TW202243911A - 液晶聚合物膜、聚合物膜及積層體 - Google Patents
液晶聚合物膜、聚合物膜及積層體 Download PDFInfo
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- TW202243911A TW202243911A TW111105881A TW111105881A TW202243911A TW 202243911 A TW202243911 A TW 202243911A TW 111105881 A TW111105881 A TW 111105881A TW 111105881 A TW111105881 A TW 111105881A TW 202243911 A TW202243911 A TW 202243911A
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Classifications
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/12—Polyester-amides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
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| JP2021024494 | 2021-02-18 | ||
| JP2021-024494 | 2021-02-18 |
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| TW202243911A true TW202243911A (zh) | 2022-11-16 |
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| JP2010046830A (ja) * | 2008-08-19 | 2010-03-04 | Junkosha Co Ltd | ガスバリアフィルムの製造方法、ガスバリアフィルム及びガスバリアバッグ |
| JP2010103269A (ja) * | 2008-10-23 | 2010-05-06 | Kuraray Co Ltd | 多層回路基板およびその製造方法 |
| TWI719955B (zh) * | 2014-12-18 | 2021-03-01 | 日商住友化學股份有限公司 | 三層薄膜、三層薄膜之製造方法、層合板及印刷電路基板 |
| WO2017130721A1 (ja) * | 2016-01-27 | 2017-08-03 | 株式会社新技術研究所 | 表面改質ポリエステル系樹脂を含む銅または銅合金物品および製造方法 |
| CN108925132B (zh) * | 2016-04-11 | 2020-07-07 | Ａｇｃ株式会社 | 层叠体、印刷基板和层叠体的制造方法 |
| JP7390127B2 (ja) * | 2019-02-15 | 2023-12-01 | 住友化学株式会社 | 液晶ポリエステル組成物、フィルムの製造方法、及び積層体の製造方法 |
| JP7366397B2 (ja) * | 2019-08-27 | 2023-10-23 | 共同技研化学株式会社 | 積層フィルム及び該積層フィルムの製造方法 |
-
2022
- 2022-02-16 CN CN202280009811.0A patent/CN116669950A/zh active Pending
- 2022-02-16 KR KR1020237023080A patent/KR20230116047A/ko active Pending
- 2022-02-16 JP JP2023500900A patent/JPWO2022176914A1/ja not_active Abandoned
- 2022-02-16 WO PCT/JP2022/006195 patent/WO2022176914A1/ja not_active Ceased
- 2022-02-17 TW TW111105881A patent/TW202243911A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022176914A1 (ja) | 2022-08-25 |
| CN116669950A (zh) | 2023-08-29 |
| JPWO2022176914A1 (https=) | 2022-08-25 |
| KR20230116047A (ko) | 2023-08-03 |
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