TW202239691A - Pickup collet, pickup apparatus and mounting apparatus capable of picking up electronic parts in a non-contact manner - Google Patents

Pickup collet, pickup apparatus and mounting apparatus capable of picking up electronic parts in a non-contact manner Download PDF

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TW202239691A
TW202239691A TW111111328A TW111111328A TW202239691A TW 202239691 A TW202239691 A TW 202239691A TW 111111328 A TW111111328 A TW 111111328A TW 111111328 A TW111111328 A TW 111111328A TW 202239691 A TW202239691 A TW 202239691A
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electronic component
collet
pick
pickup
gas
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TW111111328A
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Chinese (zh)
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TWI843075B (en
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羽根洋祐
橋本正規
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日商芝浦機械電子裝置股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386Separation by peeling
    • H01L2221/6839Separation by peeling using peeling wedge or knife or bar

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Manipulator (AREA)

Abstract

The present invention provides a pickup collet capable of picking up electronic parts in a non-contact manner, a pickup apparatus, and a mounting apparatus. The pickup collet ( 200 ) according to an embodiment is such a pickup collet ( 200 ) that sucks and holds an electronic part ( 2 ) and picks it up. The pickup collet has a porous member ( 201 ). The porous member (201) has the air permeability and ejects the supplied gas into the interior in a planar manner through the pores of a facing surface (201a) facing the electronic part (2). A suction hole (201c) is disposed in the porous member (201). The suction hole (201c) has an opening (201d) on the facing surface (201a) and sucks the electronic part (2) by a negative pressure. A guide portion (201e) that restricts the movement of the electronic part (2) is disposed along the outer edge of the facing surface (201a).

Description

拾取筒夾、拾取裝置及安裝裝置Pick-up collet, pick-up device and installation device

本發明是有關於一種拾取筒夾(pickup collet)、拾取裝置及安裝裝置。The invention relates to a pickup collet, a pickup device and an installation device.

在將作為邏輯、記憶體、圖像感測器等半導體元件的電子零件安裝在基板上時,藉由切斷形成有半導體元件的晶片而製成單片化的晶片。然後,將所述晶片一個個拾取並移送至基板來進行安裝。When mounting electronic components such as logic, memory, and image sensors on a substrate, the wafer on which the semiconductor elements are formed is cut to form individual wafers. Then, the wafers are picked up one by one and transferred to a substrate for mounting.

作為晶片的其中一面的表面成為形成有微細的回路的功能面。若在從晶片拾取所述晶片時拾取的構件與功能面直接接觸,則回路等有破損的擔心,因此有希望避免接觸的要求。One surface of the wafer is a functional surface on which fine circuits are formed. When the wafer is picked up from the wafer, if the picked-up member comes into direct contact with the functional surface, circuits and the like may be damaged, so there is a need to avoid contact.

另外,還使晶片的表面的連接端子與基板的連接端子相向地接合。此時,為了確保並提高連接端子彼此的接合性,有時對晶片的表面進行等離子體處理或表面活性化處理等表面處理。為了維持進行了此種處理的晶片的表面狀態,也有希望避免拾取的構件與晶片的表面直接接觸的要求。In addition, the connection terminals on the surface of the wafer and the connection terminals on the substrate are joined to face each other. At this time, in order to ensure and improve the bondability of the connection terminals, the surface of the wafer may be subjected to surface treatment such as plasma treatment or surface activation treatment. In order to maintain the surface state of the wafer subjected to such processing, there is also a requirement to avoid direct contact of picked-up members with the surface of the wafer.

為了應對使構件不與晶片的表面接觸的要求,以往在作為拾取晶片的構件的筒夾中,將保持晶片的面作為錐面,以並非晶片的表面而是僅周緣部與筒夾的錐面接觸的狀態被保持(參照專利文獻1)。 [現有技術文獻] [專利文獻] In order to meet the requirement that the member does not come into contact with the surface of the wafer, conventionally, in the collet as a member for picking up the wafer, the surface holding the wafer is used as a tapered surface, so that not the surface of the wafer but only the peripheral portion and the tapered surface of the collet The contact state is maintained (see Patent Document 1). [Prior art literature] [Patent Document]

[專利文獻1] 日本專利實開昭63-124746號公報[Patent Document 1] Japanese Patent Application Publication No. 63-124746

[發明所欲解決之課題][Problem to be Solved by the Invention]

然而,在如所述那樣的現有技術中,在晶片的周邊部也存在與筒夾的接觸。因此,藉由與晶片的表面的周緣部接觸,有可能產生晶片的缺損、破裂。另外,晶片與筒夾的接觸原本就會導致顆粒(particle)的產生。因此,要求即使對於晶片的表面的周緣部也可以不接觸的方式保持的筒夾。However, in the prior art as described above, there is also contact with the collet at the peripheral portion of the wafer. Therefore, chipping and cracking of the wafer may occur due to contact with the peripheral portion of the surface of the wafer. In addition, the contact between the wafer and the collet inherently results in the generation of particles. Therefore, there is a demand for a collet that can hold even the periphery of the surface of the wafer without contact.

本發明是為了解決如所述那樣的課題而完成的,其目的在於提供一種能夠以不接觸的方式拾取電子零件的拾取筒夾、拾取裝置及安裝裝置。 [解決課題之手段] The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a pickup collet capable of picking up electronic components without contact, a pickup device, and a mounting device. [Means to solve the problem]

本發明是抽吸保持電子零件並進行拾取的拾取筒夾,具有多孔質構件,所述多孔質構件具有通氣性且將被供給的氣體經由與所述電子零件相向的相向面的細孔呈面狀噴出至內部,在所述多孔質構件中設置有抽吸孔,所述抽吸孔在所述相向面具有開口且藉由負壓抽吸所述電子零件,沿著所述相向面的外緣設置有限制所述電子零件的移動的引導部。The present invention is a pick-up collet for sucking and holding electronic components and picking them up. The porous member is provided with a gas permeable surface through which the supplied gas passes through the pores on the surface facing the electronic components. The porous member is provided with a suction hole which has an opening on the facing surface and sucks the electronic component by negative pressure, along the outer surface of the facing surface. The edge is provided with a guide that restricts movement of the electronic parts.

另外,本發明是從貼附有所述電子零件的片材中拾取所述電子零件的拾取裝置,具有:所述拾取筒夾;以及筒夾移動機構,使所述拾取筒夾接近至所述片材中的能夠抽吸保持所述電子零件的位置,能夠將抽吸保持的所述電子零件從所述片材上剝落並移送。In addition, the present invention is a pick-up device for picking up the electronic component from a sheet to which the electronic component is attached, comprising: the pick-up collet; and a collet moving mechanism for bringing the pick-up collet close to the A position in the sheet where the electronic component can be suction-held, and the electronic component held by suction can be peeled off from the sheet and transferred.

另外,本發明的安裝裝置具有:所述拾取裝置;接合頭,設置成能夠相對於所述拾取筒夾相對移動,從所述拾取筒夾接收所述電子零件;以及安裝部,將保持在所述接合頭的所述電子零件移送至基板並進行安裝。 [發明的效果] In addition, the mounting device of the present invention has: the pick-up device; a bonding head provided so as to be relatively movable with respect to the pick-up collet, and receives the electronic component from the pick-up collet; The electronic components of the bonding head are transferred to the substrate and mounted. [Effect of the invention]

根據本發明的拾取筒夾、拾取裝置及安裝裝置,可以不接觸的方式拾取電子零件。According to the picking collet, picking device and mounting device of the present invention, electronic parts can be picked up in a non-contact manner.

參照附圖來說明本發明的實施形態。再者,附圖是示意圖,各部的尺寸、比率等為了容易理解而包含誇張的部分。如圖1及圖2所示,本實施形態的拾取筒夾200用於電子零件2的移送裝置1。移送裝置1包括拾取裝置20、搭載裝置30及控制裝置50,是藉由拾取裝置20將電子零件2向搭載裝置30交接的裝置。Embodiments of the present invention will be described with reference to the drawings. In addition, the drawings are schematic diagrams, and the dimensions, ratios, etc. of each part include exaggerated parts for easy understanding. As shown in FIGS. 1 and 2 , the pickup collet 200 of this embodiment is used in the transfer device 1 of the electronic component 2 . The transfer device 1 includes a pick-up device 20 , a mounting device 30 , and a control device 50 , and is a device that transfers the electronic component 2 to the mounting device 30 through the pick-up device 20 .

電子零件2例如是晶片狀的零件。本實施形態中,電子零件2是將晶片分割成單片的半導體晶片。另外,安裝裝置100是經由利用移送裝置1進行的移送將從供給裝置10供給的電子零件2安裝在基板上的裝置。即,安裝裝置100除了包括移送裝置1的結構以外,還包括供給裝置10、支援基板的基板載台60。Electronic component 2 is, for example, a wafer-shaped component. In this embodiment, the electronic component 2 is a semiconductor wafer obtained by dividing a wafer into individual pieces. Moreover, the mounting apparatus 100 is an apparatus which mounts the electronic component 2 supplied from the supply apparatus 10 on a board|substrate via transfer by the transfer apparatus 1. As shown in FIG. That is, the mounting apparatus 100 includes the supply apparatus 10 and the substrate stage 60 for supporting the substrate in addition to the structure of the transfer apparatus 1 .

供給裝置10是向拾取裝置20供給電子零件2的裝置。供給裝置10使作為拾取物件的電子零件2移動至供給位置P1。所謂供給位置P1,是拾取裝置20拾取作為拾取物件的電子零件2的位置。供給裝置10包括支援貼附有電子零件2的片材11的供給載台12、使供給載台12移動的載台移動機構13。作為所述載台移動機構13,例如可使用藉由以伺服電動機驅動的滾珠螺桿機構而使滑動器在導軌上移動的線性引導件。The supply device 10 is a device that supplies the electronic components 2 to the pickup device 20 . The supply apparatus 10 moves the electronic component 2 which is a pick-up object to supply position P1. The supply position P1 is a position where the pick-up device 20 picks up the electronic component 2 as a pick-up object. The supply device 10 includes a supply stage 12 that supports the sheet 11 on which the electronic component 2 is attached, and a stage moving mechanism 13 that moves the supply stage 12 . As the stage moving mechanism 13, for example, a linear guide that moves a slider on a guide rail by a ball screw mechanism driven by a servo motor can be used.

此處,貼附有電子零件2的片材11是貼附在未圖示的晶片環上的具有粘著性的晶片片材。在片材11上,電子零件2配置成矩陣(matrix)狀。本實施形態中,電子零件2以功能面露出至上方的朝上狀態配置。Here, the sheet 11 to which the electronic component 2 is attached is an adhesive wafer sheet attached to a wafer ring not shown. Electronic components 2 are arranged in a matrix on the sheet 11 . In this embodiment, the electronic component 2 is arrange|positioned in the upward state which exposed the functional surface upward.

供給載台12是水準支持貼附有片材11的晶片環的台。即,供給載台12經由晶片環支援貼附有電子零件2的片材11。供給載台12被設置成通超載台移動機構13能夠在水準方向上移動。片材11由供給載台12以及載台移動機構13水準地支持,因此片材11及載置於所述片材11上的電子零件2也另外被設置成能夠在水準方向上移動。The supply stage 12 is a stage for horizontally supporting the wafer ring to which the sheet 11 is attached. That is, the supply stage 12 supports the sheet 11 on which the electronic component 2 is attached via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by an overload stage moving mechanism 13 . Since the sheet 11 is supported horizontally by the supply stage 12 and the stage moving mechanism 13 , the sheet 11 and the electronic components 2 placed on the sheet 11 are also separately provided so as to be movable in the horizontal direction.

再者,如圖1所示,將水準方向中供給裝置10與搭載裝置30排列的方向稱為X軸方向,將與X軸正交的方向稱為Y軸方向。另外,將與片材11的平面正交的方向稱為Z軸方向或上下方向。所謂上方向,是以片材11的平面為邊界且載置有電子零件2的一側的方向,所謂下方向,是以片材11的平面為邊界且未載置電子零件2的一側的方向。In addition, as shown in FIG. 1 , the direction in which the supply device 10 and the mounting device 30 are arranged in the horizontal direction is called the X-axis direction, and the direction perpendicular to the X-axis is called the Y-axis direction. In addition, the direction orthogonal to the plane of the sheet|seat 11 is called Z-axis direction or an up-down direction. The so-called upward direction is the direction of the side on which the electronic component 2 is placed, which is bounded by the plane of the sheet 11, and the direction of the side where the electronic component 2 is not placed is defined by the plane of the sheet 11 direction.

[拾取裝置] 拾取裝置20是從供給裝置10拾取電子零件2並將拾取的電子零件2交接至搭載裝置30的裝置。所述拾取裝置20包括拾取筒夾200、筒夾移動機構22、方向轉換部23、以及上推銷24。 [pickup device] The pick-up device 20 is a device that picks up the electronic components 2 from the supply device 10 and delivers the picked-up electronic components 2 to the mounting device 30 . The pick-up device 20 includes a pick-up collet 200 , a collet moving mechanism 22 , a direction changing part 23 , and a push-up pin 24 .

如圖3的(A)、圖3的(B)~圖5所示,拾取筒夾200是抽吸保持電子零件2並解除抽吸保持而釋放電子零件2的構件。拾取筒夾200具有多孔質構件201、基座202。As shown in FIG. 3(A) and FIG. 3(B) to FIG. 5 , the pickup collet 200 is a member that suction-holds the electronic component 2 and releases the suction-holding to release the electronic component 2 . The pickup collet 200 has a porous member 201 and a base 202 .

多孔質構件201是具有通氣性且經由與電子零件2相向的相向面201a的細孔供給被供給至內部的氣體的構件。本實施形態的多孔質構件201為長方體的板狀,整體上緻密且大致均勻地形成有連通的微細空間。多孔質構件201藉由所述結構而具有通氣性,但其流導率非常小。多孔質構件201的任意一個面成為相向面201a,當從相向面201a的相反的一側的背面201b向內部供給氣體時,從相向面201a的緻密且均等地存在的細孔噴出氣體。所述噴出成為向噴出的相向面201a的整個面擴展的實質上為面狀的噴出。所述噴出極其緩慢,可以說是滲出來的感覺,是靠近手指稍微感覺到氣流的程度。再者,在相向面201a與背面201b以外的面,細孔也可堵塞。The porous member 201 is a member that has air permeability and supplies the gas supplied inside through the pores of the facing surface 201 a facing the electronic component 2 . The porous member 201 of the present embodiment has a rectangular parallelepiped plate shape, and fine spaces connected thereto are formed densely and substantially uniformly as a whole. The porous member 201 has air permeability due to the above-mentioned structure, but its flow conductivity is very small. Either surface of the porous member 201 serves as the facing surface 201a, and when gas is supplied to the inside from the back surface 201b opposite to the facing surface 201a, the gas is ejected from the dense and uniform pores of the facing surface 201a. The discharge is a substantially planar discharge that spreads over the entire surface of the discharge-facing surface 201a. The ejection is extremely slow, so to speak, so to speak, and it is to the extent that a slight airflow is felt close to the fingers. Furthermore, the pores may be blocked on surfaces other than the facing surface 201a and the back surface 201b.

多孔質構件201是如上所述作為內部的微細空間的細孔相互連通且氣體能夠通過細孔間的連續結構體。作為此種多孔質構件201,可使用燒結金屬、陶瓷、樹脂等。就內部粒子難以分離流出的觀點而言,優選為設為燒結金屬。The porous member 201 is a continuous structure in which pores, which are internal micro spaces, communicate with each other and gas can pass between the pores as described above. As such a porous member 201, sintered metal, ceramics, resin, or the like can be used. From the viewpoint that internal particles are difficult to separate and flow out, it is preferable to use a sintered metal.

進而,如圖3的(A)、圖3的(B)及圖4所示,在多孔質構件201中設置有抽吸孔201c,所述抽吸孔201c是在相向面201a具有開口201d且藉由負壓抽吸電子零件2的貫通孔。本實施形態的抽吸孔201c從背面201b的中央呈直線狀地貫通至相向面201a的中央。Furthermore, as shown in FIG. 3(A), FIG. 3(B) and FIG. 4 , the porous member 201 is provided with a suction hole 201c having an opening 201d on the facing surface 201a and The through hole of the electronic component 2 is sucked by negative pressure. The suction hole 201c of this embodiment penetrates linearly from the center of the back surface 201b to the center of the opposing surface 201a.

基座202是覆蓋相向面201a以外的多孔質構件201的面的構件。本實施形態的基座202是下方開口的長方體形狀的箱。多孔質構件201從基座202的開口以底面作為相向面201a而露出的方式插入,組裝至基座202內並加以固定。The susceptor 202 is a member covering the surface of the porous member 201 other than the facing surface 201a. The base 202 of the present embodiment is a rectangular parallelepiped box with an open bottom. The porous member 201 is inserted from the opening of the base 202 so that the bottom surface is exposed as the facing surface 201 a , assembled into the base 202 , and fixed.

如圖3的(A)、圖3的(B)及圖5所示,在基座202的頂面上設置有供氣孔202a、排氣孔202b、安裝孔202c。供氣孔202a是用於向多孔質構件201供氣的貫通孔。供氣孔202a由於與供氣孔202a連接的配管而形成在靠近基座202的外緣的位置處。排氣孔202b是用於經由抽吸孔201c使開口201d產生負壓的貫通孔。排氣孔202b向下方延伸,以與多孔質構件201的抽吸孔201c一致的方式形成。在排氣孔202b的周圍的基座202的內表面與多孔質構件201之間形成有氣體滯留的空間。再者,排氣孔202b也可貫通抽吸孔201c而到達相向面201a。在所述情況下,多孔質構件201的抽吸孔201c、開口201d以與到達多孔質構件201的相向面201a的排氣孔202b的外側密接的方式設置。安裝孔202c是在與筒夾移動機構22連接時用於防止偏移的一對凹陷孔。As shown in FIG. 3(A), FIG. 3(B) and FIG. 5 , an air supply hole 202 a , an exhaust hole 202 b , and an installation hole 202 c are provided on the top surface of the base 202 . The air supply holes 202 a are through holes for supplying air to the porous member 201 . The air supply hole 202a is formed at a position close to the outer edge of the base 202 due to piping connected to the air supply hole 202a. The exhaust hole 202b is a through hole for generating a negative pressure in the opening 201d via the suction hole 201c. The exhaust holes 202 b extend downward and are formed so as to coincide with the suction holes 201 c of the porous member 201 . A space where gas stays is formed between the inner surface of the susceptor 202 around the exhaust hole 202 b and the porous member 201 . Furthermore, the exhaust hole 202b may also pass through the suction hole 201c to reach the opposite surface 201a. In this case, the suction hole 201c and the opening 201d of the porous member 201 are provided in close contact with the outside of the exhaust hole 202b reaching the facing surface 201a of the porous member 201 . The mounting holes 202c are a pair of recessed holes for preventing misalignment when the collet moving mechanism 22 is connected.

供氣孔202a經由未圖示的配管連接至氣體的供給回路。供給回路包括氣體的供給源、泵、閥等而構成。此處,經由供氣孔202a向多孔質構件201供給的氣體設為惰性氣體。排氣孔202b經由未圖示的配管而與包括真空泵、閥等的負壓產生回路連通。The gas supply hole 202a is connected to a gas supply circuit through a pipe not shown. The supply circuit includes a gas supply source, a pump, a valve, and the like. Here, the gas supplied to the porous member 201 through the gas supply hole 202a is an inert gas. The exhaust hole 202b communicates with a negative pressure generating circuit including a vacuum pump, a valve, and the like through piping not shown.

筒夾移動機構22是使裝設有拾取筒夾200的拾取頭21在供給位置P1與交接位置P2之間往復移動且在供給位置P1及交接位置P2升降的機構。再者,所謂交接位置P2,是拾取裝置20將在供給位置P1拾取的電子零件2交接至作為後述的接收部發揮功能的接合頭31的位置。供給位置P1及交接位置P2主要是指XY方向的位置,不一定是指Z軸方向的位置。The collet moving mechanism 22 is a mechanism that reciprocates the pickup head 21 on which the pickup collet 200 is mounted between the supply position P1 and the delivery position P2 and lifts up and down between the supply position P1 and the delivery position P2. In addition, delivery position P2 is a position where the pick-up device 20 delivers the electronic component 2 picked up at the supply position P1 to the bonding head 31 which functions as the receiving part mentioned later. The supply position P1 and the delivery position P2 mainly refer to positions in the XY direction, and do not necessarily refer to positions in the Z-axis direction.

另外,即使在是指Z軸方向的位置(高度)的情況下,其高度也具有規定的寬度。規定的寬度包括電子零件2的厚度、將電子零件2上推的距離、能夠吸附電子零件2的距離等。在尤其是指Z軸方向的位置(高度)的情況下,在供給位置P1,將接近位置處的高度設為H1,將剝落位置處的高度設為H2(參照圖8的(A)~圖8的(D))。In addition, even when referring to the position (height) in the Z-axis direction, the height has a predetermined width. The predetermined width includes the thickness of the electronic component 2 , the distance for pushing the electronic component 2 up, the distance for the electronic component 2 to be sucked, and the like. In particular, when referring to the position (height) in the Z-axis direction, at the supply position P1, the height at the approaching position is H1, and the height at the peeling position is H2 (see (A) to Fig. 8 ). 8(D)).

筒夾移動機構22具有安裝有拾取頭21的臂222a,藉由移動臂222a而移動裝設在拾取頭21上的拾取筒夾200。在拾取頭21的前端設置有裝卸部222b,裝卸部222b在內部包括磁鐵,利用磁鐵的抽吸力吸附保持拾取筒夾200的基座202。如圖4及圖5所示,在裝卸部222b的與基座202的接觸面上設置有一對銷222c。銷222c嵌入設置在基座202上的安裝孔202c中,由此防止拾取筒夾200相對於裝卸部222b的偏移。再者,雖未圖示,但與排氣孔202b連接的配管通過裝卸部222b內,與供氣孔202a連接的配管由裝卸部222b支援。The collet moving mechanism 22 has an arm 222a on which the pick-up head 21 is installed, and the pick-up collet 200 mounted on the pick-up head 21 is moved by the moving arm 222a. A detachable part 222b is provided at the front end of the pick-up head 21, and the detachable part 222b includes a magnet inside, and uses the suction force of the magnet to attract and hold the base 202 of the pick-up collet 200. As shown in FIGS. 4 and 5 , a pair of pins 222c are provided on the contact surface of the detachable portion 222b with the base 202 . The pin 222c is fitted into the attachment hole 202c provided in the base 202, thereby preventing the pickup collet 200 from being shifted relative to the detachable portion 222b. In addition, although not shown in figure, the piping connected to the exhaust hole 202b passes through the inside of the detachable part 222b, and the piping connected to the air supply hole 202a is supported by the detachable part 222b.

筒夾移動機構22包括滑動機構221、升降機構222。滑動機構221藉由移動安裝有拾取頭21的臂222a而使拾取筒夾200在供給位置P1與交接位置P2之間往復移動。此處,滑動機構221具有:與X軸方向平行地延伸且固定於支持框架221a的導軌221b、以及在導軌221b上行進的滑動器221c。雖未圖示,但滑動器221c藉由以旋轉電動機驅動的滾珠螺桿、線性電動機等而受到驅動。The collet moving mechanism 22 includes a sliding mechanism 221 and a lifting mechanism 222 . The slide mechanism 221 reciprocates the pickup collet 200 between the supply position P1 and the delivery position P2 by moving the arm 222a on which the pickup head 21 is mounted. Here, the slide mechanism 221 has the guide rail 221b extended parallel to the X-axis direction, and fixed to the support frame 221a, and the slider 221c which runs on the guide rail 221b. Although not shown, the slider 221c is driven by a ball screw driven by a rotary motor, a linear motor, or the like.

升降機構222藉由移動安裝有拾取頭21的臂222a而使拾取筒夾200在上下方向上移動。具體而言,升降機構222可使用藉由以伺服電動機驅動的滾珠螺桿機構而使滑動器在導軌上移動的線性引導件。即,藉由伺服電動機的驅動,拾取筒夾200沿著Z軸方向升降。再者,拾取筒夾200經由裝卸部222b被拾取頭21彈性支援且設置成能夠相對於拾取頭21在Z軸方向上上下滑動移動。而且,拾取頭21具有檢測所述滑動器移動的感測器。The lift mechanism 222 moves the pickup collet 200 in the up-down direction by moving the arm 222a to which the pickup head 21 is attached. Specifically, the lift mechanism 222 may use a linear guide that moves a slider on a guide rail by a ball screw mechanism driven by a servo motor. That is, the pickup collet 200 moves up and down along the Z-axis direction by the drive of the servo motor. Furthermore, the pick-up collet 200 is elastically supported by the pick-up head 21 via the detachable portion 222b, and is provided so as to be able to slide up and down in the Z-axis direction relative to the pick-up head 21 . Furthermore, the pickup head 21 has a sensor for detecting the movement of the slider.

方向轉換部23設置在拾取筒夾200與筒夾移動機構22之間。此處,方向轉換部23是包括變更拾取筒夾200的朝向的電動機等驅動源、滾珠軸承等旋轉引導件而成的致動器。所謂拾取筒夾200的朝向,設為從拾取筒夾200的基座202側朝向相向面201a的朝向。所謂變更朝向,是在上下方向上旋轉0°~180°。例如,使相向面201a朝向供給載台12的拾取筒夾200在供給位置P1吸附保持電子零件2。之後,方向轉換部23以吸附面朝上的方式變更拾取筒夾200的朝向。此時,旋轉角度為180°。The direction changing part 23 is provided between the pickup collet 200 and the collet moving mechanism 22 . Here, the direction changing unit 23 is an actuator including a driving source such as a motor for changing the orientation of the pickup collet 200 and a rotating guide such as a ball bearing. The orientation of the pick-up collet 200 is the direction from the base 202 side of the pick-up collet 200 toward the facing surface 201 a. The so-called change of direction means to rotate 0° to 180° in the vertical direction. For example, the pick-up collet 200 with the opposing surface 201a facing the supply stage 12 absorbs and holds the electronic component 2 at the supply position P1. Thereafter, the direction changing unit 23 changes the direction of the pickup collet 200 so that the suction surface faces upward. At this time, the rotation angle is 180°.

上推銷24設置在供給裝置10的片材11的下方。上推銷24是前端尖銳的針狀構件。上推銷24以長度方向平行於Z軸方向的方式設置在支撐體241的內部。The push-up pin 24 is provided below the sheet 11 of the supply device 10 . The push-up pin 24 is a needle-like member with a sharp tip. The push-up pin 24 is disposed inside the support body 241 such that its length direction is parallel to the Z-axis direction.

支撐體241具有使上推銷24從其內部進出或退避至其內部的驅動機構。所述進出或退避在上下方向上進行。所述驅動機構例如包括由上下方向的導軌引導而移動的滑動器、以及驅動滑動器的氣缸或凸輪機構。The support body 241 has a drive mechanism for moving the push-up pin 24 in and out from the inside or withdrawing therein. The entry and exit or retraction is performed in the up and down direction. The drive mechanism includes, for example, a slider that moves while being guided by vertical guide rails, and an air cylinder or a cam mechanism that drives the slider.

[搭載裝置] 搭載裝置30是將從拾取裝置20接收到的電子零件2搬運至安裝位置P3並搭載在基板上的裝置。所謂安裝位置P3,是將電子零件2安裝在基板上的位置。搭載裝置30具有接合頭31、頭移動機構32。 [installation device] The mounting device 30 is a device that conveys the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the board. The mounting position P3 is a position where the electronic component 2 is mounted on the board. The mounting device 30 has a bonding head 31 and a head moving mechanism 32 .

接合頭31是具有作為在交接位置P2從拾取筒夾200接收電子零件2的接收部的功能且將所述電子零件2在安裝位置P3安裝在基板上的裝置。接合頭31保持電子零件2,並且在安裝後解除保持狀態而釋放電子零件2。The bonding head 31 is a device that functions as a receiving unit that receives the electronic component 2 from the pickup collet 200 at the delivery position P2 and mounts the electronic component 2 on the substrate at the mounting position P3. The bonding head 31 holds the electronic component 2 , and releases the holding state to release the electronic component 2 after mounting.

具體而言,接合頭31包括噴嘴31a。噴嘴31a保持電子零件2,並且解除保持狀態而釋放電子零件2。噴嘴31a包括噴嘴孔。噴嘴孔在噴嘴31a的前端的吸附面開口。噴嘴孔與真空泵等負壓產生回路(未圖示)連通,藉由所述回路產生負壓,在噴嘴31a的吸附面吸附保持電子零件2。另外,藉由解除負壓,從吸附面解除電子零件2的保持狀態。Specifically, the bonding head 31 includes a nozzle 31a. The nozzle 31 a holds the electronic component 2 and releases the electronic component 2 from the held state. The nozzle 31a includes a nozzle hole. The nozzle hole opens on the adsorption surface at the tip of the nozzle 31a. The nozzle hole communicates with a negative pressure generating circuit (not shown) such as a vacuum pump, and the negative pressure is generated by the circuit, and the electronic component 2 is adsorbed and held on the adsorption surface of the nozzle 31a. In addition, by releasing the negative pressure, the held state of the electronic component 2 is released from the suction surface.

頭移動機構32是使接合頭31在交接位置P2與安裝位置P3之間往復移動且在交接位置P2及安裝位置P3升降的機構。具體而言,頭移動機構32包括滑動機構321、升降機構322。The head moving mechanism 32 is a mechanism that reciprocates the bonding head 31 between the delivery position P2 and the mounting position P3, and lifts and lowers the bonding head 31 between the delivery position P2 and the mounting position P3. Specifically, the head moving mechanism 32 includes a slide mechanism 321 and a lift mechanism 322 .

滑動機構321使接合頭31在交接位置P2與安裝位置P3之間往復移動。此處,滑動機構321具有:與X軸方向平行地延伸且固定在支援框架321a上的兩根導軌321b、以及在導軌321b上行進的滑動器321c。雖未圖示,但滑動器321c藉由以旋轉電動機驅動的滾珠螺桿、線性電動機等而受到驅動。The slide mechanism 321 reciprocates the bonding head 31 between the delivery position P2 and the installation position P3. Here, the slide mechanism 321 has two guide rails 321b extending parallel to the X-axis direction and fixed to the support frame 321a, and a slider 321c running on the guide rails 321b. Although not shown, the slider 321c is driven by a ball screw driven by a rotary motor, a linear motor, or the like.

再者,雖未圖示,但滑動機構321具有使接合頭31在Y軸方向上滑動移動的滑動機構。所述滑動機構也可包括Y軸方向的導軌與在導軌上行進的滑動器。滑動器藉由以旋轉電動機驅動的滾珠螺桿、線性電動機等而受到驅動。升降機構322使接合頭31在上下方向上移動。具體而言,升降機構322可使用藉由以伺服電動機驅動的滾珠螺桿機構而使滑動器在導軌上移動的線性引導件。即,藉由伺服電動機的驅動,接合頭31沿著Z軸方向升降。In addition, although not shown in figure, the slide mechanism 321 has a slide mechanism which slides and moves the bonding head 31 in the Y-axis direction. The sliding mechanism may also include a guide rail in the Y-axis direction and a slider traveling on the guide rail. The slider is driven by a ball screw driven by a rotary motor, a linear motor, or the like. The elevating mechanism 322 moves the bonding head 31 in the vertical direction. Specifically, the lift mechanism 322 may use a linear guide that moves a slider on a guide rail by a ball screw mechanism driven by a servo motor. That is, the bonding head 31 is raised and lowered in the Z-axis direction by the drive of the servo motor.

基板載台60是支援用於安裝電子零件2的基板的台。基板載台60設置在載台移動機構61。載台移動機構61是使基板載台60在XY平面上滑動移動且將電子零件2在基板上的安裝預定位置定位在安裝位置P3的移動機構。載台移動機構61例如可使用藉由以伺服電動機驅動的滾珠螺桿機構而使滑動器在導軌上移動的線性引導件。The substrate stage 60 is a stage for supporting a substrate on which the electronic component 2 is mounted. The substrate stage 60 is provided on a stage moving mechanism 61 . The stage moving mechanism 61 is a movement mechanism that slides the substrate stage 60 on the XY plane and positions the planned mounting position of the electronic component 2 on the substrate at the mounting position P3. As the stage moving mechanism 61 , for example, a linear guide that moves a slider on a guide rail by a ball screw mechanism driven by a servo motor can be used.

[控制裝置] 控制裝置50控制供給裝置10、拾取裝置20、搭載裝置30、基板載台60的啟動、停止、速度、動作時機等。即,控制裝置50是移送裝置1及安裝裝置100的控制裝置。控制裝置50例如可藉由專用的電子回路或以規定的程式運作的電腦等實現。操作者輸入控制所需的指示或資訊的輸入裝置、用於確認裝置的狀態的輸出裝置與控制裝置50連接。輸入裝置可使用開關、觸控式螢幕、鍵盤、滑鼠等。輸出裝置可使用液晶、有機電致發光(electroluminescence,EL)等的顯示部。 [control device] The control device 50 controls the start, stop, speed, operation timing, etc. of the supply device 10 , the pickup device 20 , the mounting device 30 , and the substrate stage 60 . That is, the control device 50 is a control device of the transfer device 1 and the mounting device 100 . The control device 50 can be realized by, for example, a dedicated electronic circuit or a computer operating with a predetermined program. An input device for an operator to input instructions or information necessary for control, and an output device for checking the state of the device are connected to the control device 50 . The input device may use a switch, a touch screen, a keyboard, a mouse, and the like. As the output device, a display unit such as liquid crystal or organic electroluminescence (EL) can be used.

圖6是控制裝置50的功能框圖。控制裝置50具有:控制供給裝置10的供給裝置控制部51、控制拾取裝置20的上推銷控制部52及拾取控制部53、控制搭載裝置30的接合頭控制部54、控制基板載台60的基板載台控制部56、以及記憶部57。FIG. 6 is a functional block diagram of the control device 50 . The control device 50 has a supply device control unit 51 for controlling the supply device 10 , a push pin control unit 52 and a pick-up control unit 53 for controlling the pickup device 20 , a bonding head control unit 54 for controlling the mounting device 30 , and a substrate control unit for controlling the substrate stage 60 . stage control unit 56 and memory unit 57 .

供給裝置控制部51控制供給載台12的移動。即,控制載置於片材11上的作為拾取物件的電子零件2的移動。上推銷控制部52控制上推銷24的移動、即支撐體241的動作。The supply device control unit 51 controls the movement of the supply stage 12 . That is, the movement of the electronic component 2 as a pick-up object placed on the sheet 11 is controlled. The push-up pin control unit 52 controls the movement of the push-up pin 24 , that is, the movement of the support body 241 .

拾取控制部53控制拾取筒夾200的移動。即,拾取控制部53控制筒夾移動機構22及方向轉換部23的動作。另外,拾取控制部53控制與供氣孔202a連通的供給回路、與排氣孔202b連通的負壓產生回路,控制電子零件2的保持及釋放。The pick-up control unit 53 controls the movement of the pick-up collet 200 . That is, the pickup control unit 53 controls the operations of the collet moving mechanism 22 and the direction changing unit 23 . Moreover, the pick-up control part 53 controls the supply circuit which communicates with the air supply hole 202a, and the negative pressure generation circuit which communicates with the exhaust hole 202b, and controls holding and releasing of the electronic component 2.

接合頭控制部54控制接合頭31的移動、即頭移動機構32的動作。另外,接合頭控制部54控制與接合頭31的噴嘴孔連通的負壓產生回路,控制電子零件2的保持及釋放。基板載台控制部56控制基板載台60的移動、即載台移動機構61的動作。The bonding head control unit 54 controls the movement of the bonding head 31 , that is, the operation of the head moving mechanism 32 . In addition, the bonding head control unit 54 controls a negative pressure generating circuit communicated with the nozzle hole of the bonding head 31 to control holding and releasing of the electronic component 2 . The substrate stage control unit 56 controls the movement of the substrate stage 60 , that is, the operation of the stage moving mechanism 61 .

記憶部57是包括作為記錄媒體的各種記憶體(硬碟驅動器(Hard Disk Drive,HDD)或固態驅動器(Solid State Drive,SSD)等)、記錄媒體與外部的介面的記憶裝置。記憶部57中預先記憶有移送裝置1的動作所需的資料、程式,且記憶移送裝置1的動作所需的資料。所謂所述所需資料,例如是氣體的供給量、排氣壓力、供給位置P1、交接位置P2、安裝位置P3的位置座標、各移動機構的位置座標。所述各移動機構基於這些座標進行各結構的移動控制。The memory unit 57 is a memory device including various memories (hard disk drives (HDD) or solid state drives (SSD)) as recording media, recording media, and external interfaces. The data and programs required for the operation of the transfer device 1 are stored in advance in the storage unit 57 , and the data required for the operation of the transfer device 1 is stored therein. The required data are, for example, the supply amount of gas, exhaust pressure, position coordinates of supply position P1, transfer position P2, installation position P3, and position coordinates of each moving mechanism. Each of the movement mechanisms performs movement control of each structure based on these coordinates.

[利用拾取筒夾進行的抽吸保持的原理] 接著,對利用如所述那樣的拾取筒夾200可抽吸保持電子零件2的原理進行說明。如圖3的(A)所示,從供氣孔202a供給的氣體G從相向面201a的細孔呈面狀地噴出,由此在與電子零件2之間形成氣體的層。所述層例如成為2 μm~10 μm。然後,在藉由負壓產生回路使負壓作用於抽吸孔201c的狀態下,使相向面201a接近電子零件2,由此抽吸保持電子零件2。此時,在相向面201a與電子零件2之間形成有氣體的層,因此相向面201a與電子零件2維持不接觸的狀態。另外,藉由解除由負壓產生回路產生的負壓,負壓不會作用於抽吸孔201c,因此從拾取筒夾200釋放電子零件2。 [Principle of Suction Holding by Pickup Collet] Next, the principle by which the electronic component 2 can be suction-held by the pickup collet 200 as described above will be described. As shown in FIG. 3(A) , the gas G supplied from the gas supply hole 202 a is blown out from the pores of the opposing surface 201 a in a planar manner, thereby forming a layer of gas between the electronic component 2 and the electronic component 2 . The layer is, for example, 2 μm to 10 μm. Then, the electronic component 2 is sucked and held by bringing the opposing surface 201a close to the electronic component 2 in a state where a negative pressure is applied to the suction hole 201c by the negative pressure generating circuit. At this time, since a layer of gas is formed between the facing surface 201a and the electronic component 2, the state where the facing surface 201a and the electronic component 2 are not in contact is maintained. In addition, by releasing the negative pressure generated by the negative pressure generating circuit, the negative pressure does not act on the suction hole 201c, so the electronic component 2 is released from the pickup collet 200 .

[動作] 關於在如以上那樣的移送裝置1中藉由拾取裝置20從供給裝置10拾取電子零件2並將所述電子零件2交接至搭載裝置30的動作,除了參照圖1~圖6以外,還參照圖7的流程圖、圖8的(A)~圖8的(D)的說明圖在下文進行說明。 [action] Regarding the operation of picking up the electronic component 2 from the supply device 10 by the pick-up device 20 in the transfer device 1 as above and delivering the electronic component 2 to the mounting device 30, in addition to referring to FIGS. 1 to 6 , refer to FIG. The flowchart of FIG. 7 and the explanatory diagrams of FIG. 8(A) to FIG. 8(D) will be described below.

首先,藉由拾取裝置20及供給裝置10,使拾取筒夾200移動至上推銷24所在的供給位置P1,使拾取筒夾200的相向面201a與上推銷24相向(步驟S01)。此時,經由供氣孔202a向多孔質構件201供給經加壓的氣體,從相向面201a吹出氣體。另外,此時,不從排氣孔202b排氣,不從開口201d進行抽吸。First, the pick-up collet 200 is moved to the supply position P1 where the push pin 24 is located by the pick-up device 20 and the supply device 10, and the facing surface 201a of the pick-up collet 200 faces the push pin 24 (step S01). At this time, the pressurized gas is supplied to the porous member 201 through the gas supply hole 202a, and the gas is blown out from the opposing surface 201a. In addition, at this time, exhaust is not exhausted from the exhaust hole 202b, and suction is not performed from the opening 201d.

另一方面,供給裝置10使供給載台12移動,如圖8的(A)所示,使作為拾取物件的電子零件2位於供給位置P1(步驟S02)。之後,從相向面201a供給了氣體G的拾取筒夾200與拾取頭21一起下降,而接近電子零件2。當拾取筒夾200接近電子零件2時,相向面201a的氣體G被相向面201a與電子零件2夾持,形成氣體層。認為此時的被夾持的氣體層成為粘性流層。因此,氣體層自身的氣體G的流動性非常差,幾乎不發生由來自後述的排氣孔202b的排氣引起的抽吸、從氣體層外緣部的流出。然後,如圖8的(B)所示,拾取筒夾200藉由不進一步被壓縮的氣體層停止相對於電子零件2的下降(步驟S03)。On the other hand, the supply apparatus 10 moves the supply stage 12, as shown in FIG. 8(A), and locates the electronic component 2 which is a pick-up object at the supply position P1 (step S02). Thereafter, the pickup collet 200 supplied with the gas G from the facing surface 201 a descends together with the pickup head 21 and approaches the electronic component 2 . When the picking collet 200 approaches the electronic component 2 , the gas G on the facing surface 201 a is clamped by the facing surface 201 a and the electronic component 2 to form a gas layer. The trapped gas layer at this time is considered to be a viscous flow layer. Therefore, the fluidity of the gas G in the gas layer itself is very poor, and the suction by the exhaust from the exhaust hole 202b described later or the outflow from the outer edge of the gas layer hardly occurs. Then, as shown in (B) of FIG. 8 , the pickup collet 200 stops falling relative to the electronic component 2 with the gas layer that is not further compressed (step S03 ).

此處,在拾取筒夾200與電子零件2接觸時,拾取筒夾200自身停止。其中,拾取筒夾200由拾取頭21彈性支援,因此即使拾取筒夾200停止,拾取頭21也繼續下降,拾取頭21相對於拾取筒夾200滑動移動。在利用感測器檢測到所述滑動時,拾取控制部53識別出拾取筒夾200與電子零件2接觸,停止拾取頭21的下降。此時,拾取筒夾200不與電子零件2接觸。但是,在相向面201a與電子零件2之間形成氣體層,因此相向面201a不進一步靠近電子零件2而停止。此時的拾取筒夾200的高度位置成為接近位置H1。即,接近位置H1並不預先設定為特定的停止位置。Here, when the pickup collet 200 comes into contact with the electronic component 2, the pickup collet 200 itself stops. Wherein, the pick-up collet 200 is elastically supported by the pick-up head 21 , so even if the pick-up collet 200 stops, the pick-up head 21 continues to descend, and the pick-up head 21 slides relative to the pick-up collet 200 . When the sensor detects the sliding, the pick-up control unit 53 recognizes that the pick-up collet 200 is in contact with the electronic component 2 , and stops the descent of the pick-up head 21 . At this time, the pickup collet 200 is not in contact with the electronic component 2 . However, since the gas layer is formed between the opposing surface 201a and the electronic component 2, the opposing surface 201a stops without approaching the electronic component 2 any further. The height position of the pickup collet 200 at this time is the approach position H1. That is, the approach position H1 is not set in advance as a specific stop position.

如此,在拾取筒夾200經由氣體層停止且進而拾取頭21停止的狀態下,藉由來自排氣孔202b的排氣,開始利用抽吸孔201c進行的抽吸(步驟S04)。即,在拾取筒夾200經由氣體層將電子零件2推壓在由支撐體241支持的片材11上的狀態下,即在與支撐體241之間夾持片材11及電子零件2的狀態下,開始抽吸。In this way, in a state where the pickup collet 200 is stopped through the gas layer and the pickup head 21 is stopped, the suction through the suction hole 201c is started by the exhaust from the exhaust hole 202b (step S04 ). That is, in a state where the pickup collet 200 pushes the electronic component 2 against the sheet 11 supported by the support 241 through the gas layer, that is, the state of holding the sheet 11 and the electronic component 2 between the support 241 Down, start pumping.

在所述狀態下,如圖8的(C)所示,拾取筒夾200上升,並且與此同步地,由上推銷24的上升引起的上推開始(步驟S05)。由此,片材11從電子零件2的背面開始剝離。進而,如圖8的(D)所示,上推銷24當上升預先設定的規定量時停止。然後,藉由進一步上升的拾取筒夾200,在維持由氣體的層產生的間隙的狀態下藉由負壓被抽吸至拾取筒夾200的電子零件2從片材11上被剝落,由此被拾取(步驟S06)。如此,電子零件2被完全剝落的高度位置是剝落位置H2,但並不預先設定為特定的停止位置。In this state, as shown in (C) of FIG. 8 , the pickup collet 200 rises, and in synchronization with this, the push-up caused by the rise of the push-up pin 24 starts (step S05 ). Thereby, the sheet|seat 11 starts peeling from the back surface of the electronic component 2. Furthermore, as shown in (D) of FIG. 8 , the push-up pin 24 stops when raised by a predetermined amount set in advance. Then, by the further rising pickup collet 200, the electronic component 2 sucked to the pickup collet 200 by negative pressure is peeled off from the sheet 11 while maintaining the gap created by the gas layer, thereby is picked up (step S06). In this way, the height position at which the electronic component 2 is completely peeled off is the peeling position H2, but it is not set as a specific stop position in advance.

拾取裝置20利用方向轉換部23使拾取筒夾200反轉(步驟S07)。即,使拾取筒夾200的朝向在上下方向上旋轉180°,使拾取筒夾200的相向面201a朝向上方。再者,此處,步驟S07的反轉動作在拾取電子零件2之後立即進行,但也可在從供給位置P1至交接位置P2之間的任意地點進行。The pick-up device 20 reverses the pick-up collet 200 using the direction changer 23 (step S07 ). That is, the orientation of the pick-up collet 200 is rotated 180° in the vertical direction, and the facing surface 201 a of the pick-up collet 200 is directed upward. In addition, here, the reverse operation of step S07 is performed immediately after the electronic component 2 is picked up, but it may be performed at any point between the supply position P1 and the delivery position P2.

拾取裝置20利用筒夾移動機構22使拾取的電子零件2移動至交接位置P2(步驟S08)。在交接位置P2,搭載裝置30的接合頭31待機,經由電子零件2而與拾取筒夾200的相向面201a相向。The pick-up device 20 moves the picked-up electronic component 2 to the delivery position P2 by using the collet moving mechanism 22 (step S08 ). At the delivery position P2 , the bonding head 31 of the mounting device 30 is on standby, and faces the facing surface 201 a of the pickup collet 200 via the electronic component 2 .

在使接合頭31向位於交接位置P2的拾取筒夾200下降並利用接合頭31保持電子零件2後,拾取筒夾200解除負壓,由此從拾取筒夾200向接合頭31交接電子零件2(步驟S09)。再者,之後,接合頭31以離開拾取筒夾200的方式上升,向安裝位置P3移動,將電子零件2安裝在基板上。After the bonding head 31 is lowered to the pickup collet 200 located at the transfer position P2 and the electronic component 2 is held by the bonding head 31 , the negative pressure is released from the pickup collet 200 , whereby the electronic component 2 is delivered from the pickup collet 200 to the bonding head 31 (step S09). In addition, after that, the bonding head 31 moves up to separate from the pickup collet 200, moves to the mounting position P3, and mounts the electronic component 2 on the board.

[效果] (1)本實施形態的拾取筒夾200是抽吸保持電子零件2並進行拾取的拾取筒夾200,具有多孔質構件201,所述多孔質構件201具有通氣性且經由與電子零件2相向的相向面201a的細孔供給被供給至內部的氣體,在多孔質構件201中設置有在相向面201a具有藉由負壓將電子零件2抽吸至相向面201a的開口201d的抽吸孔201c。 [Effect] (1) The pick-up collet 200 of this embodiment is a pick-up collet 200 for picking up and holding the electronic component 2 by suction, and has a porous member 201 having air permeability through which the electronic component 2 faces. The pores of the facing surface 201a supply the gas supplied to the inside, and the porous member 201 is provided with a suction hole 201c having an opening 201d in the facing surface 201a to suck the electronic component 2 to the facing surface 201a by negative pressure.

另外,本實施形態的拾取裝置20具有筒夾移動機構22,所述筒夾移動機構22使拾取筒夾200接近至片材11上的能夠抽吸保持電子零件2的位置,能夠將抽吸保持的電子零件2從片材11上剝落並移送。In addition, the pick-up device 20 of the present embodiment has a collet moving mechanism 22 that brings the pick-up collet 200 close to a position on the sheet 11 where the electronic component 2 can be sucked and held, and can suction and hold the electronic component 2 . The electronic components 2 are peeled off from the sheet 11 and transferred.

進而,本實施形態的安裝裝置100具有:接合頭31,設置成能夠相對於拾取筒夾200能夠相對移動,從拾取筒夾200的前端接收電子零件2;以及安裝部,將保持在接合頭31的電子零件2移送至基板並進行安裝。Furthermore, the mounting device 100 of the present embodiment has: a bonding head 31 disposed relatively movable with respect to the picking collet 200 and receiving the electronic component 2 from the front end of the picking collet 200; The electronic components 2 are transferred to the substrate and mounted.

因此,在藉由從抽吸孔201c的抽吸拾取電子零件2時,藉由從多孔質構件201的細孔排出的氣體的層,可使電子零件2與相向面201a不接觸,可抑制對電子零件2造成損傷。另外,即使在電子零件2的移送時,也可在減少與相向面201a接觸而對電子零件2造成損傷的可能性的同時,保持電子零件2而防止落下等。Therefore, when the electronic component 2 is picked up by suction from the suction hole 201c, the electronic component 2 and the opposing surface 201a can be prevented from contacting by the layer of gas discharged from the pores of the porous member 201, and the impact on the electronic component 2 can be suppressed. Electronic part 2 is damaged. Moreover, even when the electronic component 2 is being transferred, the electronic component 2 can be held and prevented from falling while reducing the possibility of contacting the facing surface 201 a to damage the electronic component 2 .

此處,考慮到如下情況:使從所述空間排出的氣體在電子零件2和與電子零件2相向的面之間流動,由此藉由利用由大量氣流產生的負壓產生抽吸力的伯努利吸盤來保持電子零件2。在所述情況下,抽吸力非常弱,即使可在與筒夾遠離一定距離的狀態下保持電子零件2,也無法獲得將粘著在片材11上的電子零件2剝落的吸附力。另外,為了獲得伯努利效應,需要使每單位時間的氣體的流量非常多,因此用於在維持不接觸的同時進行保持的抽吸力的調整非常困難。進而,由於大量的氣體向拾取部位的周圍吹出,有產生顆粒的擔心。Here, it is considered that the gas exhausted from the space flows between the electronic component 2 and the surface facing the electronic component 2, thereby generating primary suction force by utilizing negative pressure generated by a large amount of airflow. Use suction cups to hold electronic parts2. In this case, the suction force is very weak, and even if the electronic component 2 can be held at a certain distance from the collet, the suction force for peeling off the electronic component 2 adhering to the sheet 11 cannot be obtained. In addition, in order to obtain the Bernoulli effect, it is necessary to increase the flow rate of the gas per unit time very much, so it is very difficult to adjust the suction force for maintaining non-contact. Furthermore, since a large amount of gas is blown around the pick-up site, there is a possibility that particles may be generated.

另外,在筒夾的與電子零件2相向的面上設置與抽吸孔同等尺寸的氣體的噴出孔而不設置如多孔質構件201那樣的細孔,向電子零件2噴射氣體使電子零件2浮動,在要藉由抽吸孔抽吸電子零件2來對抗由所述噴射引起的電子零件2的浮動力的情況下,也與所述同樣地,用於在維持不接觸(浮動)的同時進行保持的抽吸力的調整非常困難,由於大量的氣體向拾取部位的周圍吹出,有產生顆粒的擔心。In addition, on the surface of the collet facing the electronic component 2, a gas ejection hole of the same size as the suction hole is provided without fine holes like the porous member 201, and the gas is injected to the electronic component 2 to make the electronic component 2 float. , in the case where the electronic component 2 is to be sucked through the suction hole to counteract the floating force of the electronic component 2 caused by the above-mentioned jetting, it is also used to carry out while maintaining non-contact (floating) in the same way as described above. It is very difficult to adjust the holding suction force, and there is a possibility of particle generation because a large amount of air is blown around the pick-up area.

與此相對,本實施形態中,經由相向面201a的微細孔,從相向面201a的整體呈面狀地吹出的氣體的流量極少。因此,無產生顆粒的擔心。從相向面201a的吹出不是積極地使電子零件2浮動,而是在相向面201a與電子零件2接近時形成粘性流的氣體的層。因此,抽吸力越強,越容易將相向面201a與電子零件2保持為不接觸狀態,即使將來自抽吸孔201c的由負壓引起的抽吸力設為用於從片材11上剝落電子零件2的充分的力,也可藉由相向面201a與電子零件2之間的氣體的層來防止接觸,因此不論是獲得強抽吸力、還是抽吸力的調整均變得容易。On the other hand, in the present embodiment, the flow rate of the gas blown out from the whole of the opposing surface 201a in a planar shape through the micropores of the opposing surface 201a is extremely small. Therefore, there is no concern of particle generation. The blowing from the facing surface 201 a does not actively float the electronic component 2 , but forms a layer of gas with a viscous flow when the facing surface 201 a approaches the electronic component 2 . Therefore, the stronger the suction force is, the easier it is to keep the facing surface 201a and the electronic component 2 in a non-contact state, even if the suction force caused by the negative pressure from the suction hole 201c is set for peeling off the sheet 11. Sufficient force of the electronic component 2 can also be prevented from contact by the layer of gas between the opposing surface 201a and the electronic component 2, so whether it is obtaining a strong suction force or adjusting the suction force becomes easy.

基於本申請的發明者進行的研究的結果為,例如若是以下的條件,則可獲得如下結果、即藉由拾取筒夾200,可在維持與電子零件2的不接觸的同時進行抽吸保持的結果。首先,作為多孔質構件201,使用通氣率為例如在供給壓力為0.3 MPa時,從多孔質構件201流出的氣體的流量為0.7 L/min左右的構件。向多孔質構件201供給的氣體(氮氣)的壓力可為0.1 MPa~0.7 MPa左右的範圍內,此時,經由多孔質構件201流動的氣體的流量為0.3 L/min~1.5 L/min左右的範圍內,可確實地維持拾取筒夾200與電子零件2的不接觸。另外,抽吸的壓力為-10 kPa~-90 kPa的範圍內,可確實地從片材11拾取電子零件2。此時,電子零件2與相向面201a之間的氣體層中的壓力可獲得0.1 MPa~0.5 MPa。As a result of studies conducted by the inventors of the present application, for example, under the following conditions, the following result can be obtained, that is, by picking up the collet 200, it is possible to perform suction holding while maintaining non-contact with the electronic component 2 result. First, as the porous member 201 , a member having a gas flow rate of about 0.7 L/min when the supply pressure is 0.3 MPa, for example, is used. The pressure of the gas (nitrogen) supplied to the porous member 201 may be in the range of about 0.1 MPa to 0.7 MPa. At this time, the flow rate of the gas flowing through the porous member 201 is about 0.3 L/min to 1.5 L/min. Within the range, the pickup collet 200 and the electronic component 2 can be reliably kept out of contact. In addition, the suction pressure is in the range of -10 kPa to -90 kPa, and the electronic component 2 can be reliably picked up from the sheet 11 . At this time, the pressure in the gas layer between the electronic component 2 and the facing surface 201a can be 0.1 MPa to 0.5 MPa.

作為比較例,使用與所述拾取筒夾200為相同尺寸且作為原材料不具有細孔的不銹鋼(steel use stainless,SUS)制的筒夾。在所述筒夾中,以矩陣配設有50個直徑0.3 mm的孔,從孔噴出以0.02 MPa的壓力供給的氣體的情況下,抽吸的壓力為-50 kPa,可維持電子零件2與相向面201a不接觸的電子零件2與相向面201a之間的壓力為0.025 MPa~0.035 MPa而極小,其寬度也小。即,判明了:與多孔質構件201的細孔不同,在利用形成在筒夾的多個孔進行的氣體的吹出中,即使是微小的按壓力或抽吸力,另外即使是按壓力或抽吸力發生微小的變化,電子零件2也會容易與相向面接觸。進而,當為了增加電子零件2與相向面201a之間的壓力而增加供給壓力時,電子零件2容易脫落。As a comparative example, a collet made of stainless steel (steel use stainless, SUS) having the same size as the pickup collet 200 and having no pores as a material was used. In the collet, 50 holes with a diameter of 0.3 mm are arranged in a matrix. When the gas supplied at a pressure of 0.02 MPa is ejected from the holes, the suction pressure is -50 kPa, and the electronic parts 2 and the The pressure between the electronic component 2 not in contact with the facing surface 201a and the facing surface 201a is extremely small at 0.025 MPa to 0.035 MPa, and its width is also small. That is, it was found that, unlike the pores of the porous member 201, in blowing out the gas through the plurality of holes formed in the collet, even a slight pressing force or suction force, and even a slight pressing force or suction force When the suction force is slightly changed, the electronic component 2 is likely to come into contact with the facing surface. Furthermore, when the supply pressure is increased in order to increase the pressure between the electronic component 2 and the facing surface 201a, the electronic component 2 is likely to come off.

(2)在相向面201a與電子零件2相向的狀態下,開口201d設置在電子零件2的投影面內、即與電子零件2重疊的位置。本實施形態中,在相向面201a的中央設置有與抽吸孔201c連通的一個開口201d。因此,氣體不從電子零件2的外緣流入,利用大氣壓可確保強的抽吸力。再者,開口201d可為多個,其位置只要是相向面201a與電子零件2重疊的位置,則並不限定於中央。(2) The opening 201 d is provided in a projection plane of the electronic component 2 , that is, at a position overlapping the electronic component 2 in a state where the opposing surface 201 a faces the electronic component 2 . In this embodiment, one opening 201d communicating with the suction hole 201c is provided at the center of the facing surface 201a. Therefore, gas does not flow in from the outer edge of the electronic component 2, and a strong suction force can be secured by utilizing the atmospheric pressure. In addition, the opening 201d may be plural, and its position is not limited to the center as long as it is a position where the facing surface 201a overlaps with the electronic component 2 .

[變形例] 本發明並不限定於所述實施形態。基本結構與所述實施形態相同,如以下那樣的變形例也能夠應用。 (1)在如所述那樣的拾取筒夾200的情況下,被保持的電子零件2容易在水準的相向面201a內移動。尤其是在電子零件2的反轉時、移送時、交接時等,在增大動作的加減速的情況下,有可能產生位置偏移。進而,也有無法維持保持而脫落的擔心。 [modified example] This invention is not limited to the said embodiment. The basic structure is the same as that of the above-mentioned embodiment, and the following modified examples are also applicable. (1) In the case of picking up the collet 200 as described above, the held electronic component 2 easily moves within the horizontal facing surface 201 a. In particular, when the acceleration and deceleration of the operation is increased when the electronic component 2 is reversed, transferred, and handed over, positional displacement may occur. Furthermore, there is also a possibility that the maintenance cannot be maintained and the product may fall off.

為了應對此情況,也可沿著相向面201a的外緣設置限制電子零件2的移動的引導部。例如,如圖9、圖10及圖11所示,將引導部201e設為設置在基座202的四個側面的矩形的板狀體。各引導部201e具有較相向面201a而言突出的突出部分。引導部201e從相向面201a突出的距離(突出量)只要可限制經由氣體層被保持在相向面201a上的電子零件2的移動即可,只要至少為從相向面201a向經由氣體層被保持的電子零件2施加的程度以上即可。其中,在所述引導部201e的突出部分成為超出經由氣體層被保持在相向面201a上的電子零件2而突出的距離的情況下,需要考慮在從晶片拾取時與拾取的電子零件2的周圍的電子零件2不接觸。因此,引導部201e的突出部分從相向面201a突出的距離優選為設為經由氣體層被保持在相向面201a上的電子零件2的側面內。再者,如後所述,藉由在拾取時控制上推銷24,可對應於各種突出量而不與周圍的電子零件2接觸。In order to cope with this, a guide portion that restricts movement of the electronic component 2 may be provided along the outer edge of the facing surface 201a. For example, as shown in FIGS. 9 , 10 , and 11 , the guide portion 201 e is a rectangular plate-shaped body provided on four side surfaces of the base 202 . Each guide portion 201e has a protruding portion protruding from the facing surface 201a. The distance (protrusion amount) of the guide portion 201e protruding from the facing surface 201a is sufficient as long as the movement of the electronic component 2 held on the facing surface 201a through the gas layer can be restricted, and it is at least as long as it is from the facing surface 201a to the distance held through the gas layer. It is sufficient that the electronic component 2 is applied or more. Wherein, when the protruding portion of the guide portion 201e becomes a distance beyond the protruding distance of the electronic component 2 held on the opposing surface 201a via the gas layer, it is necessary to consider the surroundings of the picked-up electronic component 2 when picking up from the wafer. The electronic parts 2 do not touch. Therefore, it is preferable that the distance by which the protruding portion of the guide portion 201e protrudes from the facing surface 201a is within the side surface of the electronic component 2 held on the facing surface 201a via the gas layer. Furthermore, as will be described later, by controlling the push-up pin 24 at the time of picking up, it is possible to correspond to various protrusion amounts without contacting the surrounding electronic components 2 .

在此種變形例中,即使由於反轉時等的電子零件2的移動所伴隨的慣性力而電子零件2在以非接觸的方式被保持的相向面201a上水準移動,也可防止從拾取筒夾200偏離。另外,即使在被引導部201e包圍的區域內電子零件2的位置偏移,若由開口201d產生的抽吸在電子零件2的投影面內,則無論開口201d的位置如何,均能夠進行抽吸保持。In this modified example, even if the electronic component 2 moves horizontally on the opposing surface 201a held in a non-contact manner due to the inertial force accompanying the movement of the electronic component 2 when it is reversed, etc., Clip 200 is off. In addition, even if the position of the electronic component 2 is shifted in the area surrounded by the guide portion 201e, if the suction generated by the opening 201d is within the projection plane of the electronic component 2, the suction can be performed regardless of the position of the opening 201d. Keep.

其中,當電子零件2與引導部201e接觸時,電子零件2有可能受到影響。因此,藉由引導部201e噴出氣體而與電子零件2不接觸,從而可在防止從拾取筒夾200脫離的同時,消除由於與引導部201e接觸而對電子零件2造成的損傷的產生。However, when the electronic component 2 comes into contact with the guide portion 201e, the electronic component 2 may be affected. Therefore, the gas is ejected from the guide part 201e so as not to contact the electronic component 2, thereby avoiding the occurrence of damage to the electronic component 2 due to contact with the guide part 201e while preventing detachment from the pickup collet 200.

例如,如圖12所示,在引導部201e中的突出部分的與電子零件2的側面相向的位置設置引導用多孔質構件201f。在引導部201e的內部設置有連通外部與引導用多孔質構件201f的通氣路徑201g。通氣路徑201g經由未圖示的配管而與氣體的供給回路連接。For example, as shown in FIG. 12 , a guiding porous member 201f is provided at a position facing the side surface of the electronic component 2 in the protruding portion of the guiding portion 201e. Inside the guide portion 201e, an air passage 201g is provided that communicates with the outside and the guiding porous member 201f. The ventilation path 201g is connected to a gas supply circuit through piping not shown.

引導部201e經由引導用多孔質構件201f噴出氣體G。由此,沿著電子零件2的側面形成有氣體G的層,因此可抑制電子零件2的偏移或偏離,並且也可維持電子零件2與引導部201e不接觸。因此,也可減少電子零件2的缺損、破裂,抑制由接觸引起的顆粒的產生。氣體G的噴出量也少,因此也可抑制由氣流引起的顆粒的產生。進而,也可減少移送時的電子零件2的偏移或落下。The guide part 201e ejects the gas G through the guide porous member 201f. As a result, a layer of gas G is formed along the side surface of the electronic component 2, so that the electronic component 2 can be suppressed from shifting or shifting, and the electronic component 2 can also be kept out of contact with the guide portion 201e. Therefore, chipping and cracking of the electronic component 2 can also be reduced, and generation of particles due to contact can be suppressed. Since the ejection amount of the gas G is also small, the generation of particles due to the air flow can also be suppressed. Furthermore, deviation and drop of the electronic component 2 at the time of transfer can also be reduced.

另外,如圖13所示,藉由不設置引導用多孔質構件201f而從與通氣路徑201g連通的噴出口201h向電子零件2的側面噴出氣體G,也能夠抑制電子零件2的偏移或偏離、與電子零件2的接觸。在所述情況下,只要形成有避免與電子零件2接觸的氣體G的層即可,因此噴出量也少。In addition, as shown in FIG. 13 , by ejecting the gas G toward the side surface of the electronic component 2 from the discharge port 201h communicating with the air passage 201g without providing the guiding porous member 201f, it is also possible to suppress the deviation or deviation of the electronic component 2. , Contact with electronic parts 2. In such a case, it is only necessary to form a layer that avoids the gas G coming into contact with the electronic component 2 , so the discharge amount is also small.

再者,如上所述,在有從相向面201a突出的引導部201e的情況下,需要在拾取時使引導部201e與片材11上的拾取物件的周圍的電子零件2不接觸。因此,可在拾取時預先上推電子零件2。即,如圖14所示,根據引導部201e的從相向面201a的突出量,在拾取筒夾200下降開始的同時,上推銷24上升而上推作為拾取物件的電子零件2,由此上升至引導部201e不會碰撞周圍的電子零件2的高度為止,以便引導部201e不碰撞周圍的電子零件2。在所述狀態下拾取筒夾200接近,經由氣體層而停止後開始抽吸,由此可如上所述那樣進行拾取。Furthermore, as described above, when there is guide portion 201e protruding from facing surface 201a, it is necessary to keep guide portion 201e from contacting electronic components 2 around the picked-up object on sheet 11 during pickup. Therefore, the electronic component 2 can be pushed up in advance at the time of picking up. That is, as shown in FIG. 14, according to the protruding amount of the guide portion 201e from the facing surface 201a, at the same time when the pickup collet 200 starts to descend, the push-up pin 24 rises to push up the electronic component 2 as the pick-up object, thereby rising to The guide part 201e does not hit the height of the surrounding electronic components 2 so that the guide part 201e does not collide with the surrounding electronic components 2. In this state, the pickup collet 200 approaches, passes through the gas layer, stops, and then starts suction, whereby pickup can be performed as described above.

進而,引導部201e也可不從相向面201a突出。例如,如圖15所示,將引導部201e的下端設為與基座202、相向面201a共面或更上方,將噴出口201h設置在引導部201e的下表面。然後,從噴出口201h噴出氣體G。如此,引導部201e向沿著電子零件2的側面的上下的方向噴出氣體G,由此由引導部201e的氣體G的噴出方向成為下方的氣體G形成壁,因此可抑制電子零件2的偏移或偏離。另外,在與電子零件2的側面相向的位置沒有突出部分,因此與電子零件2的側面不接觸,在拾取時也與其他的電子零件2不接觸。Furthermore, the guide part 201e does not need to protrude from the facing surface 201a. For example, as shown in FIG. 15 , the lower end of the guide portion 201e is set to be on the same plane as the base 202 and the facing surface 201a or above, and the ejection port 201h is provided on the lower surface of the guide portion 201e. Then, the gas G is ejected from the ejection port 201h. In this way, the guide portion 201e ejects the gas G in the up-and-down direction along the side surface of the electronic component 2, whereby the gas G whose ejection direction of the gas G of the guide portion 201e becomes downward forms a wall, so that the deviation of the electronic component 2 can be suppressed. or deviate. In addition, since there is no protruding portion at the position facing the side surface of the electronic component 2, it does not contact the side surface of the electronic component 2, and does not contact other electronic components 2 at the time of picking up.

再者,如圖16所示,也可以來自噴出口201h的氣體G的噴出方向成為朝向電子零件2的側面的方向的方式使通氣路徑201g傾斜。在所述情況下,可使氣體G更強力地碰撞至電子零件2的側面,因此可抑制氣體G的噴出量。In addition, as shown in FIG. 16, you may incline the ventilation path 201g so that the discharge direction of the gas G from the discharge port 201h may become the direction toward the side surface of the electronic component 2. In this case, the gas G can be made to collide more strongly with the side surface of the electronic component 2 , so that the ejection amount of the gas G can be suppressed.

如所述那樣的引導部201e只要以可限制電子零件2的移動的方式沿著相向面201a的外緣設置即可。因此,可不設置在相向面201a的整周,也可為一部分。例如,藉由如圖17的(A)所示沿著角部或者如圖17的(B)所示夾著角部而配置引導部201e,氣體G從四個方向向夾持的方向噴出,因此可提高定位效果。The guide part 201e as mentioned above should just be provided along the outer edge of the facing surface 201a so that movement of the electronic component 2 can be restricted. Therefore, it may not be provided on the entire circumference of the facing surface 201a, but may be partly provided. For example, by arranging the guide portion 201e along the corners as shown in (A) of FIG. 17 or sandwiching the corners as shown in (B) of FIG. Therefore, the positioning effect can be improved.

(2)抽吸孔201c及開口201d的數量或尺寸並不限定於所述實施方式。在多孔質構件201的相向面201a中,藉由電子零件2被氣體的層支撐的面積與開口201d的總面積的平衡,可實現抽吸保持狀態與不接觸狀態的維持。(2) The number and size of the suction hole 201c and the opening 201d are not limited to the above-mentioned embodiment. On the facing surface 201a of the porous member 201, the maintenance of the suction holding state and the non-contact state can be realized by the balance between the area of the electronic component 2 supported by the gas layer and the total area of the opening 201d.

(3)抽吸孔201c及開口201d的位置或形狀也不限定於所述實施方式。例如,如上所述,開口201d的形狀可為圓形、矩形,也可為其他的橢圓形、多邊形、圓角多邊形、星形等。(3) The positions and shapes of the suction hole 201c and the opening 201d are not limited to the above-described embodiment, either. For example, as mentioned above, the shape of the opening 201d may be circular, rectangular, or other oval, polygonal, polygonal with rounded corners, star, etc.

(4)拾取筒夾200設置成能夠更換,由此可根據電子零件2的形狀、尺寸進行更換。作為所述能夠更換的結構,可由磁鐵抽吸保持的結構簡單,更換作業也容易。其中,只要是能夠更換拾取筒夾200的結構即可。例如,可為使用負壓的吸附保持,也可為機械保持的結構。(4) The pick-up collet 200 is provided interchangeably so that it can be replaced according to the shape and size of the electronic component 2 . As the replaceable structure, the structure that can be sucked and held by the magnet is simple, and the replacement work is also easy. Among them, any configuration is required as long as the pickup collet 200 can be replaced. For example, suction holding using negative pressure or mechanical holding may be possible.

[其他實施形態] 本發明並不限定於所述實施形態,也包含下述所示的其他實施形態。另外,本發明也包含將所述實施形態及下述其他實施形態全部或任意組合後的形態。進而,可在不脫離發明的範圍內對這些實施形態進行各種省略或置換、變更,其變形也包含在本發明中。 [Other Embodiments] The present invention is not limited to the above-described embodiments, and includes other embodiments described below. In addition, the present invention also includes all or arbitrary combinations of the aforementioned embodiments and other embodiments described below. Furthermore, various omissions, substitutions, and changes can be made to these embodiments without departing from the scope of the invention, and the modifications are also included in the present invention.

100:電子裝置 1:移送裝置 2:電子零件 10:供給裝置 11:片材 12:供給載台 13:載台移動機構 20:拾取裝置 21:拾取頭 22:筒夾移動機構 23:方向轉換部 24:上推銷 30:搭載裝置 31:接合頭 31a:噴嘴 32:頭移動機構 50:控制裝置 51:供給裝置控制部 52:上推銷控制部 53:拾取控制部 54:接合頭控制部 56:基板載台控制部 57:記憶部 60:基板載台 61:載台移動機構 100:安裝裝置 200:拾取筒夾 201:多孔質構件 201a:相向面 201b:背面 201c:抽吸孔 201d:開口 201e:引導部 201f:引導用多孔質構件 201g:通氣路徑 201h:噴出口 202:基座 202a:供氣孔 202b:排氣孔 202c:安裝孔 221:滑動機構 221a、321a:支持框架 221b、321b:導軌 221c、321c:滑動器 222、322:升降機構 222a:臂 222b:裝卸部 222c:銷 241:支撐體 321:滑動機構 H1:接近位置 H2:剝落位置 G:氣體 P1:供給位置 P2:交接位置 P3:安裝位置 S01~S09:步驟 100: Electronic device 1: transfer device 2: Electronic parts 10: Supply device 11: sheet 12: Supply carrier 13: Stage moving mechanism 20: Pickup device 21: Pickup head 22: collet moving mechanism 23: Direction conversion department 24: Upsell 30: Mounting device 31:Joint head 31a: Nozzle 32: Head moving mechanism 50: Control device 51: Supply device control department 52: Upsell control department 53: Pick up control unit 54: joint head control unit 56: Substrate carrier control unit 57: memory department 60: Substrate carrier 61: Stage moving mechanism 100: Installation device 200: Pick up Collet 201: Porous components 201a: opposite side 201b: back 201c: suction hole 201d: opening 201e: Guidance Department 201f: Porous member for guidance 201g: ventilation path 201h: Jet outlet 202: base 202a: air supply hole 202b: exhaust hole 202c: Mounting hole 221: sliding mechanism 221a, 321a: Support frame 221b, 321b: guide rail 221c, 321c: slider 222, 322: lifting mechanism 222a: arm 222b: loading and unloading department 222c: pin 241: support body 321: sliding mechanism H1: near position H2: peeling position G: gas P1: supply position P2: handover position P3: Installation position S01~S09: Steps

圖1是表示實施形態的移送裝置及安裝裝置的正視圖。 圖2是表示實施形態的移送裝置及安裝裝置的平面圖。 圖3的(A)是表示利用拾取筒夾進行的電子零件的保持原理的剖面示意圖,圖3的(B)是表示基座的底面側立體圖。 圖4是表示拾取筒夾及裝卸部的底面側立體圖。 圖5是表示拾取筒夾及裝卸部的上表面側立體圖。 圖6是表示移送裝置及安裝裝置的控制裝置的框圖。 圖7是表示基於實施形態的拾取動作的順序的流程圖。 圖8的(A)~圖8的(D)是表示基於實施形態的拾取動作的說明圖。 圖9是表示設置有引導部的變形例的底面側立體圖。 圖10是表示設置有引導部的變形例的上表面側立體圖。 圖11是表示設置有引導部的變形例的剖面示意圖。 圖12是表示設置有具有引導用多孔質構件的引導部的變形例的剖面示意圖。 圖13是表示設置有具有噴出口的引導部的變形例的剖面示意圖。 圖14是表示引導部突出時的拾取動作的說明圖。 圖15是表示將引導部的氣體的噴出方向設為下方的變形例的剖面示意圖。 圖16是表示使引導部的氣體的噴出方向傾斜的變形例的剖面示意圖。 圖17的(A)及圖17的(B)是表示引導部的配置的變形例的底視圖。 Fig. 1 is a front view showing a transfer device and a mounting device according to the embodiment. Fig. 2 is a plan view showing a transfer device and a mounting device according to the embodiment. FIG. 3(A) is a schematic cross-sectional view showing the principle of holding electronic components by a pick-up collet, and FIG. 3(B) is a perspective view showing the base from the bottom side. Fig. 4 is a bottom perspective view showing a pickup collet and a detachable part. Fig. 5 is a perspective view showing the upper surface side of the pickup collet and the detachable part. Fig. 6 is a block diagram showing a control device for the transfer device and the mounting device. Fig. 7 is a flowchart showing the procedure of a pickup operation according to the embodiment. FIG. 8(A) to FIG. 8(D) are explanatory diagrams showing a pickup operation according to the embodiment. Fig. 9 is a perspective view from the bottom side showing a modified example in which a guide portion is provided. Fig. 10 is a perspective view from the upper side showing a modified example in which a guide portion is provided. Fig. 11 is a schematic cross-sectional view showing a modified example in which a guide portion is provided. Fig. 12 is a schematic cross-sectional view showing a modified example in which a guide portion having a guiding porous member is provided. FIG. 13 is a schematic cross-sectional view showing a modified example in which a guide portion having a discharge port is provided. FIG. 14 is an explanatory view showing a pick-up operation when the guide portion protrudes. 15 is a schematic cross-sectional view showing a modified example in which the gas ejection direction of the guide part is set downward. 16 is a schematic cross-sectional view showing a modified example in which the direction in which the gas is ejected from the guide portion is inclined. FIG. 17(A) and FIG. 17(B) are bottom views showing a modified example of the arrangement of the guide portion.

200:拾取筒夾 200: Pick up Collet

201:多孔質構件 201: Porous components

201a:相向面 201a: opposite side

201d:開口 201d: opening

201e:引導部 201e: Guidance Department

202:基座 202: base

222b:裝卸部 222b: loading and unloading department

222c:銷 222c: pin

Claims (8)

一種拾取筒夾,是抽吸保持電子零件並進行拾取的拾取筒夾,其中 具有多孔質構件,所述多孔質構件具有通氣性且將被供給的氣體經由與所述電子零件相向的相向面的細孔呈面狀噴出至內部, 在所述多孔質構件中設置有抽吸孔,所述抽吸孔在所述相向面具有開口且藉由負壓抽吸所述電子零件, 沿著所述相向面的外緣設置有限制所述電子零件的移動的引導部。 A pick-up collet that sucks and holds electronic parts and picks them up, wherein It has a porous member that is air permeable and ejects the supplied gas into the inside in planar form through the pores on the surface facing the electronic component, A suction hole is provided in the porous member, the suction hole has an opening on the facing surface and sucks the electronic component by negative pressure, A guide portion that restricts movement of the electronic component is provided along an outer edge of the facing surface. 如請求項1所述的拾取筒夾,其中 所述引導部設置成能夠噴出氣體。 Pick up collet as described in claim item 1, wherein The guide part is provided so as to be able to eject gas. 如請求項2所述的拾取筒夾,其中 所述引導部朝向所述電子零件的側面噴出氣體。 Pick up collet as described in claim item 2, wherein The guide part ejects gas toward a side surface of the electronic component. 如請求項2或請求項3所述的拾取筒夾,其中 所述引導部向沿著所述電子零件的側面的上下的方向噴出氣體。 The pickup collet as described in claim 2 or claim 3, wherein The guide part ejects gas in a vertical direction along a side surface of the electronic component. 如請求項2或請求項3所述的拾取筒夾,其中 所述引導部經由引導用多孔質構件噴出氣體。 The pickup collet as described in claim 2 or claim 3, wherein The guide part ejects gas through the porous guide member. 如請求項1至請求項3、請求項5中任一項所述的拾取筒夾,其中 所述引導部具有自所述相向面突出的突出部分。 Pick up collet as described in any one of claim item 1 to claim item 3, claim item 5, wherein The guide portion has a protruding portion protruding from the facing surface. 一種拾取裝置,是從貼附有所述電子零件的片材中拾取所述電子零件的拾取裝置,具有: 如請求項1至請求項6中任一項所述的拾取筒夾;以及 筒夾移動機構,使所述拾取筒夾接近至所述片材中的能夠抽吸保持所述電子零件的位置,能夠將抽吸保持的所述電子零件從所述片材上剝落並移送。 A pick-up device that picks up the electronic parts from a sheet on which the electronic parts are attached, comprising: The picking collet as described in any one of claim 1 to claim 6; and The collet moving mechanism brings the pick-up collet close to a position in the sheet where the electronic component can be held by suction, and is capable of peeling and transferring the electronic component held by suction from the sheet. 一種安裝裝置,其特徵在於具有: 如請求項7所述的拾取裝置; 接合頭,設置成能夠相對於所述拾取筒夾相對移動,從所述拾取筒夾接收所述電子零件;以及 安裝部,將保持在所述接合頭的所述電子零件移送至基板並進行安裝。 A mounting device, characterized in that it has: The pickup device as described in claim 7; a bonding head configured to be relatively movable with respect to the pick collet from which the electronic part is received; and The mounting unit transfers and mounts the electronic component held by the bonding head to a substrate.
TW111111328A 2021-03-31 2022-03-25 Pick-up collets, pick-up devices and mounting devices TWI843075B (en)

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JP2021061470A JP2022157324A (en) 2021-03-31 2021-03-31 Pick-up collet, pick-up device, and mounting device
JP2021-061470 2021-03-31

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TW202239691A true TW202239691A (en) 2022-10-16
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Publication number Priority date Publication date Assignee Title
TWI830569B (en) * 2023-01-05 2024-01-21 和碩聯合科技股份有限公司 Clamping and positioning device and method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI830569B (en) * 2023-01-05 2024-01-21 和碩聯合科技股份有限公司 Clamping and positioning device and method thereof

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