TW202214066A - 脫模膜、脫模膜之製造方法、及電路基板之製造方法 - Google Patents

脫模膜、脫模膜之製造方法、及電路基板之製造方法 Download PDF

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Publication number
TW202214066A
TW202214066A TW110130835A TW110130835A TW202214066A TW 202214066 A TW202214066 A TW 202214066A TW 110130835 A TW110130835 A TW 110130835A TW 110130835 A TW110130835 A TW 110130835A TW 202214066 A TW202214066 A TW 202214066A
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TW
Taiwan
Prior art keywords
resin layer
release film
resin
film according
covering
Prior art date
Application number
TW110130835A
Other languages
English (en)
Chinese (zh)
Inventor
小屋原宏明
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202214066A publication Critical patent/TW202214066A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW110130835A 2020-09-03 2021-08-20 脫模膜、脫模膜之製造方法、及電路基板之製造方法 TW202214066A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2020-148457 2020-09-03
JP2020148457 2020-09-03

Publications (1)

Publication Number Publication Date
TW202214066A true TW202214066A (zh) 2022-04-01

Family

ID=80394484

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110130835A TW202214066A (zh) 2020-09-03 2021-08-20 脫模膜、脫模膜之製造方法、及電路基板之製造方法

Country Status (3)

Country Link
JP (2) JP2022042971A (https=)
CN (2) CN114132027A (https=)
TW (1) TW202214066A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022042971A (ja) * 2020-09-03 2022-03-15 積水化学工業株式会社 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07214716A (ja) * 1994-01-31 1995-08-15 Nagaoka Sangyo Kk 複合成形体およびその製造方法
JP3710316B2 (ja) * 1999-03-19 2005-10-26 三井化学株式会社 プリント基板製造用離型フィルム及びその製造方法
JP3937301B2 (ja) * 2001-12-03 2007-06-27 東洋製罐株式会社 多層体の切断方法および多層体切断成形品
JP4503220B2 (ja) * 2002-07-25 2010-07-14 東洋製罐株式会社 多層体の切断方法および多層成型品
JP2005101189A (ja) * 2003-09-24 2005-04-14 Bunichi Yamada プリント回路基板製造用離型フイルム
JP2006148081A (ja) * 2004-10-19 2006-06-08 Sumitomo Bakelite Co Ltd 離型フィルムおよび回路基板の製造方法
WO2006120983A1 (ja) * 2005-05-13 2006-11-16 Mitsui Chemicals, Inc. ４－メチル－１－ペンテン系重合体を含む積層体およびこれからなる離型フィルム
JP7177623B2 (ja) * 2018-08-03 2022-11-24 三井化学東セロ株式会社 樹脂モールド成形品の製造方法、樹脂モールド成形品、及びその用途。
JP2022042971A (ja) * 2020-09-03 2022-03-15 積水化学工業株式会社 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

Also Published As

Publication number Publication date
CN216267995U (zh) 2022-04-12
CN114132027A (zh) 2022-03-04
JP2025116223A (ja) 2025-08-07
JP2022042971A (ja) 2022-03-15

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