CN115379917B - 加热嘴单元 - Google Patents

加热嘴单元 Download PDF

Info

Publication number
CN115379917B
CN115379917B CN202180027326.1A CN202180027326A CN115379917B CN 115379917 B CN115379917 B CN 115379917B CN 202180027326 A CN202180027326 A CN 202180027326A CN 115379917 B CN115379917 B CN 115379917B
Authority
CN
China
Prior art keywords
wire
soldering iron
heating tip
heating
tip unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180027326.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN115379917A (zh
Inventor
须贺伸一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apolo Technology Research Co ltd
Original Assignee
Apolo Technology Research Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apolo Technology Research Co ltd filed Critical Apolo Technology Research Co ltd
Publication of CN115379917A publication Critical patent/CN115379917A/zh
Application granted granted Critical
Publication of CN115379917B publication Critical patent/CN115379917B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Resistance Heating (AREA)
CN202180027326.1A 2020-09-09 2021-07-20 加热嘴单元 Active CN115379917B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-151044 2020-09-09
JP2020151044A JP7137236B2 (ja) 2020-09-09 2020-09-09 ヒーターチップユニット
PCT/JP2021/027195 WO2022054420A1 (ja) 2020-09-09 2021-07-20 ヒーターチップユニット

Publications (2)

Publication Number Publication Date
CN115379917A CN115379917A (zh) 2022-11-22
CN115379917B true CN115379917B (zh) 2023-09-01

Family

ID=80632530

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180027326.1A Active CN115379917B (zh) 2020-09-09 2021-07-20 加热嘴单元

Country Status (6)

Country Link
JP (1) JP7137236B2 (ja)
KR (1) KR20220126796A (ja)
CN (1) CN115379917B (ja)
MY (1) MY196754A (ja)
TW (1) TW202224820A (ja)
WO (1) WO2022054420A1 (ja)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661639A (ja) * 1992-08-04 1994-03-04 Fujitsu Ltd ワイヤボンディングチップ構造
US5864118A (en) * 1997-04-30 1999-01-26 Seagate Technology, Inc. Soldering instrument with heated tip and protective heat shield associated therewith
JP2004296358A (ja) * 2003-03-27 2004-10-21 Kyocera Corp セラミックヒータの熱電対取り付け構造
JP2005066636A (ja) * 2003-08-22 2005-03-17 Kobo Pda Co Ltd 熱圧着用のヒーターチップ
JP2005319468A (ja) * 2002-05-15 2005-11-17 Kobo Pda Co Ltd 熱圧着用ヒーターチップ
JP2010253503A (ja) * 2009-04-23 2010-11-11 Miyachi Technos Corp ヒータチップ及び接合装置
JP2011000639A (ja) * 2009-05-19 2011-01-06 Miyachi Technos Corp ヒータチップ及び接合装置
CN102281981A (zh) * 2009-01-24 2011-12-14 白光株式会社 焊接装置及其制造方法
JP2012183552A (ja) * 2011-03-04 2012-09-27 Miyachi Technos Corp ヒータチップ及び接合装置及び接合方法
JP2013099779A (ja) * 2011-10-21 2013-05-23 Miyachi Technos Corp ヒータチップ及び接合装置及び接合方法並びに細線と端子の接続構造
JP2017062945A (ja) * 2015-09-25 2017-03-30 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法
JP2018012200A (ja) * 2016-07-19 2018-01-25 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法
CN107848063A (zh) * 2015-08-28 2018-03-27 株式会社工房Pda 加热芯片、结合装置和结合方法
CN110315162A (zh) * 2018-03-28 2019-10-11 白光株式会社 焊烙铁用的烙铁芯、焊接系统及焊烙铁的温度控制方法

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661639A (ja) * 1992-08-04 1994-03-04 Fujitsu Ltd ワイヤボンディングチップ構造
US5864118A (en) * 1997-04-30 1999-01-26 Seagate Technology, Inc. Soldering instrument with heated tip and protective heat shield associated therewith
JP2005319468A (ja) * 2002-05-15 2005-11-17 Kobo Pda Co Ltd 熱圧着用ヒーターチップ
JP2004296358A (ja) * 2003-03-27 2004-10-21 Kyocera Corp セラミックヒータの熱電対取り付け構造
JP2005066636A (ja) * 2003-08-22 2005-03-17 Kobo Pda Co Ltd 熱圧着用のヒーターチップ
CN102281981A (zh) * 2009-01-24 2011-12-14 白光株式会社 焊接装置及其制造方法
JP2010253503A (ja) * 2009-04-23 2010-11-11 Miyachi Technos Corp ヒータチップ及び接合装置
JP2011000639A (ja) * 2009-05-19 2011-01-06 Miyachi Technos Corp ヒータチップ及び接合装置
JP2012183552A (ja) * 2011-03-04 2012-09-27 Miyachi Technos Corp ヒータチップ及び接合装置及び接合方法
JP2013099779A (ja) * 2011-10-21 2013-05-23 Miyachi Technos Corp ヒータチップ及び接合装置及び接合方法並びに細線と端子の接続構造
CN107848063A (zh) * 2015-08-28 2018-03-27 株式会社工房Pda 加热芯片、结合装置和结合方法
JP2017062945A (ja) * 2015-09-25 2017-03-30 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法
JP2018012200A (ja) * 2016-07-19 2018-01-25 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法
CN110315162A (zh) * 2018-03-28 2019-10-11 白光株式会社 焊烙铁用的烙铁芯、焊接系统及焊烙铁的温度控制方法

Also Published As

Publication number Publication date
JP7137236B2 (ja) 2022-09-14
MY196754A (en) 2023-05-03
CN115379917A (zh) 2022-11-22
WO2022054420A1 (ja) 2022-03-17
TW202224820A (zh) 2022-07-01
JP2022045443A (ja) 2022-03-22
KR20220126796A (ko) 2022-09-16

Similar Documents

Publication Publication Date Title
KR100890715B1 (ko) 전지, 전지의 제조 방법, 용접물의 제조 방법 및 페데스탈
US9093238B2 (en) Fuse for interrupting a voltage and/or current-carrying conductor in case of a thermal fault and method for producing the fuse
US10799977B2 (en) Heater chip, joining apparatus and joining method
CN115379917B (zh) 加热嘴单元
CN115461180A (zh) 加热嘴单元
JP7137235B2 (ja) ヒーターチップ、および、ヒーターチップユニット
JP2019133965A (ja) 半導体装置及びその製造方法
JP4224050B2 (ja) ヒーターチップの熱電対取付構造および熱電対取付方法
JP2012521886A (ja) 熱極、そのための締め付け構造および製造方法
US8282432B2 (en) Weld terminal, switch assembly and methods of attachment
CN109789515A (zh) 用于接合实心与多孔金属部件的激光焊接方法
KR20170005421A (ko) 프레스 콘택에 용접된 전기 부품을 구비한 특히 기어 메커니즘 제어용 전자 제어 모듈
JP7370075B2 (ja) ヒーターチップユニット
EP1721369B1 (en) Soldering nest for a bus bar
JP2008182078A (ja) チップ型金属板抵抗器
JP2004209506A (ja) ろう材供給ノズル
JP2006105682A (ja) プローブカード、その製造方法およびコンタクトプローブ
JP2023008226A (ja) 半導体装置および半導体装置の製造方法
JP2005268410A (ja) リードフレーム及びそれを用いた電子部品

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant