is in a natural state (for example, when the protruding structure 223 is not elastically deformed due to compression). For the convenience of description, the size of the protruding structure 223 in the first direction can be represented by H1 in FIG. 2 . In some embodiments, the height H1 of the protrusion structure 223 may be in the range of 1 μm to 1000 μm. In some embodiments, the height H1 of the protrusion structure 223 may be in the range of 2 μm to 800 μm. In some embodiments, the height H1 of the protrusion structure 223 may be in the range of 4 μm to 600 μm. In some embodiments, the height H1 of the protrusion structure 223 may range from 6 μm to 500 μm. In some embodiments, the height H1 of the protrusion structure 223 may range from 8 μm to 400 μm. In some embodiments, the height H1 of the protrusion structure 223 may range from 10 μm to 300 μm.

In some embodiments, the difference between the height of the sensing cavity 250 and the height of the protruding structure 223 is within a certain range. For example, at least part of the protruding structure 223 may not be in contact with the conversion member 230 . At this time, there is a certain gap between the protruding structure 223 and the surface of the conversion component 230 . The gap between the protruding structure 223 and the surface of the conversion component 230 refers to the distance between the tip of the protruding structure 223 and the surface of the conversion component 230 . The gap may be formed during the process of processing the protruding structure 223 or installing the elastic component 220 . The height of the sensing cavity 250 can be understood as the dimension in the first direction of the sensing cavity 250 in a natural state (for example, when the first side wall and the second side wall are not vibrated or elastically deformed). For convenience of description, the size of the sensing cavity 250 in the first direction can be represented by H2 in FIG. 2 . In some embodiments, the difference between the height H1 of the protruding structure 223 and the height H2 of the sensing cavity 250 may be within 20%. In some embodiments, the difference between the height H1 of the protruding structure 223 and the height H2 of the sensing cavity 250 may be within 15%. In some embodiments, the difference between the height H1 of the protruding structure 223 and the height H2 of the sensing cavity 250 may be within 10%. In some embodiments, the difference between the height H1 of the protruding structure 223 and the height H2 of the sensing cavity 250 may be within 5%. In some embodiments, the gap between the raised structure 223 and the surface of the conversion component 230 may be within 10 μm. In some embodiments, the gap between the raised structure 223 and the surface of the conversion component 230 may be within 5 μm. In some embodiments, the gap between the raised structure 223 and the surface of the conversion member 230 may be within 1 μm.

。由於彈性部件220以及凸起結構223在第一方向上的運動幅度較小，例如，凸起結構223在第一方向上的運動幅度通常在小於1μm，在此流程中，凸起結構223可能不會與轉換部件230的表面接觸，因此

與凸起結構223無關，且

的值較小。 During the working process of the sensing device 210, the elastic member 220 will vibrate or elastically deform after receiving an external signal (for example, a vibration signal) and drive the protruding structure 223 to move along the first direction shown in FIG. 2 , so that The sensing cavity 250 shrinks or expands, and the resulting volume change of the sensing cavity 250 can be expressed as

. Since the range of motion of the elastic member 220 and the protruding structure 223 in the first direction is small, for example, the range of motion of the protruding structure 223 in the first direction is generally less than 1 μm, in this process, the protruding structure 223 may not will be in contact with the surface of the conversion component 230, so

independent of the raised structure 223, and

The value is small.

For sensing devices 210 of different types and/or sizes, the ratio or difference between the height H1 of the protruding structure 223 and the thickness H3 of the elastic film 221 is within a certain range. In some embodiments, the ratio of the height H1 of the protruding structure 223 to the thickness H3 of the elastic film 221 ranges from 0.5 to 500. In some embodiments, the ratio of the height H1 of the protruding structure 223 to the thickness H3 of the elastic film 221 ranges from 1 to 500. In some embodiments, the ratio of the height H1 of the protruding structure 223 to the thickness H3 of the elastic film 221 ranges from 1 to 200. In some embodiments, the ratio of the height H1 of the protruding structure 223 to the thickness H3 of the elastic film 221 ranges from 1 to 100. In some embodiments, the ratio of the height H1 of the protruding structure 223 to the thickness H3 of the elastic film 221 ranges from 10 to 90. In some embodiments, the ratio of the height H1 of the protruding structure 223 to the thickness H3 of the elastic film 221 ranges from 20 to 80. In some embodiments, the ratio of the height H1 of the protruding structure 223 to the thickness H3 of the elastic film 221 ranges from 40 to 60.

。另外，由於凸起結構223本身與轉換部件230相抵接，因此在外力的作用下凸起結構223會與轉換部件230發生擠壓。由於凸起結構223本身具有一定彈性，因此擠壓所產生的力會使得凸起結構223發生彈性形變。凸起結構223發生彈性形變時會進一步縮小感測腔250的體積。圖3B所示為凸起結構223在第一方向上運動的幅度以及產生的彈性形變。實線P1示出了凸起結構223在擠壓後的形狀輪廓和位置。虛線P2示出了凸起結構223在擠壓之前的形狀輪廓和位置。由圖可知，由於凸起結構223的彈性形變，感測腔250的體積進一步減小。為了方便描述，由凸起結構223與感測腔250的第二側壁擠壓所導致的感測腔250的體積變化的值可以表示為

。基於上述內容，如果凸起結構223與感測腔250的第二側壁抵接，那麼在感測裝置210工作的流程中，感測腔250的體積變化量

為

和

之和。因此，感測腔250的體積變化量

較

更大，能夠進一步提高感測裝置210的靈敏度。此外，由於凸起結構223發生形變，相較於自然狀態下而言，凸起結構223在第一方向上的尺寸變小，因而感測腔250的高度H2小於凸起結構223處於自然狀態下在第一方向上的尺寸（即H1）。 In some embodiments, the raised structure 223 may be in direct contact with the surface of the conversion component 230 . At this time, the height H1 of the protruding structure 223 is the same or similar to the height H2 of the sensing cavity 250 . 3A and 3B are schematic diagrams showing the abutment of the protrusion structure and the second side wall of the sensing cavity according to some embodiments of the present invention. As shown in FIG. 3A , the protruding structure 223 may abut against the second sidewall of the sensing cavity 250 . The protruding structure 223 may have certain elasticity. In this embodiment, when the elastic component 220 is excited by an external force to move, it will drive the protruding structure 223 to move toward the conversion component 230 . When the elastic member 220 and the protruding structure 223 move, the volume of the sensing cavity 250 will decrease, and the resulting change in the volume of the sensing cavity 250 can be expressed as

. In addition, since the protruding structure 223 abuts against the conversion component 230 , the protruding structure 223 will be pressed against the conversion component 230 under the action of an external force. Since the protruding structure 223 itself has a certain degree of elasticity, the force generated by extrusion will cause the protruding structure 223 to undergo elastic deformation. The volume of the sensing cavity 250 will be further reduced when the protruding structure 223 is elastically deformed. FIG. 3B shows the amplitude of the movement of the protruding structure 223 in the first direction and the resulting elastic deformation. The solid line P1 shows the shape profile and position of the protruding structure 223 after extrusion. The dashed line P2 shows the shape profile and position of the raised structure 223 before extrusion. It can be seen from the figure that due to the elastic deformation of the protruding structure 223 , the volume of the sensing cavity 250 is further reduced. For the convenience of description, the value of the volume change of the sensing cavity 250 caused by the extrusion between the protruding structure 223 and the second side wall of the sensing cavity 250 can be expressed as

. Based on the above, if the protruding structure 223 abuts against the second side wall of the sensing cavity 250, the volume change of the sensing cavity 250 during the working process of the sensing device 210

for

and

Sum. Therefore, the volume change of the sensing cavity 250

compare

larger, the sensitivity of the sensing device 210 can be further improved. In addition, due to the deformation of the protruding structure 223, compared with the natural state, the dimension of the protruding structure 223 in the first direction becomes smaller, so the height H2 of the sensing cavity 250 is smaller than that of the protruding structure 223 in the natural state. The dimension in the first direction (ie H1).

可以與凸起結構223的材料有關。凸起結構223可以選用一定特性的材料。例如，凸起結構223可以具有特定的楊氏模量。在一些是實施例中，凸起結構223的楊氏模量為10kPa至10MPa。在一些是實施例中，凸起結構223的楊氏模量為20kPa至8MPa。在一些是實施例中，凸起結構223的楊氏模量為50kPa至5MPa。在一些是實施例中，凸起結構223的楊氏模量為80kPa至2MPa。在一些是實施例中，凸起結構223的楊氏模量為100kPa至1MPa。對於不同類型及/或尺寸的感測裝置210，凸起結構223的楊氏模量與彈性薄膜221的楊氏模量之比或之差可以在一定範圍內。在一些實施例中，凸起結構的楊氏模量223與彈性薄膜221的楊氏模量之比可以在0.005至1範圍內。在一些實施例中，凸起結構223的楊氏模量與彈性薄膜221的楊氏模量之比可以在0.01至1範圍內。在一些實施例中，凸起結構223的楊氏模量與彈性薄膜221的楊氏模量之比可以在0.05至0.8範圍內。在一些實施例中，凸起結構的楊氏模量223與彈性薄膜221的楊氏模量之比可以在0.1至0.6範圍內。在一些實施例中，凸起結構的楊氏模量223與彈性薄膜221的楊氏模量之比可以在0.2至0.4範圍內。 In some embodiments, the volume change of the sensing cavity 250

It may be related to the material of the protruding structure 223 . The protruding structure 223 can be selected from a material with certain characteristics. For example, the protrusion structure 223 may have a specific Young's modulus. In some embodiments, the Young's modulus of the protrusion structure 223 is 10 kPa to 10 MPa. In some embodiments, the Young's modulus of the protrusion structure 223 is 20 kPa to 8 MPa. In some embodiments, the Young's modulus of the protrusion structure 223 is 50 kPa to 5 MPa. In some embodiments, the Young's modulus of the protrusion structure 223 is 80 kPa to 2 MPa. In some embodiments, the Young's modulus of the protrusion structure 223 is 100 kPa to 1 MPa. For sensing devices 210 of different types and/or sizes, the ratio or difference between the Young's modulus of the protruding structure 223 and the Young's modulus of the elastic film 221 may be within a certain range. In some embodiments, the ratio of the Young's modulus 223 of the protruding structure to the Young's modulus of the elastic film 221 may range from 0.005 to 1. In some embodiments, the ratio of the Young's modulus of the protruding structure 223 to the Young's modulus of the elastic film 221 may range from 0.01 to 1. In some embodiments, the ratio of the Young's modulus of the protruding structure 223 to the Young's modulus of the elastic film 221 may range from 0.05 to 0.8. In some embodiments, the ratio of the Young's modulus 223 of the protrusion structure to the Young's modulus of the elastic film 221 may be in the range of 0.1 to 0.6. In some embodiments, the ratio of the Young's modulus 223 of the protrusion structure to the Young's modulus of the elastic film 221 may be in the range of 0.2 to 0.4.

更大。 In some embodiments, the material for making the protruding structure 223 may include silicone rubber, silicone gel, silicone rubber, polydimethylsiloxane (Polydimethylsiloxane, PDMS), styrene-butadiene-styrene block copolymer (Styrenic Block Copolymers, SBS), to ensure that the raised structure 223 has high elasticity, and the elastic deformation is larger when subjected to the same magnitude of external force, thereby making the volume change of the sensing cavity 250

bigger.

還可以與凸起結構223的形狀有關。在一些實施例中，凸起結構223的形狀可以為各種形狀。圖4至圖6分別示出了三種不同形狀的凸起結構。其中，圖4中的凸起結構423的形狀為金字塔狀，呈點陣列分佈在彈性部件420的內表面上。圖5中的凸起結構523的形狀為半球狀，呈點陣列分佈在彈性部件520的內表面上。圖6中的凸起結構623的形狀為條紋狀，呈線陣列分佈在彈性部件620的內表面上。可以理解的是，這僅出於說明的目的，並不旨在限制凸起結構223的形狀。凸起結構223還可以為其他可能的形狀。例如，梯台狀、圓柱狀、橢球狀等。 In some embodiments, the volume change of the sensing cavity 250

It may also be related to the shape of the protruding structure 223 . In some embodiments, the shape of the protruding structure 223 can be various shapes. Fig. 4 to Fig. 6 respectively show three kinds of protrusion structures with different shapes. Wherein, the protruding structure 423 in FIG. 4 is in the shape of a pyramid, and is distributed on the inner surface of the elastic member 420 in a dot array. The protruding structure 523 in FIG. 5 is hemispherical in shape and distributed on the inner surface of the elastic member 520 in a dot array. The protruding structures 623 in FIG. 6 are in the shape of stripes and are distributed on the inner surface of the elastic member 620 in a line array. It can be understood that this is for illustrative purposes only and is not intended to limit the shape of the protruding structure 223 . The protruding structure 223 can also be in other possible shapes. For example, terraced, cylindrical, ellipsoidal, etc.

更大，對於感測裝置210的靈敏度增幅更大。 Referring to Fig. 4, the shape of the protruding structure 223 is pyramidal. Compared with other shapes (for example, hemispherical), when the protruding structure 223 is subjected to an external force, the pyramid-shaped protruding structure 223 will cause stress to concentrate on top. For protruding structures 223 of different shapes, if the Young's modulus is the same, the equivalent stiffness of the pyramid-shaped protruding structure 223 will be lower, the elastic coefficient will be lower, and the deformation amount of elastic deformation will be larger, so that The volume change of the sensing cavity 250

The larger the sensitivity of the sensing device 210 increases.

（即公式（3）中的

）有關。具體的，

，當減小

時，感測裝置210的感測腔250的聲壓的變化量

會變大，同時系統的諧振頻率

會降低。諧振頻率

率會影響系統在諧振頻率前後一定頻率範圍內的感測裝置210的靈敏度。因此，在通過調整感測裝置210的諧振頻率來調整感測裝置210的靈敏度的流程中，需要考慮頻率範圍對於感測裝置210靈敏度的影響。在一些實施例中，感測裝置210的諧振頻率在1500 Hz至6000 Hz範圍內。在一些實施例中，感測裝置210的諧振頻率在1500 Hz至5000 Hz範圍內。在一些實施例中，感測裝置210的諧振頻率在1500 Hz至4000 Hz範圍內。在一些實施例中，感測裝置210的諧振頻率在1500 Hz至3000 Hz範圍內。 In some embodiments, the sensitivity of the sensing device 210 is related to the resonant frequency of the system composed of the mass unit 260 and the elastic member 220

(ie in formula (3)

)related. specific,

, when decreasing

, the variation of the sound pressure of the sensing cavity 250 of the sensing device 210

will become larger, while the resonant frequency of the system

will decrease. Resonant frequency

The frequency will affect the sensitivity of the sensing device 210 within a certain frequency range around the resonant frequency of the system. Therefore, in the process of adjusting the sensitivity of the sensing device 210 by adjusting the resonant frequency of the sensing device 210 , it is necessary to consider the influence of the frequency range on the sensitivity of the sensing device 210 . In some embodiments, the resonant frequency of the sensing device 210 is in the range of 1500 Hz to 6000 Hz. In some embodiments, the resonant frequency of the sensing device 210 is in the range of 1500 Hz to 5000 Hz. In some embodiments, the resonant frequency of the sensing device 210 is in the range of 1500 Hz to 4000 Hz. In some embodiments, the resonant frequency of the sensing device 210 is in the range of 1500 Hz to 3000 Hz.

Fig. 7 is a schematic diagram of a sensing device according to other embodiments of the present invention. Similar to the sensing device 210 , the sensing device 710 may include a conversion part 230 , a housing 240 , a sensing cavity 250 , a mass unit 260 , a sealing unit 270 and an elastic part 720 . The casing 240 is disposed above the conversion component 230 to form an accommodating space 241 . The elastic member 720 , the mass unit 260 and the sealing unit 270 may be accommodated in the accommodation space 241 . The outer edge of the elastic component 720 is fixedly connected with the conversion component 230 through the sealing unit 270 . The elastic component 720 , the conversion component 230 and the sealing unit 270 together constitute the sensing cavity 250 . The mass unit 260 is disposed on a side of the elastic component 720 away from the sensing cavity 250 for increasing the vibration amplitude of the elastic component 720 .

In some embodiments, the sensing device 710 shown in FIG. 7 can be used as a vibration sensing device in the field of microphones, for example, a bone conduction microphone. For example, when applied to a bone conduction microphone, the sensing cavity 250 may also be called an acoustic cavity, and the conversion component 230 may be an acoustic transducer. The acoustic transducer acquires the sound pressure change of the acoustic cavity and converts it into an electrical signal.

Different from the sensing device 210 shown in FIG. 2 , in the sensing device 710 shown in FIG. 7 , the elastic component 720 may include an elastic film 721 and an elastic microstructure layer 725 . One side of the elastic microstructure layer 725 is connected to the elastic film 721 , and the other side is provided with a protruding structure 223 . Exemplarily, the protruding structure 223 can be processed in two ways. Wherein, the way (1) is to etch a groove on the silicon wafer, the shape of the groove corresponds to the shape of the protruding structure 223 to be fabricated. Then, the material (for example, PDMS) for forming the protruding structure 223 is coated on the silicon wafer, and the PDMS will fill the grooves of the silicon wafer and form a layer of PDMS film on the surface of the silicon wafer. Then, before the PDMS in the groove and the PDMS film on the surface of the silicon wafer are cured, the material for making the elastic film 721 , for example, polyimide (PI), is coated on the surface of the PDMS film. Finally, wait for the PDMS film, the elastic film 721 and the protruding structure 223 to solidify before taking them out. Method (2) is also to etch grooves on the silicon wafer. Then, the material (for example, PDMS) for making the raised structure 223 is coated on the silicon wafer, and after the PDMS in the groove and the PDMS film on the surface of the silicon wafer are cured, the material for making the elastic film 721 (for example, PI) Coating on the surface of PDMS film or adding glue before coating. Finally wait for the elastic film 721 to solidify and take it out. There is a layer of PDMS film between the convex structure 223 and the elastic film 721 processed by the above two methods, and the PDMS film is the elastic microstructure layer 725 .

In some embodiments, the elastic microstructure layer 725 and the elastic film 721 can be made of the same material. For example, the elastic microstructure layer 725 and the elastic film 721 can both be made of PDMS. Specifically, when processing the protruding structure 223 , a PDMS film may be coated on the surface of the PDMS film (ie, the elastic microstructure layer 725 ) as the elastic film 721 . In some embodiments, the elastic microstructure layer 725 and the elastic film 721 may be made of different materials. For example, the elastic microstructure layer 725 can be made of PDMS, and the elastic film 721 can be made of π. For another example, the elastic microstructure layer 725 may be made of PDMS, and the elastic film 721 may be made of polytetrafluoroethylene (PTFE).

In some embodiments, the thickness of the elastic film 721 may be the same as or different from that of the elastic film 221 in the foregoing embodiments. The thickness of the elastic microstructure layer 725 refers to the size of the elastic microstructure layer 725 in the first direction, which can be represented by H5 in FIG. 7 . In some embodiments, the thickness H5 of the elastic microstructure layer 725 may range from 1 μm to 1000 μm. In some embodiments, the thickness H5 of the elastic microstructure layer 725 may range from 10 μm to 200 μm. In some embodiments, the thickness H5 of the elastic microstructure layer 725 may be in the range of 20 μm to 100 μm.

In some embodiments, the ratio of the thickness H5 of the elastic microstructure layer 725 to the thickness of the elastic member 720 (ie, the sum of H5 and H3 ) may range from 0.5 to 1 for different types and/or sizes of sensing devices 210 . In some embodiments, the ratio of the thickness H5 of the elastic microstructure layer 725 to the thickness of the elastic member 720 is in the range of 0.8 to 1. In some embodiments, the ratio of the thickness H5 of the elastic microstructure layer 725 to the thickness of the elastic member 720 is in the range of 0.9 to 1.

FIG. 8 is a schematic diagram of a sensing device according to some embodiments of the present invention. As shown in FIG. 8 , the sensing device 810 can convert the component 230 , the housing 240 , the sensing cavity 250 , the mass unit 260 and the elastic component 820 . In some embodiments, the sensing device 810 shown in FIG. 8 is similar to the sensing device 710 shown in FIG. 7 except that the sensing cavity 250 is sealed differently. The outer edge of the elastic component 820 of the sensing device 810 is directly fixedly connected to the casing 240 , and then the sensing chamber 250 is jointly formed by the conversion component 230 , the casing 240 and the elastic component 820 . In some embodiments, the elastic member 820 may include an elastic film 821 and an elastic microstructure layer 825 . The raised structures 223 may be part of the elastic microstructure layer 825 . A side of the elastic microstructure layer 825 facing away from the sensing cavity 250 is connected to the elastic film 821 . The elastic microstructure layer 825 is disposed on the protruding structure 223 at a side close to the sensing cavity 250 . The elastic film 821 and/or the elastic microstructure layer 825 can be directly connected to the housing 240 by means of bonding, clamping, riveting, nailing and the like. Exemplarily, as shown in FIG. 8, the edge of the elastic film 821 can be directly embedded in the side wall of the housing 240, and the elastic microstructure layer 825 can be closely attached to the inner wall of the housing 240 to ensure the sealing of the sensing chamber 250. sex. In this embodiment, the elastic member 820 is directly connected to the housing 240, which can ensure good sealing of the sensing chamber 250 in one aspect, and saves the sealing unit in another aspect, which simplifies the structure of the sensing device 810. The structure simplifies the manufacturing process of the sensing device 810 .

In some embodiments, when the elastic member 820 is directly connected to the housing 240 , the projected area of the mass unit 260 in the first direction is smaller than the projected area of the sensing cavity 250 in the first direction. Specifically, if the elastic member 820 (for example, the elastic film 821 of the elastic member 820, the elastic microstructure layer 825) is directly fixedly connected to the housing 240, the projected area of the sensing cavity 250 in the first direction needs to be larger than that of the mass unit 260 The projected area in the first direction is such that there is a certain gap between the edge of the mass unit 260 and the housing 240 so that the mass unit 260 can vibrate in the first direction. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction is in the range of 0.05 to 0.95. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction is in the range of 0.1 to 0.9. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction is in the range of 0.2 to 0.9. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction is in the range of 0.3 to 0.8. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction is in the range of 0.4 to 0.7. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction is in the range of 0.5 to 0.6.

FIG. 9 is a schematic diagram of a sensing device according to some embodiments of the present invention. The sensing device 910 shown in FIG. 9 is similar to the sensing device 210 shown in FIG. 2 , except that the elastic component 920 of the sensing device 910 includes a first elastic component 920-1 and a second elastic component 920-2. The first elastic component 920-1 and the second elastic component 920-2 are respectively disposed on two sides of the mass unit 260 in the first direction. Wherein, the first elastic component 920 - 1 is located on the side of the mass unit 260 close to the conversion component 230 , and the second elastic component 920 - 2 is located on the side of the mass unit 260 away from the conversion component 230 . Similar to the elastic member 220 shown in FIG. 2, the first elastic member 920-1 includes a first elastic film 221-1 and a surface (also called an inner surface) disposed on the side of the first elastic film 221-1 facing the sensing cavity 250. ) of the first raised structure 223-1. The edge of the first protruding structure 223-1 is sealed and connected with the conversion component 230 through the first sealing unit 270-1, so that the first elastic film 221-1, the first protruding structure 223-1, and the first sealing unit 270-1 The sensing cavity 250 is formed together with the conversion component 230 . The second elastic component 920 - 2 includes a second elastic film 221 - 2 and a second protrusion structure 223 - 2 disposed on a side of the second elastic film 221 - 2 away from the sensing cavity 250 . The edge of the second protruding structure 223 - 2 is sealingly connected to the top wall of the housing 240 (ie, the side of the housing 240 away from the conversion component 230 ) through the second sealing unit 270 - 2 .

In some embodiments, at least one of the first elastic member 920-1 and the second elastic member 920-2 may include an elastic microstructure layer (not shown in the figure). Taking the first elastic component 920-1 as an example, the first elastic component 920-1 may include a first elastic film 221-1 and a first elastic microstructure layer, and the first elastic microstructure layer is disposed on the first elastic film 221-1. Towards the side of the conversion member 230 . The side of the first elastic microstructure layer facing the conversion component 230 includes a first protruding structure 223-1. The first protrusion structure 223-1 may be a part of the first elastic microstructure layer. The elastic microstructure layer may be the same as or similar to the elastic microstructure layer (for example, the elastic microstructure layer 725 shown in FIG. 7 ) in one or more of the foregoing embodiments, which will not be repeated here.

As shown in FIG. 9 , the first elastic component 920 - 1 and the second elastic component 920 - 2 are distributed on opposite sides of the mass unit 260 along the first direction. Here, the first elastic component 920 - 1 and the second elastic component 920 - 2 can be approximated as one elastic component 920 . For convenience of description, the elastic component 920 integrally formed by the first elastic component 920-1 and the second elastic component 920-2 may be referred to as a third elastic component. The centroid of the third elastic component coincides with or approximately coincides with the center of gravity of the mass unit 260, and the second elastic component 920-2 is in sealing connection with the top wall of the housing 240 (that is, the side of the housing 240 away from the conversion component 230), which can Within the target frequency range (for example, below 3000 Hz), the response sensitivity of the third elastic component to the vibration of the casing 240 in the first direction is higher than the response sensitivity of the third elastic component to the vibration of the casing 240 in the second direction.

In some embodiments, the third elastic member (ie, the elastic member 920 ) vibrates in the first direction in response to the vibration of the housing 240 . Vibration in the first direction may be regarded as a target signal picked up by the sensing device 910 (eg, a vibration sensing device), and vibration in the second direction may be regarded as a noise signal. In the working process of the sensing device 910, the response sensitivity of the third elastic component to the vibration of the housing 240 in the second direction can be reduced by reducing the vibration generated by the third elastic component in the second direction, thereby improving the sensitivity of the sensing device 910. Directional selectivity reduces the interference of noise signals to sound signals.

In some embodiments, when the third elastic component vibrates in response to the vibration of the housing 240, if the centroid of the third elastic component coincides or nearly coincides with the center of gravity of the mass unit 260, and the second elastic component 920-2 and The top wall of the housing 240 (that is, the side of the housing 240 facing away from the conversion component 230 ) is sealed and connected, so the quality can be reduced under the premise that the response sensitivity of the third elastic component to the vibration of the housing 240 in the first direction is basically unchanged. The vibration of the unit 260 in the second direction reduces the response sensitivity of the third elastic member to the vibration of the casing 240 in the second direction, thereby improving the direction selectivity of the sensing device 910 . It should be noted that here, the centroid of the third elastic component approximately coincides with the center of gravity of the mass unit 260 can be understood as the third elastic component is a regular geometric structure with uniform density, so the centroid of the third elastic component approximately coincides with the center of gravity of the mass unit 260 . The center of gravity of the third elastic component can be regarded as the center of gravity of the mass unit 260 . At this time, the centroid of the third elastic component may be considered to be approximately coincident with the center of gravity of the mass unit 260 . In some embodiments, when the third elastic component has an irregular structure or uneven density, it can be considered that the actual center of gravity of the third elastic component approximately coincides with the center of gravity of the mass unit 260 . Approximate coincidence may mean that the actual center of gravity of the third elastic component or the distance between the centroid of the third elastic component and the center of gravity of the mass unit 260 is within a certain range, for example, less than 100 μm, less than 500 μm, less than 1 mm, less than 2 mm, less than 3 mm, less than 5 mm, less than 10 mm, etc.

When the centroid of the third elastic component coincides with or approximately coincides with the center of gravity of the mass unit 260, the resonant frequency of the third elastic component vibrating in the second direction can be shifted to a high frequency without changing the third elastic component in the second direction. The resonant frequency of vibration in one direction. The resonant frequency of the third elastic member vibrating in the first direction may remain substantially unchanged, for example, the resonant frequency of the third elastic member vibrating in the first direction may be a relatively strong frequency range perceived by the human ear (for example, 20 Hz to 2000 Hz, 2000 Hz to 3000 Hz, etc.). And the resonant frequency of the third elastic member vibrating in the second direction can be shifted to high frequency and be located in the relatively weak frequency range of human ear perception (for example, 5000 Hz to 9000 Hz, 1 kHz to 14 kHz, etc.) .

FIG. 10 is a schematic diagram of a sensing component according to some embodiments of the present invention. The sensing component 1010 can be an independent component. The sensing component 1010 is assembled (for example, pasted or bonded by glue, or combined in other detachable ways) with a specific type of conversion component (not shown in the figure) to form a high-sensitivity sensing device (for example, a sensor Measuring device 10, sensing device 210). The specific type of conversion component can generate a desired signal (eg, an electrical signal) in response to the volume change of the first sensing cavity 1050 . The particular type of conversion component may include, for example, an acoustic conversion component such as an air conduction microphone.

As shown in FIG. 10 , the sensing assembly 1010 may include a housing 240 , a mass unit 260 , a first sensing chamber 1050 and an elastic member 820 . The elastic component 820 , the mass unit 260 and the housing 240 shown in FIG. 10 may be the same as or similar to the corresponding components or units of the sensing device 810 shown in FIG. 8 , and will not be repeated here. The elastic member 820 can serve as the first side wall of the first sensing cavity 1050 , and together with the housing 240 constitutes the first sensing cavity 1050 . The first sensing cavity 1050 is a semi-closed structure. In addition, the first sensing cavity 1050 of the sensing component 1010 is not closed, so dust and impurities may enter the first sensing cavity 1050 during transportation and installation, which will affect the performance of the sensing component 1010 . Therefore, in some embodiments, a dust-proof structure may be provided at the opening of the unsealed sensing component 1010 , that is, at the side of the opening of the first sensing chamber 1050 . Exemplary dustproof structures may include dustproof membranes, dustproof covers, and the like.

As an independent component, the sensing component 1010 is connected to the specific type of conversion component to form a sensing device (eg, the sensing device 10 , the sensing device 210 ). For example, the sensing component 1010 is attached to a conversion component (for example, including an acoustic converter), and the conversion component is placed opposite to the elastic component 820 to form a closed sensing cavity. The conversion component converts the volume change of the closed sensing cavity into an electrical signal. In some embodiments, the conversion component is connected to the connecting board 1031 . For example, the conversion component is connected to a side of the connecting board 1031 away from the sensing component 1010 . The connecting board 1031 may be a printed circuit board (PCB), for example, a phenolic PCB paper substrate, a composite PCB substrate, a glass fiber PCB substrate, a metal PCB substrate, a build-up multilayer PCB substrate, and the like. In some embodiments, the connecting board 1031 may be an FR-4 grade glass fiber PCB substrate made of epoxy glass fiber cloth. In some embodiments, the connection board 1031 may also be a flexible printed circuit board (FPC). Circuits and other components, such as processors and memories, may be disposed on the connection board 1031 (for example, by laser etching, chemical etching, embedding, etc.). In some embodiments, the conversion component can be fixedly connected to the connection board 1031 by fixing glue or metal pins. In some embodiments, the fixing glue can be conductive glue (for example, conductive silver glue, copper powder conductive glue, nickel carbon conductive glue, silver copper conductive glue, etc.). The conductive adhesive can be conductive glue, conductive adhesive film, conductive rubber ring, conductive tape and the like. The connecting plate 1031 includes at least one opening 1033 . A component in the conversion component that acquires a sensing signal (for example, a diaphragm of an air conduction microphone) can communicate with the first sensing cavity 1050 through the opening 1033 .

By connecting the housing 240 of the sensing component 1010 to the connection board 1031, the sensing component 1010, the connection board 1031 and the conversion components connected thereto can form a sensing device. The connection manner between the housing 240 and the connecting plate 1031 may include bonding, clamping, welding, riveting, nailing and the like. At this time, the elastic component 820 , the housing 240 , the connection plate 1031 and the components of the conversion component for acquiring sensing signals may together form a closed sensing cavity (such as the sensing cavity 250 ). The first sensing cavity 1050 is a part (eg, a sub-chamber) of the closed sensing cavity. The connecting board 1031 and the components of the conversion component for acquiring sensing signals may constitute the second side wall of the closed sensing cavity.

A protruding structure 823 is disposed on the first side wall formed by the elastic component 820 . The protruding structure 823 can reduce the volume of the sensing cavity or part of the sensing cavity 1050 to increase the sensitivity of the sensing device. In some embodiments, when the sensing component 1010 and the conversion component constitute a sensing device, the protruding structure may be configured to abut against the second side wall of the sensing cavity. When the sensing device 1010 is in the working state, the elastic member 820 will drive the protruding structure 223 to vibrate and press against the second side wall of the sensing cavity, thereby generating elastic deformation. The elastic deformation of the protruding structure can increase the volume change of the sensing cavity, thereby improving the sensitivity of the sensing device 1010 . In addition, the existence of the protruding structure can effectively reduce the contact area between the elastic member 820 and the second side wall of the sensing cavity, so it can prevent adhesion with the second side wall constituting the sensing cavity, and improve the stability and stability of the sensing device 1010. reliability.

It should be noted that the connecting board 1031 may also be a part of the sensing component 1010 , and a specific type of conversion component is connected to the connecting board 1031 to form a sensing device together with the sensing component 1010 . At this time, the elastic component, the housing 240 and the connection plate 1031 form part of the sensing cavity 1050 .

The above description of the structure of the sensing component 1010 is only a specific example, and should not be regarded as the only feasible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the bone conduction speaker, it is possible to make various forms and details of the specific method and steps of implementing the sensing component 1010 without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, sensing component 1010 may not include mass unit 260 . For another example, when the sensing component 1010 is connected to the connection plate 1031 of the acoustic transducer, the protruding structure 223 may not be in contact with the second side wall formed by the connection plate 1031 .

The basic concepts have been described above. Obviously, for those skilled in the art, the disclosures in the above applications are only examples, and do not constitute limitations to the present invention. Although not explicitly stated herein, various modifications, improvements and amendments to the present invention may be made by those skilled in the art. Such modifications, improvements and corrections are suggested in the present invention, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of the present invention.

Also, the specification has used specific words to describe the embodiments of the present invention. For example, "one embodiment", "an embodiment" and/or "some embodiments" means a certain feature, structure or characteristic related to at least one embodiment of the present invention. Therefore, it should be emphasized and noted that "an embodiment" or "an embodiment" or "an alternative embodiment" mentioned two or more times in different places in this specification do not necessarily refer to the same embodiment . In addition, certain features, structures or characteristics of one or more embodiments of the present invention may be properly combined.

Furthermore, those skilled in the art will appreciate that various aspects of the present invention may be illustrated and described in several patentable varieties or circumstances, including any new and useful process, machine, product, or combination of substances or Any new and useful improvements to them. Correspondingly, various aspects of the present invention may be entirely executed by hardware, may be entirely executed by software (including firmware, resident software, microcode, etc.), or may be executed by a combination of hardware and software. All of the above hardware or software may be referred to as "blocks", "modules", "engines", "units", "components" or "systems". Additionally, aspects of the invention may be embodied as a computer product comprising computer readable program code on one or more computer readable media.

In addition, unless clearly stated in the scope of the patent application, the sequence of processing elements and sequences, the use of numbers and letters or the use of other names in the present invention are not used to limit the sequence of the process and methods of the present invention. Although the foregoing disclosure discusses some presently believed useful application embodiments by way of various examples, it should be understood that such details are for illustrative purposes only and that the scope of the appended claims is not limited to the disclosed embodiments, rather, The scope of the patent application is intended to cover all modifications and equivalent combinations that conform to the spirit and scope of the embodiments of the present invention. For example, although the system components described above can be realized by hardware devices, they can also be realized by only software solutions, such as installing the described systems on existing servers or mobile devices.

In the same way, it should be noted that in order to simplify the expression of the disclosure of the present invention so as to facilitate the understanding of one or more application embodiments, in the foregoing descriptions of the embodiments of the present invention, sometimes multiple features are combined into one embodiment, schema or description thereof. However, this method of disclosure does not imply that the subject matter of the present invention requires more features than those mentioned in the claims. Indeed, embodiment features are less than all features of a single foregoing disclosed embodiment.

In some embodiments, numbers are used to describe the number of components and attributes. It should be understood that such numbers used in the description of embodiments use modifiers such as "about", "approximately" or "substantially" in some examples. to modify. Unless otherwise stated, "about," "approximately," or "substantially" indicates that the stated figure allows for a variation of ±20%. Accordingly, in some embodiments, the numerical data used in the specification and claims are approximations that may vary depending upon the desired characteristics of individual embodiments. In some embodiments, numerical data should take into account the specified number of significant digits and use the usual method of digit reservation. Although the numerical ranges and data used in certain embodiments of the invention to ascertain the breadth of the scope thereof are approximations, in specific embodiments, such numerical values are set as precisely as practicable.

Finally, it should be understood that the embodiments described in the specification are only used to illustrate the principles of the embodiments of the present invention. Other modifications can also belong to the scope of the present invention. Accordingly, by way of illustration and not limitation, alternative configurations of the embodiments of the present invention may be considered consistent with the teachings of the present invention. Accordingly, the embodiments of the present invention are not limited to the embodiments explicitly presented and described in the specification.

10: Sensing device 20: Elastic parts 21: elastic film 23: Raised structure 30: Conversion parts 40: shell 50: Sensing cavity 210: Sensing device 220: Elastic part 221: elastic film 221-1: The first elastic film 221-2: second elastic film 223: Raised structure 223-1: The first raised structure 223-2: Second raised structure 230: Conversion parts 240: Shell 241:Accommodating space 250: Sensing cavity 260: Mass unit 270: sealed unit 270-1: First Seal Unit 270-2:Second sealing unit 420: Elastic parts 423: Convex structure 520: Elastic parts 523: Raised structure 620: Elastic parts 623: Convex structure 710: Sensing device 720: Elastic parts 721: elastic film 725: elastic microstructure layer 810: Sensing device 820: Elastic parts 821: elastic film 821: elastic film 823: Raised structure 825: elastic microstructure layer 825: elastic microstructure layer 910: Sensing device 920: Elastic parts 920-1: First Elastic Part 920-2: Second elastic part 1010: sensing component 1031: Connection board 1033: opening 1050: the first sensing cavity

The invention will be further illustrated by way of exemplary embodiments which will be described in detail by means of the drawings. These examples are not limiting, and in these examples, like numbers indicate similar structures, wherein:

[Fig. 1] is a structural module diagram of a sensing device according to some embodiments of the present invention;

[Fig. 2] is a schematic diagram of a sensing device according to some embodiments of the present invention;

[FIG. 3A] and [FIG. 3B] are cross-sectional schematic diagrams showing the protrusion structure abutting against the second side wall of the sensing cavity according to some embodiments of the present invention;

[Fig. 4] is a structural schematic diagram of a raised structure according to some embodiments of the present invention;

[Fig. 5] is a structural schematic diagram of a raised structure according to other embodiments of the present invention;

[Fig. 6] is a structural schematic diagram of a raised structure according to some other embodiments of the present invention;

[Fig. 7] is a schematic diagram of a sensing device according to other embodiments of the present invention;

[Fig. 8] is a schematic diagram of a sensing device according to some embodiments of the present invention;

[ FIG. 9 ] is a schematic diagram of a sensing device according to some embodiments of the present invention;

[Fig. 10] is a schematic diagram showing the connection between the sensing component and the housing according to some embodiments of the present invention;

[ Fig. 11 ] is a schematic diagram of a simplified mechanical model of a system composed of elastic components and mass units according to some embodiments of the present invention.

10: Sensing device

20: Elastic parts

21: elastic film

23: Raised structure

30: Conversion parts

40: shell

50: Sensing cavity

Claims (16)

A sensing device comprising: elastic parts; a sensing cavity, the elastic member constituting a first side wall of the sensing cavity; and a conversion component, configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the conversion component communicates with the sensing cavity, and the sensing signal is related to the volume change of the sensing cavity, Wherein, the elastic member is provided with a protruding structure on one side facing the sensing cavity, the elastic member responds to an external signal to make the protruding structure move, and the movement of the protruding structure changes the sensing cavity volume. The sensing device according to claim 1, wherein the protruding structure abuts against a second side wall of the sensing cavity, and the second side wall is opposite to the first side wall. The sensing device according to claim 2, wherein the protruding structure has elasticity, and when the protruding structure moves, the protruding structure produces elastic deformation, and the reduction of the elastic deformation changes the sensing cavity volume. The sensing device according to any one of claims 1 to 3, wherein the protruding structures are arranged in an array on at least part of the surface of the elastic member. The sensing device according to any one of claims 1 to 3, wherein the shape of the protrusion structure is at least one of pyramid shape, hemispherical shape or stripe shape. The sensing device according to claim 1, wherein the elastic member includes an elastic film and an elastic microstructure layer, and the protrusion structure is disposed on the elastic microstructure layer. The sensing device according to claim 6, wherein the difference between the height of the protruding structure and the height of the sensing cavity is within 10%. The sensing device according to any one of claims 1 to 3, further comprising: a mass unit disposed on the other side surface of the elastic component, and the mass unit and the elastic component jointly generate vibrations in response to the external signal; and The casing, the elastic component, the mass unit, the sensing chamber and the conversion component are accommodated in the casing. The sensing device according to claim 8, wherein the conversion component is an acoustic transducer, the elastic component is arranged above the acoustic transducer, and the elastic component and the acoustic transducer form the Sensing cavity. The sensing device according to claim 9, wherein the outer edge of the elastic member is fixedly connected to the acoustic transducer through a sealing member, and the elastic member, the sealing member and the acoustic transducer jointly form the sensing device. Measuring cavity. The sensing device according to claim 9, wherein the outer edge of the elastic member is fixedly connected to the housing, and the elastic member, the housing and the acoustic transducer jointly form the sensing cavity. As the sensing device of claim 8, further comprising: Another elastic component is arranged symmetrically with the elastic component on both sides of the mass unit, and the other elastic component is fixedly connected to the housing. A sensing assembly comprising: elastic members; and a first sensing cavity, the elastic component constitutes a first side wall of the first sensing cavity, Wherein, a protruding structure is provided on the side of the elastic component facing the first sensing cavity, the elastic component moves the protruding structure in response to an external signal, and the movement of the protruding structure changes the The volume of the first sensing cavity. The sensing component according to claim 13, wherein the sensing component is configured to be attached to the converter, and the converter is placed opposite to the elastic member to form a closed sensing cavity, and the converter connects the The volume change of the enclosed sensing cavity is converted into an electrical signal. a vibration sensing device, Elastic vibrating components, including diaphragms; an acoustic transducer, an acoustic cavity is formed between the acoustic transducer and the diaphragm, and the acoustic transducer is used to obtain a sensing signal and convert the sensing signal into an electrical signal, the sensing signal and the The volume change of the acoustic cavity is related, Wherein, the diaphragm is provided with a protruding structure on the side facing the acoustic cavity, the elastic vibrating component moves the protruding structure in response to an external signal, and the movement of the protruding structure changes the acoustic cavity. cavity volume. A sensing assembly comprising: elastic members; and a sensing cavity, the elastic component constitutes a first side wall of the sensing cavity, Wherein, the elastic member is provided with a raised structure on the surface facing the sensing cavity, the Young’s modulus of the raised structure is 100 kPa to 1 MPa, and the elastic member responds to an external signal so that the At least one of movement and deformation of the protruding structure, at least one of the movement and deformation of the protruding structure changes the volume of the sensing cavity.

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