TW202224820A - 加熱嘴單元 - Google Patents

加熱嘴單元 Download PDF

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Publication number
TW202224820A
TW202224820A TW110133048A TW110133048A TW202224820A TW 202224820 A TW202224820 A TW 202224820A TW 110133048 A TW110133048 A TW 110133048A TW 110133048 A TW110133048 A TW 110133048A TW 202224820 A TW202224820 A TW 202224820A
Authority
TW
Taiwan
Prior art keywords
soldering iron
lead wire
wire
temperature
heater
Prior art date
Application number
TW110133048A
Other languages
English (en)
Chinese (zh)
Inventor
須賀伸一郎
Original Assignee
日商阿波羅技研股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商阿波羅技研股份有限公司 filed Critical 日商阿波羅技研股份有限公司
Publication of TW202224820A publication Critical patent/TW202224820A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Resistance Heating (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
TW110133048A 2020-09-09 2021-09-06 加熱嘴單元 TW202224820A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020151044A JP7137236B2 (ja) 2020-09-09 2020-09-09 ヒーターチップユニット
JP2020-151044 2020-09-09

Publications (1)

Publication Number Publication Date
TW202224820A true TW202224820A (zh) 2022-07-01

Family

ID=80632530

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110133048A TW202224820A (zh) 2020-09-09 2021-09-06 加熱嘴單元

Country Status (6)

Country Link
JP (1) JP7137236B2 (ja)
KR (1) KR20220126796A (ja)
CN (1) CN115379917B (ja)
MY (1) MY196754A (ja)
TW (1) TW202224820A (ja)
WO (1) WO2022054420A1 (ja)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661639A (ja) * 1992-08-04 1994-03-04 Fujitsu Ltd ワイヤボンディングチップ構造
US5864118A (en) * 1997-04-30 1999-01-26 Seagate Technology, Inc. Soldering instrument with heated tip and protective heat shield associated therewith
JP2005319468A (ja) * 2002-05-15 2005-11-17 Kobo Pda Co Ltd 熱圧着用ヒーターチップ
JP4081396B2 (ja) 2003-03-27 2008-04-23 京セラ株式会社 セラミックヒータの熱電対取り付け構造
JP3917964B2 (ja) 2003-08-22 2007-05-23 株式会社 工房Ｐｄａ 熱圧着用のヒーターチップ
US8274011B2 (en) * 2009-01-24 2012-09-25 Hakko Corporation Soldering device and method of making same
JP2010253503A (ja) * 2009-04-23 2010-11-11 Miyachi Technos Corp ヒータチップ及び接合装置
JP5457107B2 (ja) 2009-05-19 2014-04-02 ミヤチテクノス株式会社 ヒータチップ及び接合装置
JP2012183552A (ja) * 2011-03-04 2012-09-27 Miyachi Technos Corp ヒータチップ及び接合装置及び接合方法
JP5794577B2 (ja) * 2011-10-21 2015-10-14 株式会社アマダミヤチ ヒータチップ及び接合装置及び接合方法並びに導体細線と端子の接続構造
US10799977B2 (en) 2015-08-28 2020-10-13 Kobo Pda Co., Ltd. Heater chip, joining apparatus and joining method
JP6677406B2 (ja) * 2015-09-25 2020-04-08 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法
JP6851610B2 (ja) * 2016-07-19 2021-03-31 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法
US20190299311A1 (en) * 2018-03-28 2019-10-03 Hakko Corporation High Power Dual Sensor Cartridge

Also Published As

Publication number Publication date
CN115379917A (zh) 2022-11-22
KR20220126796A (ko) 2022-09-16
MY196754A (en) 2023-05-03
WO2022054420A1 (ja) 2022-03-17
JP2022045443A (ja) 2022-03-22
JP7137236B2 (ja) 2022-09-14
CN115379917B (zh) 2023-09-01

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