CN116387186A - Die ejection device and die ejection method - Google Patents

Die ejection device and die ejection method Download PDF

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Publication number
CN116387186A
CN116387186A CN202211664649.4A CN202211664649A CN116387186A CN 116387186 A CN116387186 A CN 116387186A CN 202211664649 A CN202211664649 A CN 202211664649A CN 116387186 A CN116387186 A CN 116387186A
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CN
China
Prior art keywords
die
adhesive layer
ejector
die ejector
pressure
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Pending
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CN202211664649.4A
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Chinese (zh)
Inventor
田炳浩
朴荣建
韩钟华
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Semes Co Ltd
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Semes Co Ltd
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Publication of CN116387186A publication Critical patent/CN116387186A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Presses And Accessory Devices Thereof (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The die ejection method of the present disclosure includes: a step of providing suction pressure to the adhesive layer by a die ejector; a step of relatively moving the die ejector with respect to the adhesive layer during supply of suction pressure to the adhesive layer so that an edge portion and a center portion of the die overlap the die ejector in sequence; and providing a jetting pressure to the adhesive layer through the die ejector.

Description

Die ejection device and die ejection method
Technical Field
The technical ideas of the present disclosure relate to a die ejecting device and a die ejecting method, and more particularly, to a die ejecting device for separating a die from an adhesive layer and a die ejecting method using the die ejecting device.
Background
To prevent the singulated die from coming apart during the dicing process, an adhesive layer may be adhered to one surface of the wafer. In addition, the plurality of die singulated through the dicing process may be separated from the adhesive layer by die ejector means. Recently, as the thickness of a die attached to an adhesive layer becomes thinner, researches on a die ejecting apparatus and a die ejecting method capable of easily separating the die from the adhesive layer with reduced risk of breakage of the die are actively underway.
Disclosure of Invention
Technical problem to be solved
One of the problems to be solved by the technical idea of the present disclosure is to provide a die ejecting apparatus and a die ejecting method that can easily separate a die from an adhesive layer.
One of the problems to be solved by the technical idea of the present disclosure is to provide a die ejecting apparatus and a die ejecting method capable of rapidly separating a die from an adhesive layer.
Means for solving the problems
To achieve the above object, as an exemplary embodiment of the present disclosure, there is provided a die ejecting method for separating a die from an adhesive layer, including: a step of disposing the adhesive layer on the die ejector so that a central portion of the die is spaced apart from the die ejector in a horizontal direction; a step of providing suction pressure to the adhesive layer through the die ejector; a step of relatively moving the die ejector in a first direction with respect to the adhesive layer, so that a first edge portion, a center portion, and a second edge portion opposite to the first edge portion of the die overlap the die ejector in the vertical direction in order; moving the die ejector relative to the adhesive layer in a second direction opposite to the first direction, and arranging the die and the die ejector; and providing a jetting pressure to the adhesive layer through the die ejector.
In addition, as an exemplary embodiment of the present disclosure, there is provided a die ejecting method for separating a die from an adhesive layer, including: a step of providing suction pressure to the adhesive layer by a die ejector; a step of relatively moving the die ejector with respect to the adhesive layer while providing suction pressure to the adhesive layer so that an edge portion and a center portion of the die overlap the die ejector in sequence; and providing a jetting pressure to the adhesive layer through the die ejector.
In addition, as an exemplary embodiment of the present disclosure, there is provided a die ejecting apparatus separating a die from an adhesive layer, including: a case disposed at a lower portion of the adhesive layer to provide an internal space; a die ejector that is disposed in the inner space of the case and that supplies at least any one of suction pressure and ejection pressure to the adhesive layer; the pressure adjusting device is connected with the bare chip ejector and is used for adjusting at least any one of the pressure type and the strength provided by the bare chip ejector to the bonding layer; the bare chip ejector driving device enables the bare chip ejector to move along the horizontal direction; a lifting member disposed in the inner space of the housing and disposed at a lower portion of the adhesive layer to support a portion of the adhesive layer; a lifting member driving device connected with the lifting member to move the lifting member in a vertical direction; and a controller connected to the pressure adjusting device, the die ejector driving device, and the lifting member driving device, the controller controlling the pressure adjusting device to supply the suction pressure to the adhesive layer, the controller moving the die ejector in a horizontal direction by controlling the die ejector driving device in a state in which the suction pressure is supplied to the adhesive layer so that an edge portion and a center portion of the die sequentially pass through the die ejector, the controller controlling the pressure adjusting device in a state in which the die and the die ejector are aligned to supply the injection pressure to the adhesive layer.
Drawings
Fig. 1 is a cross-sectional view of a die ejector according to an exemplary embodiment of the present disclosure.
Fig. 2 is a signal flow diagram of a die ejector according to an exemplary embodiment of the present disclosure.
Fig. 3 is a flowchart illustrating a flow of steps of a die ejection method according to an exemplary embodiment of the present disclosure.
Fig. 4 to 11 are diagrams illustrating respective steps of a die ejection method according to an exemplary embodiment of the present disclosure.
Fig. 12 is a flowchart illustrating a step flow of a die ejection method according to an exemplary embodiment of the present disclosure.
Fig. 13 to 19 are diagrams illustrating respective steps of a die ejection method according to an exemplary embodiment of the present disclosure.
Detailed Description
Embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
Fig. 1 is a cross-sectional view of a die ejector 10 according to an exemplary embodiment of the present disclosure. In addition, fig. 2 is a signal flow diagram of the die ejector 10 according to an exemplary embodiment of the present disclosure.
Referring to fig. 1 and 2 together, the die ejector 10 of the exemplary embodiment of the present disclosure may include a housing 110, a die ejector 120, a pressure adjusting device 130, a die ejector driving device 140, a lifting member 150, a lifting member driving device 160, a stage 170, a stage driving device 180, an adhesive head 190, a controller 200, and the like.
The die ejector 10 of the exemplary embodiment of the present disclosure is a device that separates a plurality of die D singulated in a dicing (sawing) process from the adhesive layer AL.
Recently, as the thickness of the die D attached to the adhesive layer AL becomes thinner, there is a need for a die ejector device that can easily and rapidly separate the die D from the adhesive layer AL with reduced risk of breakage of the die D.
Hereinafter, the horizontal direction may be defined as a direction parallel to a direction in which the adhesive layer AL extends (e.g., a direction parallel to a direction in which the X-Y plane extends), and the vertical direction may be defined as a direction perpendicular to a direction in which the adhesive layer AL extends (e.g., a direction parallel to the Z direction).
The case 110 is disposed below the adhesive layer AL, and may provide an internal space for disposing the die ejector 120 and the lifting member 150, which will be described later.
In an exemplary embodiment, the area of the upper surface of the case 110 may be set to be larger than the area of the die D. Thus, the die D may be disposed on the upper surface of the case 110.
The die ejector 120 is disposed in the inner space of the case 110, and may provide at least any one of suction pressure and ejection pressure to a portion of the adhesive layer AL exposed to the die ejector 120 to separate the die D from the adhesive layer AL.
The suction pressure may be a pressure for moving the adhesive layer AL exposed to the die ejector 120 downward, and the spray pressure may be a pressure for moving the adhesive layer AL exposed to the die ejector 120 upward.
In an exemplary embodiment, the die ejector 120 may include a duct (conduit) that provides a moving path of air ejected or inhaled from the pressure regulating device 130.
In addition, the die ejector 120 may be in a ring shape having a hole when the die ejector 120 is viewed from a plane angle. The shape of the hole of the die ejector 120 may be set to correspond to the shape of the die D. For example, when the die D is square in shape, the hole of the die ejector 120 may be provided in a square shape. However, the shape of the hole of the die ejector 120 is not limited to the foregoing.
That is, the die ejector 120 may provide at least any one of suction pressure and ejection pressure to a portion of the adhesive layer AL exposed by the hole of the die ejector 120.
The pressure adjusting device 130 is connected to the die ejector 120, and adjusts at least any one of the type of pressure and the strength of pressure provided to the adhesive layer AL by the die ejector 120.
In an exemplary embodiment, the pressure adjustment device 130 may include at least any one of a pressurizing pump, a depressurizing pump, a pressurizing line, a depressurizing line, a pressurizing valve, and a depressurizing valve to control the pressure type and the pressure intensity provided by the die ejector 120 to the adhesive layer AL.
In an exemplary embodiment, the pressure regulating device 130 may control the air flow inside the die ejector 120 such that the die ejector 120 provides any one of suction pressure and ejection pressure to the adhesive layer AL.
For example, the pressure adjusting device 130 may operate a pressure reducing pump and a pressure reducing valve so that air remaining in the pressure reducing line may be discharged to the outside, thereby causing the die ejector 120 to provide suction pressure to the adhesive layer AL. In addition, the pressure regulating device 130 may operate a pressurizing pump and a pressurizing valve so that air may flow into the pressurizing line, thereby causing the die ejector 120 to provide the spray pressure to the adhesive layer AL.
The die ejector driving device 140 is connected to at least any one of the die ejector 120 and the housing 110, and moves the die ejector 120 in a horizontal direction (e.g., a direction in which an X-Y plane extends).
In an exemplary embodiment, the die ejector driving device 140 may include a motor and a conversion device. For example, the die ejector driving device 140 may include a linear Actuator (linear Actuator) that converts a rotational force of a motor into a linear motion in a horizontal direction of the die ejector 120. For example, the conversion means may comprise a rack and pinion (rack and pinion).
Since the die ejector 120 can be moved in the horizontal direction by the die ejector driving device 140, alignment can be performed between the die D and the die ejector 120. In addition, the die ejector 120 may provide suction pressure and ejection pressure to the adhesive layer AL disposed at the lower portions of the plurality of dies D while moving in the horizontal direction. Thus, the plurality of die D may be sequentially separated from the adhesive layer AL.
The elevating member 150 is disposed in the inner space of the case 110, and supports a part of the adhesive layer AL disposed at the lower portion of the die D based on the movement in the vertical direction. In an exemplary embodiment, the elevation member 150 may be an elevation pin (pin) that moves in a vertical direction to support a portion of the adhesive layer AL.
The elevation member driving device 160 is connected to the elevation member 150 to move the elevation member 150 in a vertical direction (e.g., a direction in which the Z-axis extends).
In an exemplary embodiment, the lifting member driving device 160 may include a motor and a conversion device. For example, the elevation member driving means 160 may include a linear actuator that converts a rotational force of a motor into a linear motion in a vertical direction of the elevation member 150. For example, the conversion means may comprise a rack and pinion.
The stage 170 is disposed outside the case 110, and can support the adhesive layer AL to which the die D is adhered. The stage 170 may be moved in the horizontal direction by the stage driving device 180 in a state where the adhesive layer AL to which the die D is attached is supported.
The stage driving device 180 is connected to the stage 170, and moves the stage 170 in a horizontal direction (for example, a direction in which an X-Y plane extends).
In an exemplary embodiment, the stage driving device 180 may include a motor and a switching device. For example, the stage driving device 180 may include a linear actuator that converts a rotational force of a motor into a linear motion in a horizontal direction of the stage 170.
The bonding head 190 is disposed on the upper portion of the die ejector 120, and picks up the die D from the bonding layer AL.
In an exemplary embodiment, the bonding head 190 may adhere the die D to a substrate disposed on the stage after picking up the die D separated from the bonding layer AL. The substrate may be a wafer or a Printed Circuit Board (PCB). However, the kind of the substrate is not limited to the foregoing.
In an exemplary embodiment, the bonding head 190 may pick up the die D from the bonding layer AL by providing vacuum pressure to the upper surface of the die D, and may adhere the picked-up die D to the substrate.
The controller 200 comprehensively controls the operation of the die ejector 10. The controller 200 is connected to the pressure adjusting device 130, the die ejector driving device 140, the elevation member driving device 160, and the stage driving device 180, and may control at least any one of the pressure adjusting device 130, the die ejector driving device 140, the elevation member driving device 160, and the stage driving device 180.
In an exemplary embodiment, the controller 200 may be implemented by hardware, firmware, software, or any combination thereof. For example, the controller 200 may be a computing device such as a workstation computer, a desktop computer, a notebook computer, a tablet computer, or the like. The controller 200 may be a processor, dedicated hardware, or firmware composed of a simple controller, a microprocessor, a CPU, a GPU, or other complex processor or software. The controller 200 may be implemented by application specific hardware such as a general purpose computer or digital signal processor (Digital Signal Process, DSP), field programmable gate array (Field Programmable Gate Array, FPGA), and application specific integrated circuit (Application Specific Integrated Circuit, ASIC), for example.
In an exemplary embodiment, the operations of the controller 200 may be implemented by instructions stored on a machine-readable medium, which may be read and executed by one or more processors. Here, a machine-readable medium may include any mechanism for storing and/or transmitting information in a form readable by a machine (e.g., a computing device). For example, a machine-readable medium may include Read Only Memory (ROM), random access Memory (Random Access Memory, RAM), magnetic disk storage media, optical storage media, flash Memory devices, electrical, optical, acoustical or other form of propagated signals (e.g., carrier waves, infrared signals, digital signals, etc.), and any other signals.
The controller 200 may be implemented by firmware, software, routines and instructions for operating the die ejector 10. For example, the controller 200 may be implemented by software that receives data for feedback, generates signals for operating the die ejector 10, and performs predetermined operations.
In an exemplary embodiment, the controller 200 may control the pressure adjusting device 130 to adjust the type of pressure and the pressure intensity provided to the adhesive layer AL by the die ejector 120.
In an exemplary embodiment, the controller 200 may control the pressure adjustment device 130 such that the die ejector 120 provides suction pressure to the adhesive layer AL. In addition, the controller 200 may control the pressure adjusting device 130 to adjust the intensity of the suction pressure provided to the adhesive layer AL by the die ejector 120.
In addition, the controller 200 may control the pressure adjustment device 130 such that the die ejector 120 provides the spray pressure to the adhesive layer AL. In addition, the controller 200 may control the pressure adjusting device 130 to adjust the intensity of the spray pressure provided to the adhesive layer AL by the die ejector 120.
In an exemplary embodiment, the controller 200 may control the die ejector driving device 140 to move the die ejector 120 in a horizontal direction. For example, the controller 200 may move the die ejector 120 in the horizontal direction by controlling the die ejector driving device 140 such that the center portion of the die D and the center of the die ejector 120 overlap in the horizontal direction.
In an exemplary embodiment, the controller 200 may control the elevation member driving device 160 to move the elevation member 150 in the vertical direction.
In addition, in an exemplary embodiment, the controller 200 may control the stage driving device 180 to move the stage 170 in the horizontal direction. For example, the controller 200 may move the stage 170 by controlling the stage driving device 180 such that the center portion of the die D and the center of the die ejector 120 overlap in the horizontal direction.
In an exemplary embodiment, the controller 200 may control at least any one of the die ejector driving device 140 and the stage driving device 180. For example, the controller 200 may control the die ejector drive 140 without controlling the stage drive 180. In addition, the controller 200 may not control the die ejector driving device 140 but control the stage driving device 180. However, without being limited thereto, the controller 200 may control the die ejector driving device 140 and the stage driving device 180.
In an exemplary embodiment, the controller 200 may control the pressure adjustment device 130 to provide suction pressure to the adhesive layer AL. Before the controller 200 controls the pressure adjusting device 130 to supply the suction pressure to the adhesive layer AL, the controller 200 controls at least one of the die ejector driving device 140 and the stage driving device 180 so that the center portion of the die D is spaced apart from the center of the die ejector 120 in the horizontal direction.
In addition, in a state where the suction pressure is supplied to the adhesive layer AL, the controller 200 may move the die ejector 120 in the horizontal direction by controlling the die ejector driving device 140 such that the edge portion and the center portion of the die D sequentially pass through the center of the die ejector 120.
However, without being limited thereto, in a state where the suction pressure is supplied to the adhesive layer AL, the controller 200 controls the stage driving device 180 to move the stage 170 in the horizontal direction so that the edge portion and the center portion of the die D sequentially pass through the center of the die ejector 120. Thereby, the adhesion between the die D and the adhesive layer AL can be weakened for the first time.
In an exemplary embodiment, after the edge portion and the center portion of the die D sequentially pass through the center of the die ejector 120, the controller 200 may control at least any one of the die ejector driving device 140 and the stage driving device 180 such that the center portion of the die D and the center of the die ejector 120 overlap in the vertical direction. That is, the controller 200 may align the die D and the die ejector 120 by controlling at least any one of the die ejector driving device 140 and the stage driving device 180.
In an exemplary embodiment, in a state where the die D and the die ejector 120 are aligned, the controller 200 may control the elevation member driving device 160 to move the adhesive layer AL disposed at the lower portion of the edge portion of the die D upward by the elevation member 150. In addition, when the elevation member 150 moves upward such that the elevation member 150 supports a portion of the adhesive layer AL, the controller 200 may control the pressure adjustment means 130 so as to continue to supply the suction pressure to the adhesive layer AL.
In addition, in an exemplary embodiment, the controller 200 may control the pressure adjustment device 130 to provide the spray pressure to the adhesive layer AL in a state where the die D and the die ejector 120 are aligned.
The die ejector 10 of the exemplary embodiment of the present disclosure relatively moves the die ejector 120 in a horizontal direction with respect to the adhesive layer AL during the period in which the die ejector 120 provides suction pressure to the lower portion of the adhesive layer AL, so that the edge portion and the center portion of the die D sequentially pass through the center of the die ejector 120. Thus, the die ejector 10 can separate the die D from the adhesive layer AL for the first time.
In addition, the die ejector 10 provides a jet pressure to the lower portion of the adhesive layer AL after separating the die D from the adhesive layer AL for the first time, so that the die D is separated from the adhesive layer AL for the second time.
Thus, the die ejector 10 of the present disclosure can easily separate the die D from the adhesive layer AL.
Fig. 3 is a flowchart illustrating a flow of steps of a die ejection method S100 according to an exemplary embodiment of the present disclosure. In addition, fig. 4 to 11 are diagrams showing respective steps of the die ejection method S100 according to the exemplary embodiment of the present disclosure.
The die ejection method S100 according to the exemplary embodiment of the present disclosure is described below with reference to fig. 3 to 11. Referring to fig. 3, a die ejection method S100 of an exemplary embodiment of the present disclosure may include: step S1100, disposing an adhesive layer AL on the die ejector 120 so that a central portion D_c of the die D is spaced apart from the die ejector 120 in a horizontal direction; step S1200, providing suction pressure to the adhesive layer AL through the die ejector 120; step S1300, the die ejector 120 is relatively moved in a first direction with respect to the adhesive layer AL, such that the first edge portion d_e1, the center portion d_c, and the second edge portion d_e2 of the die D sequentially overlap the die ejector 120 in a vertical direction; step S1400, the bare chip ejector 120 moves relatively to the bonding layer AL towards the second direction, so that the bare chip D and the bare chip ejector 120 are aligned; step S1500 of moving a portion of the adhesive layer AL upward by moving the elevation member 150 in the vertical direction; step S1600, providing a jet pressure to the adhesive layer AL by the die ejector 120; and step S1700, picking up the die D from the adhesive layer AL by the adhesive head 190 disposed on the die ejector 120.
Referring to fig. 3 and 4 together, the die ejection method S100 of the exemplary embodiment of the present disclosure may include: in step S1100, an adhesive layer AL is disposed on the die ejector 120 such that the central portion d_c of the die D is spaced apart from the die ejector 120 in the horizontal direction.
Hereinafter, the first edge portion d_e1 of the die D may be a portion of an edge of the die D adjacent to the center of the die ejector 120, and the second edge portion d_e2 may be a portion of an edge of the die D opposite to the first edge portion d_e1. In addition, the central portion d_c of the die D may be a portion of the die D disposed between the first and second edge portions d_e1 and d_e2.
Referring to fig. 3 and 5 together, a die ejection method S100 of an exemplary embodiment of the present disclosure may include: in step S1200, suction pressure is supplied to the adhesive layer AL through the die ejector 120.
In step S1200, the controller 190 (fig. 2) may control the pressure adjustment device 130 such that the die ejector 120 provides suction pressure to the adhesive layer AL. In addition, in step S1200, the controller 200 may control the pressure adjusting device 130 to adjust the intensity of the suction pressure. For example, in step S1200, the controller 200 receives a signal related to the intensity of the suction pressure from a sensor (not shown) and controls the pressure adjusting device 130 based on the signal, so that the intensity of the suction pressure can be adjusted in real time.
Referring to fig. 3 and 6a to 6c together, a die ejection method S100 of an exemplary embodiment of the present disclosure may include: in step S1300, the die ejector 120 is relatively moved in the first direction with respect to the adhesive layer AL, such that the first edge portion d_e1, the center portion d_c, and the second edge portion d_e2 of the die D sequentially overlap the die ejector 120 in the vertical direction.
That is, the step S1300 may be a step of relatively moving the die ejector 120 in the first direction with respect to the adhesive layer AL such that the first edge portion d_e1, the center portion d_c, and the second edge portion d_e2 of the die D sequentially pass through the center of the die ejector 120.
The step S1300 may include: a step s1300a_i of moving the die ejector 120 in the horizontal direction by the die ejector driving device 140 so that the first edge portion d_e1 of the die D overlaps the die ejector 120 in the vertical direction; step s1300b_i, moving the die ejector 120 in the horizontal direction by the die ejector driving device 140, so that the central portion d_c of the die D overlaps the die ejector 120 in the vertical direction; and step s1300c_i, moving the die ejector 120 in the horizontal direction by the die ejector driving device 140 so that the second edge portion d_e2 of the die D overlaps the die ejector 120 in the vertical direction. In the steps of s1300a_i to s1300c_i, the stage 170 supporting the adhesive layer AL may be fixed.
That is, in step S1300, the die ejector 120 is moved in the horizontal direction in a state where suction pressure is supplied to the lower portion of the adhesive layer AL, so that the die D can be separated from the adhesive layer AL for the first time. As the die ejector 120 moves in the horizontal direction, the first edge portion d_e1, the center portion d_c, and the second edge portion d_e2 of the die D may be separated from the adhesive layer AL for the first time in sequence.
Referring to fig. 3 and 7a to 7c simultaneously, the step s1300 may include: step s1300a_ii, moving the stage 170 in the horizontal direction by the stage driving device 180, so that the first edge portion d_e1 of the die D overlaps the die ejector 120 in the vertical direction; step s1300b_ii, the stage 170 is moved in the horizontal direction by the stage driving device 180, so that the center portion d_c of the die D overlaps the die ejector 120 in the vertical direction; and step s1300c_ii, the stage 170 is moved in the horizontal direction by the stage driving device 180 so that the second edge portion d_e2 of the die D overlaps the die ejector 120 in the vertical direction. In the steps of s1300a_ii to s1300c_ii, the die ejector 120 may be fixed.
That is, in step S1300, the stage 170 is moved in the horizontal direction in a state where the suction pressure is supplied to the lower portion of the adhesive layer AL, so that the die D can be separated from the adhesive layer AL for the first time. As the stage 170 moves in the horizontal direction, the first edge portion d_e1, the center portion d_c, and the second edge portion d_e2 of the die D may be separated from the adhesive layer AL for the first time in sequence.
Referring to fig. 3 and 8a together, a die ejection method S100 of an exemplary embodiment of the present disclosure may include: in step S1400, the die ejector 120 is moved relative to the adhesive layer AL in a second direction opposite to the first direction, so that the die D and the die ejector 120 are aligned.
In an exemplary embodiment, the S1400 step may include: in step s1400_i, the die ejector 120 is moved in the horizontal direction by the die ejector driving device 140 such that the center portion d_c of the die D overlaps the die ejector 120 in the vertical direction. The second direction, which is the moving direction of the die ejector 120 in the step S1400_i, may be a direction opposite to the first direction, which is the moving direction of the die ejector 120 in the steps S1300a_i to S1300 c_i.
In an exemplary embodiment, during the execution of step S1400, the die ejector 120 may continue to provide suction pressure to the center portion d_c of the die D through the pressure regulating device 130. Thus, the central portion d_c of the die D may be separated from the adhesive layer AL.
However, without being limited thereto, during the execution of step S1400, since the operation of the pressure adjusting device 130 is interrupted, the die ejector 120 may not supply the suction pressure to the center portion d_c of the die D.
Referring to both fig. 3 and 8b, the step s1400 may include: in step s1400_ii, the stage 170 is moved in the horizontal direction by the stage driving device 180, so that the center portion d_c of the die D overlaps the die ejector 120 in the vertical direction. The second direction, which is the moving direction of the stage 170 in step S1400_ii, may be a direction opposite to the first direction, which is the moving direction of the stage 170 in steps S1300a_ii to S1300 c_ii.
Referring to fig. 3 and 9 together, a die ejection method S100 of an exemplary embodiment of the present disclosure may include: in step S1500, a part of the adhesive layer AL is moved upward by the vertical movement of the elevation member 150.
In an exemplary embodiment, the S1500 step may include: in step S1500, a part of the adhesive layer AL is moved upward by the vertical movement of the elevation member 150.
In an exemplary embodiment, in S1500, the elevation member 150 may be moved upward by the elevation member driving device 160, so that the adhesive layer AL disposed at the lower portions of the first and second edge portions d_e1 and d_e2 of the die D is moved upward.
In an exemplary embodiment, during the execution of step S1500, the die ejector 120 may continue to provide suction pressure to the center portion d_c of the die D through the pressure regulating device 130.
However, the die ejection method S100 of the exemplary embodiment of the present disclosure may omit the S1500 step.
Referring to fig. 3 and 10 together, a die ejection method S100 of an exemplary embodiment of the present disclosure may include: in step S1600, a jetting pressure is provided to the adhesive layer AL by the die ejector 120.
In step S1600, the controller 190 (fig. 2) may control the pressure regulating device 130 to cause the die ejector 120 to provide the jetting pressure to the adhesive layer AL. In addition, in step S1600, the controller 200 may control the pressure adjustment device 130 to adjust the intensity of the injection pressure. For example, in step S1600, the controller 200 receives a signal related to the intensity of the injection pressure from a sensor (not shown) and controls the pressure adjusting device 130 based on the signal, so that the intensity of the injection pressure can be adjusted in real time.
By performing step S1600, the first edge portion d_e1 and the second edge portion d_e2 of the die D may be separated from the adhesive layer AL.
Referring to fig. 3 and 11 together, a die ejection method S100 of an exemplary embodiment of the present disclosure may include: in step S1700, the die D is picked up from the adhesive layer AL by the adhesive head 190 disposed on the die ejector 120.
In step S1700, the bonding head 190 provides vacuum pressure to the upper surface of the die D so that the die D can be picked up from the bonding layer AL. In addition, the bonding head 190 may adhere the picked die D to a substrate on a stage. For example, the substrate may include a wafer or a Printed Circuit Board (PCB).
The die ejecting method S100 of the exemplary embodiment of the present disclosure may relatively move the die ejector 120 in a horizontal direction with respect to the adhesive layer AL during the period in which the die ejector 120 provides suction pressure to the lower portion of the adhesive layer AL, so that the edge portion and the center portion of the die D sequentially pass through the center of the die ejector 120. Thus, the die ejection method S100 of the present disclosure may separate the die D from the adhesive layer AL for the first time.
In addition, the die ejection method S100 of the present disclosure may provide a spray pressure to a lower portion of the adhesive layer AL after the first separation of the die D from the adhesive layer AL to separate the die D from the adhesive layer AL for the second time.
Thus, the die ejection method S100 of the present disclosure can easily separate the die D from the adhesive layer AL.
Fig. 12 is a flowchart showing a flow of steps of a die ejection method S200 according to an exemplary embodiment of the present disclosure. In addition, fig. 13 to 19 are diagrams showing respective steps of a die ejection method S200 according to an exemplary embodiment of the present disclosure.
The die ejection method S200 according to the exemplary embodiment of the present disclosure is explained below with reference to fig. 12 to 19.
Referring to fig. 12, a die ejection method S200 of an exemplary embodiment of the present disclosure may include: step S2100, disposing an adhesive layer AL on the die ejector 120 such that a central portion d_c of the die D is spaced apart from the die ejector 120 in a horizontal direction; step S2200 of providing suction pressure to the adhesive layer AL by the die ejector 120; step S2300, the die ejector 120 moves relatively to the adhesive layer AL, so that the first edge portion d_e1 and the central portion d_c of the die D sequentially overlap the die ejector 120; step S2400, interrupting the movement of the die ejector 120 to align the die D with the die ejector 120; step S2500 of moving a part of the adhesive layer AL upward by the vertical movement of the elevation member 150; step S2600, providing a jet pressure to the adhesive layer AL by the die ejector 120; and step S2700, pick up the die D from the adhesive layer AL by the adhesive head 190 disposed on the die ejector 120.
Referring to fig. 12 and 13 simultaneously, a die ejection method S200 of an exemplary embodiment of the present disclosure may include: in step S2100, an adhesive layer AL is disposed on the die ejector 120 such that the center portion d_c of the die D is spaced apart from the die ejector 120 in the horizontal direction.
As described above, the first edge portion d_e1 of the die D may be a portion of an edge of the die D adjacent to the center of the die ejector 120, and the second edge portion d_e2 may be a portion of an edge of the die D opposite to the first edge portion d_e1. In addition, the central portion d_c of the die D may be a portion of the die D disposed between the first and second edge portions d_e1 and d_e2.
Referring to fig. 12 and 14 simultaneously, a die ejection method S200 of an exemplary embodiment of the present disclosure may include: in step S2200, suction pressure is supplied to the adhesive layer AL through the die ejector 120.
In step S2200, the controller 190 (fig. 2) may control the pressure adjustment device 130 such that the die ejector 120 provides suction pressure to the adhesive layer AL. In addition, in step S2200, the controller 200 may control the pressure adjusting means 130 to adjust the intensity of the suction pressure. For example, in step S2200, the controller 200 receives a signal related to the intensity of the suction pressure from a sensor (not shown) and controls the pressure adjusting means 130 based on the signal, so that the intensity of the suction pressure can be adjusted in real time.
Referring to fig. 12 and 15 simultaneously, a die ejection method S200 of an exemplary embodiment of the present disclosure may include: in step S2300, the die ejector 120 is relatively moved with respect to the adhesive layer AL such that the first edge portion d_e1 and the center portion d_c of the die D sequentially overlap the die ejector 120 in the vertical direction.
That is, the step S2300 may be a step of moving the die ejector 120 relative to the adhesive layer AL so that the first edge portion d_e1 and the center portion d_c of the die D sequentially pass through the center of the die ejector 120.
In S2300, the die ejector 120 may be moved in the horizontal direction by the die ejector driving device 140 in a state where the stage 170 is fixed. However, not limited thereto, in step S1300, the stage 170 may be moved in the horizontal direction by the stage driving device 180 in a state where the die ejector 120 is fixed. In step S1300, the die ejector 120 and the stage 170 may be moved simultaneously.
In S2300, the die D may be separated from the adhesive layer AL for the first time since the die ejector 120 may be relatively moved with respect to the adhesive layer AL in a state where suction pressure is provided to the lower portion of the adhesive layer AL. That is, as the die ejector 120 relatively moves in the horizontal direction, the first edge portion d_e1 and the center portion d_c of the die D may be sequentially separated from the adhesive layer AL for the first time.
Referring to fig. 12 and 16 simultaneously, a die ejection method S200 of an exemplary embodiment of the present disclosure may include: in step S2400, the relative movement of the die ejector 120 with respect to the adhesive layer AL is interrupted, and the die D and the die ejector 120 are aligned.
In an exemplary embodiment, the S2400 step may include a step of interrupting a relative movement of the die ejector 120 in a horizontal direction when the central portion d_c of the die D overlaps the die ejector 120 in a vertical direction. In other words, when the die ejector 120 moves in the first direction in step S2300, the die ejector 120 may interrupt the movement in the first direction to align the die D with the die ejector 120 in step S2400.
Referring to fig. 12 and 17 simultaneously, a die ejection method S200 of an exemplary embodiment of the present disclosure may include: in step S2500, a part of the adhesive layer AL is moved upward by the vertical movement of the elevation member 150.
In an exemplary embodiment, the S2500 step may include: in step S2500, a part of the adhesive layer AL is moved upward by the vertical movement of the elevation member 150.
In an exemplary embodiment, in step S2500, the elevation member 150 may be moved upward by the elevation member driving device 160, so that the adhesive layer AL disposed at the lower portions of the first and second edge portions d_e1 and d_e2 of the die D is moved upward.
In an exemplary embodiment, during the execution of step S2500, the die ejector 120 may continue to provide suction pressure to the center portion d_c of the die D through the pressure regulating device 130.
However, the die ejection method S200 of the exemplary embodiment of the present disclosure may omit the S2500 step.
Referring to fig. 12 and 18 simultaneously, a die ejection method S200 of an exemplary embodiment of the present disclosure may include: in step S2600, a spray pressure is provided to the adhesive layer AL by the die ejector 120.
In step S2600, the controller 190 (fig. 2) may control the pressure adjustment device 130 to cause the die ejector 120 to provide the spray pressure to the adhesive layer AL. In addition, in step S2600, the controller 200 may control the pressure adjusting device 130 to adjust the intensity of the injection pressure. For example, in step S2600, the controller 200 receives a signal related to the intensity of the injection pressure from a sensor (not shown) and controls the pressure adjusting device 130 based on the signal, so that the intensity of the injection pressure can be adjusted in real time.
By performing step S2600, the first edge portion d_e1 and the second edge portion d_e2 of the die D may be separated from the adhesive layer AL.
Referring to fig. 12 and 19 simultaneously, a die ejection method S200 of an exemplary embodiment of the present disclosure may include: in step S2600, the die D is picked up from the adhesive layer AL by the adhesive head 190 disposed on the die ejector 120.
In step S2600, the bonding head 190 provides vacuum pressure to the upper surface of the die D so that the die D can be picked up from the adhesive layer AL. In addition, the bonding head 190 may adhere the picked die D to a substrate on a stage. For example, the substrate may include a wafer or a Printed Circuit Board (PCB).
The die ejecting method S200 of the exemplary embodiment of the present disclosure may relatively move the die ejector 120 in a horizontal direction with respect to the adhesive layer AL during the period in which the die ejector 120 provides suction pressure to the lower portion of the adhesive layer AL, so that the edge portion and the center portion of the die D sequentially pass through the center of the die ejector 120. Thus, the die ejection method S200 of the present disclosure may separate the die D from the adhesive layer AL for the first time.
In addition, the die ejection method S200 of the present disclosure may provide a spray pressure to a lower portion of the adhesive layer AL after the first separation of the die D from the adhesive layer AL to separate the die D from the adhesive layer AL for the second time.
Thus, the die ejection method S200 of the present disclosure can easily separate the die D from the adhesive layer AL.
In addition, the die ejecting method S200 of the exemplary embodiment of the present disclosure may provide suction pressure and ejection pressure to the adhesive layer AL while moving the die ejector 120 only in a specific direction (e.g., the +x direction), thereby separating the die D from the adhesive layer AL. Thus, the die ejection method S200 of the present disclosure can quickly separate the die D from the adhesive layer AL.

Claims (20)

1. A die ejection method for separating a die from an adhesive layer, comprising:
a step of disposing the adhesive layer on the die ejector so that a central portion of the die is spaced apart from the die ejector in a horizontal direction;
a step of providing suction pressure to the adhesive layer through the die ejector;
a step of relatively moving the die ejector in a first direction with respect to the adhesive layer, so that a first edge portion, a center portion, and a second edge portion opposite to the first edge portion of the die overlap the die ejector in the vertical direction in order;
moving the die ejector relative to the adhesive layer in a second direction opposite to the first direction, and arranging the die and the die ejector; the method comprises the steps of,
and providing jet pressure to the adhesive layer through the die ejector.
2. The die ejection method of claim 1, wherein,
the step of relatively moving the die ejector relative to the adhesive layer in a first direction includes:
and moving the die ejector in the horizontal direction in a state that the adhesive layer is fixed on the carrier.
3. The die ejection method of claim 1, wherein,
the step of relatively moving the die ejector relative to the adhesive layer in a first direction includes:
and moving a carrier for supporting the adhesive layer in a horizontal direction in a state where the die ejector is fixed.
4. The die ejection method of claim 1, wherein,
before performing the step of providing a jetting pressure to the adhesive layer by the die ejector, further comprising:
and a step of moving up a part of the adhesive layer disposed under the first and second edge portions of the die by moving a lifting member disposed under the adhesive layer in a vertical direction.
5. The die ejection method of claim 4, wherein,
during the step of moving a portion of the adhesive layer upward by the elevation member, the die ejector provides suction pressure to the adhesive layer disposed at a lower portion of the center portion of the die.
6. The die ejection method of claim 1, further comprising:
picking up the die from the adhesive layer by an adhesive head disposed on the die ejector.
7. The die ejection method of claim 1, wherein,
during the step of performing the entire array of die and the die ejector, the die ejector provides suction pressure to the adhesive layer.
8. The die ejection method of claim 1, wherein,
during the step of performing the entire array of die and the die ejector, the die ejector interrupts the supply of suction pressure to the adhesive layer.
9. A die ejection method for separating a die from an adhesive layer, comprising:
a step of providing suction pressure to the adhesive layer by a die ejector;
a step of relatively moving the die ejector with respect to the adhesive layer during the supply of the suction pressure to the adhesive layer so that an edge portion and a center portion of the die overlap the die ejector in sequence; the method comprises the steps of,
and providing jet pressure to the adhesive layer through the die ejector.
10. The die ejection method of claim 9, further comprising:
interrupting the relative movement of the die ejector when the central portion of the die overlaps the die ejector in the vertical direction, causing the die and the die ejector to be aligned,
The step of providing the injection pressure to the adhesive layer by the die ejector is performed after the step of arranging the die and the die ejector.
11. The die ejection method of claim 10, wherein,
during the step of performing the die and die ejector alignment, the die ejector provides suction pressure to the adhesive layer.
12. The die ejection method of claim 9, wherein,
the step of relatively moving the die ejector relative to the adhesive layer includes:
and moving the die ejector in the horizontal direction in a state that the adhesive layer is fixed on the carrier.
13. The die ejection method of claim 9, wherein,
a step of relatively moving the die ejector with respect to the adhesive layer, including;
and a step of moving a stage supporting the adhesive layer in a horizontal direction in a state where the die ejector is fixed.
14. The die ejection method of claim 9, wherein,
before performing the step of providing a jetting pressure to the adhesive layer by the die ejector, further comprising:
and a step of moving up a part of the adhesive layer disposed under the edge portion of the die by moving a lifting member disposed under the adhesive layer in a vertical direction.
15. The die ejection method of claim 9, further comprising:
picking up the die from the adhesive layer by an adhesive head disposed on the die ejector.
16. A die ejector separating a die from an adhesive layer, comprising:
a case disposed at a lower portion of the adhesive layer to provide an internal space;
a die ejector that is disposed in the inner space of the case and that supplies at least any one of suction pressure and ejection pressure to the adhesive layer;
the pressure adjusting device is connected with the bare chip ejector and is used for adjusting at least any one of the pressure type and the strength provided by the bare chip ejector to the bonding layer;
the bare chip ejector driving device enables the bare chip ejector to move along the horizontal direction;
a lifting member disposed in the inner space of the housing and disposed at a lower portion of the adhesive layer to support a portion of the adhesive layer;
a lifting member driving device connected with the lifting member to move the lifting member in a vertical direction; and
a controller connected with the pressure adjusting device, the bare chip ejector driving device and the lifting member driving device,
The controller controls the pressure adjusting means for supplying the suction pressure to the adhesive layer,
the controller moves the die ejector in a horizontal direction by controlling the die ejector driving means in a state where the suction pressure is supplied to the adhesive layer, so that an edge portion and a center portion of the die sequentially pass through the die ejector,
the controller controls the pressure adjusting device to supply the spray pressure to the adhesive layer in a state where the die and the die ejector are aligned.
17. The die ejector of claim 16, further comprising:
a stage supporting the adhesive layer; and
and the carrier driving device is connected with the controller and enables the carrier to move along the horizontal direction.
18. The die ejector of claim 16, wherein,
the controller controls the pressure adjusting device to supply the suction pressure to a portion of the adhesive layer disposed under the center portion of the die when the elevation member moves in a vertical direction and supports the portion of the adhesive layer disposed under the edge portion of the die.
19. The die ejector of claim 16, wherein,
the controller controls the die ejector driving device such that the central portion of the die is arranged to be spaced apart from the die ejector in a horizontal direction before the suction pressure is supplied to the adhesive layer by the pressure adjusting device.
20. The die ejector of claim 16, further comprising:
and an adhesive head disposed on the die ejector, the adhesive head picking up the die from the adhesive layer.
CN202211664649.4A 2021-12-31 2022-12-23 Die ejection device and die ejection method Pending CN116387186A (en)

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KR1020210194112A KR20230103311A (en) 2021-12-31 2021-12-31 Die ejecting apparatus and die ejecting method

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JP2004231250A (en) 2003-01-31 2004-08-19 Matsushita Electric Ind Co Ltd Sheet peeler and sheet peeling method using the same
JP5669137B2 (en) 2011-03-01 2015-02-12 富士機械製造株式会社 Die pickup device
KR20140107982A (en) 2013-02-28 2014-09-05 삼성전자주식회사 Die ejector and Die separation method
TWI628709B (en) * 2017-09-29 2018-07-01 克雷爾科技股份有限公司 Device and method for peeling workpiece
US10573543B2 (en) * 2018-04-30 2020-02-25 Cree, Inc. Apparatus and methods for mass transfer of electronic die
KR102700207B1 (en) * 2019-03-12 2024-08-28 삼성전자주식회사 Chip ejecting apparatus
TWI691013B (en) * 2019-08-21 2020-04-11 力成科技股份有限公司 Chip picking and placing method and equipment
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TWI818842B (en) 2023-10-11

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