TW202234157A - 感光性樹脂組成物、硬化物、層間絕緣膜、覆蓋塗層、表面保護膜及電子零件 - Google Patents

感光性樹脂組成物、硬化物、層間絕緣膜、覆蓋塗層、表面保護膜及電子零件 Download PDF

Info

Publication number
TW202234157A
TW202234157A TW110147963A TW110147963A TW202234157A TW 202234157 A TW202234157 A TW 202234157A TW 110147963 A TW110147963 A TW 110147963A TW 110147963 A TW110147963 A TW 110147963A TW 202234157 A TW202234157 A TW 202234157A
Authority
TW
Taiwan
Prior art keywords
group
general formula
photosensitive resin
resin composition
solvent
Prior art date
Application number
TW110147963A
Other languages
English (en)
Chinese (zh)
Inventor
吉澤篤太郎
斉藤伸行
水野康平
松川大作
板橋俊明
Original Assignee
日商艾曲迪微系統股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商艾曲迪微系統股份有限公司 filed Critical 日商艾曲迪微系統股份有限公司
Publication of TW202234157A publication Critical patent/TW202234157A/zh

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
TW110147963A 2020-12-21 2021-12-21 感光性樹脂組成物、硬化物、層間絕緣膜、覆蓋塗層、表面保護膜及電子零件 TW202234157A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2020/047736 WO2022137294A1 (ja) 2020-12-21 2020-12-21 感光性樹脂組成物、硬化物及び電子部品
WOPCT/JP2020/047736 2020-12-21

Publications (1)

Publication Number Publication Date
TW202234157A true TW202234157A (zh) 2022-09-01

Family

ID=82159091

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110147963A TW202234157A (zh) 2020-12-21 2021-12-21 感光性樹脂組成物、硬化物、層間絕緣膜、覆蓋塗層、表面保護膜及電子零件

Country Status (3)

Country Link
JP (2) JPWO2022138674A1 (https=)
TW (1) TW202234157A (https=)
WO (2) WO2022137294A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118605083A (zh) * 2024-06-07 2024-09-06 上海镭利电子材料有限公司 一种干膜型感光性树脂组合物及其制备方法和应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4761989B2 (ja) * 2006-02-02 2011-08-31 旭化成イーマテリアルズ株式会社 ポリアミド酸エステル組成物
JP6168884B2 (ja) * 2013-07-05 2017-07-26 東京応化工業株式会社 ネガ型感光性樹脂組成物
JP6368066B2 (ja) * 2016-08-22 2018-08-01 旭化成株式会社 感光性樹脂組成物及び硬化レリーフパターンの製造方法
WO2020031240A1 (ja) * 2018-08-06 2020-02-13 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118605083A (zh) * 2024-06-07 2024-09-06 上海镭利电子材料有限公司 一种干膜型感光性树脂组合物及其制备方法和应用
CN118605083B (zh) * 2024-06-07 2025-03-07 上海镭利电子材料有限公司 一种干膜型感光性树脂组合物及其制备方法和应用

Also Published As

Publication number Publication date
JP2025109967A (ja) 2025-07-25
WO2022138674A1 (ja) 2022-06-30
WO2022137294A1 (ja) 2022-06-30
JPWO2022138674A1 (https=) 2022-06-30

Similar Documents

Publication Publication Date Title
JP6935982B2 (ja) 樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
JP7521299B2 (ja) 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品
JP7491116B2 (ja) 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品
JP7443970B2 (ja) 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品
JPWO2005101125A1 (ja) 耐熱感光性樹脂組成物、該組成物を用いたパターン製造方法、及び電子部品
JP2025109967A (ja) 感光性樹脂組成物、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
TW202424056A (zh) 聚醯亞胺前驅物的製造方法、聚醯亞胺前驅物、感光性樹脂組成物、硬化物、圖案硬化物的製造方法及電子零件
JP2021148891A (ja) 感光性樹脂組成物、硬化膜、表示装置及び硬化膜の製造方法
JP5111234B2 (ja) アルカリ現像可能なネガ型感光性樹脂組成物
JP4899695B2 (ja) 感光性樹脂組成物、硬化膜、パターン硬化膜の製造方法および電子部品
JP7484527B2 (ja) 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品
JP2006083307A (ja) 感光性ポリイミドシロキサンおよびその組成物
JP2004264537A (ja) 耐熱感光性樹脂組成物、該組成物を用いたパターン製造方法、及び電子部品
TW202239819A (zh) 聚醯亞胺前驅體的選擇方法、樹脂組成物的製造方法、聚醯亞胺前驅體、樹脂組成物及硬化物
JP2880523B2 (ja) 感光性樹脂組成物及びこれを用いた感光性エレメント
JP2003121997A (ja) ネガ型感光性樹脂組成物
JP4396143B2 (ja) 耐熱性樹脂前駆体組成物
JP7852394B2 (ja) 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品
WO2024084636A1 (ja) 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品
WO2025095080A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法及び硬化物
WO2024095573A1 (ja) ポリイミド前駆体及び樹脂組成物
WO2025182048A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品
WO2025069157A1 (ja) ポリイミド前駆体の製造方法、感光性樹脂組成物の製造方法、硬化物の製造方法、ポリイミド前駆体、ポリイミド前駆体組成物、感光性樹脂組成物及び半導体装置
JP4123588B2 (ja) 感光性樹脂組成物及びレリーフパターンの製造法
WO2025182050A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品