TW202300721A - Crystal growth diameter control method, device and equipment and computer storage medium - Google Patents

Crystal growth diameter control method, device and equipment and computer storage medium Download PDF

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TW202300721A
TW202300721A TW111128931A TW111128931A TW202300721A TW 202300721 A TW202300721 A TW 202300721A TW 111128931 A TW111128931 A TW 111128931A TW 111128931 A TW111128931 A TW 111128931A TW 202300721 A TW202300721 A TW 202300721A
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diameter
crystal
liquid level
target
crystal growth
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TWI815582B (en
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宋少杰
宋振亮
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大陸商西安奕斯偉材料科技有限公司
大陸商西安奕斯偉矽片技術有限公司
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    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20Controlling or regulating
    • C30B15/22Stabilisation or shape controlling of the molten zone near the pulled crystal; Controlling the section of the crystal
    • C30B15/26Stabilisation or shape controlling of the molten zone near the pulled crystal; Controlling the section of the crystal using television detectors; using photo or X-ray detectors
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon

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  • Crystallography & Structural Chemistry (AREA)
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  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The embodiment of the invention discloses a crystal growth diameter control method, device and equipment and a computer storage medium. The control method comprises the following steps that: a change value of a liquid level distance and a corresponding crystal growth diameter deviation value are acquired in advance in an equal-diameter growth stage, and a corresponding relation between the change value of the liquid level distance and the crystal growth diameter deviation value is determined; according to the corresponding relation and the change speed of the liquid level distance, the target position of an automatic diameter control ADC device is determined, and the ADC device is horizontally moved to the target position; and after the ADC device moves to the target position, the brightness value received by an optical pyrometer sensor is adjusted to be a target brightness value, wherein the target brightness value is used for representing that the growth diameter of a crystal is a target growth diameter.

Description

晶體生長直徑的控制方法、裝置、設備及電腦存儲介質Crystal growth diameter control method, device, equipment and computer storage medium

本發明實施屬於及晶體生長技術領域,尤其關於一種晶體生長直徑的控制方法、裝置、設備及電腦存儲介質。The implementation of the present invention belongs to the technical field of crystal growth, and in particular relates to a method, device, equipment and computer storage medium for controlling the diameter of crystal growth.

電子級單晶矽晶體作為一種半導體材料,一般用於製造積體電路和其他電子元件。目前常見的單晶矽晶體的生長方法是切克勞斯基(Czochralski)法,又或被稱之為直拉法,即在單晶爐中,使籽晶浸入容置於坩堝的熔矽液中,在轉動籽晶及坩堝的同時提拉籽晶,以在籽晶末端依次進行引晶、放肩、轉肩、等徑及收尾等技術操作,從而獲得單晶矽晶體。其中,等徑階段是單晶矽晶體生長過程中極為重要的技術過程,也是保證單晶矽晶體品質的關鍵過程。Electronic grade single crystal silicon crystal is a kind of semiconductor material, which is generally used in the manufacture of integrated circuits and other electronic components. At present, the common growth method of single crystal silicon crystal is the Czochralski method, or called the Czochralski method, that is, in the single crystal furnace, the seed crystal is immersed in the molten silicon liquid contained in the crucible. In the process, the seed crystal is pulled while rotating the seed crystal and the crucible, so as to sequentially carry out technical operations such as seeding, shouldering, shoulder turning, equal diameter and finishing at the end of the seed crystal to obtain a single crystal silicon crystal. Among them, the equal-diameter stage is an extremely important technical process in the growth process of single crystal silicon crystal, and it is also a key process to ensure the quality of single crystal silicon crystal.

目前在等徑階段中,採用晶體生長直徑自動控制裝置(Automatic Diameter Control,ADC)來自動控制晶體的生長直徑。該ADC裝置主要是利用光學高溫計感測器以及電荷耦合元件(Charge Coupled Device,CCD)攝影機來對單晶矽晶體的生長直徑進行監測:其假設熔矽液的液面在某一位置不會發生變化,在晶體生長過程中通過光學高溫計感測器接收熔矽液固液介面的熱輻射並輸出對應的亮度值,通過該亮度值能夠獲得單晶矽晶體的生長直徑,進而達到了即時監控晶體的生長直徑的目的。但是在單晶矽晶體的生長過程中熔矽液的液面位置會發生變化,從而影響了ADC裝置對晶體生長直徑的監測精度,進而最終影響單晶矽晶體的品質。At present, in the equal-diameter stage, an automatic crystal growth diameter control device (Automatic Diameter Control, ADC) is used to automatically control the growth diameter of the crystal. The ADC device mainly uses an optical pyrometer sensor and a Charge Coupled Device (CCD) camera to monitor the growth diameter of a single crystal silicon crystal: it assumes that the liquid level of the molten silicon liquid will not change at a certain position. During the crystal growth process, the optical pyrometer sensor receives the thermal radiation of the molten silicon liquid-solid-liquid interface and outputs the corresponding brightness value, through which the growth diameter of the single crystal silicon crystal can be obtained, thereby achieving real-time The purpose of monitoring the growth diameter of crystals. However, during the growth process of the single crystal silicon crystal, the position of the molten silicon liquid level will change, thus affecting the monitoring accuracy of the crystal growth diameter by the ADC device, and finally affecting the quality of the single crystal silicon crystal.

有鑑於此,本發明實施例期望提供一種晶體生長直徑的控制方法、裝置、設備及電腦存儲介質;能夠保證晶體生長過程中晶體生長直徑的穩定性和準確性,同時也能夠提升晶體品質。In view of this, the embodiments of the present invention expect to provide a crystal growth diameter control method, device, equipment and computer storage medium; which can ensure the stability and accuracy of the crystal growth diameter during the crystal growth process, and can also improve the crystal quality.

本發明實施例的技術方案是這樣實現的: 第一方面,本發明實施例提供了一種晶體生長直徑的控制方法,該控制方法包括: 在等徑生長階段預先獲取液位間距的變化值以及相應的晶體生長直徑偏差值,並確定該液位間距的變化值以及晶體生長直徑偏差值之間的對應關係; 根據該對應關係以及液位元間距的變化速度,確定直徑自動控制裝置ADC的目標位置並水準移動該ADC裝置至該目標位置; 在該ADC裝置移動至該目標位置後,調整光學高溫計感測器接收的亮度值為目標亮度值; 其中,該目標亮度值用於表徵該晶體的生長直徑為目標生長直徑。 The technical scheme of the embodiment of the present invention is realized like this: In a first aspect, an embodiment of the present invention provides a method for controlling a crystal growth diameter, the control method comprising: Obtaining the change value of the liquid level spacing and the corresponding crystal growth diameter deviation value in advance in the equal diameter growth stage, and determining the corresponding relationship between the change value of the liquid level spacing and the crystal growth diameter deviation value; Determine the target position of the diameter automatic control device ADC according to the corresponding relationship and the change speed of the liquid level element spacing, and horizontally move the ADC device to the target position; After the ADC device moves to the target position, adjust the brightness value received by the optical pyrometer sensor to the target brightness value; Wherein, the target brightness value is used to represent that the growth diameter of the crystal is the target growth diameter.

第二方面,本發明實施例提供了一種晶體生長直徑的控制裝置,該控制裝置包括:獲取部分,移動部分以及調整部分;其中, 該獲取部分,經配置為在等徑生長階段預先獲取液位間距的變化值以及相應的晶體生長直徑偏差值,並確定該液位間距的變化值以及晶體生長直徑偏差值之間的對應關係; 該移動部分,經配置為根據該對應關係以及液位元間距的變化速度,確定直徑自動控制裝置ADC的目標位置並水準移動該ADC裝置至該目標位置; 該調整部分,經配置為在該ADC裝置移動至該目標位置後,調整光學高溫計感測器接收的亮度值為目標亮度值;其中,該目標亮度值用於表徵該晶體的生長直徑為目標生長直徑。 In the second aspect, an embodiment of the present invention provides a crystal growth diameter control device, the control device includes: an acquisition part, a moving part and an adjustment part; wherein, The acquisition part is configured to pre-acquire the change value of the liquid level spacing and the corresponding crystal growth diameter deviation value in the equal diameter growth stage, and determine the corresponding relationship between the change value of the liquid level spacing and the crystal growth diameter deviation value; The moving part is configured to determine the target position of the automatic diameter control device ADC and horizontally move the ADC device to the target position according to the corresponding relationship and the change speed of the distance between the liquid level elements; The adjustment part is configured to adjust the luminance value received by the optical pyrometer sensor to a target luminance value after the ADC device moves to the target position; wherein, the target luminance value is used to represent that the growth diameter of the crystal is the target growth diameter.

第三方面,本發明實施例提供了一種晶體生長直徑的控制設備,該設備應用于單晶爐,該設備包括:光學高溫計感測器、CCD攝影機、記憶體以及處理器;其中, 該CCD攝影機用於監測液位間距變化值ΔX以及相應的晶體生長直徑的偏差值ΔD; 該記憶體,用於存儲能夠在該處理器上運行的電腦程式; 該處理器,用於在運行該電腦程式時,執行以下步驟: 在等徑生長階段預先獲取液位間距的變化值以及相應的晶體生長直徑偏差值,並確定該液位間距的變化值以及晶體生長直徑偏差值之間的對應關係; 根據該對應關係以及液位元間距的變化速度,確定直徑自動控制裝置ADC的目標位置並水準移動該ADC裝置至該目標位置; 在該ADC裝置移動至該目標位置後,調整光學高溫計感測器接收的亮度值為目標亮度值; 其中,該目標亮度值用於表徵該晶體的生長直徑為目標生長直徑。 In the third aspect, the embodiment of the present invention provides a crystal growth diameter control device, which is applied to a single crystal furnace, and the device includes: an optical pyrometer sensor, a CCD camera, a memory, and a processor; wherein, The CCD camera is used to monitor the change value of the liquid level spacing ΔX and the corresponding deviation value ΔD of the crystal growth diameter; The memory is used to store computer programs that can run on the processor; The processor is configured to perform the following steps when running the computer program: Obtaining the change value of the liquid level spacing and the corresponding crystal growth diameter deviation value in advance in the equal diameter growth stage, and determining the corresponding relationship between the change value of the liquid level spacing and the crystal growth diameter deviation value; Determine the target position of the diameter automatic control device ADC according to the corresponding relationship and the change speed of the liquid level element spacing, and horizontally move the ADC device to the target position; After the ADC device moves to the target position, adjust the brightness value received by the optical pyrometer sensor to the target brightness value; Wherein, the target brightness value is used to represent that the growth diameter of the crystal is the target growth diameter.

第四方面,本發明實施例提供了一種電腦存儲介質,該電腦存儲介質存儲有晶體生長直徑的控制的程式,該晶體生長直徑的控制的程式被至少一個處理器執行時實現第一方面該晶體生長直徑的控制方法的步驟。In a fourth aspect, an embodiment of the present invention provides a computer storage medium, the computer storage medium stores a program for controlling the crystal growth diameter, and when the program for controlling the crystal growth diameter is executed by at least one processor, the first aspect of the crystal is realized. The steps of the method of controlling the growth diameter.

本發明實施例提供了一種晶體生長直徑的控制方法、裝置、設備及電腦存儲介質;能夠通過液位間距的變化值和相應的晶體生長直徑偏差值之間的對應關係,以及液位元間距的變化速度,確定ADC裝置水準移動的目標位置並移動ADC裝置至上述的目標位置,同時通過調整ADC裝置中的光學高溫計感測器接收的亮度值以保證變化後的固液介面反射至光學高溫計感測器的亮度值不會發生變化,進而製備得到生長直徑穩定的晶體。Embodiments of the present invention provide a crystal growth diameter control method, device, equipment, and computer storage medium; the corresponding relationship between the change value of the liquid level spacing and the corresponding crystal growth diameter deviation value, and the distance between the liquid level elements can be used. Change speed, determine the target position of the horizontal movement of the ADC device and move the ADC device to the above target position, and at the same time adjust the brightness value received by the optical pyrometer sensor in the ADC device to ensure that the changed solid-liquid interface is reflected to the optical high temperature The brightness value of the meter sensor will not change, and then the crystal with stable growth diameter can be prepared.

為利 貴審查委員了解本發明之技術特徵、內容與優點及其所能達到之功效,茲將本發明配合附圖及附件,並以實施例之表達形式詳細說明如下,而其中所使用之圖式,其主旨僅為示意及輔助說明書之用,未必為本發明實施後之真實比例與精準配置,故不應就所附之圖式的比例與配置關係解讀、侷限本發明於實際實施上的申請範圍,合先敘明。In order for Ligui examiners to understand the technical characteristics, content and advantages of the present invention and the effects it can achieve, the present invention is hereby combined with the accompanying drawings and appendices, and is described in detail in the form of embodiments as follows, and the drawings used therein , the purpose of which is only for illustration and auxiliary instructions, and not necessarily the true proportion and precise configuration of the present invention after implementation, so it should not be interpreted based on the proportion and configuration relationship of the attached drawings, and limit the application of the present invention in actual implementation The scope is described first.

在本發明實施例的描述中,需要理解的是,術語“長度”、“寬度”、“上”、“下”、“前”、“後”、“左”、“右”、“豎直”、“水準”、“頂”、“底”“內”、“外”等指示的方位或位置關係為基於附圖所示的方位或位置關係,僅是為了便於描述本發明實施例和簡化描述,而不是指示或暗示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作,因此不能理解為對本發明的限制。In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical ", "horizontal", "top", "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying Describes, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and operate in a specific orientation, and therefore should not be construed as limiting the invention.

此外,術語“第一”、“第二”僅用於描述目的,而不能理解為指示或暗示相對重要性或者隱含指明所指示的技術特徵的數量。由此,限定有“第一”、“第二”的特徵可以明示或者隱含地包括一個或者更多個所述特徵。在本發明實施例的描述中,“多個”的含義是兩個或兩個以上,除非另有明確具體的限定。In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

在本發明實施例中,除非另有明確的規定和限定,術語“安裝”、“相連”、“連接”、“固定”等術語應做廣義理解,例如,可以是固定連接,也可以是可拆卸連接,或成一體;可以是機械連接,也可以是電連接;可以是直接相連,也可以通過中間媒介間接相連,可以是兩個元件內部的連通或兩個元件的相互作用關係。對於本領域的具通常知識者而言,可以根據具體情況理解上述術語在本發明實施例中的具體含義。In the embodiments of the present invention, terms such as "installation", "connection", "connection" and "fixation" should be interpreted in a broad sense unless otherwise clearly specified and limited. Disassembled connection, or integration; it can be mechanical connection or electrical connection; it can be direct connection or indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those with ordinary knowledge in the art can understand the specific meanings of the above terms in the embodiments of the present invention according to specific situations.

參見圖1,其示出了能夠實現本發明實施例技術方案的單晶爐1,該單晶爐1可以包括:爐體10,爐體10中設有加熱裝置和提拉裝置;加熱裝置包括石墨坩堝20、石英坩堝30以及加熱器40等,其中,石英坩堝30用於盛放矽原料,例如多晶矽。矽原料在石英坩堝30中被加熱熔化為熔矽液MS,石墨坩堝20包裹在石英坩堝30的外側,用於在加熱過程中對石英坩堝30提供支撐,加熱器40設置在石墨坩堝20的外側。石英坩堝30上方設置有熱屏50,熱屏50具有下伸的環繞單晶矽晶體生長區域的倒錐形屏裝物,可阻斷加熱器40和高溫熔矽液MS對生長的單晶矽晶體的直接熱輻射,以降低單晶矽晶體的溫度。同時,熱屏50還能夠使下吹的保護氣體集中直接噴到生長介面附近,進一步增強單晶矽晶體的散熱。Referring to Fig. 1, it shows a single crystal furnace 1 capable of realizing the technical solution of the embodiment of the present invention, the single crystal furnace 1 may include: a furnace body 10, a heating device and a pulling device are arranged in the furnace body 10; the heating device includes Graphite crucible 20, quartz crucible 30, heater 40, etc., wherein, quartz crucible 30 is used to contain silicon raw material, such as polysilicon. The silicon raw material is heated and melted in the quartz crucible 30 into molten silicon liquid MS. The graphite crucible 20 is wrapped on the outside of the quartz crucible 30 to provide support for the quartz crucible 30 during the heating process. The heater 40 is arranged on the outside of the graphite crucible 20 . A heat shield 50 is arranged above the quartz crucible 30, and the heat shield 50 has an inverted conical shield extending downwards around the growth area of the monocrystalline silicon crystal, which can block the growth of the monocrystalline silicon from the heater 40 and the high-temperature molten silicon liquid MS. Direct thermal radiation of the crystal to reduce the temperature of the single crystal silicon crystal. At the same time, the heat shield 50 can also make the downward blowing protective gas concentrated and sprayed directly near the growth interface, further enhancing the heat dissipation of the single crystal silicon crystal.

提拉裝置包括豎直設置的籽晶纜60和坩堝軸70,籽晶纜60設置在石英坩堝30的上方,坩堝軸70設置在石墨坩堝20的底部,籽晶纜60的底部通過夾具安裝有籽晶,其頂部連接籽晶驅動裝置,使其能夠一邊旋轉一邊向上緩慢提拉籽晶;坩堝軸70的底部設有坩堝軸驅動裝置,使坩堝軸70能夠帶動石墨坩堝20進行旋轉。The pulling device comprises a vertically arranged seed crystal cable 60 and a crucible shaft 70, the seed crystal cable 60 is arranged above the quartz crucible 30, the crucible shaft 70 is arranged at the bottom of the graphite crucible 20, and the bottom of the seed crystal cable 60 is installed with The top of the seed crystal is connected to the seed crystal driving device, so that it can slowly lift the seed crystal while rotating; the bottom of the crucible shaft 70 is provided with a crucible shaft driving device, so that the crucible shaft 70 can drive the graphite crucible 20 to rotate.

需要說明的是,圖1所示的單晶爐1結構並非具體限定,為了清楚地闡述本發明實施例的技術方案從而省略地沒有示出用於實施直拉法製備單晶矽晶體所需要的其他部件。基於圖1所示的單晶爐1,在爐體10的上方,還可以開設有觀測視窗80,以供ADC裝置2來監控晶體的生長直徑。It should be noted that the structure of the single crystal furnace 1 shown in FIG. 1 is not specifically limited. In order to clearly illustrate the technical solution of the embodiment of the present invention, the necessary components for preparing a single crystal silicon crystal by the Czochralski method are omitted. other parts. Based on the single crystal furnace 1 shown in FIG. 1 , an observation window 80 may also be provided above the furnace body 10 for the ADC device 2 to monitor the growth diameter of the crystal.

利用上述單晶爐1進行晶體的製備時,在常規的技術方案中,假定液面位置不變的,因此,在晶體的等徑生長階段會將ADC裝置2固定於某一位置保持不變,通過光學高溫計感測器21接收彎月面熱輻射對應的亮度值來回饋晶體的生長直徑。但是在實際等徑生長階段,隨著晶體的不斷生長,熔矽液的液面位置是隨時發生變化的,且不同的液面位置對應的晶體生長直徑也會發生偏差,因此,在晶體的等徑生長階段,設置ADC裝置2的位置一直保持固定不變會對晶體生長直徑的控制精度產生影響。When using the above-mentioned single crystal furnace 1 to prepare crystals, in the conventional technical scheme, it is assumed that the position of the liquid level remains unchanged. Therefore, the ADC device 2 will be fixed at a certain position during the equal-diameter growth stage of the crystal and remain unchanged. The growth diameter of the crystal is fed back by the optical pyrometer sensor 21 receiving the brightness value corresponding to the thermal radiation of the meniscus. However, in the actual equal-diameter growth stage, as the crystal continues to grow, the liquid level position of the molten silicon liquid changes at any time, and the crystal growth diameter corresponding to different liquid level positions will also deviate. In the diameter growth stage, if the position of the ADC device 2 is kept fixed, it will affect the control accuracy of the crystal growth diameter.

可以理解地,在具體實施時,ADC裝置2主要是利用光學高溫計感測器21接收熔矽液固液介面反射的熱輻射以獲得對應的亮度值。當獲得的亮度值為固定值時,也就表示了晶體的生長直徑保持在穩定值。舉例來說,當獲得的亮度值為2000時,即可認為晶體的生長直徑為300mm。因此,在本發明實施例中,在晶體的等徑生長過程中,為了控制晶體的生長直徑為目標生長直徑D 0,可以通過即時控制光學高溫計感測器21接收的彎月面熱輻射對應的亮度值穩定在目標亮度值即可,也就是說,當亮度值為目標亮度值時,表示晶體的生長直徑為目標生長直徑D 0,所獲得的晶體為目標晶體。 It can be understood that in actual implementation, the ADC device 2 mainly uses the optical pyrometer sensor 21 to receive the heat radiation reflected by the liquid-solid-liquid interface of molten silicon to obtain the corresponding brightness value. When the brightness value obtained is a fixed value, it means that the growth diameter of the crystal remains at a stable value. For example, when the obtained brightness value is 2000, it can be considered that the growth diameter of the crystal is 300 mm. Therefore, in the embodiment of the present invention, in order to control the growth diameter of the crystal to be the target growth diameter D 0 during the equal-diameter growth process of the crystal, the thermal radiation of the meniscus received by the optical pyrometer sensor 21 can be controlled immediately to correspond to The luminance value of is stable at the target luminance value, that is, when the luminance value is the target luminance value, it means that the growth diameter of the crystal is the target growth diameter D 0 , and the obtained crystal is the target crystal.

同時,ADC裝置2中的CCD攝影機22主要是在晶體的生長過程中監測熔矽液MS的液面位置變化以及晶體的生長直徑偏差。At the same time, the CCD camera 22 in the ADC device 2 mainly monitors the liquid level change of the molten silicon liquid MS and the deviation of the growth diameter of the crystal during the growth process of the crystal.

需要說明的是,在本發明實施例中,熔矽液的液面位置指的是熔矽液液面處至導流筒(圖中未示出)底部的距離,也即液位間距。It should be noted that, in the embodiment of the present invention, the liquid level position of the molten silicon liquid refers to the distance from the liquid surface of the molten silicon liquid to the bottom of the guide tube (not shown in the figure), that is, the liquid level distance.

因此,基於上述闡述的內容,參見圖2,其示出了本發明實施例提供的一種晶體生長直徑的控制方法,該方法具體包括: S201、在等徑生長階段預先獲取液位間距的變化值以及相應的晶體生長直徑偏差值,並確定該液位間距的變化值以及晶體生長直徑偏差值之間的對應關係; S202、根據該對應關係以及液位元間距的變化速度,確定直徑自動控制裝置ADC的目標位置並水準移動該ADC裝置至該目標位置; S203、在該ADC裝置移動至該目標位置後,調整光學高溫計感測器接收的亮度值為目標亮度值; 其中,該目標亮度值用於表徵該晶體的生長直徑為目標生長直徑。 Therefore, based on the content described above, referring to FIG. 2 , it shows a method for controlling the crystal growth diameter provided by an embodiment of the present invention. The method specifically includes: S201. Pre-acquire the change value of the liquid level spacing and the corresponding crystal growth diameter deviation value in the equal diameter growth stage, and determine the corresponding relationship between the change value of the liquid level spacing and the crystal growth diameter deviation value; S202. Determine the target position of the automatic diameter control device ADC and horizontally move the ADC device to the target position according to the corresponding relationship and the change speed of the liquid level element spacing; S203. After the ADC device moves to the target position, adjust the brightness value received by the optical pyrometer sensor to the target brightness value; Wherein, the target brightness value is used to represent that the growth diameter of the crystal is the target growth diameter.

對於上述技術方案,步驟S201可以認為是在等徑生長階段,預先獲得液位元間距變化值與晶體生長直徑偏差值之間對應關係的過程。步驟S202以及步驟S203則可以被認為是在晶體的等徑生長過程中通過水準移動ADC裝置2後以使得ADC裝置2保持在相同的工作條件下後再通過調整光學高溫計感測器21接收的亮度值以保證獲得目標生長直徑的晶體的過程。For the above technical solution, step S201 can be regarded as a process of pre-obtaining the corresponding relationship between the change value of the liquid level element spacing and the deviation value of the crystal growth diameter in the equal diameter growth stage. Steps S202 and S203 can be considered as receiving by adjusting the optical pyrometer sensor 21 after moving the ADC device 2 horizontally so that the ADC device 2 remains under the same working conditions during the equal-diameter growth process of the crystal. Brightness value to ensure the process of obtaining crystals with the target growth diameter.

需要說明的是,對於上述相同的工作條件指的是ADC裝置2中心軸線始終與目標晶體之間的夾角是固定不變的。在這種情況下,能夠保證ADC裝置2始終是以與目標晶體之間的夾角為同一角度在對晶體的生長直徑進行監測,從而保證了光學高溫計感測器21接收的是相同角度下彎月面的熱輻射,以消除ADC裝置2移動後對監測結果的影響。It should be noted that the above-mentioned same working conditions mean that the included angle between the central axis of the ADC device 2 and the target crystal is always constant. In this case, it can be guaranteed that the ADC device 2 is always monitoring the growth diameter of the crystal at the same angle as the included angle with the target crystal, thereby ensuring that the optical pyrometer sensor 21 receives the same angle. The thermal radiation of the lunar surface is used to eliminate the influence of the ADC device 2 on the monitoring results after moving.

對於圖2所示的技術方案,通過預先獲得的對應關係以及預先設定的液面變化速度,能夠確定ADC裝置2的水準移動目標位置,進而通過調整光學高溫計感測器接收的亮度值為目標亮度值以保證獲得目標生長直徑的晶體。基於此,本發明實施例相較於目前相關的技術方案,能夠消除液位元間距變化引起的晶體生長直徑的偏差,以獲得穩定且準確的晶體生長直徑。For the technical solution shown in Figure 2, the target position of the level movement of the ADC device 2 can be determined through the pre-obtained corresponding relationship and the pre-set liquid level change speed, and then the brightness value received by the optical pyrometer sensor can be adjusted to reach the target position. Brightness value to ensure that crystals with the target growth diameter are obtained. Based on this, compared with the current related technical solutions, the embodiment of the present invention can eliminate the deviation of the crystal growth diameter caused by the change of the liquid level element spacing, so as to obtain a stable and accurate crystal growth diameter.

對於圖2所示的技術方案,在一些示例中,該在等徑生長階段預先獲取液位間距的變化值以及相應的晶體生長直徑偏差值,並確定該液位間距的變化值以及晶體生長直徑偏差值之間的對應關係,包括: 在該晶體的等徑生長階段,通過CCD攝影機獲取液位間距的變化值ΔX以及該晶體生長直徑的偏差值ΔD; 根據該液位元間距的變化值ΔX以及相應的晶體生長直徑偏差值ΔD,獲取ADC裝置與目標晶體之間的夾角。 For the technical solution shown in Figure 2, in some examples, the change value of the liquid level spacing and the corresponding crystal growth diameter deviation value are obtained in advance during the equal diameter growth stage, and the change value of the liquid level spacing and the crystal growth diameter are determined Correspondence between deviation values, including: In the equal-diameter growth stage of the crystal, the change value ΔX of the liquid level spacing and the deviation value ΔD of the crystal growth diameter are obtained by the CCD camera; The included angle between the ADC device and the target crystal is obtained according to the change value ΔX of the liquid level element spacing and the corresponding crystal growth diameter deviation value ΔD.

對於上述示例,在一些具體的實施方式中,該根據該液位元間距的變化值ΔX以及相應的晶體生長直徑偏差值ΔD,獲取ADC裝置與目標晶體之間的夾角,包括: 根據

Figure 02_image001
計算獲得該ADC裝置與該目標晶體之間的夾角
Figure 02_image003
。 For the above examples, in some specific implementations, the angle between the ADC device and the target crystal is obtained according to the change value ΔX of the liquid level element spacing and the corresponding crystal growth diameter deviation value ΔD, including:
Figure 02_image001
Calculate the angle between the ADC device and the target crystal
Figure 02_image003
.

可以理解地,如圖1所示,在等徑階段,假定液位位置處於位置Ⅰ時,晶體的生長直徑為目標生長直徑D 0;可以理解地,當熔矽液MS的液面位置從液面位置Ⅰ變化至液面位置Ⅱ時,此時CCD攝影機22能夠監測到液位間距的變化值為ΔX,且此時晶體的生長直徑由D 0變化為D 1,其生長直徑偏差值為

Figure 02_image005
。因此結合圖3,可以獲得ADC裝置2與目標晶體(如圖中豎直的虛線所示)之間的夾角
Figure 02_image003
,且根據圖3所示的幾何關係,能夠獲得ADC裝置2與目標晶體之間的對應關係為
Figure 02_image007
,進而可以獲得
Figure 02_image001
。 It can be understood that, as shown in Figure 1, in the isodiametric stage, assuming that the liquid level position is at position I, the growth diameter of the crystal is the target growth diameter D 0 ; understandably, when the liquid level position of the molten silicon liquid MS changes from When the surface position I changes to the liquid surface position II, the CCD camera 22 can monitor the change value of the liquid level distance at this time as ΔX, and at this time the growth diameter of the crystal changes from D 0 to D 1 , and the growth diameter deviation is
Figure 02_image005
. Therefore, in combination with Fig. 3, the angle between the ADC device 2 and the target crystal (as shown by the vertical dotted line in the figure) can be obtained
Figure 02_image003
, and according to the geometric relationship shown in Figure 3, the corresponding relationship between the ADC device 2 and the target crystal can be obtained as
Figure 02_image007
, so that you can get
Figure 02_image001
.

對於圖2所示的技術方案,在一些示例中,根據該對應關係以及液位元間距的變化速度,確定直徑自動控制裝置ADC的目標位置並水準移動該ADC裝置至該目標位置,包括: 根據該對應關係以及該液位元間距的變化速度,獲取該ADC裝置的水準移動速度; 根據該ADC裝置的水準移動速度,確定該ADC裝置的目標位置; 根據該ADC裝置的目標位置,水準移動該ADC裝置至該目標位置。 For the technical solution shown in Figure 2, in some examples, according to the corresponding relationship and the change speed of the liquid level spacing, the target position of the automatic diameter control device ADC is determined and the ADC device is horizontally moved to the target position, including: Obtain the horizontal movement speed of the ADC device according to the corresponding relationship and the change speed of the liquid level element spacing; determining the target position of the ADC device according to the horizontal moving speed of the ADC device; According to the target position of the ADC device, the ADC device is horizontally moved to the target position.

對於上述示例,在一些具體的實現方式中,該根據該對應關係以及該液位元間距的變化速度,獲取該ADC裝置的水準移動速度,包括: 根據

Figure 02_image010
計算獲得該ADC裝置的水準移動速度
Figure 02_image012
; 其中,
Figure 02_image014
為該液位元間距的變化速度。 For the above examples, in some specific implementations, the level moving speed of the ADC device is obtained according to the corresponding relationship and the speed of change of the liquid level spacing, including:
Figure 02_image010
Calculate the level moving speed of the ADC device
Figure 02_image012
; in,
Figure 02_image014
is the change speed of the liquid level element spacing.

需要說明的是,液位元間距的變化速度可以通過CCD攝影機22即時測得,舉例來說,在導流筒的底部設置一“L”型石英銷,通過CCD攝影機22即時監測“L”型石英銷末端在熔矽液MS固液介面形成的亮斑圖像以獲得液位元間距變化值;當然也可以根據等徑生長時間以及等徑生長階段設定的固液介面的距離變化值以獲得液位間距的即時變化值。本發明實施例對獲取液位元間距的變化速度的方法不作具體闡述。It should be noted that the change speed of the distance between the liquid level elements can be measured in real time by the CCD camera 22. For example, an "L"-shaped quartz pin is set at the bottom of the draft tube, and the "L"-shaped pin is monitored in real time by the CCD camera 22. The bright spot image formed at the end of the quartz pin at the solid-liquid interface of the molten silicon liquid MS can be used to obtain the change value of the liquid level element spacing; of course, the distance change value of the solid-liquid interface set according to the isometric growth time and the isometric growth stage can be obtained The instantaneous change value of the liquid level spacing. The embodiment of the present invention does not specifically describe the method for obtaining the change speed of the liquid level element spacing.

需要說明的是,速度

Figure 02_image016
向量,因此在本發明實施例中當液面位置上升時,規定液位元間距的變化速度
Figure 02_image014
為正速度,當液面位置下降時,液位元間距的變化速度
Figure 02_image014
為負速度;ADC裝置2沿水準方向向右移動時,規定其水準移動速度
Figure 02_image012
為正速度;相反,ADC裝置2沿水準方向向左移動時,規定其水準移動速度
Figure 02_image012
為負速度。 It should be noted that the speed
Figure 02_image016
Vector, so in the embodiment of the present invention, when the liquid level rises, the change speed of the liquid level spacing is specified
Figure 02_image014
is a positive speed, when the liquid level position drops, the change speed of the liquid level element spacing
Figure 02_image014
is a negative speed; when the ADC device 2 moves to the right along the horizontal direction, its horizontal moving speed is specified
Figure 02_image012
is a positive speed; on the contrary, when the ADC device 2 moves to the left along the horizontal direction, its horizontal moving speed is specified
Figure 02_image012
is a negative velocity.

可以理解的是,如圖4所示,在晶體的等徑生長過程中,當液面位置從液面位置Ⅰ變化至液面位置Ⅱ時,如果ADC裝置2一直保持在最初的位置不變,則如圖4所示,此時ADC裝置2與目標晶體之間的夾角為

Figure 02_image003
',且
Figure 02_image021
。因此為了保證ADC裝置2能夠即時準確地監控當前晶體的生長直徑,如圖5所示,需要在液面位置發生變化時即時水準移動ADC裝置2,以使得ADC裝置2與目標晶體之間的夾角為
Figure 02_image003
保持不變,這樣就保證了ADC裝置2是在相同的工作條件下對晶體的等徑生長過程進行監測的。 It can be understood that, as shown in FIG. 4 , during the equidiametric crystal growth process, when the liquid level position changes from liquid level position I to liquid level position II, if the ADC device 2 remains at the original position, As shown in Figure 4, the angle between the ADC device 2 and the target crystal is
Figure 02_image003
',and
Figure 02_image021
. Therefore, in order to ensure that the ADC device 2 can accurately monitor the growth diameter of the current crystal in real time, as shown in Figure 5, it is necessary to move the ADC device 2 horizontally in real time when the liquid level changes, so that the angle between the ADC device 2 and the target crystal for
Figure 02_image003
remains unchanged, thus ensuring that the ADC device 2 monitors the equal-diameter growth process of the crystal under the same working conditions.

基於上述闡述,由圖5可以看出,在晶體等徑階段的T時刻,

Figure 02_image024
Figure 02_image026
;進而結合
Figure 02_image001
可得,
Figure 02_image010
。 Based on the above description, it can be seen from Figure 5 that at time T of the crystal isometric stage,
Figure 02_image024
,
Figure 02_image026
; and then combine
Figure 02_image001
Available,
Figure 02_image010
.

對於圖2所示的技術方案,在一些示例中,該在該ADC裝置移動至該目標位置後,調整光學高溫計感測器接收的亮度值為目標亮度值,包括: 在該ADC裝置移動至該目標位置後,通過該晶體的溫度曲線調整該光學高溫計感測器接收的亮度值為目標亮度值。 For the technical solution shown in FIG. 2 , in some examples, after the ADC device moves to the target position, the brightness value received by the optical pyrometer sensor is adjusted to a target brightness value, including: After the ADC device moves to the target position, the brightness value received by the optical pyrometer sensor is adjusted to the target brightness value through the temperature curve of the crystal.

可以理解地,當ADC裝置2的位置發生了變化時,其光學高溫計感測器21接收的亮度值也會隨之發生變化,為了保證光學高溫計感測器21接收的亮度值仍然為目標亮度值,此時可以通過自動溫度轉換(Automatic Temperature Conversion,ATC)方法自動調整以使得光學高溫計感測器21接收的亮度值為目標亮度值,進而使得晶體的生長直徑為目標生長直徑D 0It can be understood that when the position of the ADC device 2 changes, the brightness value received by the optical pyrometer sensor 21 will also change accordingly. In order to ensure that the brightness value received by the optical pyrometer sensor 21 is still the target The brightness value, at this time, can be automatically adjusted by the automatic temperature conversion (Automatic Temperature Conversion, ATC) method so that the brightness value received by the optical pyrometer sensor 21 is the target brightness value, so that the growth diameter of the crystal is the target growth diameter D 0 .

對於圖2所示的技術方案,在一些示例中,該在該ADC裝置移動至該目標位置後,調整光學高溫計感測器接收的亮度值為目標亮度值,包括: 在該ADC裝置移動至該目標位置後,通過調整該晶體的提拉速度以調整該光學高溫計感測器接收的亮度值為目標亮度值。 For the technical solution shown in FIG. 2 , in some examples, after the ADC device moves to the target position, the brightness value received by the optical pyrometer sensor is adjusted to a target brightness value, including: After the ADC device moves to the target position, the brightness value received by the optical pyrometer sensor is adjusted to a target brightness value by adjusting the pulling speed of the crystal.

同樣地,當ADC裝置2的位置發生了變化後,其光學高溫計感測器21接收的亮度值會發生變化,為了保證光學高溫計感測器21接收的亮度值仍然為目標亮度值,在本發明實施例中也可以通過調整晶體的提拉速度(P/S)以自動調整熔矽液的液面位置,使得光學高溫計感測器21接收的亮度值為目標亮度值,進而使得晶體的生長直徑為目標生長直徑D 0Similarly, when the position of the ADC device 2 changes, the brightness value received by its optical pyrometer sensor 21 will change. In order to ensure that the brightness value received by the optical pyrometer sensor 21 is still the target brightness value, the In the embodiment of the present invention, the liquid level position of the molten silicon liquid can also be automatically adjusted by adjusting the pulling speed (P/S) of the crystal, so that the brightness value received by the optical pyrometer sensor 21 is the target brightness value, and then the crystal The growth diameter of is the target growth diameter D 0 .

基於前述技術方案相同的發明構思,參見圖6,其示出了本發明實施例提供的一種晶體生長直徑的控制裝置6,該控制裝置6包括:獲取部分601,移動部分602以及調整部分603;其中, 該獲取部分601,經配置為在等徑生長階段預先獲取液位間距的變化值以及相應的晶體生長直徑偏差值,並確定該液位間距的變化值以及晶體生長直徑偏差值之間的對應關係; 該移動部分602,經配置為根據該對應關係以及液位元間距的變化速度,確定直徑自動控制裝置ADC的目標位置並水準移動該ADC裝置至該目標位置; 該調整部分603,經配置為在該ADC裝置移動至該目標位置後,調整光學高溫計感測器接收的亮度值為目標亮度值;其中,該目標亮度值用於表徵該晶體的生長直徑為目標生長直徑。 Based on the same inventive concept as the aforementioned technical solution, see FIG. 6 , which shows a crystal growth diameter control device 6 provided by an embodiment of the present invention. The control device 6 includes: an acquisition part 601, a moving part 602 and an adjustment part 603; in, The acquisition part 601 is configured to pre-acquire the change value of the liquid level spacing and the corresponding crystal growth diameter deviation value in the equal diameter growth stage, and determine the corresponding relationship between the change value of the liquid level spacing and the crystal growth diameter deviation value ; The moving part 602 is configured to determine the target position of the automatic diameter control device ADC and horizontally move the ADC device to the target position according to the corresponding relationship and the change speed of the distance between liquid level elements; The adjustment part 603 is configured to adjust the luminance value received by the optical pyrometer sensor to a target luminance value after the ADC device moves to the target position; wherein the target luminance value is used to characterize the growth diameter of the crystal as Target growth diameter.

在一些示例中,該獲取部分601,經配置為: 在該晶體的等徑生長階段,通過CCD攝影機獲取液位間距的變化值ΔX以及該晶體生長直徑的偏差值ΔD; 根據該液位元間距的變化值ΔX以及相應的晶體生長直徑偏差值ΔD,獲取ADC裝置與目標晶體之間的夾角。 In some examples, the obtaining part 601 is configured to: In the equal-diameter growth stage of the crystal, the change value ΔX of the liquid level spacing and the deviation value ΔD of the crystal growth diameter are obtained by the CCD camera; The included angle between the ADC device and the target crystal is obtained according to the change value ΔX of the liquid level element spacing and the corresponding crystal growth diameter deviation value ΔD.

在一些示例中,該獲取部分601,經配置為: 根據

Figure 02_image001
計算獲得該ADC裝置與該目標晶體之間的夾角
Figure 02_image003
。 In some examples, the acquisition part 601 is configured to:
Figure 02_image001
Calculate the angle between the ADC device and the target crystal
Figure 02_image003
.

在一些示例中,該移動部分602,經配置為: 根據該對應關係以及該液位元間距的變化速度,獲取該ADC裝置的水準移動速度; 根據該ADC裝置的水準移動速度,確定該ADC裝置的目標位置; 根據該ADC裝置的目標位置,水準移動該ADC裝置至該目標位置。 In some examples, the moving part 602 is configured to: Obtain the horizontal movement speed of the ADC device according to the corresponding relationship and the change speed of the liquid level element spacing; determining the target position of the ADC device according to the horizontal moving speed of the ADC device; According to the target position of the ADC device, the ADC device is horizontally moved to the target position.

在一些示例中,該移動部分602,還經配置為: 根據

Figure 02_image010
計算獲得該ADC裝置的水準移動速度
Figure 02_image012
; 其中,
Figure 02_image014
為該液位元間距的變化速度。 In some examples, the mobile part 602 is further configured to:
Figure 02_image010
Calculate the level moving speed of the ADC device
Figure 02_image012
; in,
Figure 02_image014
is the change speed of the liquid level element spacing.

在一些示例中,該調整部分603,經配置為: 在該ADC裝置移動至該目標位置後,通過該晶體的溫度曲線調整該光學高溫計感測器接收的亮度值為目標亮度值。 In some examples, the adjustment section 603 is configured to: After the ADC device moves to the target position, the brightness value received by the optical pyrometer sensor is adjusted to the target brightness value through the temperature curve of the crystal.

在一些示例中,該調整部分603,還經配置為: 在該ADC裝置移動至該目標位置後,通過調整該晶體的提拉速度以調整該光學高溫計感測器接收的亮度值為目標亮度值。 In some examples, the adjustment section 603 is further configured to: After the ADC device moves to the target position, the brightness value received by the optical pyrometer sensor is adjusted to a target brightness value by adjusting the pulling speed of the crystal.

可以理解地,在本實施例中,“部分”可以是部分電路、部分處理器、部分程式或軟體等等,當然也可以是單元,還可以是模組也可以是非模組化的。Understandably, in this embodiment, a "part" may be a part of a circuit, a part of a processor, a part of a program or software, etc., of course it may also be a unit, and may also be a module or non-modular.

另外,在本實施例中的各組成部分可以集成在一個處理單元中,也可以是各個單元單獨物理存在,也可以兩個或兩個以上單元集成在一個單元中。上述集成的單元既可以採用硬體的形式實現,也可以採用軟體功能模組的形式實現。In addition, each component in this embodiment may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit. The above-mentioned integrated units can be implemented not only in the form of hardware, but also in the form of software function modules.

該集成的單元如果以軟體功能模組的形式實現並非作為獨立的產品進行銷售或使用時,可以存儲在一個電腦可讀取存儲介質中,基於這樣的理解,本實施例的技術方案本質上或者說對現有技術做出貢獻的部分或者該技術方案的全部或部分可以以軟體產品的形式體現出來,該電腦軟體產品存儲在一個存儲介質中,包括若干指令用以使得一台電腦設備(可以是個人電腦,伺服器,或者網路設備等)或處理器(processor)執行本實施例該方法的全部或部分步驟。而前述的存儲介質包括:U盤、移動硬碟、唯讀記憶體(Read Only Memory,ROM)、隨機存取記憶體(Random Access Memory,RAM)、磁碟或者光碟等各種可以存儲程式碼的介質。If the integrated unit is implemented in the form of a software function module and is not sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this embodiment is essentially or The part that contributes to the existing technology or the whole or part of the technical solution can be embodied in the form of software products. The computer software products are stored in a storage medium and include several instructions to make a computer device (which can be A personal computer, a server, or a network device, etc.) or a processor (processor) executes all or part of the steps of the method in this embodiment. The aforementioned storage media include: U disk, mobile hard disk, read only memory (Read Only Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disk or optical disk, etc., which can store program codes. medium.

因此,本實施例提供了一種電腦存儲介質,該電腦存儲介質存儲有晶體生長直徑的控制的程式,該晶體生長直徑的控制的程式被至少一個處理器執行時實現上述技術方案中該晶體生長直徑的控制方法步驟。Therefore, the present embodiment provides a computer storage medium, the computer storage medium stores a program for controlling the crystal growth diameter, and when the program for controlling the crystal growth diameter is executed by at least one processor, the crystal growth diameter in the above technical solution is realized. control method steps.

根據上述晶體生長直徑的控制裝置6以及電腦存儲介質,參見圖7,其示出了本發明實施例提供的一種能夠實施上述晶體生長直徑的控制裝置6的晶體生長直徑的控制設備7的具體硬體結構,該控制設備7可以應用於圖1所示的單晶爐1中,該控制設備7可以包括:光學高溫計感測器21、CCD攝影機22、記憶體701以及處理器702;各個元件通過匯流排系統703耦合在一起。可理解,匯流排系統703用於實現這些元件之間的連接通信。匯流排系統703除包括資料匯流排之外,還包括電源匯流排、控制匯流排和狀態信號匯流排。但是為了清楚說明起見,在圖7中將各種匯流排都標為匯流排系統703。其中, 該CCD攝影機22用於監測液位間距變化值ΔX以及相應的晶體生長直徑的偏差值ΔD; 該記憶體701,用於存儲能夠在該處理器702上運行的電腦程式; 該處理器702,用於在運行該電腦程式時,執行以下步驟: 在等徑生長階段預先獲取液位間距的變化值以及相應的晶體生長直徑偏差值,並確定該液位間距的變化值以及晶體生長直徑偏差值之間的對應關係; 根據該對應關係以及液位元間距的變化速度,確定直徑自動控制裝置ADC的目標位置並水準移動該ADC裝置至該目標位置; 在該ADC裝置移動至該目標位置後,調整光學高溫計感測器接收的亮度值為目標亮度值; 其中,該目標亮度值用於表徵該晶體的生長直徑為目標生長直徑。 According to the control device 6 of the above-mentioned crystal growth diameter and the computer storage medium, referring to Fig. 7, it shows the specific hardware of the control device 7 of the crystal growth diameter that can implement the control device 6 of the above-mentioned crystal growth diameter provided by the embodiment of the present invention. Body structure, the control device 7 can be applied in the single crystal furnace 1 shown in Figure 1, the control device 7 can include: optical pyrometer sensor 21, CCD camera 22, memory 701 and processor 702; They are coupled together via a bus bar system 703 . It can be understood that the bus bar system 703 is used to realize connection and communication between these components. In addition to the data bus, the bus system 703 also includes a power bus, a control bus and a status signal bus. However, for clarity of illustration, the various bus bars are labeled bus bar system 703 in FIG. 7 . in, The CCD camera 22 is used to monitor the change value ΔX of the liquid level spacing and the corresponding deviation value ΔD of the crystal growth diameter; The memory 701 is used to store computer programs that can run on the processor 702; The processor 702 is configured to perform the following steps when running the computer program: Obtaining the change value of the liquid level spacing and the corresponding deviation value of the crystal growth diameter in advance in the equal diameter growth stage, and determining the corresponding relationship between the change value of the liquid level spacing and the deviation value of the crystal growth diameter; Determine the target position of the diameter automatic control device ADC according to the corresponding relationship and the change speed of the liquid level element spacing, and horizontally move the ADC device to the target position; After the ADC device moves to the target position, adjust the brightness value received by the optical pyrometer sensor to the target brightness value; Wherein, the target brightness value is used to represent that the growth diameter of the crystal is the target growth diameter.

可以理解,本發明實施例中的記憶體701可以是易失性記憶體或非易失性記憶體,或可包括易失性和非易失性記憶體兩者。其中,非易失性記憶體可以是唯讀記憶體(Read-Only Memory,ROM)、可程式設計唯讀記憶體(Programmable ROM,PROM)、可擦除可程式設計唯讀記憶體(Erasable PROM,EPROM)、電可擦除可程式設計唯讀記憶體(Electrically EPROM,EEPROM)或快閃記憶體。易失性記憶體可以是隨機存取記憶體(Random Access Memory,RAM),其用作外部快取記憶體。通過示例性但不是限制性說明,許多形式的RAM可用,例如靜態隨機存取記憶體(Static RAM,SRAM)、動態隨機存取記憶體(Dynamic RAM,DRAM)、同步動態隨機存取記憶體(Synchronous DRAM,SDRAM)、雙倍數據速率同步動態隨機存取記憶體(Double Data Rate SDRAM,DDRSDRAM)、增強型同步動態隨機存取記憶體(Enhanced SDRAM,ESDRAM)、同步連接動態隨機存取記憶體(Synchlink DRAM,SLDRAM)和直接記憶體匯流排隨機存取記憶體(Direct Rambus RAM,DRRAM)。本文描述的系統和方法的記憶體701旨在包括但不限於這些和任意其它適合類型的記憶體。It can be understood that the memory 701 in the embodiment of the present invention may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory can be read-only memory (Read-Only Memory, ROM), programmable read-only memory (Programmable ROM, PROM), erasable programmable read-only memory (Erasable PROM) , EPROM), electrically erasable programmable read-only memory (Electrically EPROM, EEPROM) or flash memory. The volatile memory may be Random Access Memory (RAM), which is used as external cache memory. By way of illustration and not limitation, many forms of RAM are available such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous Dynamic Random Access Memory ( Synchronous DRAM, SDRAM), double data rate synchronous dynamic random access memory (Double Data Rate SDRAM, DDRSDRAM), enhanced synchronous dynamic random access memory (Enhanced SDRAM, ESDRAM), synchronous connection dynamic random access memory (Synchlink DRAM, SLDRAM) and Direct Memory Bus Random Access Memory (Direct Rambus RAM, DRRAM). The memory 701 of the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.

而處理器702可能是一種積體電路晶片,具有信號的處理能力。在實現過程中,上述方法的各步驟可以通過處理器702中的硬體的集成邏輯電路或者軟體形式的指令完成。上述的處理器702可以是通用處理器、數位訊號處理器(Digital Signal Processor,DSP)、專用積體電路(Application Specific Integrated Circuit,ASIC)、現場可程式設計閘陣列(Field Programmable Gate Array,FPGA)或者其他可程式設計邏輯器件、分立門或者電晶體邏輯器件、分立硬體元件。可以實現或者執行本發明實施例中的公開的各方法、步驟及邏輯框圖。通用處理器可以是微處理器或者該處理器也可以是任何常規的處理器等。結合本發明實施例所公開的方法的步驟可以直接體現為硬體解碼處理器執行完成,或者用解碼處理器中的硬體及軟體模組組合執行完成。軟體模組可以位於隨機記憶體,快閃記憶體、唯讀記憶體,可程式設計唯讀記憶體或者電可讀寫可程式設計記憶體、寄存器等本領域成熟的存儲介質中。該存儲介質位於記憶體701,處理器702讀取記憶體701中的資訊,結合其硬體完成上述方法的步驟。The processor 702 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by an integrated logic circuit of hardware in the processor 702 or instructions in the form of software. The aforementioned processor 702 may be a general purpose processor, a digital signal processor (Digital Signal Processor, DSP), an application specific integrated circuit (Application Specific Integrated Circuit, ASIC), a field programmable gate array (Field Programmable Gate Array, FPGA) Or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. Various methods, steps and logic block diagrams disclosed in the embodiments of the present invention may be implemented or executed. A general-purpose processor may be a microprocessor, or the processor may be any conventional processor, or the like. The steps of the methods disclosed in connection with the embodiments of the present invention may be directly implemented by a hardware decoding processor, or implemented by a combination of hardware and software modules in the decoding processor. The software module can be located in a mature storage medium in the field such as random access memory, flash memory, read-only memory, programmable read-only memory or electrically readable and writable programmable memory, register. The storage medium is located in the memory 701, and the processor 702 reads the information in the memory 701, and completes the steps of the above method in combination with its hardware.

可以理解的是,本文描述的這些實施例可以用硬體、軟體、固件、中介軟體、微碼或其組合來實現。對於硬體實現,處理單元可以實現在一個或多個專用積體電路(Application Specific Integrated Circuits,ASIC)、數位訊號處理器(Digital Signal Processing,DSP)、數位信號處理設備(DSP Device,DSPD)、可程式設計邏輯裝置(Programmable Logic Device,PLD)、現場可程式設計閘陣列(Field-Programmable Gate Array,FPGA)、通用處理器、控制器、微控制器、微處理器、用於執行本發明該功能的其它電子單元或其組合中。It should be understood that the embodiments described herein may be implemented by hardware, software, firmware, middleware, microcode or a combination thereof. For hardware implementation, the processing unit can be implemented in one or more application specific integrated circuits (Application Specific Integrated Circuits, ASIC), digital signal processor (Digital Signal Processing, DSP), digital signal processing equipment (DSP Device, DSPD), Programmable Logic Device (Programmable Logic Device, PLD), Field-Programmable Gate Array (Field-Programmable Gate Array, FPGA), general-purpose processor, controller, microcontroller, microprocessor, for implementing the present invention functions in other electronic units or combinations thereof.

對於軟體實現,可通過執行本文所述功能的模組(例如過程、函數等)來實現本文所述的技術。軟體代碼可存儲在記憶體中並通過處理器執行。記憶體可以在處理器中或在處理器外部實現。For a software implementation, the techniques described herein can be implemented through modules (eg, procedures, functions, and so on) that perform the functions described herein. Software codes may be stored in memory and executed by a processor. Memory can be implemented within the processor or external to the processor.

具體來說,處理器702還配置為運行該電腦程式時,執行前述技術方案中該晶體生長直徑的控制方法步驟,這裡不再進行贅述。Specifically, the processor 702 is also configured to execute the steps of the method for controlling the crystal growth diameter in the foregoing technical solution when running the computer program, and details will not be repeated here.

以上僅為本發明之較佳實施例,並非用來限定本發明之實施範圍,如果不脫離本發明之精神和範圍,對本發明進行修改或者等同替換,均應涵蓋在本發明申請專利範圍的保護範圍當中。The above are only preferred embodiments of the present invention, and are not used to limit the implementation scope of the present invention. If the present invention is modified or equivalently replaced without departing from the spirit and scope of the present invention, it shall be covered by the protection of the patent scope of the present invention. in the range.

1:單晶爐 2:ADC裝置 6:控制裝置 7:控制設備 10:爐體 20:石墨坩堝 21:高溫計感測器 22:CCD攝影機 30:石英坩堝 40:加熱器 50:熱屏 60:籽晶纜 70:坩堝軸 80:觀測視窗 601:獲取部分 602:移動部分 603:調整部分 701:記憶體 702:處理器 703:匯流排系統 MS:熔矽液 S201-S203:步驟 1: Single crystal furnace 2: ADC device 6: Control device 7: Control equipment 10: furnace body 20: Graphite Crucible 21: Pyrometer sensor 22:CCD camera 30: Quartz Crucible 40: heater 50: hot screen 60:Seed cable 70: crucible shaft 80: Observation window 601: get part 602: Moving part 603: Adjust part 701: Memory 702: Processor 703: bus bar system MS: molten silicon liquid S201-S203: Steps

圖1為本發明實施例提供的一種單晶爐結構示意圖; 圖2為本發明實施例提供的一種晶體生長直徑的控制方法流程示意圖; 圖3為本發明實施例提供的液位元間距變化值與晶體生長直徑偏差值之間的關係示意圖; 圖4為本發明實施例提供的ADC裝置位置與晶體夾角之間關係示意圖; 圖5為本發明實施例提供的ADC裝置位置與晶體夾角之間關係另一示意圖; 圖6為本發明實施例提供的一種晶體生長直徑的控制裝置組成示意圖; 圖7為本發明實施例提供的一種晶體生長直徑的控制設備硬體結構示意圖。 Fig. 1 is a schematic structural diagram of a single crystal furnace provided by an embodiment of the present invention; Fig. 2 is a schematic flow chart of a crystal growth diameter control method provided by an embodiment of the present invention; 3 is a schematic diagram of the relationship between the change value of the liquid level element spacing and the deviation value of the crystal growth diameter provided by the embodiment of the present invention; Fig. 4 is a schematic diagram of the relationship between the position of the ADC device and the included angle of the crystal provided by the embodiment of the present invention; Fig. 5 is another schematic diagram of the relationship between the position of the ADC device and the included angle of the crystal provided by the embodiment of the present invention; Fig. 6 is a schematic composition diagram of a crystal growth diameter control device provided by an embodiment of the present invention; FIG. 7 is a schematic diagram of a hardware structure of a crystal growth diameter control device provided by an embodiment of the present invention.

S201-S203:步驟 S201-S203: Steps

Claims (10)

一種晶體生長直徑的控制方法,該控制方法包括: 在等徑生長階段預先獲取液位間距的變化值以及相應的晶體生長直徑偏差值,並確定該液位間距的變化值以及晶體生長直徑偏差值之間的對應關係; 根據該對應關係以及液位元間距的變化速度,確定直徑自動控制裝置ADC的目標位置並水準移動該ADC裝置至該目標位置; 在該ADC裝置移動至該目標位置後,調整光學高溫計感測器接收的亮度值為目標亮度值; 其中,該目標亮度值用於表徵該晶體的生長直徑為目標生長直徑。 A method for controlling the diameter of crystal growth, the method comprising: Obtaining the change value of the liquid level spacing and the corresponding crystal growth diameter deviation value in advance in the equal diameter growth stage, and determining the corresponding relationship between the change value of the liquid level spacing and the crystal growth diameter deviation value; Determine the target position of the diameter automatic control device ADC according to the corresponding relationship and the change speed of the liquid level element spacing, and horizontally move the ADC device to the target position; After the ADC device moves to the target position, adjust the brightness value received by the optical pyrometer sensor to the target brightness value; Wherein, the target brightness value is used to represent that the growth diameter of the crystal is the target growth diameter. 如請求項1所述之晶體生長直徑的控制方法,其中,該在等徑生長階段預先獲取液位間距的變化值以及相應的晶體生長直徑偏差值,並確定該液位間距的變化值以及晶體生長直徑偏差值之間的對應關係,包括: 在該晶體的等徑生長階段,通過CCD攝影機獲取液位間距的變化值ΔX以及該晶體生長直徑的偏差值ΔD; 根據該液位元間距的變化值ΔX以及相應的晶體生長直徑偏差值ΔD,獲取ADC裝置與目標晶體之間的夾角。 The method for controlling the crystal growth diameter as described in Claim 1, wherein the change value of the liquid level spacing and the corresponding crystal growth diameter deviation value are obtained in advance during the equal diameter growth stage, and the change value of the liquid level spacing and the crystal growth diameter are determined. Correspondence between growth diameter deviation values, including: In the equal-diameter growth stage of the crystal, the change value ΔX of the liquid level spacing and the deviation value ΔD of the crystal growth diameter are obtained by the CCD camera; The included angle between the ADC device and the target crystal is obtained according to the change value ΔX of the liquid level element spacing and the corresponding crystal growth diameter deviation value ΔD. 如請求項2所述之晶體生長直徑的控制方法,其中,該根據該液位元間距的變化值ΔX以及相應的晶體生長直徑偏差值ΔD,獲取ADC裝置與目標晶體之間的夾角,包括: 根據
Figure 03_image001
計算獲得該ADC裝置與該目標晶體之間的夾角
Figure 03_image003
The method for controlling the crystal growth diameter as described in Claim 2, wherein the angle between the ADC device and the target crystal is obtained according to the change value ΔX of the liquid level element spacing and the corresponding crystal growth diameter deviation ΔD, including: according to
Figure 03_image001
Calculate the angle between the ADC device and the target crystal
Figure 03_image003
.
如請求項3所述之晶體生長直徑的控制方法,其中,該根據該對應關係以及液位元間距的變化速度,確定直徑自動控制裝置ADC的目標位置並水準移動該ADC裝置至該目標位置,包括: 根據該對應關係以及該液位元間距的變化速度,獲取該ADC裝置的水準移動速度; 根據該ADC裝置的水準移動速度,確定該ADC裝置的目標位置; 根據該ADC裝置的目標位置,水準移動該ADC裝置至該目標位置。 The crystal growth diameter control method as described in Claim 3, wherein, according to the corresponding relationship and the change speed of the liquid level element spacing, determine the target position of the automatic diameter control device ADC and move the ADC device horizontally to the target position, include: Obtain the horizontal movement speed of the ADC device according to the corresponding relationship and the change speed of the liquid level element spacing; determining the target position of the ADC device according to the horizontal moving speed of the ADC device; According to the target position of the ADC device, the ADC device is horizontally moved to the target position. 如請求項4所述之晶體生長直徑的控制方法,其中,該根據該對應關係以及該液位元間距的變化速度,獲取該ADC裝置的水準移動速度,包括: 根據
Figure 03_image010
計算獲得該ADC裝置的水準移動速度
Figure 03_image012
; 其中,
Figure 03_image014
為該液位元間距的變化速度。
The method for controlling the crystal growth diameter as described in Claim 4, wherein, according to the corresponding relationship and the change speed of the liquid level element spacing, obtaining the horizontal movement speed of the ADC device includes: According to:
Figure 03_image010
Calculate the level moving speed of the ADC device
Figure 03_image012
; in,
Figure 03_image014
is the change speed of the liquid level element spacing.
如請求項1所述之晶體生長直徑的控制方法,其中,該在該ADC裝置移動至該目標位置後,調整光學高溫計感測器接收的亮度值為目標亮度值,包括: 在該ADC裝置移動至該目標位置後,通過該晶體的溫度曲線調整該光學高溫計感測器接收的亮度值為目標亮度值。 The method for controlling the crystal growth diameter as described in Claim 1, wherein after the ADC device moves to the target position, adjusting the brightness value received by the optical pyrometer sensor to the target brightness value includes: After the ADC device moves to the target position, the brightness value received by the optical pyrometer sensor is adjusted to the target brightness value through the temperature curve of the crystal. 如請求項1所述之晶體生長直徑的控制方法,其中,該在該ADC裝置移動至該目標位置後,調整光學高溫計感測器接收的亮度值為目標亮度值,包括: 在該ADC裝置移動至該目標位置後,通過調整該晶體的提拉速度以調整該光學高溫計感測器接收的亮度值為目標亮度值。 The method for controlling the crystal growth diameter as described in Claim 1, wherein after the ADC device moves to the target position, adjusting the brightness value received by the optical pyrometer sensor to the target brightness value includes: After the ADC device moves to the target position, the brightness value received by the optical pyrometer sensor is adjusted to a target brightness value by adjusting the pulling speed of the crystal. 一種晶體生長直徑的控制裝置,該控制裝置包括:獲取部分,移動部分以及調整部分;其中, 該獲取部分,經配置為在等徑生長階段預先獲取液位間距的變化值以及相應的晶體生長直徑偏差值,並確定該液位間距的變化值以及晶體生長直徑偏差值之間的對應關係; 該移動部分,經配置為根據該對應關係以及液位元間距的變化速度,確定直徑自動控制裝置ADC的目標位置並水準移動該ADC裝置至該目標位置; 該調整部分,經配置為在該ADC裝置移動至該目標位置後,調整光學高溫計感測器接收的亮度值為目標亮度值;其中,該目標亮度值用於表徵該晶體的生長直徑為目標生長直徑。 A crystal growth diameter control device, the control device includes: an acquisition part, a moving part and an adjustment part; wherein, The acquisition part is configured to pre-acquire the change value of the liquid level spacing and the corresponding crystal growth diameter deviation value in the equal diameter growth stage, and determine the corresponding relationship between the change value of the liquid level spacing and the crystal growth diameter deviation value; The moving part is configured to determine the target position of the automatic diameter control device ADC and horizontally move the ADC device to the target position according to the corresponding relationship and the change speed of the distance between the liquid level elements; The adjustment part is configured to adjust the luminance value received by the optical pyrometer sensor to a target luminance value after the ADC device moves to the target position; wherein, the target luminance value is used to represent that the growth diameter of the crystal is the target growth diameter. 一種晶體生長直徑的控制設備,該設備應用于單晶爐,該設備包括:光學高溫計感測器、CCD攝影機、記憶體以及處理器;其中, 該CCD攝影機用於監測液位間距變化值ΔX以及相應的晶體生長直徑的偏差值ΔD; 該記憶體,用於存儲能夠在該處理器上運行的電腦程式; 該處理器,用於在運行該電腦程式時,執行以下步驟: 在等徑生長階段預先獲取液位間距的變化值以及相應的晶體生長直徑偏差值,並確定該液位間距的變化值以及晶體生長直徑偏差值之間的對應關係; 根據該對應關係以及液位元間距的變化速度,確定直徑自動控制裝置ADC的目標位置並水準移動該ADC裝置至該目標位置; 在該ADC裝置移動至該目標位置後,調整光學高溫計感測器接收的亮度值為目標亮度值; 其中,該目標亮度值用於表徵該晶體的生長直徑為目標生長直徑。 A crystal growth diameter control device, the device is applied to a single crystal furnace, the device includes: optical pyrometer sensor, CCD camera, memory and processor; wherein, The CCD camera is used to monitor the change value of the liquid level spacing ΔX and the corresponding deviation value ΔD of the crystal growth diameter; The memory is used to store computer programs that can run on the processor; The processor is configured to perform the following steps when running the computer program: Obtaining the change value of the liquid level spacing and the corresponding crystal growth diameter deviation value in advance in the equal diameter growth stage, and determining the corresponding relationship between the change value of the liquid level spacing and the crystal growth diameter deviation value; Determine the target position of the diameter automatic control device ADC according to the corresponding relationship and the change speed of the liquid level element spacing, and horizontally move the ADC device to the target position; After the ADC device moves to the target position, adjust the brightness value received by the optical pyrometer sensor to the target brightness value; Wherein, the target brightness value is used to represent that the growth diameter of the crystal is the target growth diameter. 一種電腦存儲介質,該電腦存儲介質存儲有晶體生長直徑的控制的程式,該晶體生長直徑的控制的程式被至少一個處理器執行時實現請求項1至7中任一項所述之晶體生長直徑的控制方法的步驟。A computer storage medium, the computer storage medium stores a program for controlling the crystal growth diameter, and when the program for controlling the crystal growth diameter is executed by at least one processor, the crystal growth diameter described in any one of claims 1 to 7 is realized steps of the control method.
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