TW202245125A - 低質量基板支撐件 - Google Patents
低質量基板支撐件 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 143
- 238000012545 processing Methods 0.000 claims description 22
- 238000005382 thermal cycling Methods 0.000 abstract description 3
- 238000003780 insertion Methods 0.000 abstract description 2
- 230000037431 insertion Effects 0.000 abstract description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 22
- 238000002347 injection Methods 0.000 description 18
- 239000007924 injection Substances 0.000 description 18
- 230000008021 deposition Effects 0.000 description 10
- 238000012546 transfer Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000010926 purge Methods 0.000 description 6
- 230000007704 transition Effects 0.000 description 5
- 238000005137 deposition process Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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Abstract
根據某些實施例,揭露了用於減低質量的基板支撐件的系統和設備。提供前側袋部以用於支撐基板,同時提供背側袋部以減低基板支撐件的質量。藉由提供背側袋部,減低了整體基板支撐件的質量,為基板支撐件提供更快的熱循環時間並減低用於運輸的基板支撐件的重量。根據所揭露的實施例,升降銷系統藉由從每一升降銷孔提供中空延伸部來與現有基座系統相容,該中空延伸部從背側袋部的底部延伸以提供對用於升降銷插入和操作的支撐。
Description
本揭示案的實施例大體係關於基板處理工具,且更特定言之係關於用於基板處理工具的基板支撐件。
傳統上,現有的基板支撐件可具有高熱質量,此可增加處理能量和回應時間,減低處理均勻性。
需要用於克服先前方法的缺陷的系統和設備。
所揭露的實施例係關於一種基板支撐件,包括:碟形主體,該碟形主體在該碟形主體的外邊緣處具有厚度,及位於該碟形主體的軸向中心線處的中心;環,該環耦合至且環繞該碟形主體;及前側袋部,該前側袋部由該碟形主體的前表面及該環延伸超出該碟形主體的該前表面的第一徑向向內邊緣界定。該基板支撐件進一步包括:背側袋部,該背側袋部由該碟形主體的背側及該環延伸超出該碟形主體的該背側的第二徑向向內邊緣界定;複數個升降銷開口,該複數個升降銷開口延伸穿過該碟形主體且放置於與該碟形主體的該中心相距第一徑向距離處;及複數個插槽,該複數個插槽放置於該背側上與該碟形主體的該中心相距第二徑向距離處,該第二徑向距離大於該第一徑向距離。
揭露一種基板支撐件,包括:碟形主體,包括:第一表面,該第一表面具有繞著圓周設置的第一升高圓形環且界定第一側袋部,該第一升高圓形環具有第一徑向寬度;及第二表面,該第二表面在該碟形主體上相對於該第一表面,該第二表面具有繞著該圓周設置的第二升高圓形環且界定第二側袋部,該第二升高圓形環具有第二徑向寬度。該基板支撐件進一步包括:複數個升降銷開口,穿過該碟形主體形成該複數個升降銷開口,且將該複數個升降銷開口放置於與該碟形主體的中心相距第一距離;及複數個插槽,該複數個插槽放置於該第二表面上,該複數個插槽與該等升降銷開口徑向對準且放置於與該碟形主體相距第二距離處,該第二距離小於該圓周且大於該第一距離。
揭露一種處理腔室,包括:上窗部及下窗部,該上窗部及該下窗部界定處理體積;及基板支撐件,該基板支撐件設置於該處理體積內。根據某些實施例,該基板支撐件包括:碟形主體,該碟形主體在該碟形主體的外邊緣處具有厚度,及位於該碟形主體的軸向中心線處的中心;環,該環耦合至且環繞該碟形主體;及前側袋部,該前側袋部由該碟形主體的前表面及該環延伸超出該碟形主體的該前表面的第一徑向向內邊緣界定。該基板支撐件進一步包括:背側袋部,該背側袋部由該碟形主體的背側及該環延伸超出該碟形主體的該背側的第二徑向向內邊緣界定;複數個升降銷開口,該複數個升降銷開口延伸穿過該碟形主體且放置於與該碟形主體的該中心相距第一徑向距離處;及複數個插槽,該複數個插槽放置於該背側上與該碟形主體的該中心相距第二徑向距離處,該第二徑向距離大於該第一徑向距離。
在下文中,參考了本揭示案的實施例。然而,應理解,本揭示案不限於特定描述的實施例。反之,以下特徵和元件的任何組合,無論是否相關於不同的實施例,都被考量以實作和實踐本揭示案。此外,儘管本揭示案的實施例可達成優於其他可能的解決方案及/或先前技術的優勢,給定實施例是否達成特定優勢並不限制本揭示案。因此,以下態樣、特徵、實施例和優點僅是說明性的且不被認為是所附請求項的要素或限制,除非在請求項中明確記載。同樣地,對「本揭示案」的引用不應被解釋為對本文所揭露的任何發明標的之概括,且不應被視為所附請求項的要素或限制,除非在請求項中明確記載。
根據某些實施例,揭露了用於減低質量的基板支撐件的系統和設備。提供用於支撐基板的前側袋部,同時提供減低基板支撐件的質量的背側袋部。藉由提供背側袋部,整個基板支撐件的質量減低,為基板支撐件提供更快的熱循環時間,並減低用於運輸的基板支撐件的重量。根據所揭露的實施例,升降銷系統藉由從每一升降銷孔或從背側袋部的底部延伸的開口提供中空延伸部來與現有的基座系統相容,以提供用於升降銷插入和操作的支撐。
參考圖1,根據本揭示案的實施例圖示了沉積腔室100的示意圖,本文亦揭露為處理腔室。沉積腔室100是外延沉積腔室且可在集群工具(未圖示)內使用。沉積腔室100用於在基板(例如基板102)上生長外延膜。沉積腔室100跨基板102的頂部表面150產生前體的交叉流動。
沉積腔室100包括上主體156、設置在上主體156下方的下主體148、及設置在上主體156和下主體148之間的腔室主體組件105。上主體156、腔室主體組件105、和下主體148形成腔室101。設置在腔室101內的是基板支撐件106、上窗部108、下窗部109、複數個上燈141、和複數個下燈143。如所圖示,控制器120與沉積腔室100通訊並用於控制處理,例如本文所述的處理。控制器120包括中央處理單元(CPU) 152、記憶體裝置135、和支援電路158。基板支撐件106可為碟形主體,且設置在上窗部(例如,圓頂)108和下窗部(例如圓頂)109之間。複數個上燈141設置在上窗部108和蓋154之間。蓋154包括設置在其中的複數個感測器153以用於測量基板102的溫度。複數個下燈143(一個被標記)設置在燈罩151內的下窗部109之間。複數個下燈143形成下燈組件145。
在上窗部108和下窗部109之間形成處理體積136。處理體積136具有設置在其中的基板支撐件106。基板支撐件106包括其上設置基板102的頂部表面。基板支撐件106附接至軸件114。軸件114連接至運動組件121。運動組件121包括一或更多個致動器及/或調整裝置以提供處理體積136內軸件114及/或基板支撐件106的移動及/或調整。運動組件121包括旋轉致動器122以使軸件114及/或基板支撐件106繞著沉積腔室100的縱軸A(例如,中心垂直軸)旋轉。運動組件121進一步包括垂直致動器124以在z方向上升高和降低基板支撐件106。運動組件121包括傾斜調整裝置126和橫向調整裝置128,傾斜調整裝置126用於調整基板支撐件106的平面定向,橫向調整裝置128用於調整軸件114和基板支撐件106在處理體積136內的左右位置。
基板支撐件106可包括設置在其中的升降銷孔107,亦可稱為升降銷開口。升降銷孔107的尺寸被設定為容納升降銷132以用於在執行沉積處理之前或之後從基板支撐件106升降基板102。當基板支撐件106從處理位置降低到傳送位置時,升降銷132可安置在升降銷止動件134上。
如本文所圖示,腔室主體組件105是分段的腔室主體組件。腔室主體組件105包括基底板和注入環。基底板包括基底主體117、基板傳送通路116、和穿過其中設置的一或更多個排氣通路118。基板傳送通路116的尺寸被設定為使得基板和機械臂能夠從中通過。在一些實施例中,基板傳送通路116的寬度大於206 mm,例如寬度大於300 mm。一或更多個排氣通路118流體耦合至處理體積136和排氣泵119。注入環設置在基底板的頂部上並耦合至基底板。注入環包括注入主體113和複數個氣體注入通路111。複數個氣體注入通路111垂直設置在基板傳送通路116上方,且與一或更多個排氣通路118相對。氣體注入通路111流體連接至處理氣體源112。複數個氣體注入通路111從一或更多個排氣通路118垂直偏移,因為穿過注入環形成複數個氣體注入通路111,注入環設置在基底板的頂部上。因此,複數個氣體注入通路111垂直設置在一或更多個排氣通路118上方。
基底板和注入環之其中一者或兩者可進一步包括複數個淨化氣體入口(未圖示)。複數個淨化氣體入口可設置在複數個氣體注入通路111下方,使得複數個淨化氣體入口設置在複數個氣體注入通路111和基板傳送通路116之間。複數個淨化氣體入口可替代地與複數個氣體注入通路111垂直對準,使得複數個淨化氣體入口亦可由複數個氣體注入通路111來表示。放置氣體注入通路111和淨化氣體入口以使氣體流動平行於設置在處理體積136內的基板102的頂部表面150。
一或更多個襯墊195、197設置在腔室主體組件105的內表面上且保護腔室主體組件105免受沉積處理期間使用的反應性氣體的影響。在一些實施例中,使用單個襯墊,且組合一或更多個襯墊195、197以形成單個單元。
參考圖2,根據某些實施例圖示了基板支撐件206的背側200。可用於代替基板支撐件106的基板支撐件206的背側200相對於前側600(如下方論述的圖6中所圖示),前側600在含有基板支撐件206的腔室101的操作期間直接支撐基板102。根據某些實施例的基板支撐件206包括碟形主體208和環205。根據所揭露實施例的基板支撐件206的背側200具有背側袋部220。背側袋部220減低了基板支撐件206的熱質量,以實現快速熱循環並減低基板支撐件206的重量。基板支撐件206的背側200的環205從外邊緣210朝向基板支撐件206的中心215徑向延伸。根據某些實施例,作為環205的外直徑和內直徑之間的差異的徑向寬度207在1 mm和187 mm之間。在一個實施例中,徑向寬度207可為約30 mm和40 mm。背側袋部220從中心215延伸到約153 mm+/-2 mm的半徑R1。
在與中心215相距約110 mm和120 mm的半徑R2處徑向設置的可為一或更多個升降銷孔225。在所圖示的實施例中,將三個升降銷孔225以相等的角間距圖示。在與中心215相距約180 mm+/-3.0 mm的半徑R3處徑向設置的可為一或更多個插槽240。在所圖示的實施例中,將三個插槽240以相等的角間距圖示。將在下方更詳細地論述升降銷孔225和插槽240。
參考圖3A至圖3D,根據某些實施例,圖示了基板支撐件206的橫截面。在圖3A中,環205包括一或更多個插槽240,根據某些實施例,插槽240是環205中的橢圓形凹陷以與處理腔室的一或更多個基板支撐軸件(圖1中未圖示)接合以支撐和對準基板支撐件206。環205的高度H1可從基板支撐件206的背側袋部220的表面延伸約1.00 mm至約1.85 mm,例如約1.78 mm+/-0.02 mm。參考圖3A至圖3C,插槽240包括圓柱形基底部分306,具有喇叭形上部分307以促進基板支撐件206在腔室100內的對準。喇叭形上部分307具有約0.5 mm×0.5 mm至約1.1 mmx1.1 mm的倒角。根據某些實施例,插槽240具有約1.00 mm至約1.85 mm的深度D2,例如約1.78 mm +/- 0.02 mm,約9 mm至13 mm的長度L1,和約4 mm至約7 mm的寬度W1。
參考圖3A至圖3D,中空延伸部327從基板支撐件206的背側袋部220延伸並圍繞每一相應的升降銷孔225。根據某些實施例,中空延伸部327可從基板支撐件206的背側袋部220延伸約1.78 mm+/-0.02 mm的高度H2。根據某些實施例,在基板支撐件206的前側袋部620中的升降銷孔225的部分可具有約5 mm至約6 mm的直徑D3。背側袋部220中的升降銷孔225的部分可具有由中空延伸部327界定的約3.5 mm至約4.0 mm的直徑D4。在中空延伸部327內,升降銷孔225具有約89度至約91度的過渡錐體340,經配置以將升降銷132的頭部保持在升降銷孔225內。
參考圖4,根據某些實施例的基板支撐件406的背側400。可用於代替基板支撐件106的基板支撐件406的背側400相對於前側600(下方論述),前側600在含有基板支撐件406的腔室101的操作期間直接支撐基板102。根據某些實施例的基板支撐件406包括碟形主體408和環405。根據所揭露的實施例,基板支撐件406的背側400具有背側袋部420。背側袋部420減低了基板支撐件406的熱質量以實現快速熱循環並減低基板支撐件406的重量。基板支撐件406的背側400的環405從外邊緣410朝向基板支撐件406的中心415徑向延伸。根據某些實施例,環405的徑向寬度407在1 mm和187 mm之間。在一個實施例中,徑向寬度407可為約2 mm至約5 mm。背側袋部420具有約153 mm+/-2 mm的半徑R4。
在與中心415相距約110 mm至約120 mm的半徑R5處徑向設置的可為一或更多個升降銷孔425。在所圖示的實施例中,將三個升降銷孔425以相等的角間距圖示。在與中心415相距約180 mm+/-3.0 mm的半徑R6處徑向設置的可為一或更多個插槽440。在所圖示的實施例中,將三個插槽440以相等的角間距圖示。根據某些實施例,放置一或更多個插槽440相鄰於環405且由間隙445分開。
參考圖5A至圖5D,根據某些實施例,圖示了基板支撐件406的橫截面。環405相鄰於一或更多個插槽440,環405藉由間隙445與插槽440分開。根據某些實施例,一或更多個插槽440是背側袋部420中的橢圓形結構以與處理腔室的一或更多個基板支撐軸件(圖1中未圖示)接合以支撐和對準基板支撐件。環405的高度H3可從基板支撐件406的背側袋部420的表面延伸約1.00 mm至約1.85 mm,例如約1.78 mm+/-0.02 mm。參考圖5A至圖5C,插槽440包括具有喇叭形上部分507的圓柱形基底部分506以促進基板支撐件406在腔室100內的對準(如圖1中所圖示)。喇叭形上部分507具有約0.5 mm×0.5 mm至約1.1 mm×1.1 mm的倒角。根據某些實施例,插槽440具有約1.00 mm至約1.85 mm的深度D5,例如約1.78 mm+/-0.02 mm,約9 mm至13 mm的長度L2,和約4 mm至約7 mm的寬度W2。
參考圖5A至圖5D,中空延伸部527從基板支撐件406的背側袋部420延伸並圍繞每一相應的升降銷孔425。根據某些實施例,中空延伸部527可從基板支撐件406的背側袋部420延伸約1.78 mm+/-0.02 mm的高度H4。根據某些實施例,基板支撐件206的前側袋部620中的升降銷孔425的部分可具有約5 mm至約6 mm的直徑D6。背側袋部420中的升降銷孔515的部分可具有由中空延伸部527界定的約3.5 mm至約4.0 mm的直徑D7。在中空延伸部527內,升降銷孔具有約89度至約91度的過渡錐體540,經配置以將升降銷132的頭部保持在升降銷孔225內。
參照圖6,根據某些實施例圖示了基板支撐件606的前側600。可使用基板支撐件606代替圖1的基板支撐件106。基板支撐件606的背側(未圖示)可為圖2的基板支撐件206的背側200或圖4的基板支撐件406的背側400。
基板支撐件606的前側600包括從邊緣610朝向中心615徑向向內延伸的環605。前側600的表面608和環605的徑向向內邊緣604界定了前側袋部620。儘管本文揭露的各種基板支撐件被描述為具有碟狀主體(亦即,在其前側600上的環和在圖2的背側200或圖4的400上的環),應理解的是,通常這些部件形成單一主體。換句話說,本申請案的各種基板支撐件可替代地描述為碟形主體,在前側和背側的每一者上具有與其整體形成的環,且從相應的前側和背側延伸。在這些實施例中,所得基板支撐件的邊緣具有厚度t(如圖3A和圖5A中所圖示),是環605和環205或環405之其中一者的組合,組合的基板支撐件厚度t約為3.7 mm+/-0.2 mm。
前側袋部620可具有由徑向向內邊緣604界定的約153 mm+/-2 mm的半徑R7。如圖3A和圖5A中所圖示,前側袋部620的深度D1可為約1.08 mm+/-0.2 mm。在某些實施例中,前側袋部620的中心615處的深度可為約1.08 mm+/-0.2 mm,同時相鄰於環605的前側袋部620的深度可為約0.48 mm+/-0.02 mm,形成從中心615到環605的斜面。在一個範例中,形成的基板支撐件606的中心處的厚度可為約0.83 mm+/-0.02 mm。在另一實施例中,形成的基板支撐件606的中心處的厚度可為約0.5 mm至約12.6 mm。根據一些實施例,用作排氣管線的一或更多個溝槽635可從環605朝向中心615徑向延伸。每一溝槽635在前側袋部620的表面608下方具有約0.9 mm +/- 0.5 mm的深度。
基板支撐件606的碟形主體包括在其中形成的一或更多個升降銷孔625。升降銷孔625在與中心相距半徑R8處形成,對應於圖2中與背側200相關的升降銷孔225,及圖中與背側400相關的升降銷孔425。
藉由提供根據所揭露的實施例的背側袋部,所揭露的基板支撐件的質量可小於傳統方法的質量,從而減低熱循環基板支撐件所需的時間,此外亦減低了便於運輸基板支撐件的總體重量,或具有放置在前側袋部中的基板的基板支撐件。
儘管前述內容針對本揭示案的實施例,可設計本揭示案的其他和進一步的實施例而不背離其基本範圍,且其範圍由以下請求項來決定。
100:沉積腔室
101:腔室
102:基板
105:腔室主體組件
106:基板支撐件
107:升降銷孔
108:上窗部
109:下窗部
111:氣體注入通路
112:處理氣體源
113:注入主體
114:軸件
116:基板傳送通路
117:基底主體
118:排氣通路
119:排氣泵
120:控制器
121:運動組件
122:旋轉致動器
124:垂直致動器
126:傾斜調整裝置
128:橫向調整裝置
132:升降銷
134:升降銷止動件
135:記憶體裝置
136:處理體積
141:上燈
143:下燈
145:下燈組件
148:下主體
150:頂部表面
151:燈罩
152:CPU
153:感測器
154:蓋
156:上主體
158:支援電路
195:襯墊
197:襯墊
200:背側
205:環
206:基板支撐件
207:徑向寬度
208:碟形主體
210:外邊緣
215:中心
220:背側袋部
225:升降銷孔
240:插槽
306:圓柱形基底部分
307:喇叭形上部分
327:中空延伸部
340:過渡錐體
400:背側
405:環
406:基板支撐件
407:徑向寬度
408:碟形主體
410:外邊緣
415:中心
420:背側袋部
425:升降銷孔
440:插槽
445:間隙
506:圓柱形基底部分
507:喇叭形上部分
527:中空延伸部
540:過渡錐體
600:前側
604:徑向向內邊緣
605:環
606:基板支撐件
608:表面
610:邊緣
615:中心
620:前側袋部
625:升降銷孔
635:溝槽
為了能夠詳細理解本揭示案的上述特徵的方式,可藉由參考實施例來獲得上文簡要概括的本揭示案的更特定的描述,其中一些圖示於附圖。然而,注意附圖僅圖示示例性實施例,因此不應被認為是對範圍的限制,因為本揭示案可承認其他等效的實施例。
圖1是根據實施例的沉積腔室的示意性橫截面視圖,在本文中亦揭露為處理腔室。
圖2是根據某些實施例的基板支撐件的背側(亦即,底部)視圖。
圖3A至圖3D是根據某些實施例的圖2中描繪的基板支撐件的部分橫截面視圖。
圖4是根據某些實施例的基板支撐件的背側視圖。
圖5A至圖5D是根據某些實施例的圖4中描繪的基板支撐件的部分橫截面視圖。
圖6是根據某些實施例的基板支撐件的頂部平面視圖。
為了便於理解,在可能的情況下,使用相同的參考數字來表示圖式共有的相同元件。考量一個實施例的元件和特徵可有益地併入其他實施例中而無需進一步敘述。
國內寄存資訊(請依寄存機構、日期、號碼順序註記)
無
國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記)
無
205:環
206:基板支撐件
220:背側袋部
225:升降銷孔
240:插槽
306:圓柱形基底部分
307:喇叭形上部分
327:中空延伸部
340:過渡錐體
600:前側
620:前側袋部
Claims (20)
- 一種基板支撐件,包括: 一碟形主體,該碟形主體在該碟形主體的一外邊緣處具有一厚度,及位於該碟形主體的一軸向中心線處的一中心; 一環,該環耦合至且環繞該碟形主體; 一前側袋部,該前側袋部由該碟形主體的一前表面及該環延伸超出該碟形主體的該前表面的一第一徑向向內邊緣界定; 一背側袋部,該背側袋部由該碟形主體的一背側及該環延伸超出該碟形主體的該背側的一第二徑向向內邊緣界定; 複數個升降銷開口,該複數個升降銷開口延伸穿過該碟形主體且放置於與該碟形主體的該中心相距一第一徑向距離處;及 複數個插槽,該複數個插槽放置於該背側上與該碟形主體的該中心相距一第二徑向距離處,該第二徑向距離大於該第一徑向距離。
- 如請求項1所述之基板支撐件,其中該前側袋部具有約151 mm至約155 mm的一半徑且在該前側袋部的一中心處具有約1.06 mm至約1.10 mm的一深度。
- 如請求項2所述之基板支撐件,其中該前側袋部在相鄰於該環的該前側袋部的一邊緣處具有約0.28 mm至約0.68 mm的一深度。
- 如請求項2所述之基板支撐件,其中該背側袋部具有約1 mm至約153 mm的一半徑。
- 如請求項4所述之基板支撐件,其中該背側袋部的該深度為約0.1 mm至約1.80 mm。
- 如請求項5所述之基板支撐件,其中從該複數個升降銷開口之每一者延伸的一中空延伸部的一高度為約1.76 mm至約1.80 mm。
- 如請求項1所述之基板支撐件,其中在該碟形主體的一中心處的該碟形主體的一厚度為約0.5 mm至約12.6 mm。
- 一種基板支撐件,包括: 一碟形主體,包括: 一第一表面,該第一表面具有繞著一圓周設置的一第一升高圓形環且界定一第一側袋部,該第一升高圓形環具有一第一徑向寬度; 一第二表面,該第二表面在該碟形主體上相對於該第一表面,該第二表面具有繞著該圓周設置的一第二升高圓形環且界定一第二側袋部,該第二升高圓形環具有一第二徑向寬度; 複數個升降銷開口,該複數個升降銷開口穿過該碟形主體形成且放置為與該碟形主體的一中心相距一第一距離;及 複數個插槽,該複數個插槽放置於該第二表面上,該複數個插槽與該等升降銷開口徑向對準且放置於與該碟形主體相距一第二距離處,該第二距離小於該圓周且大於該第一距離。
- 如請求項8所述之基板支撐件,其中該前側袋部具有約151 mm至約155 mm的一半徑及約1.06 mm至約1.10 mm的一深度。
- 如請求項9所述之基板支撐件,其中該前側袋部在相鄰於該第一升高圓形環的該前側袋部的一邊緣處具有約0.28 mm至約0.68 mm的一深度。
- 如請求項9所述之基板支撐件,其中該第二側袋部具有約1 mm至約153 mm的一半徑。
- 如請求項11所述之基板支撐件,其中該第二側袋部的該深度為約1.76 mm至約1.80 mm。
- 如請求項12所述之基板支撐件,其中從該複數個升降銷開口之每一者延伸的一中空延伸部的一高度為約0.1 mm至約1.80 mm。
- 如請求項8所述之基板支撐件,其中繞著該碟形主體的一中心線的一厚度為約0.83 mm。
- 一種處理腔室,包括: 一上窗部及一下窗部,該上窗部及該下窗部界定一處理體積;及 一基板支撐件,該基板支撐件設置於該處理體積內,該基板支撐件包括: 一碟形主體,該碟形主體在該碟形主體的一外邊緣處具有一厚度,及位於該碟形主體的一軸向中心線處的一中心; 一環,該環耦合至且環繞該碟形主體; 一前側袋部,該前側袋部由該碟形主體的一前表面及該環延伸超出該碟形主體的該前表面的一第一徑向向內邊緣界定; 一背側袋部,該背側袋部由該碟形主體的一背側及該環延伸超出該碟形主體的該背側的一第二徑向向內邊緣界定; 複數個升降銷開口,該複數個升降銷開口延伸穿過該碟形主體且放置於與該碟形主體的該中心相距一第一徑向距離處;及 複數個插槽,該複數個插槽放置於該背側上與該碟形主體的該中心相距一第二徑向距離處,該第二徑向距離大於該第一徑向距離。
- 如請求項15所述之處理腔室,其中該前側袋部具有約151 mm至約155 mm的一半徑且在該前側袋部的一中心處具有約1.06 mm至約1.10 mm的一深度。
- 如請求項16所述之處理腔室,其中該基板支撐件的該前側袋部在相鄰於該環的該前側袋部的一邊緣處具有約0.28 mm至約0.68 mm的一深度。
- 如請求項16所述之處理腔室,其中該基板支撐件的該背側袋部具有約1 mm至約153 mm的一半徑。
- 如請求項18所述之處理腔室,其中該基板支撐件厚度的該深度為約3.5 mm至約3.9 mm。
- 如請求項19所述之處理腔室,其中從該基板支撐件的該複數個升降銷開口之每一者延伸的一中空延伸部的一高度為約1.76 mm至約1.80 mm。
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EP (1) | EP4338199A1 (zh) |
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US6086680A (en) * | 1995-08-22 | 2000-07-11 | Asm America, Inc. | Low-mass susceptor |
KR100660416B1 (ko) * | 1997-11-03 | 2006-12-22 | 에이에스엠 아메리카, 인코포레이티드 | 개량된 저질량 웨이퍼 지지 시스템 |
US6444027B1 (en) * | 2000-05-08 | 2002-09-03 | Memc Electronic Materials, Inc. | Modified susceptor for use in chemical vapor deposition process |
US8042697B2 (en) * | 2008-06-30 | 2011-10-25 | Memc Electronic Materials, Inc. | Low thermal mass semiconductor wafer support |
KR101238841B1 (ko) * | 2011-01-04 | 2013-03-04 | 주식회사 엘지실트론 | 화학 기상 증착 장치용 서셉터 및 이를 갖는 화학 기상 증착 장치 |
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