JP2022042971A - 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法 - Google Patents

離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法 Download PDF

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Publication number
JP2022042971A
JP2022042971A JP2021133708A JP2021133708A JP2022042971A JP 2022042971 A JP2022042971 A JP 2022042971A JP 2021133708 A JP2021133708 A JP 2021133708A JP 2021133708 A JP2021133708 A JP 2021133708A JP 2022042971 A JP2022042971 A JP 2022042971A
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JP
Japan
Prior art keywords
resin layer
release film
resin
film according
covering portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021133708A
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English (en)
Japanese (ja)
Inventor
宏明 小屋原
Hiroaki Koyahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of JP2022042971A publication Critical patent/JP2022042971A/ja
Priority to JP2025093544A priority Critical patent/JP2025116223A/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2021133708A 2020-09-03 2021-08-18 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法 Pending JP2022042971A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025093544A JP2025116223A (ja) 2020-09-03 2025-06-04 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020148457 2020-09-03
JP2020148457 2020-09-03

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025093544A Division JP2025116223A (ja) 2020-09-03 2025-06-04 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

Publications (1)

Publication Number Publication Date
JP2022042971A true JP2022042971A (ja) 2022-03-15

Family

ID=80394484

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021133708A Pending JP2022042971A (ja) 2020-09-03 2021-08-18 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法
JP2025093544A Pending JP2025116223A (ja) 2020-09-03 2025-06-04 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

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JP2025093544A Pending JP2025116223A (ja) 2020-09-03 2025-06-04 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

Country Status (3)

Country Link
JP (2) JP2022042971A (https=)
CN (2) CN114132027A (https=)
TW (1) TW202214066A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022042971A (ja) * 2020-09-03 2022-03-15 積水化学工業株式会社 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07214716A (ja) * 1994-01-31 1995-08-15 Nagaoka Sangyo Kk 複合成形体およびその製造方法
JP2000263724A (ja) * 1999-03-19 2000-09-26 Mitsui Chemicals Inc プリント基板製造用離型フィルム及びその製造方法
JP2003165194A (ja) * 2001-12-03 2003-06-10 Toyo Seikan Kaisha Ltd 多層体の切断方法および多層体切断成形品
JP2004058181A (ja) * 2002-07-25 2004-02-26 Toyo Seikan Kaisha Ltd 多層体の切断方法および多層容器の成形方法並びに多層成型品
JP2005101189A (ja) * 2003-09-24 2005-04-14 Bunichi Yamada プリント回路基板製造用離型フイルム
WO2006120983A1 (ja) * 2005-05-13 2006-11-16 Mitsui Chemicals, Inc. ４－メチル－１－ペンテン系重合体を含む積層体およびこれからなる離型フィルム
JP2020019264A (ja) * 2018-08-03 2020-02-06 三井化学東セロ株式会社 樹脂モールド成形品の製造方法、樹脂モールド成形品、及びその用途。

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006148081A (ja) * 2004-10-19 2006-06-08 Sumitomo Bakelite Co Ltd 離型フィルムおよび回路基板の製造方法
JP2022042971A (ja) * 2020-09-03 2022-03-15 積水化学工業株式会社 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07214716A (ja) * 1994-01-31 1995-08-15 Nagaoka Sangyo Kk 複合成形体およびその製造方法
JP2000263724A (ja) * 1999-03-19 2000-09-26 Mitsui Chemicals Inc プリント基板製造用離型フィルム及びその製造方法
JP2003165194A (ja) * 2001-12-03 2003-06-10 Toyo Seikan Kaisha Ltd 多層体の切断方法および多層体切断成形品
JP2004058181A (ja) * 2002-07-25 2004-02-26 Toyo Seikan Kaisha Ltd 多層体の切断方法および多層容器の成形方法並びに多層成型品
JP2005101189A (ja) * 2003-09-24 2005-04-14 Bunichi Yamada プリント回路基板製造用離型フイルム
WO2006120983A1 (ja) * 2005-05-13 2006-11-16 Mitsui Chemicals, Inc. ４－メチル－１－ペンテン系重合体を含む積層体およびこれからなる離型フィルム
JP2020019264A (ja) * 2018-08-03 2020-02-06 三井化学東セロ株式会社 樹脂モールド成形品の製造方法、樹脂モールド成形品、及びその用途。

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CN216267995U (zh) 2022-04-12
TW202214066A (zh) 2022-04-01
CN114132027A (zh) 2022-03-04
JP2025116223A (ja) 2025-08-07

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