JPWO2022138674A1 - - Google Patents

Info

Publication number
JPWO2022138674A1
JPWO2022138674A1 JP2022571523A JP2022571523A JPWO2022138674A1 JP WO2022138674 A1 JPWO2022138674 A1 JP WO2022138674A1 JP 2022571523 A JP2022571523 A JP 2022571523A JP 2022571523 A JP2022571523 A JP 2022571523A JP WO2022138674 A1 JPWO2022138674 A1 JP WO2022138674A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022571523A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022138674A1 publication Critical patent/JPWO2022138674A1/ja
Priority to JP2025085803A priority Critical patent/JP2025109967A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
JP2022571523A 2020-12-21 2021-12-21 Pending JPWO2022138674A1 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025085803A JP2025109967A (ja) 2020-12-21 2025-05-22 感光性樹脂組成物、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2020/047736 WO2022137294A1 (ja) 2020-12-21 2020-12-21 感光性樹脂組成物、硬化物及び電子部品
PCT/JP2021/047425 WO2022138674A1 (ja) 2020-12-21 2021-12-21 感光性樹脂組成物、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025085803A Division JP2025109967A (ja) 2020-12-21 2025-05-22 感光性樹脂組成物、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品

Publications (1)

Publication Number Publication Date
JPWO2022138674A1 true JPWO2022138674A1 (https=) 2022-06-30

Family

ID=82159091

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022571523A Pending JPWO2022138674A1 (https=) 2020-12-21 2021-12-21
JP2025085803A Pending JP2025109967A (ja) 2020-12-21 2025-05-22 感光性樹脂組成物、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025085803A Pending JP2025109967A (ja) 2020-12-21 2025-05-22 感光性樹脂組成物、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品

Country Status (3)

Country Link
JP (2) JPWO2022138674A1 (https=)
TW (1) TW202234157A (https=)
WO (2) WO2022137294A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118605083B (zh) * 2024-06-07 2025-03-07 上海镭利电子材料有限公司 一种干膜型感光性树脂组合物及其制备方法和应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007206423A (ja) * 2006-02-02 2007-08-16 Asahi Kasei Electronics Co Ltd ポリアミド酸エステル組成物
JP2015014705A (ja) * 2013-07-05 2015-01-22 東京応化工業株式会社 ネガ型感光性樹脂組成物
WO2018037997A1 (ja) * 2016-08-22 2018-03-01 旭化成株式会社 感光性樹脂組成物及び硬化レリーフパターンの製造方法
WO2020031240A1 (ja) * 2018-08-06 2020-02-13 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007206423A (ja) * 2006-02-02 2007-08-16 Asahi Kasei Electronics Co Ltd ポリアミド酸エステル組成物
JP2015014705A (ja) * 2013-07-05 2015-01-22 東京応化工業株式会社 ネガ型感光性樹脂組成物
WO2018037997A1 (ja) * 2016-08-22 2018-03-01 旭化成株式会社 感光性樹脂組成物及び硬化レリーフパターンの製造方法
WO2020031240A1 (ja) * 2018-08-06 2020-02-13 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品

Also Published As

Publication number Publication date
JP2025109967A (ja) 2025-07-25
WO2022138674A1 (ja) 2022-06-30
WO2022137294A1 (ja) 2022-06-30
TW202234157A (zh) 2022-09-01

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