TW202233890A - 金屬皮膜形成方法 - Google Patents

金屬皮膜形成方法 Download PDF

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Publication number
TW202233890A
TW202233890A TW110140958A TW110140958A TW202233890A TW 202233890 A TW202233890 A TW 202233890A TW 110140958 A TW110140958 A TW 110140958A TW 110140958 A TW110140958 A TW 110140958A TW 202233890 A TW202233890 A TW 202233890A
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TW
Taiwan
Prior art keywords
metal film
group
metal
forming
layer
Prior art date
Application number
TW110140958A
Other languages
English (en)
Chinese (zh)
Inventor
深澤憲正
白髪潤
Original Assignee
日商Dic股份有限公司
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Filing date
Publication date
Application filed by 日商Dic股份有限公司 filed Critical 日商Dic股份有限公司
Publication of TW202233890A publication Critical patent/TW202233890A/zh

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
TW110140958A 2020-11-05 2021-11-03 金屬皮膜形成方法 TW202233890A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020184980 2020-11-05
JPJP2020-184980 2020-11-05

Publications (1)

Publication Number Publication Date
TW202233890A true TW202233890A (zh) 2022-09-01

Family

ID=81457865

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110140958A TW202233890A (zh) 2020-11-05 2021-11-03 金屬皮膜形成方法

Country Status (3)

Country Link
JP (1) JPWO2022097487A1 (enrdf_load_stackoverflow)
TW (1) TW202233890A (enrdf_load_stackoverflow)
WO (1) WO2022097487A1 (enrdf_load_stackoverflow)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001107257A (ja) * 1999-10-07 2001-04-17 Inoac Corp 電気的不導体への金属メッキ方法
JP4897165B2 (ja) * 2000-09-27 2012-03-14 名古屋メッキ工業株式会社 金属めっきされた有機高分子繊維の製造方法
JP2016160480A (ja) * 2015-02-28 2016-09-05 住江織物株式会社 めっき繊維及びその製造方法
WO2017154879A1 (ja) * 2016-03-11 2017-09-14 Dic株式会社 積層体の製造方法
JP2019123909A (ja) * 2018-01-17 2019-07-25 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解メッキ用被メッキ構造体および電気回路の構造体、並びに、無電解メッキの前処理方法および無電解メッキ方法
JP6960359B2 (ja) * 2018-03-08 2021-11-05 三菱重工業株式会社 めっき層を有する成形品の製造方法

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Publication number Publication date
JPWO2022097487A1 (enrdf_load_stackoverflow) 2022-05-12
WO2022097487A1 (ja) 2022-05-12

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