JPWO2022176914A1 - - Google Patents

Info

Publication number
JPWO2022176914A1
JPWO2022176914A1 JP2023500900A JP2023500900A JPWO2022176914A1 JP WO2022176914 A1 JPWO2022176914 A1 JP WO2022176914A1 JP 2023500900 A JP2023500900 A JP 2023500900A JP 2023500900 A JP2023500900 A JP 2023500900A JP WO2022176914 A1 JPWO2022176914 A1 JP WO2022176914A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2023500900A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022176914A1 publication Critical patent/JPWO2022176914A1/ja
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/12—Polyester-amides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
JP2023500900A 2021-02-18 2022-02-16 Abandoned JPWO2022176914A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021024494 2021-02-18
PCT/JP2022/006195 WO2022176914A1 (ja) 2021-02-18 2022-02-16 液晶ポリマーフィルム、ポリマーフィルム、及び積層体

Publications (1)

Publication Number Publication Date
JPWO2022176914A1 true JPWO2022176914A1 (https=) 2022-08-25

Family

ID=82930599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023500900A Abandoned JPWO2022176914A1 (https=) 2021-02-18 2022-02-16

Country Status (5)

Country Link
JP (1) JPWO2022176914A1 (https=)
KR (1) KR20230116047A (https=)
CN (1) CN116669950A (https=)
TW (1) TW202243911A (https=)
WO (1) WO2022176914A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024111229A1 (https=) * 2022-11-22 2024-05-30

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005041044A (ja) * 2003-07-25 2005-02-17 Nitto Denko Corp 液晶フィルム、液晶配向フィルムの製造方法および画像表示装置
JP2007152886A (ja) * 2005-12-08 2007-06-21 Fujifilm Corp 積層シート及びその製造方法
JP2010046830A (ja) * 2008-08-19 2010-03-04 Junkosha Co Ltd ガスバリアフィルムの製造方法、ガスバリアフィルム及びガスバリアバッグ
JP2010103269A (ja) * 2008-10-23 2010-05-06 Kuraray Co Ltd 多層回路基板およびその製造方法
JP2016117281A (ja) * 2014-12-18 2016-06-30 住友化学株式会社 三層フィルム、三層フィルムの製造方法、積層板及びプリント回路基板
WO2017130721A1 (ja) * 2016-01-27 2017-08-03 株式会社新技術研究所 表面改質ポリエステル系樹脂を含む銅または銅合金物品および製造方法
WO2017179542A1 (ja) * 2016-04-11 2017-10-19 旭硝子株式会社 積層体、プリント基板、および積層体の製造方法
JP2020132849A (ja) * 2019-02-15 2020-08-31 住友化学株式会社 液晶ポリエステル粉末、液晶ポリエステル組成物、フィルムの製造方法、及び積層体の製造方法
JP2021030631A (ja) * 2019-08-27 2021-03-01 共同技研化学株式会社 積層フィルム及び該積層フィルムの製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005041044A (ja) * 2003-07-25 2005-02-17 Nitto Denko Corp 液晶フィルム、液晶配向フィルムの製造方法および画像表示装置
JP2007152886A (ja) * 2005-12-08 2007-06-21 Fujifilm Corp 積層シート及びその製造方法
JP2010046830A (ja) * 2008-08-19 2010-03-04 Junkosha Co Ltd ガスバリアフィルムの製造方法、ガスバリアフィルム及びガスバリアバッグ
JP2010103269A (ja) * 2008-10-23 2010-05-06 Kuraray Co Ltd 多層回路基板およびその製造方法
JP2016117281A (ja) * 2014-12-18 2016-06-30 住友化学株式会社 三層フィルム、三層フィルムの製造方法、積層板及びプリント回路基板
WO2017130721A1 (ja) * 2016-01-27 2017-08-03 株式会社新技術研究所 表面改質ポリエステル系樹脂を含む銅または銅合金物品および製造方法
WO2017179542A1 (ja) * 2016-04-11 2017-10-19 旭硝子株式会社 積層体、プリント基板、および積層体の製造方法
JP2020132849A (ja) * 2019-02-15 2020-08-31 住友化学株式会社 液晶ポリエステル粉末、液晶ポリエステル組成物、フィルムの製造方法、及び積層体の製造方法
JP2021030631A (ja) * 2019-08-27 2021-03-01 共同技研化学株式会社 積層フィルム及び該積層フィルムの製造方法

Also Published As

Publication number Publication date
TW202243911A (zh) 2022-11-16
WO2022176914A1 (ja) 2022-08-25
CN116669950A (zh) 2023-08-29
KR20230116047A (ko) 2023-08-03

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